TWI391673B - Alternative probe devices and probe cards for their applications - Google Patents

Description

Replaceable probe device and probe card for its application

The present invention relates to a probe card, and more particularly to a probe device for a replaceable probe and a probe card for the same.

On a typical semiconductor wafer, the circuit contacts for electrically connecting the wafers are often distributed in various ways according to the characteristics of the circuit components in the wafer. Therefore, when the wafer level test engineering is performed, the circuits are disposed at different positions on the wafer. The components have different test conditions; therefore, the test probe card also needs corresponding circuit layout and corresponding probe distribution structure to transmit the test signals required by different circuit components to the circuit through a specific electrical transmission line. Components for testing. In practical applications, the probe card supplier specifically sets the circuit trace of the probe card circuit board to a specific board structure corresponding to the chip circuit, and generally pre-produces the circuit board of the public board structure; that is, the circuit board plane There are a plurality of solder joints from the outside to the inside, and the solder joints of the test area, the transfer area and the probe area are distinguished according to the radial distribution, and the solder joints of the probe area are directly longitudinally turned on and the probes are arranged under the circuit board. The electrical connection between the needle and the solder joint between the test area and the transfer area is a simple radial trace design, which is used to conduct the solder joints on the test area for the touch of the test machine to the transfer area for other electrical properties. For connection; then, according to the wafer circuit layout provided by the fab, a separate wire structure is arranged between the transfer area and the solder joint of the probe area, and the solder joint of the transfer area is electrically connected to the probe by a jumper The region is electrically connected to the probe.

The probe card provided in the above manner enables the probe card supplier to meet the various wafer design conditions of the fab, and does not need to make a special board for the specific circuit layout, so that it can be provided in the shortest working hours. The probe card is applied, and the cost of manufacturing the special board can be saved. However, when the wire structure is compared with the fine-sized probe structure, the wire diameter of the wire is approximately two orders or more. To connect the wires to the probe area of the probe card, The installation density of the wires is high, which often causes complicated and difficult assembly work. Furthermore, for the cantilever probe structure, the probe and the circuit board are assembled by sticking the body of all the probes to a probe holder to form a probe set, and then the probe ends of each probe. Soldering on the solder joint at the bottom of the probe area of the board; once the body of the probe has been attached to the mount, if there is a need for wafer testing for different circuit spacing, or after the probe card has been used, the probe must be repaired. In the case of processing, all the probe tails must be reflowed with their respective electrically connected circuit board solder joints, so that the probe and probe holder can be removed from the circuit board for repair or replacement. Probe set for other probe spacing. This type of reflow repair method not only consumes man-hours, but also causes damage to the probe due to the loss of the operation of the reflow process, which increases the burden of maintenance work or causes unnecessary expenditure on the production cost of the probe card.

In order to solve the above problems, there is a "semiconductor test fixture" as disclosed in Japanese Laid-Open Patent Publication No. 2001-144149, as shown in FIG. 9A and B, the test fixture 6 has a cantilever probe set. The first substrate 62 is disposed at a center of the first substrate 62, and a second substrate 64 is disposed around the first substrate 62, and a plurality of wires 65 are used to electrically conduct the first and second substrates 62 and 64 in a jumper manner. The electronic device of the test is electrically connected; the probe set 60 has a plurality of cantilever probes 600 fixed on a circuit board 61, and each probe 600 extends from the periphery of the circuit board 61 toward the center to make the tip of the probe 600 The portion is concentratedly suspended in the center of the circuit board 61. The periphery of the circuit board 61 is directly electrically connected to the first substrate 62 by the conductive strip 611, so that the probes 600 can electrically conduct the first substrate 62. The test fixture 6 is configured by assembling the probe set 60, the first and second substrates 62, 64 via a two-stage locking manner, wherein the first and second substrates 62, 64 are interlocked by a fixed frame 63. The periphery of the circuit board 61 is joined to the first substrate 62 by the locking members 612 and 613.

Therefore, the test fixture 6 has the function of the public board structure used in the above general probe card, as long as the second substrate 64 and the probe set 60 are prepared in advance, and the circuit layout conditions of the wafer provided by the fab are A substrate 62 is disposed in a circuit structure corresponding to the wafer circuit, that is, the probe set 60 circuit board 61 is assembled and electrically connected to the first substrate 62, and the first and second substrates 62, 64 are assembled and utilized by the wires. 65 electrical connection. Since the wire 65 jumps to the second substrate 64 in the region around the periphery of the first substrate 62, it is not necessary to directly connect to the circuit board 61 provided by the probe 600. Therefore, the density of the wires 65 is not too dense, which can reduce the difficulty of assembly engineering. And when the need to replace or repair the probes 600 of the cantilever probe structure, the probe set 60 can be directly detached from the first substrate 62, thereby eliminating the reflow of the probe as described above. The project to be faced is missing.

However, since the probes 600 are disposed around the circuit board 61 and are located at a central position of the first substrate 62, the number of probe probes 600 is limited to the circumference of the circuit board 61. Furthermore, in order to achieve the two-stage assembly purpose, the test fixture 6 can only be configured to engage the outer edge of the circuit board 61 with the inner edge of the first substrate 62 by the locking members 612, 613, and by the fixing frame 63. The outer edge of the first substrate 62 and the inner edge of the second substrate 64 are joined to each other; when the probes 600 touch the circuit contacts of the wafer to be tested on the wafer plane, the reaction force from the wafer plane is completely applied to the Circuit board 61. If probe set 60 requires more probes and a higher density distribution for simultaneous testing of a large number of wafer circuit components, a larger reaction force from the wafer plane must result in probe set 60 circuit board 61. The deformation of the circuit board 61 and the inner edge of the first substrate 62 are only caused by the outer edge of the circuit board 61. When the circuit board 61 is subjected to stress, the outer edge of the circuit board 61 or the inner edge of the first substrate 62 may even be cracked. In addition, because the wafer test needs to be operated under high temperature conditions, the circuit board is more susceptible to deformation under uneven force; no matter the stress or high temperature deformation, once the circuit board 61 is slightly deformed, the probe tip cannot be deformed. The coplanar effect is achieved, so that the probe set 60 needs to apply a greater downforce to the wafer so that all the probe tips are in good electrical contact with the wafer circuit contacts to be touched, so that the easier This causes severe deformation of the probe set 60 circuit board 61.

Of course, if the deformation problem of the stress applied to the fixing device or the circuit board for setting the probe is simply solved, there are also many reinforcing structures designed for the circuit board, and the Japanese Patent No. 7098330 is taken as an example, and the reinforcement is proposed. The functional structure of the probe device; however, it is limited by the electrical connection between the cantilever probe and the probe card circuit board, and can only reinforce the functional structure of the probe device that has been fixedly soldered to the circuit board. The above difficulties in repairing the probe or repairing it are not possible.

A membrane detection system (MEMBRANE PROBING SYSTEM) provided by Taiwan Patent No. 492219 discloses a structure in which a replaceable probe set is disposed on a circuit board of a probe card, by the replaceable probe The assembly and disassembly of the circuit board of the probe card are adjusted or repaired. However, the probe probe system of the alternative probe set proposed by the diaphragm detection system is to make a probe on the film substrate, so it must be realized by using a micro-electromechanical process, which is relatively expensive to manufacture.

In addition, semiconductor wafer circuits tend to be high-frequency, multi-functional integration. In order to meet the requirements of wafer circuit testing, the probe card must be placed above the board of the probe card to increase the placement of electronic components to achieve high frequency or multi-function. The requirements of the corresponding test of the chip circuit, but a large number of electronic components make the space above the board insufficient, so it is necessary to increase the space above the board to solve the problem of insufficient space. A probe card with a coplanar daughter card (PROBE CARD WITH COPLANAR DAUGHTER CARD) proposed by Taiwan Patent No. 577988 is provided with a daughter card, that is, a small circuit board, on the circuit board of the probe card. In the placement of electronic components and circuit layout, to increase the space above the board, but the daughter card will increase the complexity of the circuit, and the quality of the signal transmission will be affected, so increase the top of the probe card board Space is also a problem that the probe card needs to solve.

Therefore, the main object of the present invention is to provide a replaceable probe device and a probe card for the same, which can be used for wafer testing with high-density circuit distribution, and is convenient for replacing or repairing the probe, thereby effectively saving the probe card. Manufacturing or repair costs.

To achieve the foregoing, the present invention provides an alternative probe device that can be disposed on a circuit board to form a probe card. The probe device includes a fixed plate, an adapter plate, and a plurality of probes. The fixing plate has a base and a fixing portion on the periphery of the base, and the fixing portion is provided with a plurality of locking devices for fixing with the circuit board; the adapter plate is disposed on the base of the fixing plate, and has a different The inner region and an outer region surround the inner region, and the inner portion of the adapter plate is disposed with a plurality of wires extending between the inner and outer regions; the width of the inner region is only about half of the adapter plate, so as to have a fine pitch. The probes are electrically connected to the circuit board and are disposed between the fixing board and the circuit board; the probes are suspended from a probe holder and The inner area of the adapter plate is electrically connected to the lines.

The probe card transmits the test signal to the adapter board via the circuit board, and then transmits the test signals correspondingly to the high-density distribution of the probes through the circuit space conversion function in the adapter board; The adapter board and the fixed board need to occupy the circuit space of the surface, and the space above the circuit board can be used to set the electronic components to meet the testing requirements of the high frequency or multi-function chip circuit; Fixing the adapter plate on the circuit board is a material having higher hardness than the adapter plate, so even if only a small portion of the adapter plate is in contact with the circuit board, the fixing plate can be provided by the fixing plate The stress support effectively prevents the adapter plate from being deformed even by temperature changes. Moreover, since the probes are assembled only in the inner region of the interposer, when there are other circuit structures for the test of the wafer or when the probe needs to be repaired, the board is detached from the board. The adapter plate can be easily removed and replaced together with the probes, and the probe construction is not required to be re-welded as in the conventional probe card to detach the circuit board, and the circuit board can be reused. Effectively save the production cost and working hours of the probe card.

In the following, a number of preferred embodiments are provided to illustrate the structure and function of the present invention. The following is a brief description of the drawings: The first figure is a three-dimensional embodiment of the first preferred embodiment of the present invention. The second drawing is a schematic view of the structure of the second preferred embodiment of the present invention; the third drawing is a schematic view of the second preferred embodiment of the present invention; and the fourth drawing is a third preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a perspective exploded view of a fourth preferred embodiment of the present invention; FIG. 6 is a schematic structural view of the fourth preferred embodiment; An exploded perspective view of the fifth preferred embodiment; the eighth embodiment is a schematic structural view of the fifth preferred embodiment.

Please refer to the probe card 1 of the first preferred embodiment of the present invention as shown in the first and second figures, which includes a circuit board 10, an adapter plate 12, a fixing plate 14, and a plurality of cantilever probes. The pin 16, wherein the circuit board 10 is made of a multi-layer printed circuit board having a relatively upper surface 101 and a lower surface 102. The upper surface 101 of the circuit board 10 is provided with a plurality of conductive portions 103 corresponding to the outer ring region. The test board is electrically connected, and the upper surface 101 is provided with a plurality of conductive portions 104 corresponding to the inner ring region for electrically connecting the adapter plate 12, and a plurality of wires 100 are disposed inside the circuit board 10 for electrically connecting the wires. The conductive portions 103 and 104 transmit test signals between the inner and outer ring regions of the circuit board 10; an opening 105 is defined between the conductive portions 104 for receiving the probes 16.

The adapter plate 12 is disposed on the circuit board 10 and corresponds to the positions of the conductive portions 104 and the openings 105. The adapter plate 12 is made of a plurality of layers of organic material or a plurality of layers of ceramic material, and has a pair of upper and lower surfaces 121 and 122 and a plurality of wires 120 disposed between the inner and outer regions of the adapter plate 12, Each of the two ends of the line 120 corresponds to a contact point 123, 124 in the inner and outer regions of the adapter plate 12 to expose the lower surface 122; the contacts 123 of the inner region correspond to the opening 105 of the circuit board 10, and the outer side The contact point 124 is located on the conductive portion 104 of the circuit board 10, so that the width of the adapter plate 12 is approximately half of the width of the inner surface of the circuit board 10, and the contacts 124 are respectively located corresponding to the conductive portions. 104 on. Since each of the lines 120 can electrically connect the inner and outer regions of the interposer 12 to each other, the circuit space is switched to convert the line 120 corresponding to the outer region of the interposer 12 to the inner region. A denser distribution.

The outer portion of the adapter plate 12 is covered with a conductive sheet 11 corresponding to the contacts 124. The conductive sheet 11 is made of a material having a single-directional electrical conduction function, such as an anisotropic conductive adhesive for the adapter plate. Each of the contacts 124 of the 12 is electrically connected to the conductive portion 104 of the circuit board 10 in a longitudinal direction, so that the line 120 of the interposer 12 and the line 100 of the circuit board 10 are electrically connected to each other. Certainly, the manner in which the conductive portion 104 of the circuit board 10 and the contact 124 of the interposer 12 are electrically connected is not limited by the conductive sheet 11; the arrangement of the conductive sheet 11 is mainly due to the circuit board 10 The process deviation factor of the conductive portions 103 is such that the thickness of each of the conductive portions 103 is inevitably different, and the thickness of each conductive portion 103 can be compensated for by the arrangement of the conductive sheets 11, so that the conductive portions 103 and the turn The contact 124 of the board 12 can have a good electrical connection, and the conductive portion 103 does not contact the contact 124 and cannot be electrically turned on. Therefore, in addition to compensating the above-mentioned process deviation factors in such a manner that the conductive sheets 11 are provided, the conductive materials made of soft conductive materials such as gold, silver, copper, tin, nickel, cobalt, and alloys thereof are low at normal temperature. The material of the hardness can be deformed by applying a slight pressure to make up for the difference in size of each of the conductive portions 103, and has a good electrical connection with each of the conductive portions 103. Furthermore, once the circuit board 10 is formed into the conductive portions 104 and the adapter plate 12 is formed into the contacts 124, the conductive portions 104 and the contacts may be processed by a process such as planarization. The junction of 124 is a completely flat joint plane, and the conductive sheet 11 is also not required to achieve good electrical contact between the conductive portion 104 and the contact 124.

The fixing plate 14 is disposed on the adapter plate 12 and covers the upper surface 121 of the adapter plate 12 . The fixing plate 14 has a fixing portion corresponding to the periphery of the adapter plate 12 for defining the adapter plate 12 . The relative position on the board 10. In this embodiment, a frame 141 formed along the circumference of the fixing plate 14 is provided as the fixing portion, so that the frame 141 is correspondingly surrounded by a base 142, so that the base 142 and the frame 141 are formed correspondingly. An accommodating portion 143 is disposed to receive the adapter plate 12, and the frame 141 is fixed to the circuit board 10 by a plurality of locking devices 13; the height of the receiving portion 143 is equivalent to the adapter plate 12 and the The thickness of the conductive sheet 11 is such that when the locking devices 13 are locked to the circuit board 10, the adapter plate 12 and the conductive sheet 11 can be sandwiched and fixed to the fixing plate 14 and the circuit board 10. between. The fixing plate 14 is configured to provide good stress support of the adapter plate 12, and is made of a material having higher hardness than the adapter plate 12, so that the adapter plate 12 is prevented from being subjected to force or even Temperature changes cause deformation. In addition, in order to increase the space of the upper surface 121 of the circuit board 10 for the layout of electronic components, the length of the fixing plate 14 can be designed to be less than 20% of the diameter of the circuit board 10.

The cantilever probes 16 are fixed on an annular probe holder 15 . The probe holders 15 are disposed on the lower surface 122 of the adapter plate 12 and are surrounded by the contacts 123 . The portion 161 is adhered to the probe holder 15 , and a needle tip 160 of each probe 16 is suspended near the center of the probe holder 15 . One of the probes 16 is electrically connected to the contact point 123 of the adapter plate 12 . . The probe holder 15 of the present embodiment has a thickness higher than the thickness of the circuit board 10 to pass through the circuit board 10 so that the needle tips 160 of the probes 16 are correspondingly protruded from the lower surface 102 of the circuit board 10. The planes of the wafers to be tested are in contact.

As can be seen from the above, the probe card 1 provided by the present invention can transmit the test signal to the interposer 12 via the line 100 of the circuit board 10, and then the lines 120 in the interposer 12. The circuit space conversion function transmits the test signals correspondingly to the probes 16 of the high-density distribution; since the probes 16 are assembled in the connection point 123 of the adapter board 12, the adapter board 12, The fixing plate 14, the probe base 15 and the probes 16 form a replaceable probe device. When the wafer test needs of other circuit structures or the need for probe repair, the fixing plate 14 is removed. From the circuit board 10, the adapter plate 12 can be easily removed and replaced together with the probes 16, without replacing the circuit board 10 at the same time. In addition, the fixing plate 14 is disposed on the circuit board 10 so as to cover the adapter plate 12, so that the entire area of the circuit board 10 is deducted from the portion overlapping the fixing plate 14, and the remaining space is available. The layout of electronic components to meet the testing needs of high frequency or multi-function chip circuits. And because the fixing plate is used for fixing the adapter plate on the circuit board, compared with the adapter plate being a material having higher hardness, even if only a small portion of the adapter plate is in contact with the circuit board, The fixing plate can provide stress support; effectively avoiding deformation of the adapter plate even by temperature changes, and maintaining the flatness of the tip plane of the probes 16 to achieve high reliability electrical test results. Therefore, the probe card 1 provided by the present invention can be used not only for high-quality electrical testing of high-frequency or multi-function wafers with high-density circuit distribution, but also without the need for a conventional probe card when replacing or repairing the probe. The process of reflowing the probe construction is to detach the circuit board, and the circuit board 10 can be reused, thereby effectively saving the manufacturing cost and working time of the probe card 1.

Referring to FIG. 3, a probe card 2 according to a second preferred embodiment of the present invention has the same circuit board 10, the adapter board 12, and the fixed board 14 of the first preferred embodiment. The probe holder 15 differs from the first preferred embodiment described above in a plurality of probes 20. Each of the probes 20 has a bare pin 21 and a wire 23 connected to the tail end 22 of the bare pin 21 , so that one end of the wire 23 is fixed to the probe base 15 together with the tail end 22 of the bare needle 21 . The other end of the wire 23 is electrically connected to the contact 123 of the adapter plate 12; the wire 23 can be made of a single-core wire covered with a good insulating material or covered with a metal wire. The insulating material and the metal material sleeve form a coaxial wire similar to the high frequency transmission line structure, so that the signal is transmitted to the probe 20 and has good electrical conductivity with the noise in the environment or the signal transmitted by the adjacent probe 20. Barrier effect. And because the probe holder 15 is higher than the thickness of the circuit board 10, the length of the probe 20 connected from the probe holder 15 to the adapter board 12 also needs to be greater than the thickness of the circuit board 10; When the signal is transmitted on the probe 20, the electrical interference is prevented from being transmitted on the transmission path between the adapter plate 12 and the bare needle 21.

Referring to FIG. 4, a probe card 3 according to a third preferred embodiment of the present invention has the same circuit board 10, a fixed board 14, and a probe base 15 as the first preferred embodiment. The probe 16 differs from the first preferred embodiment described above in an adapter plate 30. The adapter plate 30 is similar to the one provided in the above embodiment, and a plurality of wires 300 are disposed between the inner and outer regions of the adapter plate 30, and the adapter plate 30 corresponds to the edge ring of the opening 105 of the circuit board 10. A convex portion 31 is disposed to protrude from the circuit board 10 by a predetermined height, and a recess 32 is formed in the convex portion 31 to provide the probe base 15; one end of each of the wires 300 is correspondingly disposed to the convex portion The surface of the 31 is formed with a contact 33 for electrically connecting the probe 16. The protrusion 31 is smaller than the thickness of the probe holder 15 or even the circuit board 10, so that the probe 16 and the contact point 33 has ample assembly space when connected.

By the design of the convex portion 31, the probe 16 is connected from the probe holder 15 to the contact point 33 of the adapter plate 30, and only a small portion of the bare needle portion exposed to the air is exposed. When the probe 16 is in a high-density setting requirement, it is not necessary to set the wire 23 structure as in the probe 20 of the second embodiment described above to isolate the electrical interference and instead occupy the setting space of the probe; 33 is closer to the body 161 of the probe 16, which can shorten the bare needle structure of the probe 16, and effectively reduce the electrical interference effect when the signal is transmitted by the probe 16.

Referring to the fifth and sixth figures, a probe card 4 according to a fourth preferred embodiment of the present invention has a circuit board 40, an adapter plate 42, a fixing plate 44, and the same The probe base 15 and the probe 20 are provided by the second embodiment. The circuit board 40 has a pair of upper surface 401 and a lower surface 402. The upper surface 401 of the circuit board 40 has a plurality of outer ring regions. The conductive portion 403 is electrically connected to the test machine, and the lower surface 402 is provided with a plurality of conductive portions 404 corresponding to the inner ring region for electrically connecting the adapter plate 42. The circuit board 40 is internally provided with a plurality of wires 400 for respectively Each of the conductive portions 403 and 404 is electrically connected to transmit a test signal between the inner and outer ring regions of the circuit board 40.

The adapter plate 42 is disposed on the lower surface 402 of the circuit board 40, and has a pair of upper and lower surfaces 421, 422 and a plurality of wires 420 disposed between the inner and outer regions of the adapter plate 42. The two ends of the line 420 correspond to the inner and outer regions of the adapter plate 42 respectively, and a contact 423 exposes the lower surface 422 and a contact 424 exposes the upper surface 421. The outer contacts 424 respectively correspond to the circuit board 40. Each of the conductive portions 404 is electrically connected; and each of the wires 420 electrically connects the inner and outer regions of the adapter plate 42 to each other. The outer portion of the adapter plate 42 is further provided with a conductive strip 41 corresponding to the contacts 424, so that the contacts 424 of the interposer 42 are electrically connected to the conductive portion 404 of the circuit board 40, respectively. Therefore, the line 420 of the interposer 42 and the line 400 of the circuit board 40 are electrically connected to each other.

The fixing plate 44 covers the lower surface 422 of the adapter plate 42 and has a base 441, a fixing portion 442 surrounding the base 441, and an opening 443 penetrating the base 441. The fixing portion 442 is adjacent to the circumference of the adapter plate 42 , and the adapter plate 42 is supported by the base 441 and the fixing portion 442 . The fixing portion 442 is further provided with a plurality of locking devices 43 for the circuit board 40 . The fixing plate 44 and the circuit board 40 form a receiving portion, whereby the adapter plate 42 and the conductive piece 41 are sandwiched and fixed to the receiving portion, and the fixing plate is fixed. 44 provides the adapter plate 42 with good stress support; and since the circuit board 40 is a multi-layer printed circuit board structure, the adapter plate 12 is made of a material having higher hardness, so that the adapter plate 12 is avoided. The force is even deformed by temperature changes. The opening 441 is sized to correspond to the contact 423 of the inner region of the adapter plate 42 so that the probe holder 15 and the probes 20 can be disposed on the adapter plate 42 through the opening 441, and the The probes 20 are electrically connected to the conductive portions 423, respectively.

Therefore, the probe card 4 provided in this embodiment not only has the same functions as those provided by the above embodiments, but also transmits the test signal from the line 400 of the circuit board 40 to the line 420 of the interposer 42 to a high density. Each of the probes 20 is distributed, and the adapter plate 42 and the probes 20 can be easily removed for probe replacement or repair work; and moreover, the adapter plate 42 is attached to the circuit board 40. The lower surface 402, the fixing plate 44 covers the lower surface 422 of the interposer 42 so that the upper surface 401 of the circuit board 40 has more space for the layout of electronic components to achieve high frequency or multi-function chip circuit testing. demand.

Referring to FIG. 7 and FIG. 8 , a probe card 5 according to a fifth preferred embodiment of the present invention has a circuit board 50 , an adapter plate 52 , a fixing plate 54 , and a probe . And a plurality of vertical probes 56, wherein: the circuit board 50 has an opposite upper surface 501 and a lower surface 502. The upper surface 501 of the circuit board 50 is provided with a plurality of conductive portions 503 corresponding to the outer ring area for testing. The upper surface 501 is electrically connected to the inner surface of the inner surface of the inner surface of the circuit board 50. The circuit board 50 is internally provided with a plurality of wires 500 for electrically connecting the plurality of wires 500. The conductive portions 503, 504 pass the test signals between the inner and outer ring regions of the circuit board 50. An opening 505 is defined between the conductive portions 504 for receiving the probe holder 55 and the probes 56.

The adapter plate 52 is made of a flexible printed circuit (FPC), is disposed on the upper surface 501 of the circuit board 50, and has a plurality of upper and lower surfaces 521, 522 and a plurality of lines. 520 is connected between the inner and outer regions of the adapter plate 52. The two ends of the circuit 520 correspond to the inner and outer regions of the adapter plate 52. A contact 523, 524 respectively exposes the lower surface 522, and the outer contact 524. The conductive portions 504 corresponding to the circuit board 50 are respectively electrically connected. Due to the manufacturing process, the heights of the conductive portions 503 of the circuit board 50 are different. Therefore, the adapter plate 52 can be tightly bonded to the conductive portions 503 by the material of the flexible circuit board, so that the conductive portions 503 and the turn The contacts 524 in the outer region of the board 52 can have good electrical contact, thereby causing the line 520 of the interposer 52 and the line 500 of the board 50 to be electrically connected to each other.

Since the vertical probe 56 is used in this embodiment, each probe 56 vertically corresponds to the contact point 523 of the inner region of the adapter plate 52 along the needle body, so the design of the adapter plate 52 will correspond to the rotation. The pitch of the line 520 in the outer region of the land 52 is switched to a smaller pitch in the inner region, so that the probes 56 are correspondingly densely distributed.

The fixing plate 54 is disposed on the adapter plate 52 to cover the upper surface 521 of the adapter plate 52. The fixing portion 541 of the fixing plate 54 is located at a periphery of the adapter plate 52. The adapter plate 52 is disposed corresponding to the 542. The fixing portion 541 is fixed to the circuit board 50 by a plurality of locking devices 53 to form a receiving portion between the fixing plate 54 and the circuit board 50. The adapter plate 52 is sandwiched and fixed to the receiving portion, and the adapter plate 52 is provided with good stress support by the fixing plate 54; and the fixing plate 54 is higher than the adapter plate 52. The hardness of the material is made, so that the adapter plate 52 is prevented from being deformed even by temperature changes. The opening 505 is sized to correspond to the contact 523 of the inner region of the adapter plate 52. The probe holder 55 and the probes 56 are disposed through the opening 505 on the lower surface 522 of the adapter plate 52. And the probes 56 are electrically connected to the conductive portions 523, respectively.

The above-mentioned embodiments are merely preferred embodiments of the present invention, and equivalent structural changes to the scope of the present invention and the scope of the claims are intended to be included in the scope of the present invention.

1, 2, 3, 4, 5. . . Probe card

10, 40, 50. . . Circuit board

100, 120, 300, 400, 420, 500. . . line

101, 121, 401, 421, 501. . . Upper surface

102, 122, 402, 422, 502. . . lower surface

103, 104, 403, 404, 503, 504. . . Conductive part

105, 443, 505. . . Opening

11, 41. . . Conductive sheet

12, 30, 42, 52. . . Adapter plate

13. . . Locking device

123, 124, 33, 423, 424, 523, 524. . . contact

14, 44, 54. . . Fixed plate

141. . . frame

142, 542. . . Base

143. . . Housing

15, 55. . . Probe holder

16, 20, 56. . . Probe

160. . . Tip

161. . . Body

162. . . Needle tail

twenty one. . . Bare needle

twenty two. . . Tail end

twenty three. . . wire

31. . . Convex

32. . . Groove

441. . . Base

442, 541. . . Fixed part

The first drawing is an exploded perspective view of a first preferred embodiment of the present invention;

The second drawing is a schematic structural view of the first preferred embodiment;

The third drawing is a schematic structural view of a second preferred embodiment of the present invention;

Figure 4 is a schematic view showing the structure of a third preferred embodiment of the present invention;

Figure 5 is a perspective exploded view of a fourth preferred embodiment of the present invention;

Figure 6 is a schematic structural view of the fourth preferred embodiment;

Figure 7 is a perspective exploded view of a fifth preferred embodiment of the present invention;

Figure 8 is a schematic structural view of the fifth preferred embodiment;

The ninth diagram A and the ninth diagram B are schematic diagrams of the structure of the conventional probe card.

1. . . Probe card

10. . . Circuit board

100, 120. . . line

101, 121. . . Upper surface

102. . . lower surface

103. . . Conductive part

105. . . Opening

11. . . Conductive sheet

12. . . Adapter plate

123, 124. . . contact

13. . . Locking device

14. . . Fixed plate

141. . . frame

142. . . Base

143. . . Housing

15. . . Probe holder

16. . . Probe

160. . . Tip

161. . . Body

162. . . Needle tail

Claims (15)

An alternative probe device for being disposed on a circuit board to transmit an electrical signal between the circuit board and the integrated circuit component for electrically testing the integrated circuit component, the probe device including a fixing plate having a base and a fixing portion, the fixing portion is located around the base, the fixing portion is provided with a plurality of locking devices for fixing with the circuit board; and an adapter plate is disposed at the fixing a base of the board, the adapter board is divided into an inner area and an outer area surrounding the inner area, wherein the inner area and the outer area are respectively provided with a plurality of first and second contacts, and the first contacts and the The second contacts respectively correspond to the electrical connection; a probe holder is disposed on the inner side of the adapter plate and the first contacts are located on the same side of the adapter plate; and, a plurality of probes are suspended And the receiving portion is electrically connected to the first contact; and the receiving portion is disposed between the base and the fixing portion of the fixing plate to receive the adapter plate; The inner side of the connecting plate is more convexly provided with a convex portion, and the convex portion Surrounding the probe housing, the plurality of contacts disposed on the first projecting portion. According to the probe device of claim 1, the second contact of the adapter plate is provided with a conductive piece, and has a function of electrically conducting in a single direction. According to the probe device of claim 1, the adapter plate is made of a flexible circuit board. According to the probe device of claim 1, the second contacts of the adapter plate are made of a metal material which can be deformed at a normal temperature. According to the probe device of claim 1, the first contact of the adapter plate surrounds the probe holder. According to the probe device of claim 1 or 5, each of the probes has a bare pin and a wire, and the two ends of the wire are respectively connected to the first contact of the adapter plate and the bare One end of the needle, the wire is fixed to the probe holder together with the end of the bare needle. According to the probe device of claim 6, the wire is formed by coating at least one insulating material on the outer side of a metal wire, and the metal wire is electrically connected to the bare needle. According to the probe device of claim 1, the probe holder is disposed on the first contact of the adapter plate, and the probes are suspended from the bottom of the adapter plate. A probe card comprising: a circuit board; a replaceable probe device disposed on the circuit board to transmit an electrical signal between the circuit board and the integrated circuit component to form an integrated circuit component For the electrical test, the probe device includes: a fixing plate having a base and a fixing portion, the fixing portion is located around the base, and the fixing portion is provided with a plurality of locking devices for the circuit board Fixed; an adapter plate is disposed on the base of the fixed plate, and the adapter plate is divided into An inner region and an outer region surround the inner region, and the inner region and the outer region are respectively disposed with a plurality of first and second contacts, and the first contacts and the second contacts respectively are electrically connected a probe holder disposed on an inner side of the adapter plate and the first contacts are located on a same side of the adapter plate; and a plurality of probes are suspended on the probe holder and respectively associated with the probe The first contact is electrically connected; wherein the circuit board ring is provided with a plurality of first and second conductive portions, the first conductive portions surround the second conductive portions, and the second conductive portions are electrically connected The first conductive portion is electrically connected to the second contact of the adapter plate; wherein the adapter plate has an opposite upper surface and a lower surface, and the first and second contacts are disposed on the first contact point a lower surface; the circuit board is disposed on a lower surface of the adapter board, the circuit board has an opening surrounded by the second conductive portions, and the probe holder and the probes pass through the opening. According to the probe card of claim 9, the length of the fixing plate is less than 20% of the diameter of the circuit board. According to the probe card of claim 9, the adapter plate further protrudes from an opening of the circuit board adjacent to an edge of the opening, and a convex portion surrounds the probe base, and the first portion The contact is disposed on the convex portion, and the height of the convex portion is less than or equal to the thickness of the circuit board. According to the probe card of claim 9, a receiving portion is formed between the fixing plate and the circuit board to accommodate the adapter plate, and a conductive plate is disposed between the adapter plate and the circuit board. Sheet with single direction electrical Turn-on function. According to the probe card of claim 9, the adapter plate further protrudes from the edge of the opening adjacent to the opening, and a convex portion surrounds the probe base, and the first contacts are disposed. The height of the protrusion is smaller than the thickness of the probe holder on the protrusion. A probe card includes: a circuit board having an inner ring region and an outer ring region surrounding the inner ring region; the inner ring region is provided with a plurality of conductive portions; and a fixing plate is disposed on the circuit board The utility model has a base and a plurality of locking devices, wherein the locking devices are located around the inner ring area of the circuit board; an adapter plate is disposed on the base of the fixing plate, and the adapter plate is clamped on the fixing plate And a plurality of first and second contacts are disposed on the adapter board, and the second contacts are disposed around the first contacts and are connected to the first contacts The points are respectively electrically connected, and the second contacts are respectively electrically connected to the conductive portion of the circuit board; a probe holder is disposed on the adapter board and the first contacts are located on the adapter board The same side is surrounded by the first contacts; and a plurality of probes are suspended from the probe holder and electrically connected to the first contacts respectively; wherein the circuit board has a relative One of the upper surface and the lower surface, the outer ring area of the circuit board corresponding to the upper surface is provided with a plurality of a conductive portion, wherein the conductive portion of the inner ring region of the circuit board is a second conductive portion, each of the second conductive portions is electrically connected to the first conductive portion; wherein the second conductive portions are disposed on the upper surface The adapter plate is located at An upper surface of the circuit board, the circuit board having an opening surrounded by the second conductive portions, the probe holder and the probes passing through the opening. According to the probe card of claim 14, the length of the fixing plate is less than 20% of the diameter of the circuit board.