201042266 六、發明說明： 【發明所屬之技術領域】 本發明係與探針卡有關，特別是指一種可替換探針之 探針裝置及其應用之探針卡。 【先前技術】 y般半導體晶®上’晶片供以電性連接的電路接點往 〇 錄照晶片内的電路元件特性而有多種不同的設置分佈， 故執仃晶圓級測試工程時，晶圓上不同位置所設置的電路 讀即有不同的測試條件需求；因此測試用探針卡亦需有 對應的電路佈設以及對應的探針分佈結構，以將不同電路 疋件所需的測試訊號藉由特定電性傳輸線路傳送至電路元 件以進行測4。實際應用上，探針卡供應商除了將探針卡 電_的電路走線專門佈設為與晶片電路特定對應的專板 結構’普遍更預先製作公板結構的電路板；亦即電路板平 ° 自上由輕内設置❹數鱗點，健向分料區分有測 、轉接區及探針區之銲點，且探針區之銲點直接縱向 _與電路板下方所設置之探針電性連接，職區與轉接 區之銲點之間為簡單的徑向走線設計，用以將測試區上供 測試機台點觸的銲點導通至轉接區以作其他電性連接用； 然後再依晶圓廠所提供晶片電路佈設，於轉接區與探針區 之銲點之間另行配置導線結構，利用導線以跳線方式使轉 接區之銲點導通至探針區與探針電性連接。 以上述方式所提供的探針卡，使探針卡供應商不但可 3 201042266 晶片設計條件，且不必再另行製作特定 而可在最短卫時内提供符合實際應用 之探針卡，並可郎省製造專板的成本支出。然而 結構與細微尺寸的探針結構相較之下，導線的線徑約略大 了兩固級數W上，若要將各導線於探針卡之 接至一探針，導線的設置密产 了應連 的繁雜及困難声：：’在往造成組裝工程 困難度。再者，對於懸臂式探針結構而言，探針 與，板之組裝方式係為將所有探針之身部黏著於一探針 成二探針組，再將各探針之針尾烊接於電路板 :::P之鋅點上；一旦已將探針之身部黏著於固定座 後，右有需要供不同電路間距的晶片測試用，或者探針 後需對探針維修時’處理方式皆_所有探針之針 尾與其各自f性連接之電路板銲點進行啤的工程 以7探針及探針固定座—同自電路板上移除以做維修或^ I他探針間距的探針組。此種回鮮維修方式不但耗費工 時且#易因回銲触的作業疏失反而造成探針的損毀， ^增維修工程的負擔或者造成探針卡製作成本不必要的支201042266 VI. Description of the Invention: [Technical Field] The present invention relates to a probe card, and more particularly to a probe device for a replaceable probe and a probe card for the same. [Prior Art] y-like semiconductor crystals on the 'wafers are electrically connected to the circuit contacts to record the characteristics of the circuit components in the wafer and have a variety of different settings, so when performing wafer level test engineering, crystal The circuit read in different positions on the circle has different test conditions; therefore, the test probe card also needs corresponding circuit layout and corresponding probe distribution structure to borrow the test signals required for different circuit components. It is transmitted to the circuit component by a specific electrical transmission line for measurement 4. In practical applications, the probe card supplier specially sets the circuit trace of the probe card to be a specific board structure corresponding to the chip circuit, which is generally pre-made with a public board structure; that is, the board is flat. From the top, the number of scales is set by the light, and the direction of the material is divided into the solder joints of the test, the transfer area and the probe area, and the solder joints of the probe area are directly longitudinally _ and the probes disposed under the circuit board are electrically Sex connection, between the welding area of the service area and the transfer area is a simple radial wiring design, which is used to connect the solder joints on the test area for the test machine to the transfer area for other electrical connection. Then, according to the wafer circuit layout provided by the fab, a wire structure is additionally arranged between the soldering point of the transfer area and the probe area, and the solder joint of the transfer area is electrically connected to the probe area by using a wire by a jumper. The probe is electrically connected. The probe card provided in the above manner enables the probe card supplier to not only provide 3 201042266 chip design conditions, but also eliminates the need to make a specific probe card to provide practical application in the shortest time. The cost of manufacturing a special board. However, compared with the probe structure of the fine size, the wire diameter of the wire is slightly larger than the two solid level W. If the wires are connected to the probe card to the probe, the wire arrangement is densely produced. The complicated and difficult sounds that should be connected:: 'It is difficult to make assembly work. Furthermore, for the cantilever probe structure, the probe and the plate are assembled by attaching the body of all the probes to one probe into the two probe sets, and then splicing the probe ends of the probes to each other. The board:::P is on the zinc point; once the body of the probe has been attached to the holder, there is a need for wafer testing for different circuit spacing on the right, or when the probe needs to be repaired after the probe. All the probe ends of all probes and their respective f-connected circuit board solder joints for beer engineering with 7 probes and probe holders - removed from the board for repair or ^ probe spacing Needle set. This kind of fresh-keeping maintenance method not only consumes labor hours, but also causes the damage of the probe due to the negligence of the reflow contact, and increases the burden of the maintenance project or the unnecessary cost of the probe card production.
為解決以上問韻，田而女L Ί畸口而有如曰本公開專利第 :侧49號所提供之「半導體測試治具」，請參閱如第 九圖A、B所示，該測試治具6係具有—懸臂式 設於一第-基板62中央，以及一第二基板料設於第一武 板62之㈣’並有多個導線&以跳線方式將第—及第^ 基板62、64上用以施行電性測試的電子裝置電性連接^ 201042266 針組60係有多數懸臂式探針600固定於一電路板61上， 各探針600自該電路板61周邊朝向中央延伸設置，使探針 600之針尖部位集中懸設於該電路板61中央，該電路板6i 之周邊藉由導電片611與第一基板62直接縱向導通，可使 該些探針600電性導通該第一基板62。該測試治具6為經 由兩段式鎖設方式將探針組60、第一及第二基板62、64 組裝，其中，該第一及第二基板62、64之間由一固定框 0 63相互鎖设接合，該電路板61之周邊則藉由鎖設件612、 613與第一基板62接合。 因此s亥測試治具6具有如上述一般探針卡所使用公板 釔構之功能，只要預先製作該第二基板64以及該探針組 6〇，再依晶®廠所提供晶片之電路佈設條件將第—基板62 佈為與晶片電路相對應的電路結構，即可將探針組 電路板61與第—基板62組裝並電性連接，以及將第一與 第二基板62、64組裝並利用導線65冑性連接。由於導線 ❹ 65為於第一基板62外圍的區域跳接至第二基板64，不必 i接連接至探針6GG設置的電路板61上，因此導線65設 i密度不致太過密集，可降低組t程的困難度；且在對 懸臂式探針結構之該純針_進行更換或維修之需要 時’可直接將探針組60拆離第一基板62，因而免除如上 述之對探針進行回銲所需面臨的工程缺失。 然，由於該些探針6〇〇為接設於電路板61周圍，相對 位於第-基板62巾央位置，使探針探針_設置數量揭限 於電路板61周長。再者，該測試治具6為了達成兩段式組 5 201042266 裝目的，結構上僅能藉由鎖設件612、613將電路板61外 緣與第一基板62内緣相互接合，以及藉由固定框將第 一基板62外緣與第二基板64内緣相互接合；如此該些探 針600在點觸晶圓平面上待測晶片的電路接點時，來自晶 圓平面的反作用力完全作用至該電路板61。若探針組6〇 尚汉置炅夕ί木針且更尚岔集度的分佈，以作為對大量的晶 片電路元件進行同步測試時，來自晶圓平面更大的反作用 力必定造成探針組60電路板61的變形；且由於電路板61 僅靠外緣與第一基板62内緣相互接合，當電路板Η受到 應力作用時電路板61外緣或第一基板62内緣甚至會產生 =裂的絲。另外亦有因晶片測試需操作於高溫條;而使 在受力不均情況下更易產生形變；無論是應力作用 或馬溫變形影響’一 Η雷路柘6丨猫 針針尘^ , 變_現象，即令探 从無法達到共平_絲，使叙 圓，的下壓力才能使所有探針針尖皆與待二 組路^達^好的電性接觸效果，如此越易造成探針 電路板61的嚴重變形。 板二=純解決用以設置探針之固定襄置或電路 補強結=二=，亦有諸多針對電路板所設計的 補強探針裝置的功二構利^ 7_3G號為例，即有提出 卡電路板的電性連接方式，亦4，式探針與探針 的探針裳置做到補強的魏、㈣j已固定焊接於電路板 探針進行輕^ H轉決上述需對 正-飞雖修等維修工程所面臨的因難。 201042266 種隔膜探測 而台灣公告專利第492219號所提供之一 ==_P_GSY_)，已揭露在一探針 換式探針2設置—可替換式探針組的結構，藉由該可替 換^探針組與該探針卡的電路板組裝或拆卸，進行調整或 机。但是該隔酶測系統所提出的可替換式探針植之探 於薄絲底上面製作探針，因此轉使用微機 電製程來實現，其製作成本相當昂貴。In order to solve the above question, Tian and the female L Ί Ί 而 而 有 : : : : : : : : : : : : : : : : 侧 侧 侧 侧 侧 侧 「 「 「 「 「 「 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体The 6 series has a cantilever type disposed at the center of a first substrate 62, and a second substrate material is disposed at the (four)' of the first slab 62 and has a plurality of wires & the first and second substrates 62 are jumpered. The electrical connection of the electronic device for performing the electrical test on the 64 is used. The 201042266 needle set 60 has a plurality of cantilever probes 600 fixed on a circuit board 61. Each probe 600 extends from the periphery of the circuit board 61 toward the center. The tip end portion of the probe 600 is suspended from the center of the circuit board 61. The periphery of the circuit board 6i is directly electrically connected to the first substrate 62 by the conductive strip 611, so that the probes 600 can be electrically connected to the first portion. A substrate 62. The test fixture 6 is configured by assembling the probe set 60, the first and second substrates 62, 64 via a two-stage locking manner, wherein the first and second substrates 62, 64 are interlocked by a fixed frame 0 63 The periphery of the circuit board 61 is joined to the first substrate 62 by the locking members 612 and 613. Therefore, the shai test fixture 6 has the function of the public board structure used in the above general probe card, as long as the second substrate 64 and the probe set 6〇 are prepared in advance, and the circuit layout of the chip provided by the ICP® factory is provided. The condition that the first substrate 62 is disposed as a circuit structure corresponding to the wafer circuit, the probe set circuit board 61 and the first substrate 62 are assembled and electrically connected, and the first and second substrates 62, 64 are assembled and assembled. The wires 65 are connected by wires. Since the wire ❹ 65 is jumped to the second substrate 64 in the region around the periphery of the first substrate 62, it is not necessary to connect to the circuit board 61 provided by the probe 6GG. Therefore, the wire 65 is not too dense, and the group can be lowered. The difficulty of the t-pass; and when the need to replace or repair the pure needle of the cantilever probe structure, the probe set 60 can be directly detached from the first substrate 62, thereby eliminating the need for the probe as described above. The engineering work required for reflow is missing. However, since the probes 6 are connected around the circuit board 61 and are located at the center of the first substrate 62, the number of probe probes is limited to the circumference of the circuit board 61. Furthermore, in order to achieve the two-stage assembly 5 201042266, the test fixture 6 can only be configured to engage the outer edge of the circuit board 61 with the inner edge of the first substrate 62 by the locking members 612, 613, and by The fixing frame engages the outer edge of the first substrate 62 and the inner edge of the second substrate 64; thus, when the probes 600 touch the circuit contacts of the wafer to be tested on the wafer plane, the reaction force from the wafer plane is completely effective. To the circuit board 61. If the probe set is set to be a set of large-scale wafer circuit components, the larger reaction force from the wafer plane must cause the probe set. The deformation of the circuit board 61; and since the circuit board 61 is joined to the inner edge of the first substrate 62 only by the outer edge, the outer edge of the circuit board 61 or the inner edge of the first substrate 62 may even be generated when the circuit board is subjected to stress. Cracked silk. In addition, because the wafer test needs to be operated on the high temperature strip; it is more prone to deformation under the condition of uneven force; whether it is stress or the deformation of the horse temperature, '一Η雷路柘6丨猫针针尘^, _ Phenomenon, that is, the exploration can not reach the common level _ silk, so that the downward pressure of the circle, so that all the probe tips are in good electrical contact with the two groups of roads, so the easier to cause the probe circuit board 61 Serious deformation. Board 2 = pure solution to set the probe's fixed device or circuit reinforcement junction = two =, there are many for the circuit board design of the reinforced probe device's power two structure ^ 7_3G number as an example, that is, there is a card The electrical connection mode of the circuit board is also 4, the probe of the probe and the probe are placed to achieve the reinforcement of Wei, (4) j has been fixedly soldered to the circuit board probe for light ^ H conversion to the above need to be right - fly though Difficulties in repairing maintenance projects. 201042266 A membrane probe is provided by Taiwan Patent No. 492219, ==_P_GSY_), which has been disclosed in a probe-switching probe 2-replaceable probe set structure, by which the replaceable probe The group is assembled or disassembled with the circuit board of the probe card for adjustment or machine. However, the alternative probe proposed by the enzyme-measuring system probes the probe on the bottom of the thin wire, so that it is realized by using a micro-electromechanical process, which is relatively expensive to manufacture.
…此外’半導體晶片電路有傾向於高頻、多功能整合的 需求’為了符合⑼電賴試㈣求，探針卡 卡的電路板上謂加電子元件的佈設，以制高頻或多功 能晶片電路相對應的測試的需求’但是大量的電子元件使 知電路板上方的空間不足，因此需要增加電路板上方的空 間以解決空間不足的問題。以台灣公告專利第577988號所 提出之一種具有共平面子卡之探針卡（PROBE CARD WITH COPLANAR DAUGHTER CARD) ’係在探針卡的電路板上 方增設一子卡，即小型的電路板，用於放置電子元件及進 行電路的佈設，來增加電路板上方的空間，但是子卡將造 成電路的複雜度提高，且電訊號傳遞的品質也會受到影 響，因此增加探針卡的電路板上方的空間，也是探針卡所 需面Eft解決的課題。 【發明内容】 因此，本發明之主要目的乃在於提供一種可替換式探 針裝置及其應用之探針卡，可供有高密度電路分佈的晶片 7 201042266 有效節省探針卡之製作 測試用，且方便更換或維修探針， 或維修成本。 為達成前揭目的，本發明所提供一種 置，可設置於，板峨-贿， 有一固定板、-轉接板及多數個探針。該固定板且有一底 座及-蚊部錄誠斜圍，料錄個鎖設 裝置用以與上述電路板相固接；該_缺於·定板之 底座，係區分有-内側區域及—外側區域環繞該内側區 域，該轉接板内部佈設有多數個線路延伸於内、外側區域 之間；該内侧區域的寬度僅約佔去該轉接板一半，以設置 具有細微間距的該些探針，該外側區域用以提供該些線路 與該電路板電性連接，且為該固定板與該電路板所夾置； 該些探針懸設於一探針座並於該轉接板之内側區域與該些 線路電性連接。 該探針卡可使測試訊號經由該電路板傳遞至該轉接板 後，再於該轉接板内經電路空間轉換功能將各測試訊號對 應傳輸至高密度分佈的各該探針；該電路板除了設置該轉 接板及固定板需佔去表面的電路空間外，其餘該電路板上 方的空間皆可用以設置電子元件，以達到高頻或多功能晶 片電路的測試需求；由於該固定板用以固定該轉接板於該 電路板上，相較於該轉接板為具有更高硬度的材質，因此 即使轉接板僅有少部分面積與該電路板接觸，仍可藉由該 固定板提供應力支撐，有效避免該轉接板受力甚至受溫度 變化產生形變。更由於該些探針之組裝方式僅為接設於該 201042266 古愛内側區域’當有其他電路結構的晶片測試需求或 άτ缸旦订探針維修時’只要將該固定板拆離該電路板’即 二：丰亥轉接板與該些探針-同取下更換，不需如習用 叙對探針施工進行回銲的工程以拆離電路板，並可 複使用該電路板’有效節省探針卡之製作成本及工時。 【實施方式】 Ο 〇 Χ下錄配合圖不列舉若干較佳實施例，用以對本 發月之，構與功效作詳細朗，其中所用圖示之簡要說 明如下： ^圖係本發明所提供第—較佳實施例之立體分解圖； ，一圖係上述第-較佳實施例所提供之結構示意圖； =圖係本發明所提供第二較佳實施例之結構示意圖； 四圖係本發明所提供第三較佳實施例之結構示意圖； 第所提供第四較佳實施例之立體分解圖； ^、^係上衫四較佳實施例所提供之結構示意圖； ==所提供第五較佳實施例之立體分解圖； Ϊ夂實施例所提供之結構示意圖。 施例二圖卿本發日崎_—較佳實 施例之探針卡卜包括有一電路板1〇、 固定板14及複數個懸臂式探針16，其中： 一 該電路板10為以多層印刷電路板所 呈 一上表面101及一下表面1〇2，該電路板1〇上^目對之 應於外圈區域設有多數個導電部1〇3供測試機台電 9 201042266 接，且上表面101對應於内圈區域設有多數個導電部1〇4 供轉接板12電性連接，該電路板1〇内部設有多數個線路 100分別用以電性連接各該導電部103、104，使測試訊號 傳遞於電路板10内、外圈區域之間；該些導電部1〇4之間 有一開口 105對應供以容置該些探針16。 該轉接板12設於該電路板10上，對應於該些導電部 104及開口 1〇5之位置。該轉接板12為以多層有機材質或 多層陶瓷材質所製成，具有相對之一上、下表面121、丨22 以及佈設有多數個線路12〇導通於轉接板12之内、外側區 域之間，各該線路uo兩端對應於該轉接板12内、外侧區 域分別有-接點123、124露出該下表面122 ; _區域之 該些接點123對應位於該電路板1()之開口 1()5，外側之接 點124對應位於該電路板1〇之導電部1〇4上，因此該轉接 板12約略有—半的寬度與該電路板1G之關區域相互重 叠使該些接點m分別對應位於該些導電部顺上。由於 各》亥線路12G可使該轉接板12之内、外側區域相互電性導 通口而具有電路空間轉換的作用，以將對應於該轉接板 12外側區域之祕12G轉換朗域使成為較密集的分 佈。 該轉接板丨2外舰域對應於該些接點124上覆有一導 電片U 4導電# 11為具有單方向電性導通功能的材質， ^異方随導電膠’用以將該轉接板12之各該接點124 ▲ J對應縱向電性導通該電路板之導電部刚，因此使 〆轉接板12之線路12〇與該電路板之線路⑽相互導 201042266 通。當然，將該電路板10之導電部104與該轉接板12之 接點124電性導通方式並不限定需藉由導電>1 11;該導電 片11的5又置主要係因該電路板10上製成該些導電部103... In addition, 'semiconductor chip circuits have the tendency to be high-frequency, multi-functional integration'. In order to meet the requirements of (9) electro-research (4), the circuit board of the probe card is equipped with electronic components to make high-frequency or multi-function chips. The corresponding test requirements of the circuit 'but a large number of electronic components make the space above the board insufficient, so it is necessary to increase the space above the board to solve the problem of insufficient space. A probe card with a coplanar daughter card (PROBE CARD WITH COPLANAR DAUGHTER CARD) proposed by Taiwan Patent No. 577988 is to add a daughter card above the circuit board of the probe card, that is, a small circuit board. In the placement of electronic components and circuit layout, to increase the space above the board, but the daughter card will increase the complexity of the circuit, and the quality of the signal transmission will be affected, so increase the top of the probe card board Space is also the subject of the Eft solution required for the probe card. SUMMARY OF THE INVENTION Therefore, the main object of the present invention is to provide a replaceable probe device and a probe card for the same, which can be used for a high-density circuit distributed wafer 7 201042266 to effectively save the test of the probe card. And easy to replace or repair the probe, or repair costs. In order to achieve the foregoing, the present invention provides a device that can be placed in a board, a fixed plate, an adapter plate, and a plurality of probes. The fixing plate has a base and a mosquito net, and the locking device is used for fixing the circuit board; the base of the fixed plate is separated from the inner side and the outer side. The region surrounds the inner region, and the inner portion of the adapter plate is disposed with a plurality of wires extending between the inner and outer regions; the width of the inner region is only about half of the adapter plate to set the probes with fine pitches. The outer area is used to provide electrical connection between the circuit and the circuit board, and the fixing board is sandwiched between the circuit board; the probes are suspended from a probe base and are inside the adapter board The area is electrically connected to the lines. The probe card transmits the test signal to the adapter board via the circuit board, and then transmits the test signals correspondingly to the high-density distribution of the probes through the circuit space conversion function in the adapter board; the circuit board In addition to the circuit space where the adapter board and the fixed board need to occupy the surface, the space above the board can be used to set electronic components to meet the testing requirements of the high frequency or multi-function chip circuit; The fixing plate is fixed on the circuit board, and the adapter plate is made of a material having higher hardness. Therefore, even if only a small portion of the adapter plate is in contact with the circuit board, the fixing plate can be used. The stress support is provided to effectively prevent the adapter plate from being deformed even by temperature changes. Moreover, since the probes are assembled only in the inner area of 201042266, when there is a wafer test requirement of other circuit structures or when the probe is repaired, the shield plate is detached from the board. 'Yi 2: Fenghai adapter plate and these probes - the same removal and replacement, do not need to re-weld the probe construction as in the application to detach the circuit board, and can reuse the circuit board' effective saving The production cost and working hours of the probe card. [Embodiment] The following is a detailed description of the structure and function of the present month. The brief description of the illustrations used is as follows: ^The figure is provided by the present invention. - A perspective view of a preferred embodiment; a diagram showing the structure of the first preferred embodiment; = Figure 2 is a schematic view of the second preferred embodiment of the present invention; A schematic structural view of a third preferred embodiment is provided; a perspective exploded view of the fourth preferred embodiment is provided; ^, ^ is a schematic view of the preferred embodiment of the top four shirts; An exploded perspective view of the embodiment; a schematic view of the structure provided by the embodiment. The second embodiment of the present invention has a circuit board 1A, a fixed plate 14 and a plurality of cantilever probes 16, wherein: the circuit board 10 is printed in multiple layers. The circuit board has an upper surface 101 and a lower surface 1〇2, and the circuit board 1 is provided with a plurality of conductive portions 1〇3 for the test machine power 9 201042266, and the upper surface The plurality of conductive portions 1 〇 4 are electrically connected to the inner ring region, and the plurality of wires 100 are electrically connected to the conductive portions 103 and 104 respectively. The test signal is transmitted between the inner and outer ring regions of the circuit board 10; an opening 105 is defined between the conductive portions 1 to 4 for receiving the probes 16. The interposer 12 is disposed on the circuit board 10 corresponding to the positions of the conductive portions 104 and the openings 1〇5. The adapter plate 12 is made of a plurality of layers of organic material or a plurality of layers of ceramic material, and has a pair of upper and lower surfaces 121, 丨 22 and a plurality of wires 12 disposed in the inner and outer regions of the adapter plate 12 . Between the two ends of each of the lines uo corresponding to the inner and outer regions of the adapter plate 12, the contacts 123, 124 respectively expose the lower surface 122; the contacts 123 of the _ region are corresponding to the circuit board 1 () The opening 1 () 5, the outer contact 124 corresponds to the conductive portion 1 〇 4 of the circuit board 1 , so that the adapter plate 12 has a width of approximately half - and the overlapping area of the circuit board 1G overlaps with each other. The contacts m are respectively located corresponding to the conductive portions. Since each of the 12G lines can electrically connect the inner and outer regions of the adapter plate 12 to each other to have a circuit space conversion function, the secret 12G corresponding to the outer region of the adapter plate 12 is converted into a domain. A denser distribution. The outer plate of the adapter plate 对应2 corresponds to the contacts 124 and is covered with a conductive sheet U 4 conductive # 11 as a material having a single-directional electrical conduction function, and the heterogeneous conductive adhesive is used for the transfer. Each of the contacts 124 ▲ J of the board 12 is electrically connected to the conductive portion of the circuit board in a longitudinal direction, so that the line 12A of the 〆 argon plate 12 and the line (10) of the circuit board are mutually connected to each other. Of course, the manner in which the conductive portion 104 of the circuit board 10 and the contact 124 of the interposer 12 are electrically connected is not limited to be controlled by conduction>1; The conductive portions 103 are formed on the board 10
差因素’使各導電部1G3的厚度難免有所差 異’藉由導電片11的設置可以彌補各導電部103的厚度差 異’使该些導電部1〇3與該轉接板12之接點124可以有良 好的電性連接’不會有導電部103接觸不到接點124而無 法電性導通的情形發生。因此除了以設置導電片11的方式 補償上述製程偏差因素，藉由該些接點124使用為軟性的 導電材質，例如金、銀、鋼、錫、鎳、鈷及其合金等在常 溫下為低硬度的材質，？、要勤施壓即可產生形變以達到 彌補各導電部1〇3的尺寸差異而與各導電部ω3有良好的 電性連接。再者，—旦該電路板製成該些導電部104 後以及該轉接板12製成該些接點I24後可㈣平坦化等製 程處理’使该些導電部104與該些接點124之接合處為完 全平坦之接合平面，_；^需該導電片u村使導電; 104與接點124達到良好的電性接觸效果。 該固定板14設於該轉接板12上覆蓋該轉接板η之 表面121，該固定板14具有—固定部對應位於該轉接板12 之周緣，用錄定轉接板12於該轉板ω上的 置。以本實施例而言，係以沿著朗定板14周緣所 -邊框⑷提供為該固定部，使該邊框⑷對應 底座M2，使該底座142與該邊框⑷之間對應形成一二 置部143卩容置該轉接板12，且該邊框⑷藉由數個鎖^ 201042266 裝置13固定至該電路板10上；該容置部143之高度相當 為該轉接板12與該導電片丨丨之厚度，藉此當該些鎖設裝 置13鎖固於該電路板1〇後，可使該轉接板12與該導電片 U夾置並固定於該固定板14與該電路板10之間。該固定 板Η用以提供該轉接板12有良好的應力支撐，且相較於 該轉接板12為具有更高硬度的材質所製成，因此得以避免 5玄轉接板12受力甚至受溫度變化產生形變。底座此外， 為了增加電路板10上表面121的空間，以用於電子元件的 佈設’該固定板14的長度可設計成小於2〇%該電路板1〇 的直徑。 該些懸臂式探針16制定於-環形的探針座 该探針座15設於該轉接板12下表面122對應為該些接點 =3所環繞；各探針16之一身部161黏著於該探針座Μ， 朱針16之—針尖16G懸設於該探針座15近中心處，各 ^ 16之針尾162電性連接該轉接板12之接點123。 以對該探針座15具有高於該電路板1〇之厚度 以對應穿過_路板1G，使該些 對應凸出該電路板1G之下〈針大160得以 ^ 〇 * 〇之下表面102與待測晶圓平面相接 稽田上延可知 號經由該電叫可使測試 探針16之組裝方式為接 201042266 該轉接板12、制定板14、該探針座15及該些探針16 形成-可替換式探針襄置，當有其他電路結構的晶片測試 需求或有需進灯探針維修時，只要將該固定板14拆離該電 路板Η)’即可輕易將該轉接板12與該些探針16一同取下 更換’不需同時更換該電路板1〇。此外，該電路板川上 所設置定板U為崎蓋轉接板12為主，使整體該 電路板10的面積在扣除掉與該固定板U所重疊的部位 Ο Ο 後’其餘空間皆可用於電子元件的佈設，以達到高頻或多 功能晶片電路的測試需求。且由於該固定板用以固定該轉 f板於該電路板上，嫌__㈣具 質=此即使轉接板僅有少部分 ==供應力支樓;有效避免該轉接板受力】 化產生形變’可維持該些探針16針尖平面的平 二果：藉由本發明所 功能晶片進行高品質的電=二度且電mr或多 =如:=卡般對探針施工進行回鮮的工程：: :二複使用該電路板"’有效節省探針卡1之製 一探騎示為本發明所提供第二餘實施例之 接板12 有同於上述第—較佳實施例之電路板10、轉 差里在板14及探針座】5 ’與上述第一較佳實施例之 設_裸針各?:20具有-裸針2]及接 鳊2之V線23,使該導線23之一端 13 201042266 /、名裸針21之尾端22 一同固定於該探針座15，該導線23 之另端則電性連接該轉接板12之接點123 ;該導線23 可以-金屬線包覆有良好絕緣材質的單芯導線所製成，或 者為於金屬線外先後包覆有絕緣材質及金屬材質的套管所 構成類似同頻傳輸線結構的同軸導線’帛以使訊號傳遞於 米十〇時與環境巾的雜訊或相鄰探針如所傳遞訊號有良 好的電性阻隔效果。且由於麟針座15為高於該電路板 10,厚度’使該探針2〇自探針座15連接至轉接板12之 …t同樣㊉大於錢路板1G之厚度；藉由該導線23可使 ίΙΛυ於顧針2G上傳輸時，於該轉接板12 】 的傳：路徑上達到隔絕電性干擾的作用。 如第四_示為本發明所提供第三較佳實施例之 定^ 14 同於上述第—較佳實施例之電路板10、固 異狀-轉^ Μ及探針16 ’與上料―触實施例之差 者^有二該轉接板3〇類似於上述實施例所提供 :==線路3〇0導通於轉接板3。之内'外側區域 環設有H 31^3()對應於該電路板1G開σ 1G5之邊緣 該凸1之=該__向凸設有預定之高度， 線路之凹槽32供錢置該探針座15;各該 33,該接點33供該該凸部31表面形成有一接點 探針座15甚至該電^ •性連接’該凸部31係小於該 點33接設時有較充分的組Gf。’以使該探針16與該捿 藉由該凸部31 °又11，可使該探針16自探針座15 201042266 上接設至該轉接板30之接點33僅有少部分裸露於空氣中 的裸針部位。當探針為高密集度的設置需求時，可不必 如上述第二實施例之探針2G般需設置導線23結構以隔絕 電針擾反祕去探針的設置㈣；由於祕接幻為 接近探針16之身部161，可因此絃去-辦从1 ” " J因此縮紐探針16之裸針結構， 有效減少訊號於探針16傳遞時的電性干擾效應。 請參閱如第五及第六騎示為本伽所提供第四較佳實 〇 補之一探針卡4，具有一電路板40、-轉接板42、一固 定板44及同社述第二實關所提供找探針座15及探 針20，其中： 該電路板40具有相對之一上表面4〇1及一下表面 402，該電路板40上表面彻對應於外圈區域設有多數個 導電部403供測試機台電性連接，且下表面4〇2對應於内 圈區域設有多數個導電部404供該轉接板42電性連接，該 電路板40内部設有多數個線路4〇〇分別用以電性連接各該 〇 導電部403、彻，使測試訊號傳遞於電路板40内、外圈 區域之間。 该轉接板42係设於該電路板4〇之下表面402，具有 相對之-上、下表面421、422以及佈設有多數個線路42〇 導通於轉接板42之内、外側區域之間，各該線路42〇兩端 對應於該轉接板42内、外侧區域分別有一接點423露出該 下表面422以及一接點424露出該上表面421，外側之接 點424分別對應於該電路板40之各導電部4〇4以供電性連 接；而各該線路420可使該轉接板42之内、外側區域相互 15 201042266 電性導通。該轉接板42外侧區域對應於該些接點424上更 覆有一導電片41，以將該轉接板42之各該接點424分別 對應縱向電性導通該電路板40之導電部404，因此使該轉 接板42之線路420與該電路板40之線路400松互導通。 該固定板44覆蓋該轉接板42之下表面422，係具有 一底座441、環繞該底座441之一固定部442以及穿設該 底座441之一開口 443。該固定部442對應環繞該轉接板 42之周緣’使該轉接板42由該底座441及固定部442所 支推’該固定部442更設有數個鎖設裝置43供以與該電路 板40相固接’使該固定板44與該電路板40之間構成之一 容置部’藉此使該轉接板42與該導電片41夾置並固定於 該容置部，由該固定板44提供該轉接板42有良好的應力 支撐，且由於該電路板4〇為多層印刷電路板結構，相較於 該轉接板12為具有更高硬度的材質，因此得㈣免該轉接 板12夂力甚至受溫度變化產生形變。該開口 441之大小係 對應可露出該轉接板42内側區域之接點423，使該探針座 15及該些探針2〇得以穿過該開口相設於該轉接板^， 並使及些彳續2〇得时別電性連接該些 導電部423。 因此本實施例所提供之該探針卡4不但有同於上述實 施例所提供者之魏’可使職減自該電路板 40之線路 产们0至/亥轉接板42之線路420以至高密度分佈的各該 μ以及可&易將該轉接板42與該些探針2G取下以 雷路;二更換或轉卫程；且更由於該轉接板42係設於該 電路板40之下矣工 表面402，該固定板44覆蓋該轉接板42之 16 201042266 下表面422，使該電路板40上表面401有更多的空間可用 於電子元件的佈設’以達到高頻或多功能晶片電路的測試 需求。 請參閱如第七圖及第八圖所示為本發明所提供第五較佳 實施例之一探針卡5，具有一電路板50、一轉接板52、一 固定板54、一探針座55及多數個垂直式探針56，其中： 該電路板50具有相對之一上表面501及一下表面 q 502，該電路板50上表面501對應於外圈區域設有多數個 導電部503供測試機台電性連接，且上表面對應於内 圈區域設有多數個導電部504供該轉接板52電性連接，該 電路板50内部設有多數個線路5〇〇分別用以電性連接各該 導電部503、504，使測試訊號傳遞於電路板5〇内、外圈 區域之間。該些導電部504之間有一開口 505對應供以容 置該探針座55及該些探針56。 該轉接板52係以軟性電路板(Flexible printed dteuit ; ❹ FPC)所製成，設於該祕板50之上表面5(Π，並具有相對 之一上、下表面52卜522以及佈設有多數個線路52〇導通 於轉接板52之内、外側區域之間’各該線路52〇兩端對應 於該轉接板52内、外侧區域分別有一接點523、524露出 該下表面似，外側之接點似分別對應於該電路板5〇之 各導電部谢以供電性連接。由於製程的因素，使得該電 路板50各導電部503的高度有所差異，因此該轉接板& 以軟性電路板之材質可以緊_合於各導電部⑽，使該 些導電部503與該轉接板52外側區域之接點524可以有良 17 201042266 好的電性接觸，因此使該轉接板52之線路52〇與該電路板 50之線路5〇〇相互導通。 由於本實施例所使用的是垂直式探針56，各探針56 沿針身即垂直對應至轉接板52内側區域之接點523，所以 該轉接板52的設計係將對應於該轉接板52外側區域之線 路520間距轉換至内側區域為較小的間距，使各探針56 得以對應密集的分佈。 該固定板54設於該轉接板52上覆蓋該轉接板52之上 表面521 ’使該固定板54之一固定部541對應位於該轉接 〇 板52之周緣，該固定板54之一底座542對應設置該轉接 板52 ;且該固定部541藉由數個鎖設裝置53固定至該電 路板50上，使該固定板54與該電路板5〇之間構成一容置 部，藉此使該轉接板52夾置並固定於該容置部，由該固定 板54提供该轉接板52有良好的應力支撐；且該固定板54 相較於該轉接板52為具有更高硬度的材質所製成，因此得 以避免該轉接板52受力甚至受溫度變化產生形變。該開口 505之大小係對應可露出該轉接板52内側區域之接點 U 523，使該探針座55及該些探針56得以穿過該開口 5〇5 設於該轉接板52之下表面522，並使該些探針％得以分 別電性連接該些導電部523。 唯，以上所述者，僅為本發明之較佳可行實施例而已， 故舉凡應用本發明說明書及申請專利範圍所為之等效結樽 變化’理應包含在本發明之專利範圍内。 18 201042266 【圖式簡單說明】 第一圖係本發明所提供第一較佳實施例之立體分解 圖， 第二圖係上述第一較佳實施例所提供之結構示意圖； 第三圖係本發明所提供第二較佳實施例之結構示意 圖， 第四圖係本發明所提供第三較佳實施例之結構示意 圖； 第五圖係本發明所提供第四較佳實施例之立體分解 圖， 第六圖係上述第四較佳實施例所提供之結構示意圖； 第七圖係本發明所提供第五較佳實施例之立體分解 圖， 第八圖係上述第五較佳實施例所提供之結構示意圖； 第九圖A及第九圖B係習用探針卡之結構示意圖。 19 201042266 【主要元件符號說明】 1、2、3、4、5探針卡 10、40、50電路板 100、 120、300、400、420、500 線路 101、 121、401、421、501 上表面 102、 122、402、422、502 下表面 103、 104、403、404、503、504 導電部 105、443、505 開口 Η、41 導電片 12、30、42、52轉接板 13鎖設裝置 123、124、33、423、424、523、524 接點 14、 44、54固定板 142、542 底座 15、 55探針座 160針尖 162針尾 22尾端 31凸部 441底座 141邊框 143容置部 16、20、56 探針 161身部 21裸針 23導線 32凹槽 442、541固定部 20The difference factor 'the thickness of each of the conductive portions 1G3 is inevitably different'. The difference in thickness of each of the conductive portions 103 can be compensated by the arrangement of the conductive sheets 11 to make the contacts 124 of the conductive portions 1 and 3 with the interposer 12 There can be a good electrical connection 'there is no situation in which the conductive portion 103 does not contact the contact 124 and cannot be electrically turned on. Therefore, in addition to compensating the above-mentioned process deviation factors in the manner of providing the conductive sheets 11, the conductive materials made of soft conductive materials such as gold, silver, steel, tin, nickel, cobalt and alloys thereof are low at normal temperature. Hardness material,? In order to compensate for the difference in size of each of the conductive portions 1〇3, a good electrical connection is made to each of the conductive portions ω3. Moreover, after the circuit board is formed with the conductive portions 104 and the adapter plate 12 is formed into the contacts I24, the process can be planarized (such as planarization) to make the conductive portions 104 and the contacts 124. The joint is a completely flat joint plane, and the conductive sheet u is required to conduct electricity; 104 and the joint 124 achieve good electrical contact effect. The fixing plate 14 is disposed on the adapter plate 12 to cover the surface 121 of the adapter plate η. The fixing plate 14 has a fixing portion corresponding to the periphery of the adapter plate 12, and the recording adapter plate 12 is used for the rotation. Set on the board ω. In this embodiment, the fixing portion is provided along the periphery of the slab 14 and the frame (4), so that the frame (4) corresponds to the base M2, so that the base 142 and the frame (4) are correspondingly formed into a two-part portion. The arranging plate 12 is disposed on the 144, and the frame (4) is fixed to the circuit board 10 by a plurality of locks 201042266. The height of the receiving portion 143 is equivalent to the adapter plate 12 and the conductive sheet 丨The thickness of the crucible, whereby the adapter plate 12 and the conductive sheet U are sandwiched and fixed to the fixing plate 14 and the circuit board 10 after the locking device 13 is locked to the circuit board 1 between. The fixing plate is used to provide good stress support of the adapter plate 12, and is made of a material having higher hardness than the adapter plate 12, thereby avoiding the force of the 5x adapter plate 12 or even Deformed by temperature changes. In addition, in order to increase the space of the upper surface 121 of the circuit board 10 for the layout of electronic components, the length of the fixing plate 14 can be designed to be less than 2% by the diameter of the circuit board 1〇. The cantilever probes 16 are formed on the ring-shaped probe base. The probe holders 15 are disposed on the lower surface 122 of the adapter plate 12 corresponding to the contacts=3; one of the probes 16 is attached to the body 161. In the probe holder, the needle tip 16G is suspended near the center of the probe holder 15 , and the pin tails 162 of each of the pins 16 are electrically connected to the contacts 123 of the adapter plate 12 . The probe holder 15 has a thickness higher than the thickness of the circuit board 1 to correspond to the through-plate 1G, so that the corresponding protrusions protrude below the circuit board 1G. 102 is connected to the plane of the wafer to be tested, and the stacking of the test probe 16 can be used to connect the test probe 16 to the 201042266. The adapter board 12, the board 14 , the probe holder 15 and the probes 16 forming-replaceable probe device, when there is a wafer test requirement of other circuit structure or when there is a need to repair the lamp probe, the detachment plate 14 can be easily detached from the circuit board Η) The board 12 is removed and replaced with the probes 16 without replacing the board 1 at the same time. In addition, the fixed plate U disposed on the circuit board is mainly the bottom cover adapter plate 12, so that the entire area of the circuit board 10 is deducted from the portion overlapping the fixed plate U. The placement of electronic components to meet the testing needs of high frequency or multi-function chip circuits. And because the fixing plate is used to fix the rotating plate on the circuit board, the __(four) is qualitative=this even if only a small part of the adapter plate == supply force branch; effectively avoiding the force of the adapter plate Producing a deformation 'can maintain the flat surface of the probe 16 needle tip plane: by the functional wafer of the present invention for high quality electricity = two degrees and electric mr or more = such as: card to rejuvenate the probe construction Engineering:: Two-time use of the circuit board "Efficient saving of the probe card 1 is shown in the present invention. The second embodiment of the present invention is the same as the above-described preferred embodiment. The circuit board 10, the difference between the board 14 and the probe holder 5' and the first preferred embodiment of the first preferred embodiment _ bare needle each: 20 has - bare needle 2] and the V line 23 of the interface 2, so that One end 13 of the wire 23 201042266 /, the end 22 of the name bare pin 21 is fixed together with the probe base 15, the other end of the wire 23 is electrically connected to the contact 123 of the adapter plate 12; -The metal wire is made of a single-core wire coated with a good insulating material, or is a casing made of an insulating material and a metal material. Co-frequency coaxial cable transmission line structure 'noise silk so that the signal transmission environment when the napkin to ten square meters or adjacent probes as transmitted signals have good barrier effect good electrical properties. And because the pedestal pin 15 is higher than the circuit board 10, the thickness 'the probe 2 连接 is connected from the probe holder 15 to the adapter plate 12...t is also greater than the thickness of the money board 1G; by the wire 23 can be used to transmit electrical interference on the transmission path of the adapter board 12 when transmitting on the 2G. For example, the fourth embodiment of the present invention is the same as the circuit board 10 of the above-described first preferred embodiment, the solid-shaped-turning mechanism, and the probe 16' and the loading- The difference between the embodiment and the second embodiment is similar to that of the above embodiment: == line 3〇0 is conducted through the interposer 3. The outer region ring is provided with H 31^3 () corresponding to the edge of the circuit board 1G opening σ 1G5. The convex 1 = the __ convex is provided with a predetermined height, and the groove 32 of the line is provided for the money. Each of the 33, the contact 33 is provided with a contact probe holder 15 on the surface of the convex portion 31, and even the electrical connection portion 31 is smaller than when the point 33 is connected. Full group Gf. In order for the probe 16 and the cymbal to be attached to the contact 33 of the adapter plate 30 from the probe base 15 201042266 by the convex portion 31 ° 11 , only a small portion of the probe 33 can be exposed. The area of the bare needle in the air. When the probe is in a high-density setting requirement, it is not necessary to set the wire 23 structure as in the probe 2G of the second embodiment described above to isolate the setting of the electroacupuncture anti-mystery probe (4); The body portion 161 of the probe 16 can thus be detached from the 1" "J thus the bare needle structure of the retracting probe 16, effectively reducing the electrical interference effect when the signal is transmitted by the probe 16. See, for example, The fifth and sixth riding bicycles provide a fourth preferred embodiment of the probe card 4, which has a circuit board 40, an adapter plate 42, a fixing plate 44, and a second real-world office provided by the same company. The probe base 15 and the probe 20 are found, wherein: the circuit board 40 has a pair of upper surface 4〇1 and a lower surface 402. The upper surface of the circuit board 40 has a plurality of conductive portions 403 corresponding to the outer ring region. The test machine is electrically connected, and the lower surface 4〇2 is provided with a plurality of conductive portions 404 for electrically connecting the adapter plate 42 to the inner ring region, and a plurality of wires 4 are respectively disposed inside the circuit board 40. Electrically connecting each of the conductive portions 403 and transmitting the test signals to the inner and outer ring regions of the circuit board 40 The adapter plate 42 is disposed on the lower surface 402 of the circuit board 4, has opposite upper and lower surfaces 421, 422, and is provided with a plurality of wires 42 and is electrically connected to the inner and outer regions of the adapter plate 42. Between the two ends of each of the lines 42 对应 corresponding to the inner and outer regions of the adapter plate 42 respectively, a contact 423 exposes the lower surface 422 and a contact 424 exposes the upper surface 421, and the outer contacts 424 respectively correspond to Each of the conductive portions 4〇4 of the circuit board 40 is electrically connected; and each of the lines 420 electrically connects the inner and outer regions of the adapter plate 42 to each other 15 201042266. The outer region of the adapter plate 42 corresponds to the The contacts 424 are further provided with a conductive strip 41 for electrically connecting the conductive portions 404 of the circuit board 40 to the respective contacts 424 of the interposer 42 respectively, thereby making the line 420 of the interposer 42 The fixing plate 44 covers the lower surface 422 of the adapter plate 42 and has a base 441, a fixing portion 442 surrounding the base 441, and one of the bases 441. Opening 443. The fixing portion 442 correspondingly surrounds the circumference of the adapter plate 42 The adapter plate 42 is supported by the base 441 and the fixing portion 442. The fixing portion 442 is further provided with a plurality of locking devices 43 for fixing to the circuit board 40. The fixing plate 44 and the circuit board are fixed. A receiving portion is formed between the 40, so that the adapter plate 42 and the conductive sheet 41 are sandwiched and fixed to the receiving portion, and the fixing plate 44 provides the adapter plate 42 with good stress support. Moreover, since the circuit board 4 is a multi-layer printed circuit board structure, compared with the adapter board 12, which has a higher hardness, it is possible to prevent the adapter board 12 from being deformed even by temperature changes. The opening 441 is sized to correspond to the contact 423 of the inner region of the adapter plate 42 so that the probe holder 15 and the probes 2 are disposed through the opening and disposed on the adapter plate. And the subsequent conductive portions 423 are electrically connected. Therefore, the probe card 4 provided in this embodiment not only has the same line as the one provided in the above embodiment, but also reduces the line 420 from the circuit board 40 to the line 420 of the circuit board 40. The high-density distribution of the μ and the easy to remove the adapter plate 42 and the probes 2G to a lightning path; two replacement or transfer process; and more because the adapter plate 42 is attached to the circuit The lower surface 422 of the board 40 is covered by the lower surface 422 of the board 40, so that the upper surface 401 of the board 40 has more space for the layout of the electronic components to achieve high frequency. Or test requirements for multi-function chip circuits. Referring to FIG. 7 and FIG. 8 , a probe card 5 according to a fifth preferred embodiment of the present invention has a circuit board 50 , an adapter plate 52 , a fixing plate 54 , and a probe . And a plurality of vertical probes 56, wherein: the circuit board 50 has an opposite upper surface 501 and a lower surface q 502. The upper surface 501 of the circuit board 50 is provided with a plurality of conductive portions 503 corresponding to the outer ring region. The test machine is electrically connected, and the upper surface is provided with a plurality of conductive portions 504 corresponding to the inner ring region for electrically connecting the adapter plate 52. The circuit board 50 is internally provided with a plurality of wires 5 for electrically connecting. Each of the conductive portions 503 and 504 transmits a test signal between the inner and outer ring regions of the circuit board 5. An opening 505 is defined between the conductive portions 504 for receiving the probe holder 55 and the probes 56. The adapter plate 52 is made of a flexible printed circuit board (FPC), and is disposed on the upper surface 5 of the secret panel 50 (Π, and has a pair of upper and lower surfaces 52 and 522 and is provided with a cloth A plurality of wires 52 are electrically connected between the inner and outer regions of the adapter plate 52. The two ends of the wires 52 are corresponding to the inner and outer regions of the adapter plate 52, and a contact point 523, 524 is respectively exposed to the lower surface. The outer contacts seem to correspond to the conductive portions of the circuit board 5 respectively, and the power supply connection is made. Due to the process factor, the heights of the conductive portions 503 of the circuit board 50 are different, so the adapter plate & The material of the flexible circuit board can be tightly integrated with the conductive portions (10), so that the conductive portions 524 and the contact portion 524 of the outer region of the adapter plate 52 can have good electrical contact with the good 17 201042266, thus making the transfer The line 52 of the board 52 is electrically connected to the line 5 of the board 50. Since the vertical probe 56 is used in this embodiment, each probe 56 vertically corresponds to the inner area of the adapter board 52 along the needle body. Contact 523, so the design of the adapter plate 52 will correspond to the The pitch of the line 520 in the outer region of the board 52 is switched to the inner area to be a small pitch, so that the probes 56 are correspondingly densely distributed. The fixing board 54 is disposed on the board 52 to cover the board 52. The surface 521 ′ is such that the fixed portion 541 of the fixing plate 54 is located at the periphery of the transfer slab 52 . The base 542 of the fixing plate 54 is correspondingly disposed with the adapter plate 52 ; and the fixing portion 541 is provided by a plurality of locks The device 53 is fixed to the circuit board 50, and a receiving portion is formed between the fixing plate 54 and the circuit board 5, whereby the adapter plate 52 is sandwiched and fixed to the receiving portion. The fixing plate 54 provides the adapter plate 52 with good stress support; and the fixing plate 54 is made of a material having higher hardness than the adapter plate 52, so that the adapter plate 52 is prevented from being stressed or even The opening 505 is sized to correspond to the contact U 523 that exposes the inner region of the adapter plate 52, so that the probe holder 55 and the probes 56 can be disposed through the opening 5〇5. The lower surface 522 of the adapter plate 52, and the probes are electrically connected to the guides respectively The above description is only for the preferred embodiment of the present invention, and the equivalent variation of the specification and the scope of the patent application is intended to be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective exploded view of a first preferred embodiment of the present invention, and the second drawing is a schematic structural view of the first preferred embodiment; 2 is a schematic structural view of a third preferred embodiment of the present invention; FIG. 5 is a perspective exploded view of a fourth preferred embodiment of the present invention; 6 is a schematic structural view of the fourth preferred embodiment; the seventh embodiment is a perspective exploded view of the fifth preferred embodiment of the present invention, and the eighth embodiment is the structure provided by the fifth preferred embodiment. Schematic diagrams; ninth diagram A and ninth diagram B are schematic diagrams of the conventional probe card. 19 201042266 [Description of main component symbols] 1, 2, 3, 4, 5 probe cards 10, 40, 50 circuit boards 100, 120, 300, 400, 420, 500 lines 101, 121, 401, 421, 501 upper surface 102, 122, 402, 422, 502 lower surface 103, 104, 403, 404, 503, 504 conductive portion 105, 443, 505 opening Η, 41 conductive sheet 12, 30, 42, 52 adapter plate 13 locking device 123 , 124, 33, 423, 424, 523, 524 contacts 14, 44, 54 fixing plates 142, 542 base 15, 55 probe holder 160 needle tip 162 pin tail 22 tail end 31 convex portion 441 base 141 frame 143 housing portion 16 , 20, 56 probe 161 body 21 bare needle 23 wire 32 groove 442, 541 fixing portion 20