TWI689731B - Probe card testing device and signal switching module thereof - Google Patents

Abstract

The present disclosure discloses a probe card testing device and a signal switching module thereof. The signal switching module includes a substrate, a plurality of test modules, and a plurality of first electrical connectors. The substrate has a top surface and a bottom surface. The test modules are disposed on the top surface and are located in a wafer test area. Each test module includes a central area and a plurality of test metal pads surrounding the central area. The first electrical connectors are located in a signal transfer area and are electrically coupled to the test modules. Each first electrical connector includes a plurality of electrical contacts, the contacts are disposed on the top surface, and at least a portion of the electrical contacts are electrically coupled to the test metal pads of the corresponding test module via a plurality of signal fan-out lines. The first electrical connectors are electrically coupled to the second electrical connectors.

Description

Probe card testing device and its signal transfer module

The invention relates to a probe card testing device and its signal conversion module, in particular to a probe card testing device and its signal conversion module suitable for peripheral chip testing.

Because peripheral chips (such as complementary metal oxide semiconductor image sensors, LCD driver chips, or memory... etc.) are generally tested using a cantilever probe card, however, this type of The probe card needs to be manually pulled to connect the signal to connect the signal, the time of the wire implantation operation is longer, and in the case of multi-die testing, the difficulty of the wire implantation operation and maintenance operation will be greatly improved. Another test method is to use MEMS Probe Card (MEMS Probe Card) for testing, however, the limitation of this probe card is that it must use a ceramic substrate, and the structure of this probe card is not easy to maintain, for example : When the probe is damaged, in addition to removing the probe, you must weld the new probe for maintenance. It must depend on the equipment, and manual work is not easy to complete.

Therefore, the inventor believes that the above-mentioned defects can be improved, and Naite devotes himself to research and cooperates with the application of scientific principles, and finally proposes a reasonable design and effectively improves the above-mentioned defects of the present invention.

The technical problem to be solved by the present invention is to provide a A probe card testing device.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a probe card testing device which defines a wafer test area and a signal transfer area located around the wafer test area, and The probe card testing device includes: a signal conversion module, including: a substrate with a top surface and a bottom surface located on opposite sides; a plurality of test modules are provided on the substrate and located on the crystal A circular test area; wherein each of the test modules includes a central area and a plurality of test metal pads provided along the periphery of the central area; a plurality of first electrical connectors are provided on the substrate and are located on the A signal transfer area, and a plurality of the first electrical connectors are respectively electrically coupled to the plurality of test modules; wherein each of the first electrical connectors includes a plurality of electrical contacts; and a plurality of A signal fan-out line is provided on the substrate; wherein at least part of the plurality of electrical contacts of each of the first electrical connectors passes through the plurality of signal fan-out lines respectively Part of the signal fan-out line is electrically coupled to a plurality of test metal pads corresponding to the test module; a probe head module is located on the top surface of the signal conversion module On one side, and the probe head module includes: a positioning base; and a plurality of probe assemblies, which are located in the positioning base, in the wafer test area, and correspond in position to A plurality of the test modules of the signal conversion module; wherein, each of the probe assemblies includes a plurality of conductive probes arranged in a ring shape, and one end of the plurality of conductive probes passes through the positioning seat A plurality of test metal pads respectively corresponding to the corresponding test module, and the other ends of the plurality of conductive probes pass through the positioning seat body and are used to bear against a test object ; And a test circuit board, located on one side of the bottom surface of the signal transfer module, and provided with a plurality of second electrical connectors located in the signal transfer area, and a plurality of the second electrical The connectors are respectively electrically coupled to the plurality of first electrical connectors.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a signal conversion module of a probe card testing device, which defines a wafer testing area and A signal transfer area located around the wafer test area, and the signal transfer module of the probe card test device includes: a substrate; a plurality of test modules, disposed on the substrate, and located on the crystal A circular test area; wherein each of the test modules includes a central area and a plurality of test metal pads disposed along the periphery of the central area; and a plurality of first electrical connectors, which are disposed on the substrate and are located The signal transfer area, and a plurality of the first electrical connectors are respectively electrically coupled to the plurality of test modules; wherein each of the first electrical connectors includes a plurality of electrical contacts; and A signal fan-out line is provided on the substrate; wherein at least part of the plurality of electrical contacts of each of the first electrical connectors is fanned out through the plurality of signals respectively Part of the circuit, the signal fan-out circuit is electrically coupled to the corresponding plurality of test metal pads of the test module; wherein, the plurality of first electrical connectors are respectively configured to be electrically coupled to the setting A plurality of second electrical connectors on a test circuit board.

One of the beneficial effects of the present invention is that the probe card testing device disclosed in the embodiments of the present invention can pass the positioning of the multiple test modules of the signal transfer module and the multiple first electrical connectors and the probe head module The structure of the base body and the multiple probe assemblies, the test circuit board and other components of the test circuit board and the connection relationship between them, to replace the traditional peripheral type wafer test probe card needs to be connected by manual wire bonding The signal can enable multiple conductive probes to perform needle implantation in a straight up and down manner, thereby greatly reducing the needle implantation operation time of the conductive probe, and can greatly reduce the difficulty of maintaining the probe card testing device.

In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.

100: probe card test device

1: Signal transfer module

11: substrate

111: top surface

112: underside

113: opening

12: Test module

121: Central area

122: Test metal pad

123: Signal fan-out line

1231: Outer signal fan-out line

1232: Inner signal fan-out line

124: High-frequency signal metal pad

13: The first electrical connector

131: Electrical contact

14: soft cable

15: Flexible carrier board

2: Probe head module

21: Position the seat body

211: opening

212: opening

22: Probe assembly

221: Conductive probe

3: Test circuit board

31: Second electrical connector

32: Signal receiving metal pad

33: through hole

4: Support plate

41: Piercing

42: light transmission hole

5: pressed structure

51: Press board

52: screw

6: High-frequency signal transmission cable

7: Protection cover

71: accommodating space

72: through hole

8: Probe head mount

T: thickness direction

R1: Wafer test area

R2: Signal transfer area

O: test object

P1: first pitch

P2: second pitch

L: light

FIG. 1 is a schematic cross-sectional view of a probe card testing device according to a first embodiment of the invention.

FIG. 2 is a schematic exploded view of FIG. 1.

FIG. 3 is a schematic top view of the probe card testing device according to the first embodiment of the present invention (the probe head module is omitted).

FIG. 4 is a partially enlarged schematic view of area IV of FIG. 3.

5 is a schematic cross-sectional view of a probe card testing device according to a second embodiment of the invention.

6A is a schematic cross-sectional view of a probe card testing device according to a third embodiment of the invention.

6B is a schematic cross-sectional view of a probe card testing device according to a fourth embodiment of the invention.

7A is a schematic cross-sectional view of a probe card testing device according to a fifth embodiment of the invention.

7B is a schematic cross-sectional view of a probe card testing device according to a sixth embodiment of the invention.

8 is a schematic top view of a probe card testing device according to the fifth and sixth embodiments of the present invention (probe head module omitted).

9 is a schematic cross-sectional view of a probe card testing device according to a seventh embodiment of the invention.

FIG. 10 is a partially enlarged schematic view of the area X of FIG. 8.

FIG. 11 is a schematic plan exploded view of a probe card testing device according to a ninth embodiment of the present invention.

12 is a schematic plan exploded view of a probe card testing device according to a tenth embodiment of the present invention.

The following are specific specific examples to illustrate the disclosed embodiments of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual sizes, and are declared in advance. The following embodiments will further detail related technical contents of the present invention, but the disclosed The content is not intended to limit the scope of protection of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" as used herein may include any combination of any one or more of the associated listed items, depending on the actual situation. Furthermore, the term "electrically coupled" used herein refers to one of "indirect electrical connection" and "direct electrical connection".

[First embodiment]

Refer to FIG. 1 to FIG. 4, which is the first embodiment of the present invention. This embodiment discloses a probe card testing device 100. The probe card testing device 100 is particularly suitable for testing peripheral chips (such as complementary metal oxide semiconductor image sensors, liquid crystal display driver chips, or memory...), but the invention is not limited to this . Further, the probe card testing device 100 includes a signal adapter module 1, a probe head module 2 disposed on the signal adapter module 1 side, and a signal adapter module 1 a test circuit board 3 on the other side, a pressing structure 5 provided between the signal adapter module 1 and the probe head module 2, and a signal adapter module 1 and A supporting board body 4 between the test circuit boards 3. Wherein, the test circuit board 3, the support board body 4, the signal conversion module 1, the pressing structure 5, and the probe head module 2 are sequentially stacked along a thickness direction T in this embodiment, but the present invention Not limited to this.

It should be noted that, in order to facilitate understanding of this embodiment, the drawings only show a partial structure of the probe card testing device 100, so as to clearly present the structure and connection relationship of each element of the probe card testing device 100. Hereinafter, the structure and connection relationship of each element of the probe card testing apparatus 100 of this embodiment will be described separately.

As shown in FIGS. 1 and 3, in this embodiment, the probe card testing device 100 defines a wafer test area R1 and a signal transfer area R2 located around the wafer test area R1.

The signal conversion module 1 includes a substrate 11, multiple test modules 12, and multiple first electrical connectors 13. It is worth mentioning that although the signal conversion module 1 of this embodiment is matched with the probe head module 2, the test circuit board 3, the support board body 4, and the pressing structure 5 for illustration, the The practical application of the signal transfer module 1 is not limited to this. In other words, the signal conversion module 1 may also be a product sold separately, or may be used in conjunction with other components.

Further, in the present embodiment, the substrate 11 has a substantially circular plate shape, but the present invention is not limited to this. For example, the substrate 11 may also have a rectangular plate shape, a polygonal plate shape, or be designed into other shapes according to product design requirements. Furthermore, the substrate 11 has a top surface 111 and a bottom surface 112 on opposite sides. Wherein, the top surface 111 of the substrate 11 is a flat surface with insulating properties, and can provide the test metal pad 122 and the signal fan-out line 123 disposed on it as described below. Furthermore, the bottom surface 112 of the substrate 11 is also a flat surface with insulating properties, and can be in contact with the support plate 4. Preferably, the portion where the bottom surface 112 of the substrate 11 abuts the support plate body 4 is not provided with any metal pads or wires. That is to say, in the substrate 11 of this embodiment, only the top surface 111 is provided with metal pads or circuits, but the bottom surface 112 is not provided with metal pads or circuits.

The plurality of test modules 12 are disposed on the top surface 111 of the substrate 11, the plurality of test modules 12 are located in the wafer test area R1, and the plurality of test modules 12 are respectively electrically coupled to the plurality of first electrical connections器13. 13. More specifically, in this embodiment, the plurality of test modules 12 are arranged in a matrix (as shown in FIG. 3), but the present invention is not limited to this. For example, the plurality of test modules 12 may also be arranged in a staggered manner or arranged in other ways. As shown in FIG. 4, each of the test modules 12 includes a center area 121 and a plurality of test metal pads 122. The plurality of test metal pads 122 are spaced apart from each other and are arranged along the periphery of the center area 121.

It should be noted that, in this embodiment, the test metal pad 122 is described as a square, but in actual application, the shape of the test metal pad 122 can be adjusted and changed according to design requirements (eg, round, rectangular , Or irregular shapes).

Please continue to refer to FIG. 1 to FIG. 4, the signal conversion module 1 is further provided with a plurality of signal fan-out lines 123 on the top surface 111 of the substrate 11, and the plurality of signal fan-out lines 123 are spaced apart from each other, and Arranged in a divergent pattern. The plurality of signal fan-out lines 123 all pass through the wafer test area R1 and the signal transfer area R2. In other words, a plurality of the signal fan-out lines 123 are spanned across the wafer test area R1 and the signal transfer area R2. In this embodiment, each of the test modules 12 (including the central area 121 and a plurality of test metal pads 122) and a plurality of signal fan-out lines 123 are directly formed on the top surface 111 of the substrate 11 through a lithography process, However, the present invention is not limited to this.

More specifically, according to the structure of the peripheral type wafer, the central area 121 of each test module 12 does not have any metal pads and wires, and can expose the top surface 111 of the substrate 11. Each of the test metal pads 122 can provide the following conductive probe 221 to bear on it. Furthermore, each of the signal fan-out lines 123 can transfer the signal tested by the conductive probe 221 from the wafer test area R1 to the signal transfer area R2 and then to the first electrical connector 13.

Please continue to refer to FIG. 4, each of the first electrical connectors 13 includes a plurality of electrical contacts 131, and the plurality of electrical contacts 131 are disposed on the top surface 111 of the substrate 11. In other words, the plurality of electrical contacts 131, the plurality of test metal pads 122 and the plurality of signal fan-out lines 123 are disposed on a common plane (eg, top surface 111), but the invention is not limited Here. For example, if the number of test points of the wafer to be tested is too large or the distribution density is too dense, the substrate 11 may also be a multi-layer structure with an inner layer, and the above-mentioned multiple electrical contacts 131 and multiple test metals The pad 122 or the plurality of signal fan-out lines 123 can also be distributed in the multilayer structure of the substrate 11 according to design requirements, for example, to avoid short circuit. Further, in this embodiment, in each test module 12 corresponding to the first electrical connector 13, the number of the plurality of electrical contacts 131 is equal to the number of the plurality of test metal pads 122 And the plurality of electrical contacts 131 are electrically coupled to the plurality of test metal pads 122 of the corresponding test module 12 through at least part of the signal fan-out lines 123 of the plurality of signal fan-out lines 123, but the invention Not limited to this. Embodiments not shown in the invention In this case, the number of the plurality of electrical contacts 131 of each first electrical connector 13 may also be greater than the number of the plurality of test metal pads 122 of the corresponding test module 12, and At least part of the electrical contacts 131 of the electrical contacts 131 are electrically coupled to the plurality of test metal pads 122 of the corresponding test module 12 through at least part of the signal fan-out lines 123 of the plurality of signal fan-out lines 123 (FIG. Not shown).

According to the above configuration, the signals received by the plurality of test metal pads 122 can be transmitted to the plurality of columnar shapes inside the first electrical connector 13 through the plurality of signal fan-out lines 123 and the plurality of electrical contacts 131, respectively Conductor (not labeled).

Further, in each of the first electrical connectors 13 and the test module 12 corresponding thereto, the distance between each test metal pad 122 and its adjacent test metal pad 122 is defined as a first pitch P1, The distance between each electrical contact 131 and its adjacent electrical contact 131 is defined as a second interval P2, and the second interval P2 is greater than the first interval P1. That is to say, the signal conversion module 1 in this embodiment includes a signal fan-out structure, but the invention is not limited thereto.

It is worth mentioning that, in an embodiment not shown in the present invention, a plurality of the signal fan-out lines 123 may be preferably covered with a solder insulation layer (such as green paint) to avoid signal fan-out lines 123 Damage or oxidation occurs.

As shown in FIGS. 1 and 2, the probe head module 2 is located on the side of the top surface 111 of the substrate 11 of the signal conversion module 1 (as shown in FIG. 1, the upper side of the signal conversion module 1 ). In other words, the top surface 111 of the substrate 11 of the signal conversion module 1 faces the probe head module 2 along the thickness direction T.

More specifically, the probe head module 2 includes a positioning base 21 and a plurality of probe assemblies 22. Wherein, the positioning seat body 21 includes an upper guide plate (not labeled in the figure), a lower guide plate (not labeled in the figure) spaced apart from the upper guide plate, and a block disposed between the upper guide plate and the lower guide plate Spacers (not labeled in the figure), but the present invention is not limited thereto.

A plurality of the probe assemblies 22 are located in the positioning base 21, and a plurality of the probe assemblies 22 are located in the wafer test area R1. Furthermore, the plurality of probe assemblies 22 correspond to the plurality of test modules 12 of the signal transfer module 1 in position, respectively. More specifically, each of the probe assemblies 22 includes a plurality of conductive probes 221, the plurality of conductive probes 221 are arranged in a ring shape, and the plurality of conductive probes 221 correspond to the corresponding positions respectively Multiple test metal pads 122 of the test module 12. Wherein, in each of the probe assemblies 22, one end of the plurality of conductive probes 221 passes through the positioning base 21 and respectively abuts on the plurality of test metal pads 122 of the corresponding test module 12, and more The other end of each of the conductive probes 221 passes through the positioning base 21 and is used to bear against a test object O. In an embodiment of the invention, a length direction of each conductive probe 221 is preferably substantially perpendicular to the top surface 111 of the substrate 11.

It should be noted that, in this embodiment, the conductive probe 221 is conductive and has a flexible elongated structure, but the conductive probe 221 of the present invention is not limited to rectangular conductive probes and circular conductive Probes, or other structured conductive probes.

As shown in FIGS. 1 and 2, the test circuit board 3 is located on the side of the bottom surface 112 of the substrate 11 of the signal conversion module 1. In other words, the bottom surface 112 of the substrate 11 of the signal conversion module 1 faces the test circuit board 3 along the thickness direction T.

In this embodiment, the test circuit board 3 has a substantially circular plate shape, but the present invention is not limited to this. For example, the test circuit board 3 may also be in a rectangular plate shape, a polygonal plate shape, or be designed into other shapes according to product design requirements.

Furthermore, the test circuit board 3 is provided with a plurality of second electrical connectors 31, the plurality of second electrical connectors 31 are located in the signal transfer area R2, and the plurality of second electrical connectors 31 are electrically Sexually coupled to the plurality of first electrical connectors 13.

Further, the test circuit board 3 is configured to be electrically coupled to a test machine (not shown). In other words, the plurality of second electrical connectors 31 are electrically coupled to the testing machine, In order to analyze the signal received by the test circuit board 3 through the testing machine. The electrical coupling method between the test circuit board 3 and the test machine can be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the test circuit board 3 may also be directly integrated into the test machine.

According to the above configuration, in each of the probe assemblies 22, a plurality of the conductive probes 221 can be used to receive test signals from the object under test O and pass the test signals through the corresponding test modules in sequence 12 a plurality of test metal pads 122, a corresponding plurality of electrical contacts 131 of the first electrical connector 13, and a corresponding second electrical connector 31 are transmitted to the test circuit board 3, and finally to the The test machine is used to analyze the signal received by the test circuit board 3 through the test machine.

It is worth mentioning that, as shown in FIG. 1, in this embodiment, each of the first electrical connectors 13 penetrates the top surface 111 and the bottom surface 112 of the substrate 11, and each of the first electrical connectors 13 is One of male connection plug and female connection socket. Each second electrical connector 31 is disposed on a surface of the test circuit board 3 facing the signal conversion module 1, and each second electrical connector 31 is a male connection plug and a female connection socket Of the other. Wherein, each of the first electrical connectors 13 corresponds in position to the corresponding second electrical connector 31, and each of the first electrical connectors 13 is detachably plugged into the corresponding second electrical connector The connector 31 constitutes a male-female connector structure. According to the above configuration, the signals received by the plurality of test metal pads 122 can be transmitted to the plurality of cylindrical conductors inside the first electrical connector 13 through the plurality of signal fan-out lines 123 and the plurality of electrical contacts 131 ( (Not labeled in the figure), then, the signal can be transmitted to the plurality of columnar conductors (not labeled in the figure) inside the second electrical connector 31, respectively, and then transmitted to the inside of the test circuit board 3.

As shown in FIGS. 1 and 3, the supporting plate body 4 is sandwiched between the test circuit board 3 and the substrate 11, wherein the supporting plate body 4 has a plurality of through holes 41, and a plurality of the through holes 41 Located in the signal transfer area R2.

Further, a plurality of the second electrical connectors 31 respectively protrude from the test circuit board 3 A side surface of the signal conversion module 1, and the plurality of second electrical connectors 31 are respectively disposed in the plurality of through holes 41. Wherein, when each of the first electrical connectors 13 is inserted into the corresponding second electrical connector 31 to produce an electrical connection, the bottom surface 112 of the substrate 11 abuts against the support plate body 4. In this way, when the first electrical connector 13 and the second electrical connector 31 are plugged into each other, no gap will be generated between the bottom surface 112 of the substrate 11 and the support plate 4, so that the first The reliability of the electrical connection between the electrical connector 13 and the second electrical connector 31 can be effectively improved.

Please continue to refer to FIGS. 1 and 3. The pressing structure 5 is disposed between the signal conversion module 1 and the probe head module 2. The pressing structure 5 is configured to suppress the (first electrical connector 13) of the signal conversion module 1, and the pressing structure 5 is configured to set the probe head module 2. In more detail, the pressing structure 5 includes a pressing plate 51 and a plurality of screws 52. The pressing plate 51 is disposed on the top surface 111 of the substrate 11. The pressing plate 51 includes a plurality of screw holes (not labeled) in the signal transfer area R2. The plurality of screws 52 respectively penetrate through the plurality of screw holes of the pressing plate 51 to fix the pressing plate 51 on the substrate 11. Wherein, a plurality of the screws 52 further penetrate the signal adapter module 1, the support plate body 4, and the test circuit board 3 along the thickness direction T, so that the pressing plate 51 can suppress the signal adapter module Group 1, support board body 4, and test circuit board 3, and make the plurality of first electrical connectors 13 closely connected to the plurality of second electrical connectors 31, respectively, so as to enhance the signal conversion module 1 and The electrical connection characteristics between the test circuit board 3 are tested, and the electrical transmission path between the test circuit board 3 and the signal conversion module 1 does not need to be achieved with any soldering material. In addition, in this embodiment, when the plurality of screws 52 penetrate the signal conversion module 1, the support board body 4, and the test circuit board 3, the plurality of screws 52 only touch the insulating substrate material, It will not touch any conductive pad or conductive circuit. Furthermore, the multiple probe assemblies 22 of the probe head probe head module 2 can further penetrate the pressing plate 51 to be electrically connected to the multiple test modules of the signal transfer module 1 respectively 12.

[Second Embodiment]

As shown in FIG. 5, this is the second embodiment of the present invention. The embodiments are similar. The similarities between the two embodiments are not repeated here. The difference between this embodiment and the first embodiment described above is that the probe card testing apparatus 100 of this embodiment is further provided with a device capable of testing high-frequency signals. structure.

More specifically, the probe card testing device 100 further includes a high-frequency signal transmission cable 6. The high-frequency signal transmission cable 6 is located in the wafer test area R1, and the high-frequency signal transmission cable 6 penetrates the top surface 111 and the bottom surface 112 of the substrate 11 and also penetrates the support plate body 4. Among them, at least one of the plurality of test modules 12 further includes a high-frequency signal metal pad 124, and the high-frequency signal metal pad 124 and the test metal pad 122 surround the central area 121 of the test module 12 together .

Furthermore, one end of the high-frequency signal transmission cable 6 is electrically connected to the high-frequency signal metal pad 124, and the other end of the high-frequency signal transmission cable 6 is electrically connected to the wafer on the test circuit board 3 A signal receiving metal pad 32 in the test area R1 forms a high-frequency signal transmission path.

[Third Embodiment]

As shown in FIG. 6A, this is the third embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment. The similarities between the two embodiments are not repeated here, and this embodiment is the same as the above-mentioned first embodiment The difference of this example is that the probe card testing device 100 of this embodiment is further provided with a light-transmitting structure that can penetrate the light L, so as to be suitable for other peripheral chips that need to transmit light (such as a complementary metal oxide semiconductor image sensor) Tester) to increase the versatility of the probe card testing device 100.

More specifically, in this embodiment, the surface of the test circuit board 3 itself is an opaque insulating material, and the test circuit board 3 is formed with a plurality of through holes 33 in the wafer test area R1 to Provide multiple penetrations of light L respectively. Wherein, a plurality of optical lenses (not shown in the figure) are respectively plugged into the plurality of through holes 33, but the present invention is not limited to this.

The support plate 4 has a light transmission hole 42 formed in the wafer test area R1. The material of the substrate 11 of the signal conversion module 1 is preferably a glass substrate that can transmit light, and the probe head The materials of the upper guide plate and the lower guide plate of the positioning base 21 of the module 2 are preferably both light-transmitting glass substrates, but the invention is not limited thereto. Wherein, the plurality of through-holes 33, the light-transmitting holes 42, the light-transmitting substrate 11 and the light-transmitting positioning base 21 can jointly form a plurality of light transmission paths.

According to the above configuration, the probe card testing device 100 can be used to receive a plurality of light rays L, and allow the plurality of light rays L to sequentially pass through the plurality of light transmission paths (not shown in the figure), and then irradiate to The object to be tested O generates multiple photoelectric test signals.

Then, the plurality of conductive probes 221 can be used to receive photoelectric test signals, and sequentially pass the photoelectric test signals through the plurality of test metal pads 122 of the corresponding test module 12 and the corresponding first electrical connection The plurality of electrical contacts 131 of the device 13 and the corresponding second electrical connector 31 are transmitted to the test circuit board 3 and finally to the test machine to analyze the test circuit board 3 through the test machine The signal received.

[Fourth embodiment]

As shown in FIG. 6B, this is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned third embodiment. The similarities between the two embodiments are not repeated here, and this embodiment is the same as the above-mentioned third embodiment The difference is that there are no optical lenses plugged into the plurality of through-holes 33 in this embodiment. The substrate 11 of the signal conversion module 1 is formed with a plurality of openings 113 in the wafer test area R1. In addition, the upper guide plate and the lower guide plate of the positioning base 21 are respectively formed with a plurality of openings 211 and 212 in the wafer test area R1. The plurality of through holes 33, the light transmission holes 42, the plurality of openings 113 of the substrate 11, and the plurality of openings 211, 212 of the positioning base 21 can collectively constitute a plurality of light transmission paths (not shown in the figure) .

According to the above configuration, the probe card testing device 100 can be used to receive a plurality of light rays L, and allow the plurality of light rays L to sequentially pass through the plurality of light transmission paths, and then illuminate the object to be measured O to generate multiple photoelectric test signals.

[Fifth Embodiment]

As shown in FIG. 7A and FIG. 8, it is the fifth embodiment of the present invention. The first embodiment is similar, and the similarities between the two embodiments are not repeated here, and the difference between this embodiment and the above-mentioned first embodiment is that the first electrical connector 13 and the second The connector 31 is a male-female connector architecture, and the first electrical connector 13 and the second electrical connector 31 of this embodiment are a flexible cable connector architecture.

More specifically, in this embodiment, each of the first electrical connectors 13 is provided on the top surface 111 of the substrate 11, and each of the second electrical connectors 31 is provided on the face of the test circuit board 3 One side surface of the signal transfer module 1. Wherein, the signal conversion module 1 further includes a plurality of flexible cables 14, and each of the first electrical connectors 13 can be electrically coupled to the corresponding second circuit via one of the flexible cables 14 The connector 31 constitutes the above-mentioned flexible flat cable connector architecture (such as FPC or FFC).

Further, in this embodiment, each of the first electrical connector 13 and its corresponding second electrical connector 31 are arranged in a misaligned manner (see FIG. 7 ). Furthermore, each of the flexible cables 14 preferably spans the edge of the top surface 111 of the substrate 11 and extends in the direction of the second electrical connector 31 to be electrically connected to the third circuit board 3 provided on the test circuit board 3二电 Connector 31. In other words, each of the flexible cables 14 does not need to penetrate the top surface 111 and the bottom surface 112 of the substrate 11, and each of the first electrical connectors 13 does not need to penetrate the top surface 111 and the bottom surface 112 of the substrate 11. .

It is worth mentioning that the support plate body 4 is provided between the substrate 11 and the test circuit board 3, and in this embodiment, the support plate body 4 is a rigid iron piece for supporting the substrate 11 and The test module 12 provided on the support substrate 11. Since neither the first electrical connector 13 nor the flexible cable 14 needs to penetrate the substrate 11, the supporting plate body 4 may not need to have a through hole 41 in this embodiment.

Furthermore, in this embodiment, the probe card testing device 100 further includes a protective cover 7. The protective cover 7 is placed on the test circuit board 3 to surround the test circuit board 3 to form an accommodating space 71. Wherein, the substrate 11, the test module 12, the first electrical connector 13, the flexible cable 14, and the second electrical connector 31 of the signal conversion module 1 are all disposed in the above-mentioned accommodating space 71, Therefore, the protective cover 7 can prevent the above components from being damaged by the outside world. The protective cover The body 7 may be a transparent or non-transparent material, and the protective cover 7 may be provided on the test circuit board 3 by screwing or adhering, which is not limited by the present invention. In addition, the protective cover 7 is formed with a through hole 72 in the wafer test area R1, and one end of the plurality of conductive probes 221 can pass through the through hole 72 of the protective cover 7 to withstand the test物O。 Object O.

As shown in FIG. 8, from another perspective, in the flexible cable connector architecture of this embodiment, a plurality of the first electrical connectors 13 are arranged on the substrate 11 in a ring arrangement, and a plurality of The second electrical connectors 31 are arranged on the test circuit board 3 in an annular arrangement, and a plurality of the second electrical connectors 31 are circumferentially arranged around the plurality of the first electrical connectors 13, and The plurality of flexible cables 14 are electrically coupled to the plurality of first electrical connectors 13 respectively.

[Sixth Embodiment]

As shown in FIG. 7B, this is the sixth embodiment of the present invention. This embodiment is similar to the fifth embodiment described above. The similarities between the two embodiments are not repeated here, and this embodiment is the same as the first embodiment described above. The difference of this example is that the probe card testing device 100 of this embodiment further includes a probe head fixing base 8. The probe head fixing seat 8 and the protective cover 7 are independent members, and the probe head fixing seat 8 is located inside the protective cover 7. More specifically, in this embodiment, the probe head fixing base 8 is configured to set the probe head module 2, and the plurality of probe assemblies 22 of the probe head module 2 can be further penetrated A probe head fixing base 8 is provided to be electrically connected to the plurality of test modules 12 of the signal conversion module 1 respectively.

[Seventh Embodiment]

As shown in FIG. 9, this is the seventh embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment. The similarities between the two embodiments are not repeated here, and this embodiment is the same as the above-mentioned first embodiment The difference between the examples is that the test module 12 of the first embodiment described above is directly formed on the top surface 111 of the substrate 11, while the test module 12 of this embodiment is not directly formed on the top surface 111 of the substrate 11.

More specifically, in this embodiment, the signal transfer module 1 further includes 一SOFT Carrying Plate 15. The flexible carrier board 15 is located between the plurality of test modules 12 and the substrate 11, and the plurality of test metal pads 122 and the plurality of signal fan-out lines 123 are formed on the flexible carrier board 15 by the lithography process. On one surface of the substrate 11, a flexible circuit board that can be separated from the substrate 11 is formed together with the flexible carrier board 15.

[Eighth Embodiment]

As shown in FIG. 10, this is the eighth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment. The similarities between the two embodiments are not repeated here, and this embodiment is the same as the above-mentioned first embodiment The difference is that the multiple signal fan-out lines 123 of the first embodiment are all disposed on the top surface 111 of the substrate 11 to form a single-layer signal fan-out structure.

Unlike the first embodiment described above, the substrate 11 of this embodiment has a multilayer structure with inner layers. In this embodiment, a part of the signal fan-out lines 123 of the plurality of signal fan-out lines 123 is defined as an outer signal fan-out line 1231 (as a continuous line in FIG. 10), and another part of the signals of the plurality of signal fan-out lines 123 The fan-out line 123 is defined as the inner signal fan-out line 1232 (as shown in FIG. 10 as a discontinuous line). A plurality of the outer signal fan-out lines 1231 are disposed on the top surface 111 of the substrate 11, and a plurality of the inner signal fan-out lines 1232 pass through the inner layer of the substrate 11 to be electrically connected to the test module 12 and The first electrical connector 13 forms a multi-layer signal fan-out structure. In this way, when the circuit design of the signal conversion module 1 is too dense, the signal conversion module 1 can avoid the situation that multiple circuits are easily shorted to each other through the design of the multi-layer signal fan-out structure.

[Ninth Embodiment]

As shown in FIG. 11, this is the ninth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment. The similarities between the two embodiments are not repeated here, and this embodiment is the same as the above-mentioned first embodiment The difference between the example is that the pressing structure 5 of the first embodiment described above is an integrally formed member, which can be used to simultaneously press the signal conversion module 1 (to enhance the electrical connection between the first electrical connector 13 and the second electrical connector 31 Features), and used to set the probe head module 2.

Unlike the first embodiment described above, the probe card testing apparatus 100 of this embodiment further includes a probe head fixing base 8. The probe head fixing base 8 and the pressing structure 5 are independent members from each other, and the probe head fixing base 8 is located inside the pressing structure 5. More specifically, in this embodiment, the probe head fixing base 8 is configured to set the probe head module 2, and the plurality of probe assemblies 22 of the probe head module 2 can be further penetrated A probe head fixing base 8 is provided to be electrically connected to the plurality of test modules 12 of the signal conversion module 1 respectively. The pressing structure 5 is configured to suppress the (first electrical connector 13) of the signal conversion module 1, so that the plurality of first electrical connectors 13 are closely connected to the plurality of second electrical connectors 31 respectively In order to improve the electrical connection characteristics between the signal conversion module 1 and the test circuit board 3. That is to say, the pressing structure 5 of this embodiment is different from the first embodiment described above, and it can only be used to suppress the signal adapter module 1, and it cannot be used to set the probe head module 2.

[Tenth Embodiment]

As shown in FIG. 12, this is the tenth embodiment of the present invention. This embodiment is similar to the ninth embodiment described above. The similarities between the two embodiments are not repeated here, and this embodiment is similar to the ninth embodiment described above. The difference is that the probe card testing device 100 of this embodiment may not require the pressing structure 5. That is to say, each first electrical connector 13 and the corresponding second electrical connector 31 can be electrically connected to each other only by way of plug-in connection or flexible cable, without the need to provide the pressing structure 5.

[Beneficial effect of embodiment]

In summary, the probe card testing device 100 disclosed in the embodiments of the present invention can pass through the multiple test modules 12 of the signal transfer module 1 and the multiple first electrical connectors 13 and the probe head module 2 The positioning structure of the positioning base 21 and the plurality of probe assemblies 22 and the test circuit board 3 of the test circuit board 3 are arranged and connected with each other. Instead of the traditional peripheral chip test, the probe card needs manual wire bonding The signal is connected in a needle manner, so that a plurality of conductive probes 221 can perform needle implantation in a straight up and down manner, thereby greatly reducing the needle implantation operation time of the conductive probe 221, and can greatly reduce the probe card testing device 100 Difficulty in maintenance.

In addition, in this embodiment, the plurality of test metal pads 122 and the plurality of signal fan-out lines 123 and the electrical contacts 131 of the plurality of first electrical connectors 13 are disposed on a common plane (eg, substrate 11 On the top surface 111) to form a single-layer signal fan-out structure. Wherein, the single-layer signal fan-out structure can be matched with a plurality of first electrical connectors 13 to be electrically coupled to a plurality of second electrical connectors 31 to design the test signal from the signal transfer module 1 Transfer to the test circuit board 3, so that the use and maintenance of the probe card test device 100 is more convenient.

Further, the signal adapter module 1, the probe head module 2, the test circuit board 3, the support board body 4, and the pressing structure 5 of the probe card testing device 100 of this embodiment are detachable structures. Therefore, when any component of the probe card testing apparatus 100 of this embodiment has an abnormal condition, it can be directly repaired for the component; it is different from the existing cantilever probe card, and the probe base needs to be unsoldered. , And then re-soldering the circuit board; if there is a problem with the probe base, you need to remove the probe in an area first, then re-solder the needle and adjust the level of the needle, the process is more cumbersome.

Furthermore, the probe card testing device 100 of this embodiment is further provided with a light-transmitting structure that allows light L to pass through, so as to be suitable for other peripheral chips that need to transmit light (such as: complementary metal oxide semiconductor image sensing Test) to increase the versatility of the probe card testing device 100.

The above are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of protection of the claims of the present invention. .

100: probe card test device

1: Signal transfer module

11: substrate

111: top surface

112: underside

12: Test module

121: Central area

122: Test metal pad

123: Signal fan-out line

13: The first electrical connector

131: Electrical contact

2: Probe head module

21: Position the seat body

22: Probe assembly

221: Conductive probe

3: Test circuit board

31: Second electrical connector

4: Support plate

41: Piercing

5: pressed structure

51: Press board

52: screw

T: thickness direction

R1: Wafer test area

R2: Signal transfer area

O: test object

Claims (14)

A probe card test device defines a wafer test area and a signal transfer area located around the wafer test area. The probe card test device includes: a signal transfer module, including: a substrate , With a top surface and a bottom surface located on opposite sides; a plurality of test modules disposed on the substrate and located in the wafer test area; wherein, each of the test modules includes a central area and along the A plurality of test metal pads provided on the periphery of the central area; a plurality of first electrical connectors, which are disposed on the substrate and located in the signal transfer area, and are electrically coupled to the plurality of first electrical connectors, respectively A plurality of the test modules; wherein each of the first electrical connectors includes a plurality of electrical contacts; and a plurality of signal fan-out lines are provided on the substrate; wherein each of the first electrical connections At least part of the electrical contacts of the plurality of electrical contacts of the device are electrically coupled to corresponding ones of the test modules through portions of the signal fan-out lines of the signal fan-out lines, respectively A plurality of the test metal pads; a probe head module, located on one side of the top surface of the signal conversion module, and the probe head module includes: a positioning seat body; and A plurality of probe modules, which are located in the positioning base, in the wafer test area, and respectively correspond to the plurality of test modules of the signal conversion module in position; The probe assembly includes a plurality of conductive probes arranged in a ring shape, and one end of the plurality of conductive probes passes through the positioning seat body and respectively abuts on the plurality of test metal pads of the corresponding test module , And the other ends of the plurality of conductive probes pass through the positioning seat body to bear against an object to be tested; and a test circuit board, which is located on a side of the bottom surface of the signal conversion module Side and A plurality of second electrical connectors located in the signal transfer area are provided, and the plurality of second electrical connectors are electrically coupled to the plurality of first electrical connectors, respectively. The probe card test device according to claim 1, wherein in each of the probe assemblies, a plurality of the conductive probes can be used to receive a test signal from the object to be tested, and the The test signal is sequentially transmitted to the test module through the plurality of test metal pads of the corresponding test module, the corresponding first electrical connector, and the corresponding second electrical connector Test the circuit board. The probe card test device according to claim 1, wherein in each test module corresponding to each of the first electrical connectors, the number of the plurality of electrical contacts is greater than or equal to a plurality The number of the test metal pads. The probe card test device according to claim 1, wherein in each test module corresponding to each of the first electrical connector and each of the test metal pads and the test metal pad adjacent thereto The pitch is defined as a first pitch, and the pitch of each electrical contact and its adjacent electrical contact is defined as a second pitch, and the second pitch is greater than the first pitch. The probe card test device according to claim 1, further comprising a support plate body disposed between the signal conversion module and the test circuit board; wherein the bottom surface of the substrate has insulation It is of a nature and can be attached to the support plate, and the bottom surface of the substrate is not provided with any metal pads or wires. The probe card test device according to claim 1, further comprising a high-frequency signal transmission cable located in the wafer test area and penetrating the top surface and the bottom surface of the substrate; At least one of the test modules further includes a high-frequency signal metal pad, one end of the high-frequency signal transmission cable is electrically connected to the high-frequency signal metal pad, and the high-frequency signal The other end of the transmission cable is electrically connected to a signal receiving metal pad of the test circuit board located in the wafer test area to form a high-frequency signal transmission path. The probe card test device according to claim 1, wherein the probe card test device The device can be used to receive multiple rays of light, and allow multiple rays of light to penetrate the test circuit board, the signal conversion module, and the probe head module in sequence, and then irradiate the light Test object to generate multiple photoelectric test signals. The probe card test device according to claim 1, wherein each of the first electrical connectors penetrates the top surface and the bottom surface of the substrate, and each of the second electrical connectors is provided On a surface of the test circuit board facing the signal conversion module; wherein each of the first electrical connectors corresponds in position to the corresponding second electrical connector, and each The first electrical connector is detachably inserted into the corresponding second electrical connector to form a male-female connector structure. The probe card test device according to claim 1, wherein each of the first electrical connectors is provided on the top surface of the substrate, and each of the second electrical connectors is provided on the test A side surface of the circuit board facing the signal conversion module; wherein the signal conversion module further includes a plurality of flexible cables, and each of the first electrical connectors can pass through one of the The flexible cable is electrically coupled to the corresponding second electrical connector to form a flexible cable connector architecture. The probe card testing device according to claim 9, further comprising a protective cover body, the protective cover body cover is disposed on the test circuit board to surround the test circuit board to form a containing space; The substrate, the test module, the first electrical connector, the flexible cable, and the second electrical connector of the signal conversion module are all disposed in the accommodating space; The protective cover body is formed with a through hole in the wafer test area, and one end of the plurality of conductive probes can penetrate the through hole of the protective cover body to resist the object to be tested . The probe card testing device according to claim 9, further comprising a protective cover and a probe head fixing seat, the probe head fixing seat is located inside the protective cover, and the probe head is fixed The seat is used to set the probe head module, and the protective cover body is set on the test circuit board to surround the test circuit board to form a Accommodating space; the substrate of the signal conversion module, the test module, the first electrical connector, the flexible cable, and the second electrical connector are all provided in the accommodating space In space. The probe card testing device according to claim 1, wherein the signal conversion module further includes a flexible carrier board, the flexible carrier board is located between the plurality of test modules and the substrate, and more The test metal pads and the plurality of signal fan-out lines are formed on a surface of the flexible carrier board opposite to the substrate to form a separable layer from the substrate together with the flexible carrier board A flexible circuit board. The probe card test device according to claim 1, wherein a part of the signal fan-out lines of the plurality of signal fan-out lines is defined as an outer signal fan-out line, and the other of the plurality of signal fan-out lines A part of the signal fan-out circuit is defined as an inner signal fan-out circuit; wherein, a plurality of the outer signal fan-out circuits are provided on the top surface of the substrate, and a plurality of the inner signal fan-out circuits The inner layer passing through the substrate is electrically connected to the test module and the first electrical connector, respectively. A signal transfer module of a probe card testing device, which defines a wafer test area and a signal transfer area located around the wafer test area, and a signal transfer module of the probe card test device The method includes: a substrate; a plurality of test modules disposed on the substrate and located in the wafer test area; wherein each of the test modules includes a central area and a plurality of tests arranged along the periphery of the central area A metal pad; and a plurality of first electrical connectors disposed on the substrate and located in the signal transfer area, and the plurality of first electrical connectors are electrically coupled to the plurality of test modules, respectively; Wherein, each of the first electrical connectors includes multiple electrical contacts; and A plurality of signal fan-out lines are provided on the substrate; wherein at least part of the plurality of electrical contacts of each of the first electrical connectors pass through the plurality of signal fans respectively The signal fan-out line of the outgoing line is electrically coupled to the corresponding plurality of test metal pads of the test module; wherein, the plurality of first electrical connectors are configured to be electrically coupled to the A plurality of second electrical connectors arranged on a test circuit board.

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