JP2013120070A - Probe card - Google Patents

Abstract

【Task】
It is an object of the present invention to provide a probe card with reduced impedance mismatch.
[Solution]
The probe card has a first substrate having a first trace formed on one surface and having rigidity, a second substrate having a second trace formed on one surface and having flexibility, and the first substrate having the first trace. A connecting portion that connects an end portion of the first trace and an end portion of the second trace at a facing portion where the one surface and the one surface of the second substrate face each other; The width of the trace is wider than the width of the second trace and is a width according to the tolerance of the first substrate and the second substrate, or the width of the second trace is the width of the first trace. The width is wider and according to the tolerance of the first substrate and the second substrate.
[Selection] Figure 1

Description

  The present invention relates to a probe card.

  Conventionally, there has been a membrane type probe card. The membrane-type probe card includes a multilayer wiring film on which contact terminals are formed and a wiring board, and the wiring of the wiring board is connected to electrodes provided at the ends of the wiring of the multilayer wiring film.

JP 2000-150594 A

  By the way, since the electrode connected to the wiring (trace) of the above-mentioned multilayer wiring film is wider than the wiring, there is a possibility that impedance mismatch occurs between the wiring and the electrode.

  When impedance mismatch occurs, it may be difficult to perform a test using a higher-speed signal.

  Therefore, an object is to provide a probe card with reduced impedance mismatch.

  The probe card according to the embodiment of the present invention includes a first substrate having a first trace formed on one surface and having rigidity, and a second substrate having a second trace formed on one surface and having flexibility. And a connecting portion that connects an end portion of the first trace and an end portion of the second trace at a facing portion where the one surface of the first substrate and the one surface of the second substrate face each other. The width of the first trace is wider than the width of the second trace and is a width according to the tolerance of the first substrate and the second substrate, or the width of the second trace is The width is wider than the width of the first trace and according to the tolerance of the first substrate and the second substrate.

  A probe card with reduced impedance mismatch can be provided.

FIG. 3 is a cross-sectional view showing the probe card of the first embodiment. FIG. 3 is an exploded perspective view showing an interface board and a probe board of the probe card according to the first embodiment. 2 is a diagram showing an interface board 10 of the probe card 100 according to Embodiment 1. FIG. It is a figure which shows the probe board | substrate 20 of the probe card 100 of Embodiment 1. FIG. 2 is a diagram showing a joint portion between an interface board 10 and a probe board 20 of the probe card 100 according to Embodiment 1. FIG. It is a figure which shows the probe board | substrate 20 of the probe card of Embodiment 2. FIG. FIG. 6 is a diagram illustrating a joint portion between an interface board 10 and a probe board 20 of the probe card according to the second embodiment.

  Hereinafter, embodiments to which the probe card of the present invention is applied will be described.

<Embodiment 1>
FIG. 1 is a cross-sectional view showing the probe card of the first embodiment.

  FIG. 2 is an exploded perspective view showing an interface board and a probe board of the probe card according to the first embodiment.

  Here, an XYZ coordinate system is defined as shown in FIGS.

  The probe card 100 according to the first embodiment is a so-called membrane type probe card, and includes an interface substrate 10, a probe substrate 20, a probe guide 30, an anisotropic conductive film 40, and a pressing portion 50.

  FIG. 1 shows a cross section of the entire probe card 100 corresponding to the cross section taken along the line AA of the interface board 10 and the probe board 20 shown in FIG.

  The interface board 10 is an example of a rigid first board. For example, an FR-4 standard rigid board can be used. An opening 10 </ b> A is formed in the center of the interface substrate 10. The protruding portion 20A of the probe substrate 20 is inserted into the opening 10A.

  Further, the interface substrate 10 is provided with a trace 11, a pad 11A, a ground pad 12, and a connection pad 13. The characteristic impedance of the trace 11 is optimized so as not to reflect the signal transmitted by the trace 11 and is typically set to 50Ω.

  The pad 11A and the ground pad 12 are connected to the pad 21A and the ground pad 22 of the probe substrate 20 via the anisotropic conductive film 40, respectively.

  The ground pad 12 and the connection pad 13 are connected to each other via the via and the ground layer on the inner layer of the interface substrate 10.

  The signal line terminal 13B of the coaxial connector 13A shown in FIG. 2 is connected to the pad 11A, and the ground terminal 13C of the coaxial connector 13A is connected to the connection pad 13. The pad 11A and the signal line terminal 13B are connected by soldering, for example. The connection pad 13 and the ground terminal 13C are connected by, for example, soldering and / or screwing.

  The pad 11A and the connection pad 13 are connected to the test apparatus via a coaxial cable connected to the coaxial connector 13A. For convenience of explanation, FIG. 2 shows a state in which one coaxial connector 13A is separated from the interface board 10, but the coaxial connectors 13A are connected to the four pads 11A and the four pairs of connection pads 13, respectively. .

  The interface substrate 10 includes a ground layer, a resist layer, and the like in addition to the components described above, but components other than the components described above are omitted in FIGS. 1 and 2. Details of the interface board 10 will be described later.

  The probe substrate 20 is an example of a flexible second substrate. The probe substrate 20 is made of, for example, a flexible substrate made of polyimide, and as shown in FIG. 2, four extending portions 20B extend from each side of a rectangular portion at the center.

  Each extending portion 20B is bent in the positive direction of the Z axis from the rectangular portion at the center, and further bent in the X axis direction or the Y axis direction so as to extend outward in the XY plane. For this reason, when viewed from the XY plane in which the tip of the extending portion 20B is accommodated, the rectangular portion at the center of the probe substrate 20 constructs a protruding portion 20A that protrudes in the negative Z-axis direction.

  The probe substrate 20 includes a trace 21, a pad 21 </ b> A, a ground pad 22, and a probe pad 23. The pad 21 </ b> A is one end of the trace 21, and the probe pad 23 is the other end of the trace 21.

  The characteristic impedance of the trace 21 is optimized so that reflection of a signal transmitted by the trace 21 does not occur, and is typically set to 50Ω.

  The pad 21A and the ground pad 22 are connected to the pad 11A and the ground pad 12 of the interface substrate 10 through the anisotropic conductive film 40. The probe pad 23 is in contact with a terminal such as a semiconductor chip or a package substrate (not shown).

  The probe board 20 includes a ground layer, a coverlay, and the like in addition to the above-described constituent elements. However, in FIG. 1 and FIG. 2, constituent elements other than the above-described constituent elements are omitted. Details of the probe substrate 20 will be described later.

  The probe guide 30 is fixed to the interface substrate 10 with screws 31 in a state where the probe substrate 20 is disposed on the lower surface side. The probe guide 30 holds the pressing portion 50 that presses the probe substrate 20 against the interface substrate 10 and presses the protruding portion 20A of the probe substrate 20 in the negative Z-axis direction.

  An anisotropic conductive film 40 (ACF: Anisotropic Conductive Film) is an example of a connection portion, and is a film that exhibits conductivity in the thickness direction when pressed in the thickness direction. The anisotropic conductive film 40 is disposed between the pad 11A and the ground pad 12 of the interface substrate 10 and the pad 21A and the ground pad 22 of the probe substrate 20, and is pressed in the thickness direction.

  The pressing portion 50 has a support portion 50A inserted through the through hole 30A of the probe guide 30 and a protruding portion of the probe substrate 20 by a restoring force of a spring 51 disposed between the holding portion 30B of the probe guide 30 and the pressing portion 50. 20A is pressed in the negative Z-axis direction.

  A probe pad 23 is formed at the tip of the protruding portion 20A. The pressing part 50 presses the probe pad 23 to a terminal such as a semiconductor chip or a package substrate placed below the protruding part 20A. The pressing portion 50 only needs to be able to press the protruding portion 20A in the negative direction of the Z-axis. The thing of such a structure may be sufficient.

  Here, in FIG. 1 and FIG. 2, the configuration of the probe card 100 is simplified for convenience of explanation, and the trace 11, the pad 11A, the ground pad 12, the connection pad 13, the coaxial connector 13A, the trace 21, the pad 21A, and the ground pad 22 are simplified. And a minimum number of probe pads 23 are shown.

  However, in practice, a plurality of traces 11 and pads 11A are provided along each side of the interface board 10, and a plurality of pairs of ground pads 12 and connection pads 13 are provided along each side of the interface board 10 so as to be coaxial. A plurality of connectors 13A are provided according to the number of pads 11A and connection pads 13.

  Similarly, a plurality of traces 21 and pads 21 </ b> A are provided in each extending portion 20 </ b> B of the probe substrate 20, and a plurality of pairs of ground pads 22 are provided in each extending portion 20 </ b> B of the probe substrate 20. Further, more probe pads 23 are provided on the protruding portion 23.

  Next, the details of the interface board 10 will be described with reference to FIG.

  FIG. 3 is a diagram showing the interface board 10 of the probe card 100 according to the first embodiment. FIG. 3A shows a part of the interface board 10 indicated by a broken line D in FIG. 3B shows a cross section taken along arrow A1-A1 in FIG. 3A, and FIG. 3C shows a cross section taken along arrow B1-B1 in FIG.

  3A to 3C, an XYZ coordinate system is defined as in FIGS.

  The interface substrate 10 includes a trace 11, a pad 11 </ b> A, a ground pad 12, a dielectric layer 14, a ground layer 15, a via 16, and a resist 17.

  The trace 11 is an example of a first trace, and is formed on one surface of the dielectric layer 14. The trace 11 is a wiring formed by, for example, patterning a copper foil formed by plating on one surface of the dielectric layer 14 by etching or the like. In this etching process, the ground pad 12 and the connection pad 13 are also formed at the same time.

  Etching of the copper foil may be performed by, for example, a subtractive method. The pad 11 </ b> A is one end of the trace 11 and is a portion exposed from the opening 17 </ b> A of the resist 17.

  The width of the trace 11 (the width in the Y-axis direction) is a width that can absorb these tolerances in consideration of the tolerance of the interface board 10 and the tolerance of the probe board 20 (according to the tolerance of the interface board 10 and the probe board 20). Width). The tolerance of the interface board 10 will be described later.

  The width of the trace 11 of the interface board 10 is set wider than the width of the trace 21 of the probe board 20.

  In general, the interface board 10 using a rigid board has a manufacturing tolerance larger than that of the probe board 20 using a flexible board. Therefore, when the characteristic impedance of the trace 11 is optimized, a certain line width is required, which is wider than the trace 21 formed on the probe substrate 20 (flexible substrate).

  For this reason, in the first embodiment, the width of the trace 11 of the interface board 10 is set to a line width that is wider than the width of the trace 21 of the probe board 20 and can absorb the tolerance of the interface board 10 and the probe board 20. The

  Specifically, even if the positional deviation between the pad 11A and the pad 21A is maximized due to the tolerances of the interface substrate 10 and the probe substrate 20, the pad 21A is within the width of the pad 11A. The line width of the trace 21 may be set.

  Thereby, when connecting the pad 11A of the interface board | substrate 10 and the pad 21A of the probe board | substrate 20, the pad 21A is settled in the width | variety of the pad 11A, and the pad 11A and the pad 21A can be connected reliably. .

  One ground pad 12 is formed on each side of the trace 11. The ground pad 12 is connected to the ground layer 15 through the via 16. The ground pad 22 of the probe substrate 20 is connected to the ground pad 12 through the anisotropic conductive film 40.

  For the dielectric layer 14, for example, a FR-4 standard substrate in which a glass cloth base material is impregnated with an epoxy resin can be used. For example, the dielectric layer 14 may include a filler such as carbon fiber instead of the glass cloth base material, or may be formed of only an epoxy resin without including the glass cloth base material.

  A trace 11 and a ground pad 12 are formed on one surface of the dielectric layer 14, and a resist 17 is applied on the trace 11 and the ground pad 12.

  The ground layer 15 is formed on the other surface of the dielectric layer 14. The ground layer 15 is, for example, a copper foil formed by plating on the other surface of the dielectric layer 14. The ground layer 15 is formed on one surface (the whole) of the other surface of the dielectric layer 14. The ground layer 15 is covered with a resist 17.

  The via 16 is formed inside the dielectric layer 14 and connects the ground pad 12 and the ground layer 15. The via 16 is formed, for example, by applying copper plating to the inner wall of the through hole formed in the dielectric layer 14 by drilling or the like.

  The resist 17 is formed on both surfaces of the interface substrate 10 and covers the trace 11, the ground pad 12, and the ground layer 15. The resist 17 is produced, for example, by forming an epoxy resin by spraying or application by a screen printing method. Further, openings 17A and 17B are formed in the resist 17. The openings 17A and 17B are portions where the resist 17 is not applied.

  Here, a portion of the resist 17 formed on the surface on the Z axis positive direction side is an example of a first covering portion, and the opening portion 17A is an example of a first opening portion. That is, the first opening is an opening formed in the first covering portion and exposing the pad 11A.

  The opening 17A exposes one end of the trace 11, and the portion exposed by the opening 17A is used as the pad 11A. The opening 17B exposes the ground pad 12.

  As described above, in the interface substrate 10, the pad 11 </ b> A of the trace 11 used as the signal line is sandwiched between the pair of ground pads 12.

  Here, the tolerance of the interface board 10 will be described. The tolerance of the interface substrate 10 includes a tolerance when the trace 11 is formed, or a tolerance generated when alignment with the probe substrate 20 is performed. Further, the tolerance of the probe substrate 20 includes a tolerance when forming the trace 21 of the probe substrate 20 or a tolerance generated when aligning with the interface substrate 10. The interface substrate 10 and the probe substrate 20 have different tolerances because of different materials and manufacturing processes.

  Next, the probe substrate 20 will be described with reference to FIG.

  FIG. 4 is a diagram illustrating the probe substrate 20 of the probe card 100 according to the first embodiment.

  FIG. 4A shows a portion of the extended portion 20B of the probe substrate 20 that is disposed to face a portion of the interface substrate 10 shown in FIG. 4B shows a cross section taken along arrow A2-A2 in FIG. 4A, and FIG. 4C shows a cross section taken along arrow B2-B2 in FIG.

  4A to 4C, an XYZ coordinate system is defined as in FIGS.

  The probe substrate 20 includes a trace 21, a pad 21 </ b> A, a ground pad 22, a dielectric layer 24, a ground layer 25, a via 26, and a coverlay 27.

  The trace 21 is an example of a second trace and is formed on one surface of the dielectric layer 24. The trace 21 is, for example, a wiring formed by patterning a copper foil formed by plating on one surface of the dielectric layer 24 by etching or the like. Etching of the copper foil may be performed by, for example, a subtractive method. The pad 21 </ b> A is one end of the trace 21 and is a portion exposed from the opening 27 </ b> A of the cover lay 27.

  One ground pad 22 is formed on each side of the pad 21A. The ground pad 22 is simultaneously formed by an etching process for forming the trace 21 or the like.

  As the dielectric layer 24, for example, a polyimide film can be used. The dielectric layer 24 only needs to have flexibility, and may be formed of a resin other than polyimide.

  A trace 21 and a ground pad 22 are formed on one surface of the dielectric layer 24, and a cover lay 27 is attached on the trace 21 and the ground pad 22.

  The ground layer 25 is formed on the other surface of the dielectric layer 24. The ground layer 25 is, for example, a copper foil formed by plating on the other surface of the dielectric layer 24. The ground layer 25 is formed on one surface (the whole) of the other surface of the dielectric layer 24. The ground layer 25 is covered with a coverlay 27. The copper foil for forming the trace 21 and the ground pad 22 and the copper foil for forming the ground layer 25 are simultaneously formed on both surfaces of the dielectric layer 24.

  The via 26 is formed inside the dielectric layer 24 and connects the ground pad 22 and the ground layer 25. The via 26 is formed, for example, by applying copper plating to the inner wall of the through hole formed in the dielectric layer 24 by drilling or the like.

  The coverlay 27 is formed on both surfaces of the probe substrate 20 and covers the trace 21, the ground pad 22, and the ground layer 25. The cover lay 27 is, for example, a polyimide film or a photo solder resist film, and is formed by coating or pasting a film.

  The cover lay 27 is formed with openings 27A and 27B. The openings 27A and 27B are portions where the coverlay 27 is not formed or portions where the formed polyimide film or the like is removed.

  The opening 27A exposes one end of the trace 21, and the portion exposed by the opening 27A is used as the pad 21A. The opening 27B exposes the ground pad 22.

  As described above, in the probe substrate 20, the pad 21 </ b> A of the trace 21 used as the signal line is sandwiched between the pair of ground pads 22.

  Here, a portion of the cover lay 27 that is formed on the surface on the Z-axis negative direction side is an example of the second covering portion, and the opening portion 27A is an example of the second opening portion. That is, the second opening is an opening formed in the second covering portion and exposing the pad 21A.

  Next, the joining of the interface board 10 and the probe board 20 of the probe card 100 according to the first embodiment will be described with reference to FIG.

  FIG. 5 is a diagram illustrating a joint portion between the interface board 10 and the probe board 20 of the probe card 100 according to the first embodiment.

  FIG. 5A is a plan view showing a state in which the interface board 10 is disposed on the lower side (Z-axis negative direction side) and the probe board 20 is overlaid on the upper side. In FIG. 5A, the probe substrate 20 is arranged so that the surface on which the trace 21, the pad 21A, and the ground pad 22 are formed faces the interface substrate 10 side.

  A section C in the X-axis direction shown in FIG. 5A is a section where the interface board 10 and the probe board 20 overlap in the Z-axis direction. That is, in the section C, the interface substrate 10 and the probe substrate 20 are opposed to each other, and an opposed portion is constructed.

  The anisotropic conductive film 40 is disposed over the entire area of the facing portion where the interface substrate 10 and the probe substrate 20 face each other in the Z-axis direction.

  FIG. 5B shows a cross section taken along the arrow B3-B3 in FIG. FIG. 5C shows a cross section taken along arrow A3-A3 of FIG. FIG. 5D shows a cross section taken along the line B4-B4 of FIG.

  5A to 5D, an XYZ coordinate system is defined as in FIGS.

  As shown in FIG. 5B, the B3-B3 cross section in FIG. 5A is a cross section of the probe substrate 20 shown in FIG. Since the interface board 10 does not exist in the B3-B3 cross section, only the cross section of the probe board 20 appears.

  As shown in FIG. 5C, the anisotropic conductive film 40 is disposed between the interface substrate 10 and the probe substrate 20 in the A3-A3 cross section of FIG.

  The anisotropic conductive film 40 includes a pad 11A and a ground pad 12 of the interface board 10, and a pad 21A and a ground pad 22 of the probe board 20 by fixing the probe guide 30 to the interface board 10 with screws 31. Is pressed in the thickness direction (Z-axis direction).

  Thereby, the pad 11A and the ground pad 12 of the interface substrate 10 are electrically connected to the pad 21A and the ground pad 22 of the probe substrate 20, respectively.

  As shown in FIG. 5D, the B4-B4 cross section of FIG. 5A is the same cross section as the cross section of the interface substrate 10 shown in FIG. Since the probe board 20 does not exist in the B4-B4 cross section, only the cross section of the interface board 10 appears.

  As described above, according to the probe card 100 of the first embodiment, as shown in FIG. 5C, the pad 11A and the ground pad 12 of the interface board 10, the pad 21A and the ground pad 22 of the probe board 20, and Are electrically connected by an anisotropic conductive film 40, respectively.

  The pad 11 </ b> A is an end portion of the trace 11 and has the same width as the width of the trace 11. As described above, the width of the trace 11 is set to a width that can absorb these tolerances in consideration of the tolerance of the interface board 10 and the tolerance of the probe board 20.

  For this reason, as shown in FIG. 5C, the pad 21A fits inside the width of the pad 11A, and the pad 21A of the probe substrate 20 and the pad 10A of the interface substrate 10 can be reliably connected.

  Further, since the pad 11A of the interface board 10 is an end portion of the trace 11, the characteristic impedance of the trace 11 is optimized including the end portion that becomes the pad 11A.

  Similarly, since the pad 21A of the probe substrate 20 is an end portion of the trace 21, the characteristic impedance of the trace 21 including the end portion that becomes the pad 21A is optimized.

  That is, in the probe card 100 according to the first embodiment, the pad 11A that is the end of the trace 11 with the optimized characteristic impedance is different from the pad 21A that is the end of the trace 21 with the optimized characteristic impedance. Bonded via the conductive film 40.

  Therefore, according to the probe card 100 of the first embodiment, impedance mismatch is suppressed in the pad 11A and the pad 21A.

  Conventional probe cards ensure electrical connection between the interface board side and the probe board side through electrodes connected to the ends of the traces. The interface substrate and the probe substrate are connected by solder, an anisotropic conductive film, a spring probe, or the like, or directly connected without going through these.

  Such an electrode is wider than the trace in consideration of manufacturing tolerances between the interface substrate and the probe substrate.

  In general, since the trace has a length sufficiently longer than the wavelength of the signal, the characteristic impedance is optimized. The characteristic impedance is determined by the ratio between the capacitance per unit length of the trace and the inductance.

  On the other hand, since the electrode connected to the end of the trace does not have a length (or width) sufficiently longer than the wavelength of the signal, it behaves as an impedance element, and the impedance changes as the frequency changes.

  Therefore, even if the characteristic impedance of the trace is optimized, if an electrode having a width wider than the trace is connected to the end portion of the trace, mismatching of impedance between the trace and the electrode occurs, and the signal transmission characteristic is deteriorated.

  On the other hand, in the probe card 100 according to the first embodiment, as described above, the pad 11A that is the end of the trace 11 with the optimized characteristic impedance and the end of the trace 21 with the optimized characteristic impedance are used. A certain pad 21 </ b> A is bonded via an anisotropic conductive film 40. The probe card 100 according to the first embodiment does not include components that cause impedance mismatch unlike the conventional electrodes.

  For this reason, according to the first embodiment, it is possible to provide the probe card 100 with reduced impedance mismatch.

  In general, there are various types of probe cards such as a blade type, a cantilever type, and a vertical type in addition to a membrane type. Among these, a membrane type probe card is excellent in high-frequency characteristics, such as a semiconductor chip or a package substrate. It has a feature that it can easily cope with miniaturization.

  However, the conventional membrane-type probe card has electrodes connected to the ends of the traces, so that the impedance mismatch between the traces and the electrodes becomes more significant as the signal frequency increases.

  On the other hand, since the probe card 100 according to the first embodiment does not include components such as electrodes of the conventional probe card, the probe card 100 can cope with a signal having a higher frequency than the conventional probe card.

  As described above, according to the first embodiment, it is possible to provide a probe card 100 that can reduce impedance mismatching and can cope with high-frequency signals on the order of several tens of GHz, for example.

  Further, the probe card 100 of the first embodiment can replace the probe substrate 20 with another probe substrate for testing simply by removing the screw 31. Even when another test probe board is attached to the interface board 10, the impedance mismatch is reduced by using the end of the trace as a pad as in the case of the probe board 20, and high frequency signals are also supported. can do.

  In the above description, the form in which the width of the trace 11 of the interface board 10 is wider than the width of the trace 21 of the probe board 20 has been described.

  However, when the width of the trace 21 can be made wider than the width of the trace 11 while optimizing the characteristic impedance of each of the trace 11 and the trace 21, the width of the trace 21 of the probe board 20 is set to the width of the trace 11 of the interface board 10. It may be wider than the width.

  In this case, the width of the trace 21 may be set to a line width that is wider than the width of the trace 11 and can absorb the tolerance of the interface substrate 10 and the probe substrate 20.

<Embodiment 2>
The probe card of the second embodiment is different from the probe card 100 of the first embodiment in that bumps are used instead of the anisotropic conductive film 40.

  In the following, the same or equivalent components as those of the probe card 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. In the following, the description will be focused on the differences from the first embodiment.

  FIG. 6 is a diagram illustrating a probe substrate 20 of the probe card according to the second embodiment.

  FIG. 6A shows a portion of the extended portion 20B of the probe substrate 20 that is disposed to face a portion of the interface substrate 10 shown in FIG. 6B shows a cross section taken along arrow A2-A2 in FIG. 6A, and FIG. 6C shows a cross section taken along arrow B2-B2 in FIG. 6A.

  6A to 6C, an XYZ coordinate system is defined as in FIGS.

  In the probe substrate 20, bumps 240 </ b> A are disposed on the surface of the pad 21 </ b> A, and bumps 240 </ b> B are disposed on the surface of the ground pad 22. For example, gold bumps can be used as the bumps 240A and 240B.

  The bumps 240A and 240B connect between the pad 11A and the ground pad 12 of the interface substrate 10 and the pad 21A and the ground pad 22 of the probe substrate 20, respectively, instead of the anisotropic conductive film 40 of the first embodiment. To do. The bumps 240A and 240B are an example of connection portions.

  The height of the bumps 240A and 240B is determined by considering the difference in height between the pad 21A and the ground pad 22 and the coverlay 27, and the difference in height between the pad 11A and the ground pad 12 and the resist 17, and for the bonding. The height is set such that a sufficient electrical connection can be secured in a state where 240A and 240 are crushed.

  Next, joining of the interface board 10 and the probe board 20 of the probe card according to the second embodiment will be described with reference to FIG.

  FIG. 7 is a diagram illustrating a joint portion between the interface board 10 and the probe board 20 of the probe card according to the second embodiment.

  FIG. 7A is a plan view showing a state in which the interface board 10 is arranged on the lower side (Z-axis negative direction side) and the probe board 20 is overlaid on the upper side. In FIG. 7A, the probe substrate 20 is disposed so that the surface on which the trace 21, the pad 21A, and the ground pad 22 are formed faces the interface substrate 10 side.

  FIG. 7B shows a cross section taken along arrow B3-B3 in FIG. FIG. 7C shows a cross section taken along the line A3-A3 in FIG. FIG. 7D shows a cross section taken along arrow B4-B4 of FIG.

  7A to 7D, an XYZ coordinate system is defined as in FIGS.

  As shown in FIG. 7B, the B3-B3 cross section in FIG. 7A is a cross section in which the cross section of the probe substrate 20 shown in FIG. Since the interface board 10 does not exist in the B3-B3 cross section, only the cross section of the probe board 20 appears.

  As shown in FIG. 7C, bumps 240 </ b> A and 240 </ b> B are disposed between the interface substrate 10 and the probe substrate 20 in the A3-A3 cross section in FIG.

  The bumps 240A and 240B are formed between the pad 11A and the ground pad 12 of the interface substrate 10 and the pad 21A and the ground pad 22 of the probe substrate 20 by fixing the probe guide 30 to the interface substrate 10 with screws 31. Is pressed in the thickness direction.

  Thereby, the pad 11A and the ground pad 12 of the interface substrate 10 and the pad 21A and the ground pad 22 of the probe substrate 20 are electrically connected by the bumps 240A and 240B, respectively.

  As shown in FIG. 7D, the B4-B4 cross section of FIG. 7A is the same cross section as the cross section of the interface substrate 10 shown in FIG. Since the probe board 20 does not exist in the B4-B4 cross section, only the cross section of the interface board 10 appears.

  As described above, according to the probe card of the second embodiment, the pad 11A and the ground pad 12 of the interface substrate 10 and the pad 21A and the ground pad 22 of the probe substrate 20 are as shown in FIG. Are electrically connected by bumps 240A and 240B, respectively.

  Therefore, according to the probe card of the second embodiment, as in the probe card 100 of the first embodiment, impedance mismatch is suppressed in the pad 11A and the pad 21A.

  As described above, according to the second embodiment, it is possible to provide a probe card that can reduce impedance mismatching and can handle high-frequency signals on the order of several tens of GHz, for example.

  In the above, the form using the bumps 240A and 240B has been described. For example, the thickness of the resist 17 of the interface substrate 10 is reduced and the pad 11A and the ground pad 12 are directly connected to the pad 21A and the ground pad 22. Therefore, the bumps 240A and 240B may be omitted.

  That is, when the pad 11A and the ground pad 12 protrude from the surface of the resist 17, and the pad 11A and the ground pad 12 can be directly connected to the pad 21A and the ground pad 22, respectively, the bumps 240A and 240B are not used. Good. In this case, the pad 11A and the ground pad 12 are an example of a connection portion.

  The resist 17 may be thinned only around the openings 17A and 17B. When the resist 17 is formed by spraying, the resist 17 may be thinned by reducing the spraying amount around the openings 17A and 17B.

  Further, instead of the bumps 240A and 240B, a plating process may be performed on the surface of the pad 21A and the ground pad 22, or on the surface of the pad 11A and the ground pad 12. The surface of the pad 21A and the ground pad 22 or the surface of the pad 11A and the ground pad 12 may be thickened by plating to connect the pad 21A and the ground pad 22 to the pad 11A and the ground pad 12.

  As such plating treatment, for example, copper plating or gold plating may be performed. In this case, the surface of the pad 21A and the ground pad 22, or the plating portion formed on the surface of the pad 11A and the ground pad 12 is an example of the connection portion.

  The probe card of the exemplary embodiment of the present invention has been described above, but the present invention is not limited to the specifically disclosed embodiment, and does not depart from the scope of the claims. Various modifications and changes are possible.

DESCRIPTION OF SYMBOLS 10 Interface board 10A Opening part 11 Trace 11A pad 12 Ground pad 13 Connection pad 13A Coaxial connector 13B Signal line terminal 13C Ground terminal 20 Probe board 20A Protrusion part 20B Extension part 21 Trace 21A pad 22 Ground pad 23 Probe pad 30 Probe guide 40 Anisotropic conductive film 50 Press part 100 Probe card 240A, 240B Bump

Claims (6)

A first substrate having a first trace formed on one side and having rigidity;
A second substrate having a second trace on one side and having flexibility;
A connecting portion that connects an end portion of the first trace and an end portion of the second trace at a facing portion where the one surface of the first substrate and the one surface of the second substrate face each other; Including
The width of the first trace is wider than the width of the second trace and is a width corresponding to a tolerance of the first substrate and the second substrate, or
The width of the second trace is wider than the width of the first trace and is a width corresponding to the tolerance of the first substrate and the second substrate. The first substrate has an opening;
The second substrate has a protrusion that is bent in the opening and protrudes toward the other surface of the first substrate, and the other end of the second trace is formed in the protrusion. 1. The probe card according to 1.   The probe card according to claim 1, wherein the connection portion is an anisotropic conductive film or a bump.   4. The apparatus according to claim 1, further comprising a first covering portion formed on the first substrate so as to cover the first trace and having a first opening formed on the end portion of the first trace. The probe card according to any one of the above.   The probe card according to claim 4, wherein a thickness of a peripheral portion of the first opening portion of the first covering portion is made thinner than a portion other than the peripheral portion.   6. The device according to claim 1, further comprising: a second covering portion formed on the second substrate so as to cover the second trace and having a second opening formed on the end portion of the second trace. The probe card according to any one of the above.

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