TWI384091B - Detachable feeding/discharging structure and conductive film-forming device including the same - Google Patents
Detachable feeding/discharging structure and conductive film-forming device including the same Download PDFInfo
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- TWI384091B TWI384091B TW99114859A TW99114859A TWI384091B TW I384091 B TWI384091 B TW I384091B TW 99114859 A TW99114859 A TW 99114859A TW 99114859 A TW99114859 A TW 99114859A TW I384091 B TWI384091 B TW I384091B
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- film forming
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- conductive film
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- 238000007599 discharging Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 31
- 238000005086 pumping Methods 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 9
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 8
- 229910001887 tin oxide Inorganic materials 0.000 claims description 8
- 238000000137 annealing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 87
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 239000005329 float glass Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 238000006124 Pilkington process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 238000007507 annealing of glass Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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- Chemical Vapour Deposition (AREA)
Description
本發明是有關於一種可拆卸式進出氣結構及其導電膜成膜裝置，且特別是有關於一種具備可替換性的可拆卸式進出氣結構。The present invention relates to a detachable inlet and outlet gas structure and a conductive film forming apparatus thereof, and more particularly to an detachable inlet and outlet gas structure having an alternative.
液晶顯示元件、電激發光元件等之各種顯示元件或薄膜太陽電池之電極，其電極主要為具有可見光線透過率高，且電阻低之透明導電性之薄膜。因此，透明導電膜成為完成現今各種顯示器元件中不可或缺的電極材料。例如氧化銦錫(Indium Tin Oxide，ITO)或氧化錫(Tin Oxide，TO)、摻雜有氟之錫氧化物(Fluorine－doped Tin Oxide，FTO)等導電性金屬氧化物為主要成分之膜，兼具對可見光優異之透明性及優異之電性傳導性。The electrodes of various display elements such as a liquid crystal display element and an electroluminescence element, or electrodes of a thin film solar cell, are mainly thin films having a transparent conductive property having a high visible light transmittance and a low electric resistance. Therefore, the transparent conductive film becomes an electrode material which is indispensable for accomplishing various display elements in the present day. For example, a film containing a conductive metal oxide such as indium tin oxide (ITO), tin oxide (Tin Oxide, TO), or fluorine-doped tin oxide (FTO) as a main component, It has excellent transparency to visible light and excellent electrical conductivity.
此外，一般製造透明導電膜的裝置係使用，例如電漿CVD方法。此方法將既有的靶材，以電漿的方式在基板上進行成膜。由於製程條件必須在真空(或接近真空)下進行，所以這樣的製程假如是以連續式操作的話，所必須使用的設備不僅複雜且昂貴，使得所製造的成品價格甚高。且銦(In)因為價格昂貴，資源有限，所以並不適合未來產業的發展。而氧化錫薄膜，由於價格低、在高溫下穩定性佳以及化性穩定，且用來形成氧化錫薄膜的鍍膜製程不需要在真空的環境下進行，所以這樣的製程條件對透明導電膜的發展極具競爭力。Further, generally, a device for manufacturing a transparent conductive film is used, for example, a plasma CVD method. In this method, an existing target is plasma-formed on a substrate. Since the process conditions must be carried out under vacuum (or near vacuum), if such a process is operated in a continuous operation, the equipment that must be used is not only complicated but also expensive, so that the manufactured product is expensive. Indium (In) is not suitable for the development of future industries because of its high price and limited resources. The tin oxide film has a low price, good stability at high temperature, and stable chemical stability, and the coating process for forming a tin oxide film does not need to be performed in a vacuum environment, so the development of such a process condition for the transparent conductive film Very competitive.
習知製造氧化錫的導電膜裝置欲進行連續式操作的製程時需結合目前常用於浮法玻璃(在高溫下將熔化的玻璃液流在熔融的金屬液面上，浮飄拋光，成型為平整、光潔的平板玻璃)的製程及其退火製程。此習知技術必須將一浮法玻璃導入一體成型的隧道爐中，然而須根據反應物的製程條件對隧道爐進行改裝以符合不同製程需求這些製程條件，例如習知有在常壓下進行的化學氣相沉績法(CVD)製程。然而，對於沒有具備浮法製程的廠商，就無法施行氧化錫的鍍膜製程。It is known that a conductive film device for manufacturing tin oxide needs to be combined with a float glass which is currently used in a continuous operation process. (The molten glass liquid is flowed on a molten metal surface at a high temperature, floated and polished, and formed into a flat surface. , smooth glass plate process and its annealing process. This prior art technique must introduce a float glass into an integrally formed tunnel furnace. However, the tunnel furnace must be modified according to the process conditions of the reactants to meet the process requirements of different process requirements, such as conventionally carried out under normal pressure. Chemical vapor deposition (CVD) process. However, for manufacturers that do not have a float process, it is impossible to apply a tin oxide coating process.
因此有需要提供一種能符合前述需求導電膜成膜裝置。Therefore, there is a need to provide a film forming apparatus for a conductive film that meets the aforementioned requirements.
因此，本發明之一態樣是在提供一種可拆卸式進出氣結構及其導電膜成膜裝置，將習知隧道爐中的成膜裝置模組化成一獨立的裝置，藉以由連接元件在前後分別連接所需製程的製程機台，具有可替換的特性，而可直接與各種製程裝置組裝在一起，以節省進行改裝的成本及時間。Therefore, an aspect of the present invention provides a detachable inlet and outlet gas structure and a conductive film forming apparatus thereof, and the film forming apparatus in the conventional tunnel furnace is modularized into a separate device, whereby the connecting elements are before and after The process machines that connect the required processes are respectively replaceable, and can be directly assembled with various process devices to save the cost and time of modification.
因此，本發明之另一態樣是在提供一種即使不具備浮法玻璃製程亦可連續量產透明導電薄膜的導電膜成膜裝置，並且可以利用習知的連接元件把數個本發明的導電膜成膜裝置串列成一連續生產製程。本發明之另一態樣是在提供一種可拆卸式進出氣結構及其導電膜成膜裝置，藉由可拆卸式進出氣結構的獨立設計，因此導電膜成膜裝置的成膜原料供應管路以及排氣管路具有拆卸方便以及清洗容易的優點。Therefore, another aspect of the present invention provides a conductive film forming apparatus which can continuously mass-produce a transparent conductive film even without a float glass process, and can electrically conduct several conductive materials of the present invention by using a conventional connecting member. The film forming apparatus is serially arranged into a continuous production process. Another aspect of the present invention provides a detachable inlet and outlet gas structure and a conductive film forming device thereof. The film forming material supply line of the conductive film forming device is independently designed by the detachable inlet and outlet gas structure. And the exhaust line has the advantages of easy disassembly and easy cleaning.
本發明之另一態樣是在提供一種可與既有浮法玻璃製以及既有玻璃退火設備結合的導電膜成膜裝置，而串接成一種進行噴霧裂解法的連續生產線以生產透明導電氧化錫。Another aspect of the present invention provides a conductive film forming apparatus which can be combined with an existing float glass and an existing glass annealing apparatus, and is connected in series to a continuous production line for spray cracking to produce transparent conductive oxidation. tin.
根據本發明之上述目的，提出一種可拆卸式進出氣結構，其包含板體、排氣單元、成膜原料供應單元以及兩鎖固元件。排氣單元設置於該板體之一端。成膜原料供應單元設置於板體之另一端。兩鎖固元件分別將排氣單元以及成膜原料供應單元鎖固於板體上。排氣單元包含至少一抽氣管，每一個抽氣管具有一氣體流量控制閥。這些抽氣管共同具有一抽氣開口。成膜原料供應單元包含容室，容室具有一原料供應孔，設置於容室靠近排氣單元之一側面。According to the above object of the present invention, a detachable inlet and outlet gas structure is proposed which comprises a plate body, an exhaust unit, a film forming material supply unit, and two locking elements. The exhaust unit is disposed at one end of the plate body. The film forming material supply unit is disposed at the other end of the plate body. The two locking elements respectively lock the exhaust unit and the film forming material supply unit to the plate body. The exhaust unit includes at least one exhaust pipe, and each of the exhaust pipes has a gas flow control valve. These exhaust pipes collectively have an exhaust opening. The film forming raw material supply unit comprises a chamber, and the chamber has a raw material supply hole disposed on the side of the chamber adjacent to the exhaust unit.
根據本發明之上述目的，提出一種導電膜成膜裝置，其包含爐體、輸送裝置、加熱器、可拆卸式進出氣結構、第一連接元件以及第二連接元件。爐體具有成膜室橫向貫穿爐體，成膜室具有基板輸入端以及基板輸出端。輸送裝置具有貫穿成膜室之輸送軌道。加熱器設置於輸送軌道下方。可拆卸式進出氣結構設置於成膜室上方且面對輸送裝置。第一連接元件設置於基板輸入端，以連接至第一製程裝置。第二連接元件設置於基板輸出端，以連接至第二製程裝置。其中可拆卸式進出氣結構包含板體、第一鎖固元件、排氣單元以及成膜原料供應單元。第一鎖固元件圍繞板體以將板體鎖固於爐體上。排氣單元設置於板體之一端，且鄰近成膜室的基板輸出端。成膜原料供應單元設置於板體之另一端，且鄰近成膜室之基板輸出端。According to the above object of the present invention, there is provided a conductive film forming apparatus comprising a furnace body, a conveying device, a heater, a detachable inlet and outlet gas structure, a first connecting member, and a second connecting member. The furnace body has a film forming chamber extending transversely through the furnace body, and the film forming chamber has a substrate input end and a substrate output end. The conveyor has a conveyor track that extends through the film forming chamber. The heater is placed below the conveyor track. The detachable inlet and outlet gas structure is disposed above the film forming chamber and faces the conveying device. The first connection element is disposed at the substrate input end for connection to the first process device. The second connecting element is disposed at the output end of the substrate to be connected to the second process device. The detachable inlet and outlet gas structure comprises a plate body, a first locking component, an exhaust unit and a film forming raw material supply unit. The first locking element surrounds the plate body to lock the plate body to the furnace body. The exhaust unit is disposed at one end of the plate body and adjacent to the substrate output end of the film forming chamber. The film forming material supply unit is disposed at the other end of the plate body and adjacent to the substrate output end of the film forming chamber.
依據本發明之一實施例，上述可拆卸式進出氣結構更包含第二加熱器，設置於板體中，且位於排氣單元與成膜原料供應單元之間。According to an embodiment of the invention, the detachable inlet and outlet gas structure further comprises a second heater disposed in the plate body and located between the exhaust unit and the film forming material supply unit.
依據本發明之一實施例，上述排氣單元包含至少一個抽氣管，這些抽氣管具有共同之抽氣室，且這些抽氣管共同具有一抽氣開口。According to an embodiment of the present invention, the exhaust unit includes at least one exhaust pipe having a common pumping chamber, and the exhaust pipes collectively have an exhausting opening.
依據本發明之一實施例，上述第一製程裝置係基板加熱裝置。According to an embodiment of the invention, the first process device is a substrate heating device.
依據本發明之一實施例，上述第二製程裝置係基板退火裝置。According to an embodiment of the invention, the second process device is a substrate annealing device.
藉由運用本發明之導電膜成膜裝置，可節省購買機台進行改裝的成本，並且藉由連接元件的設置，上述成膜裝置的前段製程與後段製程具有更彈性的選擇性，且具有可替換性，達到降低生產成本之目的。By using the conductive film forming device of the present invention, the cost of purchasing the machine for modification can be saved, and by the arrangement of the connecting elements, the front-end process and the back-end process of the film forming apparatus have more elastic selectivity, and have Replacement, to achieve the purpose of reducing production costs.
請參照第1圖，其繪示依照本發明一實施例的一種導電膜成膜裝置100。導電膜成膜裝置100包含爐體110、輸送裝置120、加熱器130、可拆卸式進出氣結構140、連接元件150以及連接元件160。Please refer to FIG. 1 , which illustrates a conductive film forming apparatus 100 according to an embodiment of the invention. The conductive film forming apparatus 100 includes a furnace body 110, a conveying device 120, a heater 130, a detachable inlet and outlet gas structure 140, a connecting member 150, and a connecting member 160.
導電膜的成膜作業係於爐體110內的成膜室111內進行。成膜室111具有基板輸入端112以及基板輸出端113，以便於將欲進行成膜作業的基板101經由基板輸入端112輸入，並經由基板輸出端113輸出。而爐體110具備隔熱材，以防止爐體110的熱散失。隔熱材可例如第2圖的保溫棉114。The film forming operation of the conductive film is performed in the film forming chamber 111 in the furnace body 110. The film forming chamber 111 has a substrate input end 112 and a substrate output end 113 so as to facilitate input of the substrate 101 to be subjected to the film forming operation via the substrate input terminal 112 and output via the substrate output end 113. The furnace body 110 is provided with a heat insulating material to prevent heat loss of the furnace body 110. The heat insulating material can be, for example, the heat insulating cotton 114 of Fig. 2.
請參照第2圖，輸送裝置120包含輸送軌道121，例如可為履帶，用以將進行成膜作業的基板101自基板輸入端112輸送至基板輸出端113。在一實施例中，輸送裝置120可利用例如滾輪輸送裝置120，其包含有複數個可自由滾動的滾輪122、繞設於這些滾輪122外的輸送軌道121以及滾輪驅動裝置123，而滾輪驅動裝置係受傳動馬達124所驅動。這些滾輪122之輪軸係藉由結合件125結合在一起。結合件125可例如為鏈條或皮帶。滾輪驅動裝置120則與這些滾輪122其中一個的輪軸相互結合，藉由驅動此滾輪122的輪軸來驅動所有的滾輪122轉動。當啟動傳動馬達124後，滾輪驅動裝置123驅動所有滾輪122轉動，藉此滾輪122帶動輸送軌道121，以將基板101自基板輸入端112輸送到成膜室111內。在一實施例中，輸送裝置120更包含控制結構(未繪示)以控制滾輪驅動裝置123的驅動速度，藉此可控制滾輪122的轉動速度，以達到調整基板101在成膜室111內的移動速度。Referring to FIG. 2, the transport device 120 includes a transport track 121, which may be, for example, a crawler belt for transporting the substrate 101 that performs the film forming operation from the substrate input end 112 to the substrate output end 113. In an embodiment, the transport device 120 can utilize, for example, a roller transport device 120 that includes a plurality of freely rollable rollers 122, a transport track 121 disposed around the rollers 122, and a roller drive device 123, and the roller drive device It is driven by the drive motor 124. The axles of these rollers 122 are joined together by a joint 125. The coupling member 125 can be, for example, a chain or a belt. The roller drive unit 120 is coupled to the axle of one of the rollers 122 to drive all of the rollers 122 to rotate by driving the axle of the roller 122. When the drive motor 124 is activated, the roller drive 123 drives all of the rollers 122 to rotate, whereby the rollers 122 drive the transport track 121 to transport the substrate 101 from the substrate input end 112 into the film forming chamber 111. In an embodiment, the conveying device 120 further includes a control structure (not shown) to control the driving speed of the roller driving device 123, thereby controlling the rotation speed of the roller 122 to adjust the substrate 101 in the film forming chamber 111. Moving speed.
如第1圖所示，加熱器130設置於輸送裝置120的下方，且設置於爐體110內，以對成膜室111內的基板101進行加熱處理。在一實施例中，加熱器130的係獨立設置於輸送裝置120下方。亦即，滾輪122的轉動並不會帶動加熱器130轉動，使得基板101在受到加熱器130均勻受熱的情況下，進行成膜製程。As shown in FIG. 1, the heater 130 is disposed below the conveying device 120 and is disposed in the furnace body 110 to heat the substrate 101 in the film forming chamber 111. In an embodiment, the heaters 130 are independently disposed below the delivery device 120. That is, the rotation of the roller 122 does not drive the heater 130 to rotate, so that the substrate 101 is subjected to a film forming process under the condition that the heater 130 is uniformly heated.
可拆卸式進出氣結構140係獨立設置於成膜室111的上方，且面對輸送裝置120。請參照第3A圖，此可拆卸式進出氣結構140包含有板體141、第一鎖固元件142、排氣單元143以及成膜原料供應單元144。The detachable inlet and outlet gas structure 140 is independently disposed above the film forming chamber 111 and faces the conveying device 120. Referring to FIG. 3A , the detachable inlet and outlet gas structure 140 includes a plate body 141 , a first locking element 142 , an exhaust unit 143 , and a film forming material supply unit 144 .
板體141較佳係以高耐熱的金屬所形成，並鋪設有隔熱材，以隔絕爐體內的熱散失。請一併參照第1圖，第一鎖固元件142，例如包含螺絲142a與螺絲孔142b之組合。螺絲孔142b環繞設置於板體141之週邊，藉由螺絲142a將上述板體141鎖固於爐體110上。The plate body 141 is preferably formed of a highly heat-resistant metal and is provided with a heat insulating material to isolate heat loss in the furnace body. Referring to FIG. 1 together, the first locking component 142 includes, for example, a combination of a screw 142a and a screw hole 142b. The screw hole 142b is disposed around the periphery of the plate body 141, and the plate body 141 is locked to the furnace body 110 by a screw 142a.
請同時參照第1圖與第3B圖，第3B圖係繪示沿著第3A圖之剖線AA’的剖面示意圖。排氣單元143設置於板體141之一端，且鄰近於成膜室111的基板輸出端112。排氣單元143包含至少一個抽氣管310。在本實施例中，這些抽氣管310中的每一者均具有一氣體流量控制閥320位於管內，藉此可形成均勻的抽氣效果，且這些抽氣管310共同具有抽氣開口330。藉由抽氣開口330的抽氣可使成膜室111內產生風道效應，使得成膜室內的氣體會因排氣單元143的抽取，而自基板輸入端112向基板輸出端113的方向流動。因此，當基板101由基板輸入端112移動至基板輸出端113時，至此成膜作業已大致完成。在本實施例中，抽氣開口330為一條狀結構。在其他實施例中，抽氣開口330為一孔狀。在另一實施例中，排氣單元143包含至少一個隔板341，使得這些抽氣管中的相鄰每兩者具有一抽氣室340，如第3D圖所示，藉此可進一步提高抽氣的均勻性。在一實施例中，氣體流量控制閥320可以是球閥或者蝴蝶閥。Please refer to FIG. 1 and FIG. 3B simultaneously. FIG. 3B is a schematic cross-sectional view along the line AA' of FIG. 3A. The exhaust unit 143 is disposed at one end of the plate body 141 and adjacent to the substrate output end 112 of the film forming chamber 111. The exhaust unit 143 includes at least one exhaust pipe 310. In the present embodiment, each of the exhaust pipes 310 has a gas flow control valve 320 located within the pipe, whereby a uniform pumping effect can be formed, and the exhaust pipes 310 have a pumping opening 330 in common. The air passage effect is generated in the film forming chamber 111 by the pumping of the pumping opening 330, so that the gas in the film forming chamber flows from the substrate input end 112 to the substrate output end 113 due to the extraction of the exhaust unit 143. . Therefore, when the substrate 101 is moved from the substrate input end 112 to the substrate output end 113, the film forming operation has been substantially completed. In the present embodiment, the suction opening 330 has a strip-like structure. In other embodiments, the suction opening 330 is in the shape of a hole. In another embodiment, the exhaust unit 143 includes at least one partition 341 such that adjacent ones of the exhaust tubes have a pumping chamber 340, as shown in FIG. 3D, thereby further enhancing pumping. Uniformity. In an embodiment, the gas flow control valve 320 can be a ball valve or a butterfly valve.
請同時參照第1圖與第3C圖，第3C圖係繪示沿著第3A圖之剖線BB’的剖面示意圖。成膜原料供應單元144包含容室350以及管路360將成膜原料輸送至此容室350內。容室350更包含至少一個垂直設立之隔板356，以將容室354分隔成至少二個容室354a以進一步提高成膜原料之混合均勻性。而原料供應孔352則設置於容室350靠近排氣單元143之一側，而非位於容室350之底部。藉此成膜原料在容室350底部進一步進行儲存，直至液面高於原料供應孔352而流向入成膜室111內之基板101，以提高成膜的均勻度。在一實施例中，成膜原料係以霧氣態噴塗至基板101上，成膜原料包含，例如可溶性錫鹽的透明導電化學溶液。Please refer to FIG. 1 and FIG. 3C simultaneously, and FIG. 3C is a schematic cross-sectional view taken along line BB' of FIG. 3A. The film forming material supply unit 144 includes a chamber 350 and a line 360 for conveying the film forming material into the chamber 350. The chamber 350 further includes at least one vertically disposed partition 356 to divide the chamber 354 into at least two chambers 354a to further enhance the mixing uniformity of the film forming material. The raw material supply hole 352 is disposed on one side of the chamber 350 near the exhaust unit 143 instead of being located at the bottom of the chamber 350. Thereby, the film forming raw material is further stored at the bottom of the chamber 350 until the liquid level is higher than the material supply hole 352 and flows to the substrate 101 which is inserted into the film forming chamber 111 to improve the uniformity of film formation. In one embodiment, the film forming material is sprayed onto the substrate 101 in a mist state comprising a transparent conductive chemical solution such as a soluble tin salt.
在一實施例中，此可拆卸式進出氣結構更包含加熱器145，係設置於板體141中，且位於排氣單元143與成膜原料供應單元144之間。In an embodiment, the detachable inlet and outlet gas structure further includes a heater 145 disposed in the plate body 141 and located between the exhaust unit 143 and the film forming material supply unit 144.
請參照第4圖，其係繪示根據本發明一實施例的可拆卸式進出氣結構440。此可拆卸式進出氣結構440更包含第二鎖固元件以及第三鎖固元件，例如第4圖之複數個扣環441、442。藉由這些扣環441、442，分別將排氣單元143以及成膜原料單元144可拆卸式地鎖固於板體141上。如此有利於拆卸成膜原料供應單元144以及排氣單元143，以清除附著於管路內的成膜原料。或者，在其他實施例中，亦可視製程需求替換成膜原料供應單元144。Please refer to FIG. 4, which illustrates a detachable inlet and outlet structure 440 according to an embodiment of the invention. The detachable inlet and outlet structure 440 further includes a second locking element and a third locking element, such as a plurality of buckles 441, 442 of FIG. The venting unit 143 and the film forming material unit 144 are detachably locked to the plate body 141 by the buckles 441 and 442, respectively. This facilitates disassembly of the film forming material supply unit 144 and the exhaust unit 143 to remove the film forming material adhering to the inside of the pipe. Alternatively, in other embodiments, the film forming material supply unit 144 may also be replaced depending on the process requirements.
請同時參照第1圖與第5圖，其中弟5圖係繪示依據本發明一實施例之導電膜成膜裝置100之立體側示圖。連接元件150、160係分別設置於此導電膜成膜裝置100之基板輸入端112以及基板輸出端113。連接元件150係用以連接此導電膜成膜裝置100至第一製程裝置，例如基板加熱裝置500a，以使得基板101在進到此導電膜成膜裝置100前即具有一預設溫度。連接元件160係用以連接此導電膜成膜裝置100至第二製程裝置，例如基板退火裝置500b，以使得基板101在進行成膜作業後可進行退火製程。然而，在另一實施例中，第一製程裝置以及第二製程裝置係可根據實際製程需求以替換不同的製程裝置。Please refer to FIG. 1 and FIG. 5 simultaneously. FIG. 5 is a perspective side view of the conductive film forming apparatus 100 according to an embodiment of the present invention. The connecting members 150 and 160 are respectively disposed at the substrate input end 112 and the substrate output end 113 of the conductive film forming apparatus 100. The connecting member 150 is used to connect the conductive film forming apparatus 100 to the first process device, such as the substrate heating device 500a, so that the substrate 101 has a predetermined temperature before entering the conductive film forming device 100. The connecting member 160 is used to connect the conductive film forming apparatus 100 to the second processing apparatus, for example, the substrate annealing apparatus 500b, so that the substrate 101 can be subjected to an annealing process after performing a film forming operation. However, in another embodiment, the first process device and the second process device can replace different process devices according to actual process requirements.
由上述本發明實施方式可知，應用本發明之導電膜成膜裝置具有可節省改裝機台成本的優點。並且藉由連接元件的設置，上述成膜裝置的前段製程與後段製程具有更彈性的選擇性，且具有可替換性，達到降低生產成本之目的。此外，藉由可拆卸式進出氣結構的獨立設計，導電膜成膜裝置的成膜原料供應管路以及排氣管路具有拆卸方便以及清洗容易的優點。可以一導電膜成膜裝置搭配兩可拆卸式進出氣結構，在清除附著於管路內的成膜時，可以另一進出氣結構進行替換，藉此生產線不會因清洗而導致停止。It can be seen from the above embodiments of the present invention that the conductive film forming apparatus to which the present invention is applied has the advantage of saving the cost of the modified machine. And by the arrangement of the connecting elements, the front-end process and the back-end process of the film forming apparatus have more elastic selectivity and are replaceable, thereby achieving the purpose of reducing production cost. In addition, the film forming material supply line and the exhaust line of the conductive film forming apparatus have the advantages of convenient disassembly and easy cleaning by the independent design of the detachable inlet and outlet gas structure. A conductive film forming device can be combined with two detachable inlet and outlet structures, and when the film attached to the pipe is removed, another inlet and outlet structure can be replaced, so that the production line is not stopped by cleaning.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100．．．導電膜成膜裝置100. . . Conductive film forming device
101．．．基板101. . . Substrate
110．．．爐體110. . . Furnace body
111．．．成膜室111. . . Film forming chamber
112．．．基板輸入端112. . . Substrate input
113．．．基板輸出端113. . . Substrate output
114．．．保溫棉114. . . Insulation cotton
120．．．輸送裝置120. . . Conveyor
121．．．輸送軌道121. . . Transport track
122．．．滾輪122. . . Wheel
123．．．滾輪驅動裝置123. . . Roller drive
124．．．傳動馬達124. . . Drive motor
125．．．結合件125. . . Joint piece
130．．．加熱器130. . . Heater
140．．．可拆卸式進出氣結構140. . . Removable inlet and outlet structure
141．．．板體141. . . Plate body
142．．．第一鎖固元件142. . . First locking element
142a．．．螺絲142a. . . Screw
142b．．．螺絲孔142b. . . screw hole
143．．．排氣單元143. . . Exhaust unit
144．．．成膜原料供應單元144. . . Film forming material supply unit
145．．．加熱器145. . . Heater
310．．．抽氣管310. . . Exhaust pipe
150、160．．．連接元件150, 160. . . Connecting element
330．．．抽氣開口330. . . Pumping opening
320．．．氣體流量控制閥320. . . Gas flow control valve
341．．．隔板341. . . Partition
340．．．抽氣室340. . . Pumping room
350．．．容室350. . . Room
352．．．原料供應孔352. . . Raw material supply hole
353．．．容室353. . . Room
354．．．容室354. . . Room
354a．．．容室354a. . . Room
356．．．隔板356. . . Partition
440．．．可拆卸式進出氣結構440. . . Removable inlet and outlet structure
441、442．．．扣環441, 442. . . Buckle
500a．．．基板加熱裝置500a. . . Substrate heating device
500b．．．基板退火裝置500b. . . Substrate annealing device
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1圖係繪示依照本發明一實施例之導電膜成膜裝置的結構示意圖。1 is a schematic view showing the structure of a film forming apparatus for a conductive film according to an embodiment of the present invention.
第2圖係繪示依照本發明一實施例之輸送裝置的結構示意圖。2 is a schematic structural view of a conveying device according to an embodiment of the present invention.
第3A圖係繪示依照本發明一實施例的可拆卸式進出氣結構的結構示意圖。3A is a schematic view showing the structure of a detachable inlet and outlet gas structure according to an embodiment of the present invention.
第3B圖係繪示沿著第3A圖之剖線AA’的剖面示意圖。Fig. 3B is a schematic cross-sectional view taken along line AA' of Fig. 3A.
第3C圖係繪示沿著第3A圖之剖線BB’的剖面示意圖。Fig. 3C is a schematic cross-sectional view taken along line BB' of Fig. 3A.
第3D圖係繪示依照本發明一實施例的排氣單元的剖面示意圖。3D is a schematic cross-sectional view of an exhaust unit in accordance with an embodiment of the present invention.
第4圖係繪示依照本發明另一實施例之可拆卸式進出氣結構之結構示意圖。Figure 4 is a schematic view showing the structure of a detachable inlet and outlet gas structure according to another embodiment of the present invention.
第5圖係繪示依照本發明另一實施例之導電膜成膜裝置的結構示意圖。Figure 5 is a schematic view showing the structure of a film forming apparatus for a conductive film according to another embodiment of the present invention.
100．．．導電膜成膜裝置100. . . Conductive film forming device
101．．．基板101. . . Substrate
110．．．爐體110. . . Furnace body
111．．．成膜室111. . . Film forming chamber
112．．．基板輸入端112. . . Substrate input
113．．．基板輸出端113. . . Substrate output
120．．．輸送裝置120. . . Conveyor
121．．．輸送軌道121. . . Transport track
122．．．滾輪122. . . Wheel
130．．．加熱器130. . . Heater
140．．．可拆卸式進出氣結構140. . . Removable inlet and outlet structure
141．．．板體141. . . Plate body
142．．．第一鎖固元件142. . . First locking element
142a．．．螺絲142a. . . Screw
142b．．．螺絲孔142b. . . screw hole
143．．．排氣單元143. . . Exhaust unit
144．．．成膜原料供應單元144. . . Film forming material supply unit
145．．．加熱器145. . . Heater
150、160．．．連接元件150, 160. . . Connecting element
320．．．氣體流量控制閥320. . . Gas flow control valve
330．．．抽氣開口330. . . Pumping opening
351．．．隔板351. . . Partition
352．．．原料供應孔352. . . Raw material supply hole
Claims (16)
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| TWI262961B (en) * | 2004-05-31 | 2006-10-01 | Shimadzu Corp | Film formation apparatus and film formation system using the same |
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| TWI262961B (en) * | 2004-05-31 | 2006-10-01 | Shimadzu Corp | Film formation apparatus and film formation system using the same |
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