WO2014183339A1 - Substrate cleaning device, system and method - Google Patents

Abstract

Disclosed is a substrate cleaning device. The substrate cleaning device comprises a water tank (1), a water pump (2) connected to the water tank (1), a plurality of nozzles (3) connected to the water pump (2) wherein a fluid flowing from the plurality of nozzles (3) is sprayed onto a substrate (5), and also heaters (11, 12) which are arranged in the substrate cleaning device for heating the fluid before the fluid flows from the nozzles (3). Also disclosed are a cleaning system comprising the cleaning device and a cleaning method. Because of the heating of the heaters, the temperature of the fluid for cleaning the substrate can be increased so that the molecular movement in the fluid is accelerated, thereby increasing the solubility of foreign organic matters in the fluid, improving the removing probability of the foreign organic matters, and in turn improving the product yield.

Description

 Substrate cleaning device, system and method

Technical field

 Embodiments of the invention relate to a substrate cleaning apparatus, system, and method. Background technique

 Among flat panel display devices, Thin Film Transistor Liquid Crystal Display (TFT-LCD) has the characteristics of small size, low power consumption, relatively low manufacturing cost and no radiation, and is dominant in the current flat panel display market. status.

 Oxide Thin Film Transistor (OTFT) has the advantages of ultra-thin, light weight, low power consumption, etc., and can be used not only for manufacturing liquid crystal display panels, but also as an organic light-emitting diode for a new generation of organic light-emitting display panels (Organic). Light-Emitting Diode, OLED) The application of display devices offers the possibility. This is because the OLED display device is more colorful and clearer than the existing TFT-LCD.

 In a manufacturing process such as the above display panel, a variety of organic materials, particularly polymer materials, are involved in the production of debris that may remain on the substrate. Therefore, the cleaning process is an indispensable part of the substrate fabrication. Cleaning is a process technique that removes substrate contamination or particles in the process to improve product yield. By effectively cleaning the substrate, the adhesion between the layers can be improved.

 The wet cleaning method currently used mainly in LCD and OLED processes is room temperature water washing. Washing is divided into pure water washing and water and gas two-fluid mixing and washing. The common principle of both is through the impact force of high-pressure water flow or high-pressure water-gas two-fluid or the impact of gas bubble blasting. However, the ability to remove fine d and organic foreign matter on the substrate is very limited, so it is easy. Causes the product's non-performing rate to increase the strength. Summary of the invention

 Embodiments of the present invention provide a substrate cleaning apparatus, system, and method for improving the ability to remove fine d and organic foreign matter attached to a substrate, thereby improving product yield.

According to an aspect of the invention, a substrate cleaning apparatus is provided, comprising: a water tank, A water pump connected to the water tank, a plurality of nozzles connected to the water pump, and a heater disposed in the substrate cleaning device to heat the fluid before the fluid flows out of the nozzle. According to an embodiment of the present invention, the heater may include a first heater disposed at the plurality of nozzles to heat an outflow fluid of the plurality of nozzles.

 According to an embodiment of the present invention, the outflow fluid of the plurality of nozzles may be sprayed on the substrate to be cleaned in transit, and the plurality of nozzles may include at least one set of pre-spray nozzles and at least one set of hedging nozzles, each The set of the punching nozzles includes oppositely disposed two sets of spray nozzles opposite to each other, and the at least one set of pre-spray nozzles may be disposed upstream of the at least one set of the punching nozzles in the substrate conveying direction.

 According to an embodiment of the invention, the heater may include a second heater disposed in the water tank to heat water in the water tank.

 According to an embodiment of the present invention, the substrate cleaning apparatus may further include a gas pump connected to the plurality of nozzles, the heater including a communication line disposed on the air pump and the plurality of nozzles to perform gas Heated gas heater.

 According to an embodiment of the present invention, the substrate cleaning apparatus may further include a pre-heater configured to pre-heat the substrate to be cleaned, the pre-heater being disposed upstream of the plurality of nozzles in a substrate transfer direction.

 According to an embodiment of the invention, the preheater may be a light heater or a hot air heater.

 According to another aspect of the present invention, a substrate cleaning system is provided, comprising: any one of the substrate cleaning devices described above; a temperature sensor disposed on a water outlet side of the nozzle, configured to detect an outflow of the nozzle a temperature information of the fluid; and a control device coupled to the temperature sensor signal, configured to control the heater to heat when the temperature of the outflow fluid of the nozzle is less than a set first temperature threshold, and to flow out of the nozzle When the temperature is not less than the set first temperature threshold, the control heater stops heating.

 According to still another aspect of the present invention, a substrate cleaning method comprising: spraying cleaning a substrate with heated water or a heated water-air mixed fluid.

According to an embodiment of the present invention, the step of performing the spray cleaning on the substrate by using the heated water or the heated water-air mixed fluid may include: performing the cleaned substrate on the cleaned substrate by using the heated water or the heated water-air mixed fluid. Pre-spraying; and using the heated water or the heated water-air mixed fluid to perform a counter-spraying of the substrate to be cleaned. According to an embodiment of the present invention, the substrate cleaning method may further include: preheating the substrate to about 40 before performing the spray cleaning on the substrate to be cleaned by using heated water or a heated water-air mixed fluid. ~120 °C.

 According to an embodiment of the present invention, the substrate may be preheated to about 100 to 120 ° C before the spray cleaning of the substrate to be cleaned by using heated water or a heated water-air mixed fluid.

 According to an embodiment of the present invention, the substrate cleaning method of any one of the above methods may further include: cooling the substrate after performing the spray cleaning on the substrate to be cleaned by using heated water or a heated water-air mixed fluid. To the set temperature.

 According to an embodiment of the present invention, in the substrate cleaning method of any one of the above, the temperature of the heated water or the heated water-air mixed fluid may be about 40 to 100 °C. DRAWINGS

 The embodiments of the present invention will be described in more detail below with reference to the accompanying drawings, in which FIG.

 1 is a schematic structural view of a substrate cleaning apparatus according to an embodiment of the present invention;

 2 is a schematic view showing a nozzle arrangement structure of a substrate cleaning apparatus according to an embodiment of the present invention; FIG. 3 is a schematic diagram of a preheater distribution of a substrate cleaning apparatus according to an embodiment of the present invention; and FIG. 4 is a substrate according to an embodiment of the present invention. Schematic diagram of the workflow of the cleaning system.

 Reference mark:

 1-water tank 2-pump 3-nozzle 4-air pump 5-substrate

 6-Transfer device 11-Second heater 12-First heater 13-Gas heater

 14-Preheater 31--Group pre-spray nozzle 32--Group hedging nozzle

 The technical solutions of the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are only a part of the exemplary embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described exemplary embodiments of the present invention without the need for creative labor are within the scope of the present invention.

Unless otherwise defined, technical terms or scientific terms used herein shall be of ordinary meaning as understood by those of ordinary skill in the art to which the invention pertains. Patent application specification and right of the present invention The terms "first", "second" and similar terms used in the claims do not denote any order, quantity or importance, but are merely used to distinguish different components. Similarly, the words "a", "an" or "the" do not denote a quantity limitation, but mean that there is at least one. The word "comprising" or "comprises" or the like means that the element or item preceding the word is intended to encompass the element or the item recited after the word and its equivalent, and does not exclude other element or item. "Connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upstream", "downstream", etc. are only used to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationship may also change accordingly.

 In order to improve the removal probability of fine organic foreign matter, embodiments of the present invention provide a substrate cleaning apparatus, system, and method. In this technical solution, due to the heating effect of the heater, the temperature of the fluid for cleaning the substrate can be increased, and the molecular motion in the fluid is intensified, thereby improving the solubility of the organic foreign matter in the fluid, thereby increasing the probability of removal of the organic foreign matter. .

 An embodiment of the substrate cleaning method of the present invention comprises: spraying and cleaning the substrate with heated water or a heated water-mixed fluid.

 In the embodiment of the present invention, the substrate may be spray-cleaned with hot water, or the substrate may be spray-cleaned with a mixed fluid of hot water and hot gas. As the water temperature increases, the movement of water molecules increases, which increases the solubility of organic foreign matter in water, thereby increasing the probability of organic foreign matter removal. Further, in the cleaning method of the embodiment of the present invention, since the water temperature is increased, the cleaning time is shortened relative to the existing normal temperature cleaning time, thereby improving the production efficiency.

 According to an embodiment of the present invention, the temperature of the heated water or the heated water-gas mixture fluid is about 25 to 100 ° C. For example, the temperature of the heated water or the heated water-gas mixture fluid is About 40~100 °C.

 In the embodiment of the present invention, the temperature of the heated water or the heated water-gas mixture fluid may vary within a range of about 25 to 100 ° C according to the needs of the cleaning process. For example, the temperature may be about 25 °C, 30 ° C, 40 ° C, 50 ° C, 60 ° C, 70 ° C, 80 ° C, 90 ° C or 100 ° C, the temperature can also be a small range, such as about 40 ~ 45 ° C , 80~83 °C.

According to an embodiment of the present invention, the step of performing spray cleaning on the substrate by using the heated water or the heated water-air mixed fluid comprises: pre-preparing the substrate to be cleaned by using heated water or heated water-air mixed fluid Spraying; Thereafter, the substrate is subjected to a counter-spraying using heated water or a heated mixed gas. In the embodiment of the present invention, the substrate is pre-sprayed by using the heated water or the heated water-gas mixed fluid, so that a complete high-temperature water film can be formed on the surface of the substrate to complete the covering and wetting of the substrate; The counter-spraying of the substrate can achieve fine cleaning of fine organic foreign matter remaining on the uneven position of the cleaning substrate, thereby improving the cleanliness of cleaning and further reducing the defect rate of the product.

 According to an embodiment of the present invention, before the spray cleaning of the substrate to be cleaned by using the heated water or the heated water-air mixed fluid, the method further comprises: preheating the substrate to about 25 to 120 °C.

 In the embodiment of the present invention, by preheating the substrate, the molecular activity of the organic polymer foreign matter can be increased, and the gradient of the water temperature at the nozzle and the water temperature reaching the surface of the substrate during the post-spray cleaning can be reduced, thereby further improving the organic The removal rate of foreign matter. Preheating the substrate can be used to heat the substrate during illumination (such as infrared heat source, heating lamp, etc.) or other heat source (such as hot air) during substrate transfer. The temperature of the substrate is controlled at about 25~120 °C. . According to an embodiment of the present invention, before the substrate is subjected to spray cleaning using the heated water or the heated water-air mixed fluid, the method may further include: preheating the substrate to about 40 to 120 ° C, for example, preheating the substrate. Up to about 100~120 °C.

 The preheating temperature of the substrate is generally higher than the water temperature during the post-spray cleaning. This is because the substrate temperature may be lowered when the substrate is transferred to the position of the spray cleaning, and the substrate temperature is slightly higher than the water temperature of the spray cleaning. It is also conducive to the evaporation of spray water.

 In the embodiment of the present invention, the preheating temperature of the substrate can be adjusted according to the needs of the cleaning process. For example, the substrate can be heated to about 40 ° C, 50 ° C, 60 ° C, 70 ° C, 80 ° C, 90. °C, 100 ° C, 110 ° C or 120 ° C. The higher the heating temperature of the substrate, the higher the molecular activity of the organic foreign matter, and the easier it is to be washed by the hot water or water-air mixed fluid.

 According to an embodiment of the present invention, after the showered cleaning of the substrate to be cleaned by using the heated water or the heated water-air mixed fluid, the method further comprises: cooling the substrate to a set temperature.

 In the embodiment of the present invention, due to the needs of the substrate fabrication process, the substrate after cleaning needs to be reduced to a suitable temperature, which is determined according to the requirements of the cleaning process, and may also be determined according to the temperature requirements of the subsequent process of the cleaning process. For example, it is generally required to lower the temperature of the substrate to a normal temperature.

As shown in FIG. 1, an embodiment of the present invention provides a substrate cleaning apparatus including: a water tank 1, a water pump 2 connected to the water tank 1, and a plurality of nozzles 3 connected to the water pump 2. The effluent fluid (which may be a water or a water-gas mixed fluid, and the lower cylinder is referred to as effluent) of the plurality of nozzles 3 is sprayed on the substrate 5. A heater configured to heat the fluid before the fluid flows out of the plurality of nozzles 3 is disposed in the substrate cleaning device. As an example, two water tanks 1 are illustrated in Figure 1, however, those skilled in the art will appreciate that Depending on the actual needs, you can also set up a water tank, or more than two water tanks.

 In an embodiment of the invention, a heater is provided in the substrate cleaning apparatus, the heater being configured to heat the substrate or to heat the fluid in the substrate cleaning apparatus for cleaning the substrate, preferably a water or a water-air mixed fluid. Taking water as an example, the description is as follows. Due to the action of the heater, the temperature of the substrate or the water used for cleaning the substrate is increased, so that the molecular activity of the organic foreign matter on the substrate is increased or the movement of the water molecules is intensified, the water solubility is improved, and the fine organic foreign matter is dissolved in the water. Thereby, the fine organic foreign matter can be effectively removed, thereby improving the yield of the product. In the technical solution of the embodiment, the water pump may be a conventional water pump or a high pressure water pump. When a high-pressure water pump is used, the flow of water ejected from the nozzle has a greater impact force, and the cleaning effect on the foreign matter is better. In the technical solution of the present invention, the substrate may be a stationary substrate (requires nozzle movement) or a substrate in transit. For example, as shown in Fig. 1, the conveying device 6 transports the substrate 5 to the cleaning process position, and is also in the conveying state during the cleaning process, and the conveying device 6 may be a roller conveyor or a conveyor belt.

 According to an embodiment of the present invention, the heater includes a first heater 12 disposed at the plurality of nozzles 3 to heat the effluent of the plurality of nozzles, as shown in FIG.

 In the present embodiment, since the first heater 12 is provided at the nozzle 3, it can be used to heat the nozzle

The effluent of 3 causes the water temperature of the nozzle 3 to increase, and the movement of the water molecules is intensified, so that the water solubility is improved, and the fine organic foreign matter can be dissolved in the water, thereby effectively removing fine organic foreign matter, thereby improving the yield of the product.

 As shown in FIG. 2, according to an embodiment of the present invention, the water discharged from the plurality of nozzles 3 is sprayed on the substrate 5 being cleaned, the plurality of nozzles including at least one set of pre-spray nozzles 31 and at least one set of counter-nozzles 32. Each set of the hedging nozzles 32 includes oppositely disposed nozzles in which the two sets of spray directions are opposed to each other. The at least one set of pre-spray nozzles 31 are disposed upstream of the at least one set of hedging nozzles 32 in the substrate transport direction. The expressions here and below are defined as follows: In the substrate transport direction, the position where the substrate passes first is upstream, and the position after passing is downstream.

In an embodiment of the invention, the substrate 5 is conveyed by the transfer of the transport device 6. In the transport direction of the substrate 5, that is, in the direction of the arrow of FIG. 2, a set of pre-spray nozzles 31 are first provided to pre-spray the surface of the substrate 5; at least one set of hedges is provided after the pre-spray nozzles 31. The nozzles 32 are sprayable with respect to the conveying direction and the reverse conveying direction, respectively, and are particularly thorough for the foreign matter cleaning in the conveying direction and the reverse conveying direction, and can be used for cleaning fine foreign matter at the uneven position on the surface of the substrate. The pair of nozzles 32 may be a group, as shown in FIG. 2, or a plurality of groups may be provided, such as two groups, three groups, and the like. As shown in FIG. 2, the hedging nozzle 32 is divided into two columns of nozzle A and nozzle B, one of which The spray direction of the column nozzle A is opposite to the substrate transfer direction, and the spray direction of the other row of nozzles B coincides with the substrate transfer direction. According to the product information of the pre-cleaning process, the position of the organic foreign matter at the concave and convex portions of the substrate can be obtained, and according to the position of the organic foreign matter, one row of nozzles A can be controlled to open or one row of nozzles B can be opened, for example, the substrate conveying direction is the front side of the convex portion For example, if the organic foreign matter in the pre-cleaning process is located on the front side of the protrusion, then one row of nozzles A is controlled to be opened, and the spray direction of one row of nozzles A is opposite to the direction in which the substrate is conveyed, and the organic side located at the front side of the protrusions can be washed away. Foreign matter; Similarly, if the organic foreign matter in the pre-cleaning process is located on the back side of the protrusion, a row of nozzles B is controlled to open. In the cleaning process, the transfer speed of the substrate is generally about 3600 to 7200 mm/min. In order not to affect the cleaning effect of the cleaning process, the speed of the water flow velocity of the oppositely disposed punching nozzles may be made to coincide with the substrate. Therefore, the conveying speed of the substrate can be appropriately adjusted so that the speed at which the effluent of the two groups of nozzles reaches the substrate is uniform.

 In the substrate cleaning apparatus according to the embodiment of the invention, the heater further includes a second heater 11 disposed in the water tank 1 to heat the water in the water tank 1.

 In the embodiment of the present invention, the second heater 11 is added to the water tank so that the water entering the water pump is hot water, and the problem that the water temperature caused by the insufficient heating time at the nozzle is still relatively low is avoided.

 The substrate cleaning apparatus according to the embodiment of the present invention, as shown in FIG. 1, may further include an air pump 4 connected to the plurality of nozzles 3, the heater including a communication line disposed on the air pump 4 and the plurality of nozzles 3 to align the gas The gas heater 13 is heated.

 In the embodiment of the present invention, a gas passage is added and a gas heater 13 is disposed on the air passage to cause the hot gas and the hot water mixed fluid formed by the hot water to be sprayed from the nozzle to clean the substrate. Due to the impact of the hot air bubbles formed by the mixing of the hot air and the water, the foreign matter adhering to the surface of the substrate is more easily washed away, thereby improving the cleaning ability of the substrate cleaning device to the substrate.

 For example, as shown in FIG. 3, in the substrate cleaning apparatus of the embodiment of the present invention, the heater includes a preheater 14 that preheats the substrate, and the preheater 14 is disposed in the plurality of nozzles 3 in the conveying direction of the substrate 5. Upstream.

 In the embodiment of the present invention, the pre-heater 14 is disposed on the line before the transfer substrate 5 enters the nozzle spray, and the substrate to be cleaned may be irradiated by illumination (for example, an infrared heat source or other heat lamps or the like) or hot air. Preheating in progress. The conveying device 6 can be, for example, a roller table.

 For example, the preheater 14 is a light heater or a hot air heater.

In the embodiment of the present invention, heating of the substrate 5 can be conveniently achieved during the transfer of the substrate 5 by using a light heater or a hot air heater. The embodiment of the invention further provides a substrate cleaning system using the above substrate cleaning device, which comprises:

 a temperature sensor 7 disposed on the water outlet side of the nozzle and configured to detect the water outlet temperature information of the nozzle; the control device 8 is signally coupled to the temperature sensor 7 and configured to when the nozzle water temperature is less than the set first temperature threshold When the heater is controlled to heat.

 In the embodiment of the invention, the control device is used to realize automatic control of the spray. When the outlet water temperature of the nozzle is less than the set first temperature threshold, the heater is controlled to be heated so that the effluent reaches a suitable temperature for cleaning the substrate.

 The control device can realize the control function through hardware or the control function through software. The set first temperature threshold may be set according to experience, and the specific value thereof is not limited, and may be adjusted within a suitable range according to the needs of the cleaning process. If the set value of the first temperature threshold is about [25 ° C - 100 ° C], the set first temperature threshold may be about 25 ° C, 40 ° C, 70 ° C, 80 ° C, 90 ° C or 100 ° C.

 According to an embodiment of the invention, the control means 8 controls the heater to stop heating when the outlet water temperature of the nozzle is not less than the set first temperature threshold.

 In the embodiment of the present invention, the automatic control of the spray is realized by the control device 8. When the water temperature of the nozzle is not less than the set first temperature threshold, the temperature can meet the requirement of cleaning the substrate, and the heater is controlled at this time. Stop heating.

 In order to describe the substrate cleaning system of the present invention in more detail, a specific embodiment will be described below. In this embodiment, a substrate cleaning apparatus as shown in Fig. 1 is included, i.e., the system includes a first heater 12, a second heater 11, a gas heater 13, and an air pump 4. The substrate cleaning device cleans the substrate 5 transported by the transfer device 6. The control flow of the control device 8 will be described below.

 As shown in FIG. 4, it is a schematic diagram of the working process of the substrate cleaning system according to the embodiment of the present invention. According to the figure, the workflow of the substrate cleaning system according to an embodiment of the present invention includes:

 Step 101: Obtain water temperature information in the water tank;

 Step 102: Determine whether the water temperature in the water tank is less than a set first temperature threshold; if not, execute step 103; if yes, the control device 8 controls the water pump to be turned off, does not supply water, and continues to obtain water temperature information in the water tank (ie, Returning to step 101);

 Step 103: The control device 8 controls the water pump to be turned on to realize water supply;

 Step 104: After the water pump is turned on, obtain temperature information of the nozzle water outlet;

Step 105: Determine whether the temperature of the nozzle water is less than a set first temperature threshold; If no, go to step 106; if yes, go to step 107;

 Step 106: Control the first heater 12 to stop heating;

 Step 107: Control the first heater 12 to perform heating;

 Step 108, obtaining heating information of the first heater 12, including feeding back information of the heating by the first heater 12 to the control device 8;

 Step 109, the control device 8 controls the second heater 11 and the gas heater 13 to perform heating. Embodiments of the present invention also provide a display device including a substrate cleaned by any of the embodiments. The organic foreign matter of the substrate obtained by using the cleaning device, system and method of the embodiment of the invention is obviously reduced, and the yield of the product is greatly improved.

 The display device may be: a product or a component having any display function such as a liquid crystal panel, an electronic paper, an OLED panel, a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, or the like.

 In the above embodiments, the substrate cleaning apparatus, system and method of the present invention can effectively remove organic foreign matter remaining on the convex surface of the substrate, thereby improving the yield of the product, and the technical solution of the present invention can effectively save the cleaning time. Improve the production efficiency of the product.

 Although the above embodiment has been described with an example in which a mixed fluid of water and moisture is used as a cleaning agent, other cleaning agents may be used to clean the substrate. At this time, the heating temperature range of each heater can be adaptively modified. The spirit and scope of the invention. The invention is also intended to cover such modifications and variations as fall within the scope of the appended claims.

Claims

claims 1. A substrate cleaning device, including: water tank, a water pump connected to said water tank, a plurality of nozzles connected to the water pump, and A heater provided in the substrate cleaning device and configured to heat the fluid before the fluid flows out of the plurality of nozzles. 2. The substrate cleaning device of claim 1, wherein the heater includes a first heater disposed at the plurality of nozzles to heat outflow fluids from the plurality of nozzles. 3. The substrate cleaning device according to claim 1 or 2, wherein the outflow fluid from the plurality of nozzles is sprayed on the substrate being cleaned during transportation, and the plurality of nozzles includes at least one group of pre-spray nozzles and at least A group of counter nozzles, each group of counter nozzles includes two groups of oppositely arranged nozzles with opposite spray directions, and the at least one group of pre-spray nozzles is arranged on the at least one group of counter nozzles in the substrate conveying direction. of the upstream. 4. The substrate cleaning device according to any one of claims 1 to 3, wherein the heater includes a second heater disposed in the water tank to heat water in the water tank. 5. The substrate cleaning device according to any one of claims 1 to 4, further comprising an air pump connected to the plurality of nozzles, wherein the heater includes a communication pipe provided between the air pump and the plurality of nozzles. Gas heaters on the road to heat the gas. 6. The substrate cleaning device according to any one of claims 1 to 5, further comprising a preheater configured to preheat the substrate to be cleaned, wherein the preheater is disposed on the plurality of substrates in the substrate conveying direction. upstream of the nozzle. 7. The substrate cleaning device according to claim 6, wherein the preheater is a light heater or a hot air heater. 8. A substrate cleaning system, including: The substrate cleaning device according to any one of claims 1 to 7; A temperature sensor, which is disposed on the water outlet side of the nozzle and configured to detect temperature information of the outflow fluid from the nozzle; and A control device, which is signal-connected to the temperature sensor, is configured to control the heater to perform heating when the temperature of the outflow fluid from the nozzle is less than a set first temperature threshold, and when the flow of the nozzle When the outlet fluid temperature is not less than the set first temperature threshold, the heater is controlled to stop heating. 9. A substrate cleaning method, including: Use heated water or heated water-gas mixed fluid to spray and clean the substrate to be cleaned. 10. The substrate cleaning method according to claim 9, wherein the spray cleaning of the substrate to be cleaned using heated water or heated water-gas mixed fluid includes: Use heated water or heated water-gas mixed fluid to pre-spray the substrate to be cleaned; and Use heated water or heated water-gas mixed fluid to perform counter-spraying on the substrate to be cleaned. 11. The substrate cleaning method according to claim 9 or 10, further comprising: preheating the substrate to be cleaned before using heated water or heated water-gas mixed fluid to perform the spray cleaning on the substrate to be cleaned. to about 40~120°C. 12. The substrate cleaning method according to any one of claims 9 to 11, wherein, before using heated water or heated water-gas mixed fluid to perform the spray cleaning on the substrate to be cleaned, the substrate to be cleaned is Preheat to about 100~120 °C. 13. The substrate cleaning method according to any one of claims 9 to 12, further comprising: after using heated water or heated water-gas mixed fluid to perform the spray cleaning on the substrate to be cleaned, cleaning the substrate The substrate drops to the set temperature. 14. The substrate cleaning method according to any one of claims 9 to 12, wherein the temperature of the heated water or the heated water-gas mixed fluid is about 40 to 100°C.