1245677 twf.d〇c/c 13745 九、發明說明： 【發明所屬之技術領域】 口本發明是有關於一種承載器之接合墊開口製 程’、ΐ特別是有關於一種可折彎（FlexibIe)之軟片式 承載器（FUm carrier)的接合墊開口製程及其雷射成 孔（laser drilling)方法。 【先前技術】 隨著科技的進步與生活品質的持續提升，加上 .產業的整合與持續成長，使得積體電路（Integrated 的并驶的應用領域越來越廣。為了使結構脆弱 ^^路裸晶片㈣能受到有效的保護，並同時 f積體電路裸晶片能與外界相互傳遞訊號，才發展 ii:=package)技術。目前已_ 接人技，以晶片接合技術來說，常見的晶片 F/C) ^ 11 T/,(Wire B〇ndingj W/B)' - (Ρ1Φ Chip, ΤΑΒΐ I 動接合（丁啊 AUt〇matic Bon_g， 一 & ，、中捲帶式自動接合技術係將晶片接合於 積載器上，而封裝完成後的封裝體不但體 ^重/輕，I由於軟片本身具有可折彎的特性， 故可使侍封裝體在後續組裝上更具有彈性。 接合二二1f繪气為習知之一種軟片式承載器之 σ幵衣程。請參照圖1A，首先，先提供一望 :二〇與：金” 12〇,其中金屬層12〇係形成於 j :凊參照圖，之後，使用一沖壓模 、、曰不）對薄膜U0進行衝孔（Punch)，而產生多個 1245677 13745twf.doc/c 傳動孔130。薄膜丨丨n 動孔"0而配置於 1屬1丄20係藉由這些傳 士仏…册 輸达f (未緣不）上，並藉由 此輸,帶而帶動薄膜1ί0及金屬層120前進。 於薄膜月"〇、、、f iC’接著’钱刻(eiching)薄膜110而 係暴露出局部其，這些開， 案化金屬層120，使得 ： :之金屬物可作為多個 = 電性連接（未I示）。㈣、P一/以與外界 以確保薄no*全屬> 品檢測步驟， 而完成羽私ϋ斗、/屬g 12〇之圖案的外觀良好， 成白車人片式承載器之接合墊的製作。 開口 ‘ ：=製程而彻110上形成多個 後續環保處理；i:液藥劑’她刻液之 境造成污染。此；，要液將容易對環 過塗佈光阻、光阻氓光兀 ^衣私通常需要經 道步驟，曝先影、钱刻及去光阻等多 的製作時間。g明顯地耗#軟片式承制之接合墊 【發明内容】 式承載有=合ίΓί㈣就是在提供-種軟片 不需蝕刻軟片:口衣私及其雷射成孔方法，因 夕個開孔，故對環琦所if了於溥胺上形成 本發明之1 染程度較低。 另一目的就是在提供-種軟片式承載 745twfd〇c/c 1245677 片式：‘ 5開口製程及其雷射成孔方法，可節省於 式承載益之接合墊的製作時間。 」即名軟 為達本發明之上述目的， 式承载器之接合墊開口製 ：月=-種軟片 墨晶片之軟性雷踗祐 、用於衣w —用於噴 接人墊η σ板的接合墊，此軟片式承载哭之 至=下列步驟。首先，以 -開口，“薄膜之下表面形成至少 為預疋之一接合墊之開口。 亚作 本發明的較佳實施例所述之軟片式承恭哭 2合塾開口製程，其中在提供金屬層 在运射薄臈之後’更包括圖案化此金屬芦 口所暴露出局部之金屬層係作為此接合墊其中開 為達本發明之上述目的，本發 射成孔方法，適用於將—軟 種雷 2式承載态包括一薄臈與圖案化之一金？ 至屬層係形成於薄膜之上表面。此雷射成孔^ 少包括以下之步驟：藉由-雷射而於薄膜之下夺 形成至少一開口，其中此門0位&兩寻胰之下表面 層，並作為至少-接合墊之汗開口…备局部之金屬 依照本發明的較佳實施例所述之軟 之接合墊開口製程及其雷射成孔方法，更；括 ，形成至少-成孔記號，且此開口係=;:: 牙此成孔記號及薄膜而形成。 、貝 Ϊ245677 ,3745twf.d〇c/c 丞％上迷，本發明之軟片 口製程及其雷射成孔方法c之接合墊開 成孔記號及薄膜而形成。因9由t射就可貫穿此 承載器的接合墊開口 f程、、，』較於習知軟片式 本發明之軟片式承载器的接：：：：晴程， 剡液等化學藥劑，就可於薄膜上：”將毋須蝕 對環境所造成的污染程度較低，並可J:::L:: 省其製作時間。 ）版耘步驟，以顯著地節 目的、特徵和優點能更明 並配合所附圖式，作詳細 為讓本發明之上述和其他 顯易懂，下文特舉較佳實施例， 說明如下。 【實施方式】 :2Α〜2D $會示為本發明較佳實 器之接合墊開口製程。本發明軟片式承ί 二係適用於電性連接—喷墨匣上的噴墨晶片。 照圖=，首先,，先提供—薄膜21〇與一金屬層⑽: 而此薄膜2 1 〇的材質例如為聚乙醯胺（p〇lyimide)等， 且金屬層220的材質例如為銅箔或其他金屬等，其 金屬| 220形成於薄膜21〇上的方法包括例如 二=：鍍（sputtering)、壓合（lammate)及塗佈（c〇ating) ^製程，而此種一薄膜21〇與一金屬層22〇接合之 軟片^式承載器係為兩層板的型式；若是金屬層220 係It由黏者層（未繪示）而壓合（Laminate)於薄膜 210上時，則此種一薄膜21〇、一黏著層與一金屬層 12456¾ 3745twf.doc/c 220接合之軟片式承載器係為 照圖2B，之後，例如使用曰攸，式^月茶 膜210進行衝孔（Punch) =傳繪7對溥 中薄膜21〇及金屬層22()#my其 配置於-輸送帶（未緣示)：由動孔230而 帶動薄制0及金屬層22〇前進亚猎由此輸送帶而 至全接著，使用一雷射而貫穿薄膜210 二Γ係暴露出局部之金屬層細。請 二，、，、圖2D，之後，蝕刻金屬層22〇 案224之金屬層22〇,使得 形成具有一圖 可作為多個接合墊 與外界電性連接（未繪示)。至於此“：：： 括塗佈光阻於金屬層220上、光阻暖：Ύ 〇匕 此ί=、: ί阻等多道步驟（皆未緣示)，在 以確佯薄膜^ ,後，例如進行—成品檢測步驟， 雀保/專Μ 210與金屬層220之图安从# Α 完成軟片式承載器之接合塾的製作圖木外硯良好，以 程，/4’以=1軟片式承載…^ 再以較低能量之雷射貫編210而;二ti， 212，皆包括在本發明欲保護的範固内。7 k二斤1 口 至於在製作完成本發明軟片式 開口之後的後續製程，更包括下列之之接4 不為圖2D之軟片弋？恭D„ 乂知。圖2£繪 片式承載為，其銲罩層形成於部分 10 1245677 13/45twf. doc/c 之金屬層上的結構示意圖。請參照圖2£，然後，使 用例如一印刷（pnndng)製程而將一銲罩層2、仙步 於部分之金屬層230上。圖2F繪示為圖㈢2£之軟 式承載器，其金屬保護層形成於未被銲罩層覆蓋之 金屬層上的結構示意圖。請參照圖2F，再者，^用 例如一電鍍（plating)製程而將一金屬保護層25〇 於未被銲罩層240覆蓋之金屬層220上。圖2G^ :為，之軟片式承載器，其形成一接觸窗口的;； 圖。請參照圖2G ’接著，例如使用一沖壓模 二ίΠΐ軸21 〇與金屬層220進行衝孔⑽㈣） 形成的多條引腳係橫跨至接觸窗^ 26()^/， ^ 腳係可與一噴墨晶片之多個 一 ί Ϊ二Λ 讀，例如進行-成品檢測步驟， 二:載器之製作良好，而完成本發明之 時；或包括薄膜210與金屬層220 著層以溥？ 21〇、金屬層220及-黏 曰圖3絡人-式承載态的製作（簡稱ink process)。 載器^其具曰有^本發明較佳實施例之一種軟片式承 參照圖^，值：固f孔5己唬於薄膜上的示意圖。請 載器之接合墊開π製 ' 月+之3孝人片式承 孔之後，再於薄肢^ /、/以對薄膜210進行衝 接著，請參捋圖一上形成多個成孔記號214。 成孔記號21/及售胺f由較低能量之雷射貫穿這些 ，專版210至金屬層220之表面2221245677 twf.d〇c / c 13745 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a process of opening a bonding pad of a carrier ', and particularly to a type of bendable (FlexibIe) A bonding pad opening process of a FUm carrier and a laser drilling method thereof. [Previous technology] With the advancement of science and technology and the continuous improvement of the quality of life, coupled with the integration and continuous growth of the industry, the integrated circuit (Integrated parallel driving application areas are becoming wider and wider. In order to make the structure fragile ^^ 路Bare chip ㈣ can be effectively protected, and at the same time f integrated circuit bare chip can communicate signals with the outside world, only developed ii: = package) technology. At present _ access technology, in terms of wafer bonding technology, common chip F / C) ^ 11 T /, (Wire B〇ndingj W / B) '-(P1Φ Chip, ΤΑΒΐ I dynamic bonding (丁 啊 AUt〇 matic Bon_g, a &, medium-roll tape automatic bonding technology is the bonding of the wafer to the carrier, and the package after the package is not only heavy / light, because the film itself has the characteristics of bending, so It can make the package more flexible in the subsequent assembly. Joining 222 1f is the σ 幵 clothing process of a conventional soft sheet carrier. Please refer to FIG. 1A. First, provide a vision: 20 and: gold. " 12〇, where the metal layer 12 is formed in the j: 凊 reference picture, and then a punching die (,, or not) is used to punch the film U0, and a plurality of 1245677 13745twf.doc / c transmission holes are generated. 130. Film 丨 n moving holes " 0 are arranged in a genus 1 丄 20 series through these preachers 册 ... the book is reached on f (without fate), and by this, the film will drive the film 1ί0 and The metal layer 120 advances. Partially exposed to the film " 〇 ,,, f iC 'and then' eiching 'the film 110 to expose a part The metal layer 120 is formed by these, so that: metal objects can be used as a plurality of = electrical connections (not shown). ㈣, P a / to ensure that the thin no * belongs to all products Steps to complete the appearance of the feather private bucket and the pattern belonging to g 12〇, and make the bonding pad of the white car person sheet carrier. Opening ': = process and forming a number of subsequent environmental protection treatments on 110; i: liquid medicine 'she engraved the liquid environment to cause pollution. This ;, the liquid will be easy to coat the ring over the photoresist, photoresist light Wu ^ clothing usually need to go through the steps, exposure first shadow, money carving and go It takes a lot of production time to make photoresistors. G obviously consumes the bonding pads made of #flexible sheet type. [Content of the invention] The type of bearing is provided. The type of soft sheet does not need to be etched. The soft sheet does not need to be etched. The method, because of the openings, has a low degree of dyeing in the present invention, which is formed on the amidine. The other purpose is to provide a kind of flexible film bearing 745twfdoc / c 1245677. The 5 opening process and the laser hole forming method can save the manufacturing time of bonding pads with a bearing type. " Name soft is to achieve the above-mentioned purpose of the present invention, the bonding pad opening system of the carrier: month =-the softness of a kind of soft film ink wafer, used for clothing w-the bonding pad for spraying the human pad η σ plate, This film type bears the following steps: First, with-opening, "the lower surface of the film forms at least one opening of a pre-bonding pad. The film type is described in the preferred embodiment of the present invention Cry 2 combined opening process, which includes providing a metal layer after the thin film is fired, and further includes patterning a part of the metal layer exposed by the metal reed mouth as the bonding pad which is used to achieve the above-mentioned object of the present invention. The method of launching holes is suitable for applying the soft-type Thunder 2 load-bearing state to a thin layer of gold and a pattern of gold? The subordinate layer is formed on the upper surface of the film. The laser hole formation at least includes the following steps: at least one opening is formed under the film by -laser, wherein the gate 0 & finds the surface layer below the pancreas, and serves as at least a bonding pad Sweat opening ... Prepare local metal according to the preferred embodiment of the present invention, the soft bonding pad opening process and its laser hole formation method, and more; including, forming at least-hole formation marks, and this opening system = ;: : The teeth are formed with hole marks and films.贝 245677,3745twf.doc / c 丞% fascinated, the film mouth process of the present invention and the laser hole forming method c of the bonding pad is formed by forming hole marks and films. Because 9 is shot by t, it can pass through the opening of the bonding pad of this carrier. F ,,, and ′ are compared with the conventional soft-film type of the present invention. Can be used on the film: "It will eliminate the pollution caused by the environment to a lower degree, and J ::: L :: saves its production time.) The versioning step, so that the features, advantages and advantages of the program can be made clearer. In conjunction with the accompanying drawings, in order to make the above and other aspects of the present invention comprehensible in detail, a preferred embodiment is exemplified below and described as follows. [Embodiment]: 2Α ~ 2D $ will be shown as the preferred real device of the present invention. The process of opening the bonding pad. The second type of the flexible sheet bearing of the present invention is suitable for electrical connection—the inkjet wafer on the inkjet cartridge. Photo =, First, first provide—thin film 21 and a metal layer: and this The material of the thin film 2 1 0 is, for example, polyimide, and the material of the metal layer 220 is, for example, copper foil or other metal. The method of forming the metal | 220 on the thin film 21 includes, for example, two = : Plating, laminating, and coating processes, and this The flexible sheet carrier with the film 21 and a metal layer 22 joined is a two-layer board type; if the metal layer 220 is a laminated layer (not shown), it is laminated on the film 210 Then, such a thin film carrier with a thin film 21, an adhesive layer and a metal layer 12456¾ 3745twf.doc / c 220 is shown in FIG. 2B, and then, for example, using Yueyou, ^ month tea film 210 for punching Punch = 7 pairs of thin film 21 and metal layer 22 () # my are arranged on-conveyor belt (not shown): thin hole 0 and metal layer 22 are driven by moving hole 230 Hunting on this conveyor belt, a laser is used to penetrate through the film 210, and the Γ series exposes a thin metal layer. Please, 2 ,, Figure 2D, and then etch the metal layer 22 and the metal layer 224 22〇, so that a picture can be formed as a plurality of bonding pads to be electrically connected to the outside (not shown). As for "::: including coating a photoresist on the metal layer 220, photoresistance heating: Ύ 〇 ί = ,: ί resistance, and other multiple steps (none of which are shown), after confirming the film ^, for example, to carry out-finished product detection step, Quebao / Tuan # 210 from the special M 210 and the metal layer 220 is completed. The production of the soft sheet carrier is completed. The outer figure is good. In the process, / 4 'is = 1 to carry the soft sheet ... ^ Then with a lower energy thunder Shoot through 210 and ti, 212, are included in the scope of the invention to be protected. 7 k 2 kg 1 mouth As for the subsequent process after the completion of the film opening of the present invention, the following connection is included. 4 Is it not the film of FIG. 2D? Congratulations, you know. Figure 2 is a schematic diagram of the structure of the sheet bearing. The solder mask layer is formed on the metal layer of part 10 1245677 13 / 45twf.doc / c. Please refer to Figure 2 £, and then use, for example, a A printing process (pnndng) is performed with a welding mask layer 2 and a step on a part of the metal layer 230. Fig. 2F shows the soft carrier of Fig. 2 £, and the metal protective layer is formed on the metal not covered by the welding mask layer. A schematic diagram of the structure on the layer. Please refer to FIG. 2F. Furthermore, a metal protective layer 25 is applied on the metal layer 220 not covered by the solder mask layer 240 by, for example, a plating process. FIG. 2G ^: Figure. Please refer to FIG. 2G 'Next, for example, a punching die 2 ΠΠ axis 21 〇 and a metal layer 220 for punching ⑽㈣) formed a plurality of lead systems Straddle to the contact window ^ 26 () ^ /, ^ The feet can be read with multiple one of an inkjet wafer, such as performing-finished product detection steps, two: the carrier is well made, and the present invention is completed At that time, or including a thin film 210 and a metal layer 220 and a layer of 溥? 21〇, the metal layer 220 and- Figure 3 Production of a human-type bearing state (referred to as the ink process). The carrier ^ has the following reference ^ A preferred embodiment of the present invention is a soft sheet bearing reference figure ^, value: solid f hole 5 has been blunt on the film Schematic diagram of the carrier pad, please open the π system 'month + of the three filial piecing holes, and then punch the thin film ^ /, / to the film 210, please refer to Figure 1 to form multiple Hole-forming mark 214. Hole-forming mark 21 / and amine amine f are penetrated by lasers with a lower energy, the special plate 210 to the surface 222 of the metal layer 220
I2456H 上而形成這些開口 2 12，以—λ、丄 器之接合墊開口㈣作，本發明軟片式承載 2Β、2D、2E、2F \衣f/至於其他步驟則與圖2Α、 便不再贅述。此外，本步驟相同，故在此 孔製程亦可以—雷射而圍〜y:片式二载器之定位 周圍而於薄膜2H)上燒 二成孔δ己號2W之 在本發明之保護的範圍^。夕Ησ 212 ’亦包含 值仔注意的是，卜；+、 出多個開口 212的步膜=上燒灼 亦可以在圖2A、2C、2D、π )之後執仃， 後才進行，亦包含在本0日胃、2F或2G的步驟之 此外，相二知軟=?圍内。 製程，本發明之軟片4 ?恭二载°』的接合墊開口 以一較低处旦中工7載态的接合墊開口製程將 出多=r2f2 I就可彈性地於薄膜训上燒灼 阻飯刻製程之塗佈光阻、光 “ϋ 積層及去光阻等多道步驟， ::有效地減少製作軟片式承载器之 步驟，以顯著地節省其製作時間 二矛 之^承載器的接合墊開口製程將毋需蝕刻二 =劑ΐ蝕刻_210以形成這些開口212，故 子衣土兄所造成的污染程度較低。 =上所述，由於本發明軟片式承載器之接合塾 幵衣寿主及其雷射成孔方法因僅藉 可於薄膜上燒灼出多個開口以顯露出=:= 1245677 745twf.doc/c 層，當此金屬層經圖案化之後，這些經開口而顯露 之金屬層即成為接合墊◦因此，相較於習知軟片气 承載器之接合墊開口製程，本發明將可符合簡單、 快速地、低污染地製作軟片式承載器之接合|的需 求。 雖然本餐明已以較佳貫施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作些許之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 ” 【圖式簡單說明】 圖1A〜1D #會示為習知之—種 接合墊開口製程。 t戟口口心 片弋〜2〇 1 會示為本發明較佳實施例之-種軟 片式承載為之接合墊開口製程。 圖2 E !會不為圖2D之教片斗、7扑 形成於部分之，屬層上的結 = 圖載器’其焊草層 圖2F繪示為圖2Ε之敕片+ ? J層形成於未被銲罩層覆蓋‘屬:、『’其金屬保 圖。 至屬層上的結構示意 圖2G綠示為圖2F之教η斗7 、 晶片窗的結構示意圖。 Χ八載器，其形成一 圖3繪示為本發明較# 載器，農呈古少加丄 男、^例之—種敕Μ :永 【主要元件符號說明】 匕於·上的示意圖。 110 :薄膜 1245677 13745twf.doc/c 112 :開口 120 :金屬層 122 :接合墊 130 :傳動孔 210 :薄膜 212 :開口 214 :成孔記號 220 :金屬層 222 ··表面 ⑩ 224 :圖案 226 :接合墊 230 :傳動孔 240 :銲罩層 250 ··金屬保護層 260 :接觸窗口These openings 2 and 12 are formed on I2456H, and are formed by -λ, the joint pad openings of the device. The soft sheet of the present invention carries 2B, 2D, 2E, 2F and / or f /. For other steps, refer to FIG. 2A, and will not be repeated. . In addition, this step is the same, so this hole process can also be-laser and encircle ~ y: the positioning of the chip two carrier and around the film 2H) burned into a hole δ hexahedron 2W in the protection of the present invention Range ^. Xi Ησ 212 'also includes the value. Note: Bu; +, step film with multiple openings 212 = upper cautery can also be performed after Figure 2A, 2C, 2D, π), and only after, also included in In addition to the steps of stomach, 2F, or 2G on the 0th, the second phase is soft. In the manufacturing process, the bonding pad opening of the soft film of the present invention is 4 °, and the bonding pad opening process at a lower level is 7 °. The bonding pad opening process will be more than r2f2 I, and it can be burned on the film flexibly. The process of coating photoresist, photo- "layering and photoresist removal, etc .: :: Effectively reduce the steps of making a flexible sheet carrier to significantly save its production time. The process will not need to be etched to form these openings 212, so the degree of pollution caused by Ziyi Tuxi is relatively low. = As mentioned above, due to the bonding of the film carrier of the present invention And its laser hole formation method because it can only burn out multiple openings on the film to reveal =: = 1245677 745twf.doc / c layer. When this metal layer is patterned, these metal layers exposed through the openings That is to say, it becomes a bonding pad. Therefore, compared with the conventional bonding pad opening process of the conventional film air carrier, the present invention can meet the needs of simple, fast, and low pollution production of the bonding of the film carrier. It has been disclosed above with better examples. It is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the scope of the attached patent application. "A simple explanation of the drawings" Figures 1A ~ 1D # will be shown as a conventional—a kind of bonding pad opening process. t 口 口 口 心 弋 〇 2 〇 1 will be shown in the preferred embodiment of the present invention-a kind of flexible sheet bearing for the pad opening process. Figure 2 E! Will not be formed in the teaching bucket of Figure 2D, 7 flutter formed on the part, the knot on the genus layer = image carrier 'its welding grass layer Figure 2F is shown as the cymbal of Figure 2E +? J layer formation As it is not covered by the welding cover layer, it is: Schematic diagram of the structure on the subordinate layer FIG. 2G is a schematic diagram of the structure of the teaching window 7 and the wafer window of FIG. 2F. ⅩEight carrier, which forms a figure. Figure 3 is a schematic diagram of the present invention compared to the # carrier, Nongcheng Gushaojia, male, ^ example-species 敕 M: Yong [Description of the main component symbols]. 110: film 1245677 13745twf.doc / c 112: opening 120: metal layer 122: bonding pad 130: transmission hole 210: film 212: opening 214: hole formation mark 220: metal layer 222 · surface ⑩ 224: pattern 226: bonding Pad 230: Transmission hole 240: Welding cover layer 250.Metal protective layer 260: Contact window
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