TW200611770A - Drilling manufacturing process of contacts on film carrier and laser drilling method thereof - Google Patents
Drilling manufacturing process of contacts on film carrier and laser drilling method thereofInfo
- Publication number
- TW200611770A TW200611770A TW093130718A TW93130718A TW200611770A TW 200611770 A TW200611770 A TW 200611770A TW 093130718 A TW093130718 A TW 093130718A TW 93130718 A TW93130718 A TW 93130718A TW 200611770 A TW200611770 A TW 200611770A
- Authority
- TW
- Taiwan
- Prior art keywords
- contacts
- film
- manufacturing process
- drilling
- metal layer
- Prior art date
Links
- 238000005553 drilling Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 4
- 239000000969 carrier Substances 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
Landscapes
- Manufacture Of Switches (AREA)
- Wire Bonding (AREA)
Abstract
A drilling manufacturing process of contacts on film carrier comprises the following several steps. First, providing a film and a metal layer, wherein the metal layer is disposed on the upper surface of the film. Next, forming a plurality of apertures by laser on the lower surface of the film. A portion of the metal layer is exposed by the apertures, which are for a plurality of contact windows of the contacts. The contacts are formed by patterning the metal layer and electrical connected with the outside. Compared with the prior art of the drilling manufacturing process of the contacts on the film carrier, a plurality of apertures formed on the film by laser is provided by the invention. Therefore, the invention can effectively meet with the need for easy, fast and low-polluted manufacturing the contacts of film carriers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93130718A TWI245677B (en) | 2004-10-11 | 2004-10-11 | Drilling manufacturing process of contacts on film carrier and laser drilling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93130718A TWI245677B (en) | 2004-10-11 | 2004-10-11 | Drilling manufacturing process of contacts on film carrier and laser drilling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI245677B TWI245677B (en) | 2005-12-21 |
| TW200611770A true TW200611770A (en) | 2006-04-16 |
Family
ID=37191180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93130718A TWI245677B (en) | 2004-10-11 | 2004-10-11 | Drilling manufacturing process of contacts on film carrier and laser drilling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI245677B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101368284B (en) | 2007-08-15 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Plating device |
| TWI394499B (en) * | 2008-05-12 | 2013-04-21 | Au Optronics Corp | Flexible printed circuitry |
-
2004
- 2004-10-11 TW TW93130718A patent/TWI245677B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI245677B (en) | 2005-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |