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TWD214766S - 用於物理氣相沉積腔室的濺射靶 - Google Patents

用於物理氣相沉積腔室的濺射靶 Download PDF

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Publication number
TWD214766S
TWD214766S TW109300686F TW109300686F TWD214766S TW D214766 S TWD214766 S TW D214766S TW 109300686 F TW109300686 F TW 109300686F TW 109300686 F TW109300686 F TW 109300686F TW D214766 S TWD214766 S TW D214766S
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Taiwan
Prior art keywords
vapor deposition
sputtering target
physical vapor
deposition chamber
design
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TW109300686F
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English (en)
Inventor
基倫古莫妮拉珊卓拉 沙芬戴亞
大衛 鞏特爾
紹杰 許
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美商應用材料股份有限公司
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Publication of TWD214766S publication Critical patent/TWD214766S/zh

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Abstract

【物品用途】;本設計係關於用於物理氣相沉積腔室的濺射靶之外觀設計。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。

Description

用於物理氣相沉積腔室的濺射靶
本設計係關於用於物理氣相沉積腔室的濺射靶之外觀設計。
圖式所揭露之虛線部分，為本案不主張設計之部分。
TW109300686F 2019-08-26 2020-02-14 用於物理氣相沉積腔室的濺射靶 TWD214766S (zh)

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US29/703,194 2019-08-26
US29/703,194 USD908645S1 (en) 2019-08-26 2019-08-26 Sputtering target for a physical vapor deposition chamber

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TWD214766S true TWD214766S (zh) 2021-10-21

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TW110301789F TWD217597S (zh) 2019-08-26 2020-02-14 用於物理氣相沉積腔室的濺射靶

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Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
JP1655453S (zh) * 2019-06-17 2020-03-23
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
US12486120B2 (en) 2020-03-23 2025-12-02 Applied Materials, Inc. Substrate processing system carrier
USD980176S1 (en) * 2020-06-02 2023-03-07 Applied Materials, Inc. Substrate processing system carrier
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD989012S1 (en) 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1700776S (ja) * 2021-03-04 2021-11-29 基板処理装置用基板載置プレート
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
CN120380193A (zh) 2022-07-08 2025-07-25 东曹Smd有限公司 用于物理气相沉积溅射应用的动态真空密封系统
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200420193A (en) 2002-12-16 2004-10-01 Ifire Technology Inc Composite sputter target and phosphor deposition method
TW201525172A (zh) 2013-12-18 2015-07-01 Applied Materials Inc 具有低摩擦墊之物理氣相沉積標靶
TWI565679B (zh) 2014-02-14 2017-01-11 鋼臂功科研股份有限公司 Oxide sintered body and sputtering target
TWD188898S (zh) 2016-09-30 2018-03-01 應用材料股份有限公司 物理氣相沉積室靶
TWD203691S (zh) 2018-03-09 2020-04-01 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD411516S (en) 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (ja) 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (ja) 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
JP5189294B2 (ja) 2004-02-13 2013-04-24 エーエスエム アメリカ インコーポレイテッド オートドーピングおよび裏面堆積を減少させるための基板支持システム
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
TWD121115S1 (zh) 2005-03-30 2008-01-21 東京威力科創股份有限公司 遮護環
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
TWD125340S1 (zh) 2005-07-29 2008-10-11 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
TWD117940S1 (zh) 2005-07-29 2007-07-01 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
TWD117941S1 (zh) 2005-07-29 2007-07-01 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
TWD117939S1 (zh) 2005-07-29 2007-07-01 東京威力科創股份有限公司 電漿處理裝置之微波導入窗用頂板
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD545853S1 (en) 2006-03-30 2007-07-03 Dave Hawley Plasma gun nozzle retention ring
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
TWD130501S1 (zh) 2006-12-15 2009-08-21 東京威力科創股份有限公司 電漿處理裝置的加熱平台用遮罩
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
TWD130834S1 (zh) 2008-03-28 2009-09-11 東京威力科創股份有限公司 半導體製造用保溫筒之散熱翼片
US20090260982A1 (en) 2008-04-16 2009-10-22 Applied Materials, Inc. Wafer processing deposition shielding components
WO2009151767A2 (en) 2008-04-21 2009-12-17 Honeywell International Inc. Design and use of dc magnetron sputtering systems
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (zh) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
KR101892911B1 (ko) 2010-08-06 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 정전 척 및 정전 척의 사용 방법들
TWD146490S (zh) 2011-01-12 2012-04-21 荏原製作所股份有限公司 半導體晶圓研磨用彈性膜
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (zh) 2011-09-20 2015-04-06
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
KR20130131120A (ko) 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
TWI605142B (zh) 2013-01-04 2017-11-11 塔沙Ｓｍｄ公司 具有增進的表面輪廓和改善的性能的矽濺射靶及製造其之方法
FR3002242B1 (fr) 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
FR3002241B1 (fr) 2013-02-21 2015-11-20 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (zh) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724701S1 (en) 2014-02-04 2015-03-17 ASM IP Holding, B.V. Shower plate
USD732145S1 (en) 2014-02-04 2015-06-16 Asm Ip Holding B.V. Shower plate
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
US9991101B2 (en) 2014-07-29 2018-06-05 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (zh) 2015-06-10 2016-03-07
JP1546800S (zh) 2015-06-12 2016-03-28
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1549882S (zh) 2015-08-18 2016-05-23
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178699S (zh) 2016-01-08 2016-10-01 Asm Ip Holding Bv 用於半導體製造設備的氣體分散板
TWD178424S (zh) 2016-01-08 2016-09-21 Asm Ip Holding Bv 用於半導體製造設備的氣流控制板
USD790039S1 (en) * 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD794753S1 (en) * 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (zh) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 低损耗光纤
US10662520B2 (en) * 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10811232B2 (en) * 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200420193A (en) 2002-12-16 2004-10-01 Ifire Technology Inc Composite sputter target and phosphor deposition method
TW201525172A (zh) 2013-12-18 2015-07-01 Applied Materials Inc 具有低摩擦墊之物理氣相沉積標靶
TWI565679B (zh) 2014-02-14 2017-01-11 鋼臂功科研股份有限公司 Oxide sintered body and sputtering target
TWD188898S (zh) 2016-09-30 2018-03-01 應用材料股份有限公司 物理氣相沉積室靶
TWD191626S (zh) 2016-09-30 2018-07-11 應用材料股份有限公司 物理氣相沉積室靶
TWD203691S (zh) 2018-03-09 2020-04-01 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓

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