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USD649126S1 - Vacuum contact pad - Google Patents

Vacuum contact pad Download PDF

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Publication number
USD649126S1
USD649126S1 US29/334,787 US33478709F USD649126S US D649126 S1 USD649126 S1 US D649126S1 US 33478709 F US33478709 F US 33478709F US D649126 S USD649126 S US D649126S
Authority
US
United States
Prior art keywords
contact pad
vacuum contact
vacuum
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/334,787
Inventor
Tamami Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, TAMAMI
Application granted granted Critical
Publication of USD649126S1 publication Critical patent/USD649126S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of a vacuum contact pad showing our new design;
FIG. 2 is a back elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is an enlarged sectional view taken along the line 5—5 in X part of FIG. 1 thereof;
FIG. 6 is a front elevational view in use thereof;
FIG. 7 is an enlarged sectional view taken along the line 7—7 in X part of FIG. 1 in use thereof; and,
FIG. 8 is a reference perspective view showing the usable state thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a vacuum contact pad, as shown and described.
US29/334,787 2008-10-20 2009-04-01 Vacuum contact pad Expired - Lifetime USD649126S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-026901 2008-02-06
JP2008026901 2008-10-20

Publications (1)

Publication Number Publication Date
USD649126S1 true USD649126S1 (en) 2011-11-22

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ID=44937172

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/334,787 Expired - Lifetime USD649126S1 (en) 2008-10-20 2009-04-01 Vacuum contact pad

Country Status (1)

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US (1) USD649126S1 (en)

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD722031S1 (en) * 2013-12-31 2015-02-03 Celadon Systems, Inc. Top contact layout board in an electrical system
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770404S1 (en) * 2015-08-05 2016-11-01 Witricity Corporation Resonator coil
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD790489S1 (en) 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD792962S1 (en) * 2014-11-28 2017-07-25 Draingarde Inc. Catch basin cover
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10208884B2 (en) 2014-01-30 2019-02-19 Draingarde, Inc. Watershed protection device and system
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD881126S1 (en) * 2017-08-04 2020-04-14 Holygo Corporation Coil for wireless charger
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1049528S1 (en) * 2023-03-29 2024-10-29 Irobot Corporation Cleaning pad for use in a mobile cleaning robot
USD1051530S1 (en) * 2023-03-29 2024-11-12 Irobot Corporation Drip tray for use with a mobile cleaning robot
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
USD1072399S1 (en) 2023-03-15 2025-04-22 Irobot Corporation Cleaning pad
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1091033S1 (en) 2023-03-09 2025-08-26 Irobot Corporation Drip tray for use with a mobile cleaning robot
USD1107669S1 (en) * 2022-05-02 2025-12-30 Lam Research Corporation Processing chamber purge plate
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
US5042421A (en) * 1989-07-25 1991-08-27 Manhattan R&D, Inc. Rotatable vacuum chuck with magnetic means
US5374829A (en) * 1990-05-07 1994-12-20 Canon Kabushiki Kaisha Vacuum chuck
US6091079A (en) * 1992-03-27 2000-07-18 Micron Technology, Inc. Semiconductor wafer
US6196532B1 (en) * 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
US6257564B1 (en) * 1998-05-15 2001-07-10 Applied Materials, Inc Vacuum chuck having vacuum-nipples wafer support
US20050035514A1 (en) * 2003-08-11 2005-02-17 Supercritical Systems, Inc. Vacuum chuck apparatus and method for holding a wafer during high pressure processing
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
WO2006112531A1 (en) 2005-04-19 2006-10-26 Nihon Micro Coating Co., Ltd. Device for and method of polishing peripheral edge of semiconductor wafer
US20070063453A1 (en) * 2004-03-25 2007-03-22 Ibiden Co., Ltd. Vacuum chuck and suction board
JP2007250601A (en) 2006-03-14 2007-09-27 Okamoto Machine Tool Works Ltd Suction pad for substrate conveyor and method for conveying substrate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US20090179365A1 (en) * 2008-01-15 2009-07-16 Lerner Alexander N High temperature vacuum chuck assembly

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
US5042421A (en) * 1989-07-25 1991-08-27 Manhattan R&D, Inc. Rotatable vacuum chuck with magnetic means
US5374829A (en) * 1990-05-07 1994-12-20 Canon Kabushiki Kaisha Vacuum chuck
US6091079A (en) * 1992-03-27 2000-07-18 Micron Technology, Inc. Semiconductor wafer
US6257564B1 (en) * 1998-05-15 2001-07-10 Applied Materials, Inc Vacuum chuck having vacuum-nipples wafer support
US6196532B1 (en) * 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
US20050035514A1 (en) * 2003-08-11 2005-02-17 Supercritical Systems, Inc. Vacuum chuck apparatus and method for holding a wafer during high pressure processing
US20070063453A1 (en) * 2004-03-25 2007-03-22 Ibiden Co., Ltd. Vacuum chuck and suction board
WO2006112531A1 (en) 2005-04-19 2006-10-26 Nihon Micro Coating Co., Ltd. Device for and method of polishing peripheral edge of semiconductor wafer
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
JP2007250601A (en) 2006-03-14 2007-09-27 Okamoto Machine Tool Works Ltd Suction pad for substrate conveyor and method for conveying substrate
US20090179365A1 (en) * 2008-01-15 2009-07-16 Lerner Alexander N High temperature vacuum chuck assembly

Cited By (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729753S1 (en) 2010-12-28 2015-05-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
USD722031S1 (en) * 2013-12-31 2015-02-03 Celadon Systems, Inc. Top contact layout board in an electrical system
US10208884B2 (en) 2014-01-30 2019-02-19 Draingarde, Inc. Watershed protection device and system
USD792962S1 (en) * 2014-11-28 2017-07-25 Draingarde Inc. Catch basin cover
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD790489S1 (en) 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD770404S1 (en) * 2015-08-05 2016-11-01 Witricity Corporation Resonator coil
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD881126S1 (en) * 2017-08-04 2020-04-14 Holygo Corporation Coil for wireless charger
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1110975S1 (en) 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1107669S1 (en) * 2022-05-02 2025-12-30 Lam Research Corporation Processing chamber purge plate
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1091033S1 (en) 2023-03-09 2025-08-26 Irobot Corporation Drip tray for use with a mobile cleaning robot
USD1072399S1 (en) 2023-03-15 2025-04-22 Irobot Corporation Cleaning pad
USD1049528S1 (en) * 2023-03-29 2024-10-29 Irobot Corporation Cleaning pad for use in a mobile cleaning robot
USD1051530S1 (en) * 2023-03-29 2024-11-12 Irobot Corporation Drip tray for use with a mobile cleaning robot

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