USD1038901S1 - Collimator for a physical vapor deposition chamber - Google Patents
Collimator for a physical vapor deposition chamber Download PDFInfo
- Publication number
- USD1038901S1 USD1038901S1 US29/822,866 US202229822866F USD1038901S US D1038901 S1 USD1038901 S1 US D1038901S1 US 202229822866 F US202229822866 F US 202229822866F US D1038901 S USD1038901 S US D1038901S
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- US
- United States
- Prior art keywords
- collimator
- vapor deposition
- physical vapor
- deposition chamber
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The dash-dash broken lines in the drawings illustrate portions of the article that form no part of the claimed design. The dot-dash broken lines are for the purpose of illustrating the indications of the cross-section and form no part of the claimed design.
Claims (1)
- The ornamental design for a collimator for a physical vapor deposition chamber, as shown and described.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/822,866 USD1038901S1 (en) | 2022-01-12 | 2022-01-12 | Collimator for a physical vapor deposition chamber |
| TW111303280F TWD238346S (en) | 2022-01-12 | 2022-07-04 | Collimator for use in a physical vapor deposition (pvd) chamber |
| TW111303281F TWD237223S (en) | 2022-01-12 | 2022-07-04 | Collimator for use in a physical vapor deposition (pvd) chamber |
| JP2022014278F JP1770089S (en) | 2022-01-12 | 2022-07-04 | Collimators for physical vapor deposition chambers |
| US29/951,119 USD1110975S1 (en) | 2022-01-12 | 2024-07-08 | Collimator for a physical vapor deposition (PVD) chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/822,866 USD1038901S1 (en) | 2022-01-12 | 2022-01-12 | Collimator for a physical vapor deposition chamber |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/951,119 Division USD1110975S1 (en) | 2022-01-12 | 2024-07-08 | Collimator for a physical vapor deposition (PVD) chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1038901S1 true USD1038901S1 (en) | 2024-08-13 |
Family
ID=90926584
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/822,866 Active USD1038901S1 (en) | 2022-01-12 | 2022-01-12 | Collimator for a physical vapor deposition chamber |
| US29/951,119 Active USD1110975S1 (en) | 2022-01-12 | 2024-07-08 | Collimator for a physical vapor deposition (PVD) chamber |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/951,119 Active USD1110975S1 (en) | 2022-01-12 | 2024-07-08 | Collimator for a physical vapor deposition (PVD) chamber |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | USD1038901S1 (en) |
| JP (1) | JP1770089S (en) |
| TW (2) | TWD238346S (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1071886S1 (en) * | 2022-01-20 | 2025-04-22 | Applied Materials, Inc. | Substrate support for a substrate processing chamber |
| USD1103950S1 (en) * | 2024-03-21 | 2025-12-02 | Applied Materials, Inc. | Process chamber collimator |
| USD1110289S1 (en) * | 2024-10-18 | 2026-01-27 | Applied Materials, Inc. | Process chamber collimator |
| USD1110975S1 (en) * | 2022-01-12 | 2026-02-03 | Applied Materials Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| USD1110979S1 (en) * | 2024-10-18 | 2026-02-03 | Applied Materials, Inc. | Process chamber collimator |
Citations (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401675A (en) | 1991-04-19 | 1995-03-28 | Lee; Pei-Ing P. | Method of depositing conductors in high aspect ratio apertures using a collimator |
| US5544771A (en) * | 1994-02-23 | 1996-08-13 | Samsung Electronics Co., Ltd. | Method for manufacturing a collimator |
| US5624536A (en) | 1994-06-08 | 1997-04-29 | Tel Varian Limited | Processing apparatus with collimator exchange device |
| US5643428A (en) | 1995-02-01 | 1997-07-01 | Advanced Micro Devices, Inc. | Multiple tier collimator system for enhanced step coverage and uniformity |
| US5702573A (en) | 1996-01-29 | 1997-12-30 | Varian Associates, Inc. | Method and apparatus for improved low pressure collimated magnetron sputter deposition of metal films |
| US5705042A (en) | 1996-01-29 | 1998-01-06 | Micron Technology, Inc. | Electrically isolated collimator and method |
| US5770026A (en) * | 1996-09-19 | 1998-06-23 | Lg Semicon Co., Ltd. | Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus |
| US5958193A (en) | 1994-02-01 | 1999-09-28 | Vlsi Technology, Inc. | Sputter deposition with mobile collimator |
| US6362097B1 (en) | 1998-07-14 | 2002-03-26 | Applied Komatsu Technlology, Inc. | Collimated sputtering of semiconductor and other films |
| US20030015421A1 (en) | 2001-07-20 | 2003-01-23 | Applied Materials, Inc. | Collimated sputtering of cobalt |
| US20030029715A1 (en) | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
| TW200420001A (en) * | 2003-01-06 | 2004-10-01 | Interdigital Tech Corp | Method and system for controlling the distribution of multimedia broadcast services |
| US20040211665A1 (en) | 2001-07-25 | 2004-10-28 | Yoon Ki Hwan | Barrier formation using novel sputter-deposition method |
| TWM267462U (en) | 2000-07-17 | 2005-06-11 | Dura Tek Inc | Collimator for sputtering apparatus |
| US20070102286A1 (en) | 2005-10-31 | 2007-05-10 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| US20070228302A1 (en) | 2006-03-30 | 2007-10-04 | Norman Robert L Jr | Adjustable suspension assembly for a collimating lattice |
| US20080121620A1 (en) | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
| TWM346018U (en) | 2008-03-14 | 2008-12-01 | Everlight Electronics Co Ltd | Alterable gear collimator |
| USD598717S1 (en) | 2008-09-19 | 2009-08-25 | Dart Industries Inc. | Can strainer |
| TW200938890A (en) | 2008-03-14 | 2009-09-16 | Everlight Electronics Co Ltd | Alterable collimator and lightening module thereof |
| US20090308732A1 (en) | 2008-06-17 | 2009-12-17 | Applied Materials, Inc. | Apparatus and method for uniform deposition |
| US20090308739A1 (en) * | 2008-06-17 | 2009-12-17 | Applied Materials, Inc. | Wafer processing deposition shielding components |
| US20110278165A1 (en) | 2010-05-14 | 2011-11-17 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| USD660645S1 (en) | 2010-10-29 | 2012-05-29 | Conopco, Inc. | Tea capsule |
| TWD153743S (en) | 2012-01-25 | 2013-05-21 | 應用材料股份有限公司 | Deposition chamber liner |
| TWD159673S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD159674S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD159676S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD159675S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| USD722298S1 (en) | 2013-07-17 | 2015-02-10 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
| TWD166552S (en) | 2013-01-25 | 2015-03-11 | 日立國際電氣股份有限公司 | Vaporizer for substrate processing equipment |
| US20150114823A1 (en) * | 2013-10-24 | 2015-04-30 | Applied Materials, Inc. | Bipolar collimator utilized in a physical vapor deposition chamber |
| TWD169790S (en) | 2013-07-10 | 2015-08-11 | 日立國際電氣股份有限公司 | Part of the vaporizer for substrate processing equipment |
| US20150354054A1 (en) * | 2014-06-06 | 2015-12-10 | Applied Materials, Inc. | Cooled process tool adapter for use in substrate processing chambers |
| USD746647S1 (en) | 2014-03-13 | 2016-01-05 | Vienar Roaks | Strainer |
| TWD174341S (en) | 2014-12-22 | 2016-03-11 | 荏原製作所股份有限公司 | Inner cylinder for exhaust gas treatment device |
| TWD174342S (en) | 2014-12-22 | 2016-03-11 | 荏原製作所股份有限公司 | Part of the inner cylinder of the exhaust gas treatment device |
| USD753449S1 (en) | 2015-01-06 | 2016-04-12 | WineStor, LLC | Strainer for beverage shaker |
| TWD175855S (en) | 2015-06-12 | 2016-05-21 | Hitachi High Tech Corp | Lower chamber for plasma treatment device |
| TWD175853S (en) | 2015-06-12 | 2016-05-21 | Hitachi High Tech Corp | Cover rings for plasma processing equipment |
| TWD175852S (en) | 2015-06-12 | 2016-05-21 | Hitachi High Tech Corp | Upper chamber for plasma treatment device |
| US20160145735A1 (en) * | 2014-11-26 | 2016-05-26 | Applied Materials, Inc. | Collimator for use in substrate processing chambers |
| TWD176440S (en) | 2014-12-22 | 2016-06-11 | 荏原製作所股份有限公司 | Inner cylinder for exhaust gas treatment device |
| USD759603S1 (en) | 2013-07-17 | 2016-06-21 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
| USD760180S1 (en) * | 2014-02-21 | 2016-06-28 | Hzo, Inc. | Hexcell channel arrangement for use in a boat for a deposition apparatus |
| TWD178698S (en) | 2016-01-08 | 2016-10-01 | Asm Ip Holding Bv | Outer wall of reactor for semiconductor manufacturing apparatus |
| TWD180288S (en) | 2016-02-26 | 2016-12-21 | Hitachi High Tech Corp | Upper chamber for plasma treatment device |
| US20170117121A1 (en) * | 2015-10-27 | 2017-04-27 | Applied Materials, Inc. | Biasable flux optimizer / collimator for pvd sputter chamber |
| US20170253959A1 (en) * | 2016-03-05 | 2017-09-07 | Applied Materials, Inc. | Methods and apparatus for controlling ion fraction in physical vapor deposition processes |
| US20170301525A1 (en) * | 2014-11-05 | 2017-10-19 | Kabushiki Kaisha Toshiba | Processing apparatus and collimator |
| US9892890B2 (en) | 2012-04-26 | 2018-02-13 | Intevac, Inc. | Narrow source for physical vapor deposition processing |
| USD821039S1 (en) | 2016-06-06 | 2018-06-19 | Joe J. Owens, III | Pet food bowl |
| USD821140S1 (en) | 2016-12-27 | 2018-06-26 | Tristar Products, Inc. | Steamer plate |
| US20180233335A1 (en) * | 2016-03-14 | 2018-08-16 | Kabushiki Kaisha Toshiba | Processing device and collimator |
| US20180237903A1 (en) * | 2016-03-14 | 2018-08-23 | Kabushiki Kaisha Toshiba | Processing device, sputtering device, and collimator |
| US20180265964A1 (en) * | 2017-03-17 | 2018-09-20 | Kabushiki Kaisha Toshiba | Collimator and processing apparatus |
| US20190027346A1 (en) * | 2016-03-14 | 2019-01-24 | Kabushiki Kaisha Toshiba | Processing apparatus and collimator |
| USD858468S1 (en) * | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD859333S1 (en) * | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| TW202102001A (en) * | 2019-05-10 | 2021-01-01 | 美商尼爾森(美國)有限公司 | Content-modification system with use of multiple fingerprint data types feature |
| US11692261B2 (en) * | 2019-07-26 | 2023-07-04 | Applied Materials, Inc. | Evaporator chamber for forming films on substrates |
| USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1009816S1 (en) * | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
Family Cites Families (124)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5320728A (en) | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
| USD363464S (en) | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| USD351450S (en) | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
| USD376744S (en) | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
| USD381030S (en) | 1995-11-21 | 1997-07-15 | Avi Tepman | Sputtering target |
| AU129071S (en) | 1996-06-07 | 1997-01-14 | Riteflite Pty Ltd | Target |
| US6114216A (en) | 1996-11-13 | 2000-09-05 | Applied Materials, Inc. | Methods for shallow trench isolation |
| USD423026S (en) | 1997-08-20 | 2000-04-18 | Tokyo Electron Limited | Quartz cover |
| US6086725A (en) | 1998-04-02 | 2000-07-11 | Applied Materials, Inc. | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
| JP3551867B2 (en) | 1999-11-09 | 2004-08-11 | 信越化学工業株式会社 | Silicon focus ring and manufacturing method thereof |
| US6390905B1 (en) | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
| USD446231S1 (en) | 2000-08-21 | 2001-08-07 | Komatsu Industries Corporation | Nozzle for a plasma arc torch |
| USD487254S1 (en) | 2002-05-24 | 2004-03-02 | Nichia Corporation | Light emitting diode |
| DE60308550T2 (en) | 2002-12-16 | 2007-06-06 | Ifire Technology Corp., Fort Saskatchewan | COMPOSED SPRAY TARGET AND PHOSPHORUS DEPOSIT METHOD |
| USD496951S1 (en) | 2003-01-30 | 2004-10-05 | Thermal Dynamics Corporation | Mechanized cap for a plasma arc torch |
| USD503729S1 (en) | 2003-10-31 | 2005-04-05 | Nordson Corporation | Nozzle for dispensing adhesives and sealants |
| JP4744855B2 (en) | 2003-12-26 | 2011-08-10 | 日本碍子株式会社 | Electrostatic chuck |
| JP5189294B2 (en) | 2004-02-13 | 2013-04-24 | エーエスエム アメリカ インコーポレイテッド | Substrate support system for reducing autodoping and backside deposition |
| USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| USD559066S1 (en) | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
| USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| TWD121115S1 (en) | 2005-03-30 | 2008-01-21 | 東京威力科創股份有限公司 | Cover ring |
| TWD117941S1 (en) | 2005-07-29 | 2007-07-01 | 東京威力科創股份有限公司 | Top panel for microwave introduction window of plasma processing apparatus |
| TWD117940S1 (en) | 2005-07-29 | 2007-07-01 | 東京威力科創股份有限公司 | Top panel for microwave introduction window of plasma processing apparatus |
| TWD125340S1 (en) | 2005-07-29 | 2008-10-11 | 東京威力科創股份有限公司 | Top panel for microwave introduction window of plasma processing apparatus |
| TWD117939S1 (en) | 2005-07-29 | 2007-07-01 | 東京威力科創股份有限公司 | Top panel for microwave introduction window of plasma processing apparatus |
| USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20070076345A1 (en) | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
| TWD117576S1 (en) | 2005-12-27 | 2007-06-11 | 東京威力科創股份有限公司 | Gas supply shower for semiconductor manufacturing |
| USD545853S1 (en) | 2006-03-30 | 2007-07-03 | Dave Hawley | Plasma gun nozzle retention ring |
| TWD122892S1 (en) | 2006-06-16 | 2008-05-11 | 東京威力科創股份有限公司 | Heat Suppression Ring for Semiconductor Manufacturing |
| USD570310S1 (en) | 2006-08-01 | 2008-06-03 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| USD613829S1 (en) * | 2006-09-13 | 2010-04-13 | Hayward Industries, Inc. | Circular suction outlet assembly cover |
| US7402098B2 (en) | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
| TWD130501S1 (en) | 2006-12-15 | 2009-08-21 | 東京威力科創股份有限公司 | A cover for a heater stage of a plasma processing apparatus |
| TWD129207S1 (en) | 2006-12-26 | 2009-06-11 | 東京威力科創股份有限公司 | Shield ring |
| US20080173541A1 (en) | 2007-01-22 | 2008-07-24 | Eal Lee | Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling |
| US8968536B2 (en) | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
| TWD130834S1 (en) | 2008-03-28 | 2009-09-11 | 東京威力科創股份有限公司 | Heat dissipation fins for heat preservation cylinders used in semiconductor manufacturing |
| US20090260982A1 (en) | 2008-04-16 | 2009-10-22 | Applied Materials, Inc. | Wafer processing deposition shielding components |
| WO2009151767A2 (en) | 2008-04-21 | 2009-12-17 | Honeywell International Inc. | Design and use of dc magnetron sputtering systems |
| USD614593S1 (en) | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| US8371904B2 (en) | 2008-08-08 | 2013-02-12 | Globalfoundries Singapore Pte. Ltd. | Polishing with enhanced uniformity |
| US8070925B2 (en) | 2008-10-17 | 2011-12-06 | Applied Materials, Inc. | Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target |
| USD616389S1 (en) | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
| USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
| US8133368B2 (en) | 2008-10-31 | 2012-03-13 | Applied Materials, Inc. | Encapsulated sputtering target |
| TWI397600B (en) | 2009-01-07 | 2013-06-01 | Solar Applied Mat Tech Corp | Recycled sputtering target and its making method |
| USD616390S1 (en) | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
| USD615936S1 (en) | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Pedestal of heat insulating cylinder for manufacturing semiconductor wafers |
| USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| KR101892911B1 (en) | 2010-08-06 | 2018-08-29 | 어플라이드 머티어리얼스, 인코포레이티드 | Electrostatic chuck and methods of use thereof |
| TWD146490S (en) | 2011-01-12 | 2012-04-21 | 荏原製作所股份有限公司 | Elastic film for semiconductor wafer polishing |
| WO2012142408A2 (en) | 2011-04-14 | 2012-10-18 | Veeco Instruments Inc. | Substrate holders and methods of substrate mounting |
| USD678745S1 (en) | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| JP1438319S (en) | 2011-09-20 | 2015-04-06 | ||
| USD669509S1 (en) | 2011-10-19 | 2012-10-23 | Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts | Nozzle for torch |
| USD691974S1 (en) | 2011-12-22 | 2013-10-22 | Tokyo Electron Limited | Holding pad for transferring a wafer |
| USD683806S1 (en) | 2012-01-12 | 2013-06-04 | Surefire, Llc | Front plate for a firearm sound suppressor |
| USD687791S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
| USD687790S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
| KR20130131120A (en) | 2012-05-23 | 2013-12-03 | 삼성전자주식회사 | A flexible membrane for polishing head |
| JP5875950B2 (en) | 2012-06-29 | 2016-03-02 | 株式会社荏原製作所 | Substrate holding device and polishing device |
| USD732094S1 (en) | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
| US9475996B2 (en) | 2012-10-17 | 2016-10-25 | Richard Max Mandle | Centrifugal fluid ring plasma reactor |
| USD703162S1 (en) | 2012-10-17 | 2014-04-22 | Sumitomo Electric Industries, Ltd. | Wafer holder for stepper |
| TWI605142B (en) | 2013-01-04 | 2017-11-11 | 塔沙Smd公司 | Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same |
| FR3002242B1 (en) | 2013-02-21 | 2015-04-03 | Altatech Semiconductor | CHEMICAL VAPOR DEPOSITION DEVICE |
| FR3002241B1 (en) | 2013-02-21 | 2015-11-20 | Altatech Semiconductor | CHEMICAL VAPOR DEPOSITION DEVICE |
| US9534286B2 (en) | 2013-03-15 | 2017-01-03 | Applied Materials, Inc. | PVD target for self-centering process shield |
| USD721417S1 (en) * | 2013-04-11 | 2015-01-20 | Canada Pipeline Accessories, Co., Ltd. | Flow conditioner |
| USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD754468S1 (en) | 2013-07-23 | 2016-04-26 | Michael F. Nason | Disposable splatter shield |
| USD716742S1 (en) | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| US9960021B2 (en) | 2013-12-18 | 2018-05-01 | Applied Materials, Inc. | Physical vapor deposition (PVD) target having low friction pads |
| USD741921S1 (en) | 2014-04-15 | 2015-10-27 | Q-Linea Ab | Positive mold for manufacturing a sample holding disc |
| US9991101B2 (en) | 2014-07-29 | 2018-06-05 | Applied Materials, Inc. | Magnetron assembly for physical vapor deposition chamber |
| USD750728S1 (en) | 2014-12-02 | 2016-03-01 | John K. Kremer | Laser target |
| USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| USD801942S1 (en) | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| JP1545222S (en) | 2015-06-10 | 2016-03-07 | ||
| JP1546800S (en) | 2015-06-12 | 2016-03-28 | ||
| USD798248S1 (en) | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| US10174437B2 (en) | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
| JP1549882S (en) | 2015-08-18 | 2016-05-23 | ||
| USD819580S1 (en) | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD830434S1 (en) | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
| TWD178699S (en) | 2016-01-08 | 2016-10-01 | Asm Ip Holding Bv | Gas dispersing plate for semiconductor manufacturing apparatus |
| TWD178424S (en) | 2016-01-08 | 2016-09-21 | Asm Ip Holding Bv | Gas flow control plate for semiconductor manufacturing apparatus |
| USD794753S1 (en) | 2016-04-08 | 2017-08-15 | Applied Materials, Inc. | Showerhead for a semiconductor processing chamber |
| USD790039S1 (en) | 2016-04-08 | 2017-06-20 | Applied Materials, Inc. | Showerhead for a semiconductor processing chamber |
| USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD804230S1 (en) | 2016-06-23 | 2017-12-05 | Cbd Consolidated Llc | Bench top gripping device |
| USD813181S1 (en) | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
| USD824971S1 (en) * | 2016-07-27 | 2018-08-07 | Deka Products Limited Partnership | Gear |
| USD817372S1 (en) * | 2016-07-27 | 2018-05-08 | Deka Product Limited Partnership | Sprocket |
| USD818015S1 (en) * | 2016-07-27 | 2018-05-15 | Deka Products Limited Partnership | Wheel |
| USD836572S1 (en) | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD839224S1 (en) | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| CN206573738U (en) | 2017-03-16 | 2017-10-20 | 江苏亨通光导新材料有限公司 | Low loss fiber |
| US10662520B2 (en) | 2017-03-29 | 2020-05-26 | Applied Materials, Inc. | Method for recycling substrate process components |
| USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| US10811232B2 (en) | 2017-08-08 | 2020-10-20 | Applied Materials, Inc. | Multi-plate faceplate for a processing chamber |
| USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| TWD197827S (en) | 2017-12-19 | 2019-06-01 | Ebara Corp | Elastic film for semiconductor wafer polishing |
| USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
| USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD846514S1 (en) | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD888903S1 (en) | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD891382S1 (en) | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD893441S1 (en) | 2019-06-28 | 2020-08-18 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
| USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| USD913979S1 (en) | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
| USD1038901S1 (en) * | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
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| USD1025936S1 (en) * | 2022-12-16 | 2024-05-07 | Applied Materials, Inc. | Collimator for a physical vapor deposition (PVD) chamber |
-
2022
- 2022-01-12 US US29/822,866 patent/USD1038901S1/en active Active
- 2022-07-04 TW TW111303280F patent/TWD238346S/en unknown
- 2022-07-04 JP JP2022014278F patent/JP1770089S/en active Active
- 2022-07-04 TW TW111303281F patent/TWD237223S/en unknown
-
2024
- 2024-07-08 US US29/951,119 patent/USD1110975S1/en active Active
Patent Citations (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401675A (en) | 1991-04-19 | 1995-03-28 | Lee; Pei-Ing P. | Method of depositing conductors in high aspect ratio apertures using a collimator |
| US5958193A (en) | 1994-02-01 | 1999-09-28 | Vlsi Technology, Inc. | Sputter deposition with mobile collimator |
| US5544771A (en) * | 1994-02-23 | 1996-08-13 | Samsung Electronics Co., Ltd. | Method for manufacturing a collimator |
| US5624536A (en) | 1994-06-08 | 1997-04-29 | Tel Varian Limited | Processing apparatus with collimator exchange device |
| US5643428A (en) | 1995-02-01 | 1997-07-01 | Advanced Micro Devices, Inc. | Multiple tier collimator system for enhanced step coverage and uniformity |
| US5702573A (en) | 1996-01-29 | 1997-12-30 | Varian Associates, Inc. | Method and apparatus for improved low pressure collimated magnetron sputter deposition of metal films |
| US5705042A (en) | 1996-01-29 | 1998-01-06 | Micron Technology, Inc. | Electrically isolated collimator and method |
| US5770026A (en) * | 1996-09-19 | 1998-06-23 | Lg Semicon Co., Ltd. | Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus |
| US6362097B1 (en) | 1998-07-14 | 2002-03-26 | Applied Komatsu Technlology, Inc. | Collimated sputtering of semiconductor and other films |
| TWM267462U (en) | 2000-07-17 | 2005-06-11 | Dura Tek Inc | Collimator for sputtering apparatus |
| US20030015421A1 (en) | 2001-07-20 | 2003-01-23 | Applied Materials, Inc. | Collimated sputtering of cobalt |
| US20030029715A1 (en) | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
| US20040211665A1 (en) | 2001-07-25 | 2004-10-28 | Yoon Ki Hwan | Barrier formation using novel sputter-deposition method |
| TW200420001A (en) * | 2003-01-06 | 2004-10-01 | Interdigital Tech Corp | Method and system for controlling the distribution of multimedia broadcast services |
| US20070102286A1 (en) | 2005-10-31 | 2007-05-10 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| US20070228302A1 (en) | 2006-03-30 | 2007-10-04 | Norman Robert L Jr | Adjustable suspension assembly for a collimating lattice |
| US20080121620A1 (en) | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
| TWM346018U (en) | 2008-03-14 | 2008-12-01 | Everlight Electronics Co Ltd | Alterable gear collimator |
| TW200938890A (en) | 2008-03-14 | 2009-09-16 | Everlight Electronics Co Ltd | Alterable collimator and lightening module thereof |
| US20090308739A1 (en) * | 2008-06-17 | 2009-12-17 | Applied Materials, Inc. | Wafer processing deposition shielding components |
| US20090308732A1 (en) | 2008-06-17 | 2009-12-17 | Applied Materials, Inc. | Apparatus and method for uniform deposition |
| USD598717S1 (en) | 2008-09-19 | 2009-08-25 | Dart Industries Inc. | Can strainer |
| US20110278165A1 (en) | 2010-05-14 | 2011-11-17 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| USD660645S1 (en) | 2010-10-29 | 2012-05-29 | Conopco, Inc. | Tea capsule |
| TWD153743S (en) | 2012-01-25 | 2013-05-21 | 應用材料股份有限公司 | Deposition chamber liner |
| US9892890B2 (en) | 2012-04-26 | 2018-02-13 | Intevac, Inc. | Narrow source for physical vapor deposition processing |
| TWD159675S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD159676S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD159674S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD159673S (en) | 2012-11-30 | 2014-04-01 | 日立國際電氣股份有限公司 | Rotator for substrate processing device |
| TWD166552S (en) | 2013-01-25 | 2015-03-11 | 日立國際電氣股份有限公司 | Vaporizer for substrate processing equipment |
| TWD169790S (en) | 2013-07-10 | 2015-08-11 | 日立國際電氣股份有限公司 | Part of the vaporizer for substrate processing equipment |
| USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
| USD722298S1 (en) | 2013-07-17 | 2015-02-10 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
| USD759603S1 (en) | 2013-07-17 | 2016-06-21 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
| US20150114823A1 (en) * | 2013-10-24 | 2015-04-30 | Applied Materials, Inc. | Bipolar collimator utilized in a physical vapor deposition chamber |
| USD760180S1 (en) * | 2014-02-21 | 2016-06-28 | Hzo, Inc. | Hexcell channel arrangement for use in a boat for a deposition apparatus |
| USD746647S1 (en) | 2014-03-13 | 2016-01-05 | Vienar Roaks | Strainer |
| US20150354054A1 (en) * | 2014-06-06 | 2015-12-10 | Applied Materials, Inc. | Cooled process tool adapter for use in substrate processing chambers |
| US20170301525A1 (en) * | 2014-11-05 | 2017-10-19 | Kabushiki Kaisha Toshiba | Processing apparatus and collimator |
| US20160145735A1 (en) * | 2014-11-26 | 2016-05-26 | Applied Materials, Inc. | Collimator for use in substrate processing chambers |
| US9543126B2 (en) * | 2014-11-26 | 2017-01-10 | Applied Materials, Inc. | Collimator for use in substrate processing chambers |
| TWD174341S (en) | 2014-12-22 | 2016-03-11 | 荏原製作所股份有限公司 | Inner cylinder for exhaust gas treatment device |
| TWD174342S (en) | 2014-12-22 | 2016-03-11 | 荏原製作所股份有限公司 | Part of the inner cylinder of the exhaust gas treatment device |
| TWD176440S (en) | 2014-12-22 | 2016-06-11 | 荏原製作所股份有限公司 | Inner cylinder for exhaust gas treatment device |
| USD753449S1 (en) | 2015-01-06 | 2016-04-12 | WineStor, LLC | Strainer for beverage shaker |
| TWD175853S (en) | 2015-06-12 | 2016-05-21 | Hitachi High Tech Corp | Cover rings for plasma processing equipment |
| TWD175855S (en) | 2015-06-12 | 2016-05-21 | Hitachi High Tech Corp | Lower chamber for plasma treatment device |
| TWD175852S (en) | 2015-06-12 | 2016-05-21 | Hitachi High Tech Corp | Upper chamber for plasma treatment device |
| US20170117121A1 (en) * | 2015-10-27 | 2017-04-27 | Applied Materials, Inc. | Biasable flux optimizer / collimator for pvd sputter chamber |
| US9960024B2 (en) | 2015-10-27 | 2018-05-01 | Applied Materials, Inc. | Biasable flux optimizer / collimator for PVD sputter chamber |
| TWD178698S (en) | 2016-01-08 | 2016-10-01 | Asm Ip Holding Bv | Outer wall of reactor for semiconductor manufacturing apparatus |
| TWD180288S (en) | 2016-02-26 | 2016-12-21 | Hitachi High Tech Corp | Upper chamber for plasma treatment device |
| US20170253959A1 (en) * | 2016-03-05 | 2017-09-07 | Applied Materials, Inc. | Methods and apparatus for controlling ion fraction in physical vapor deposition processes |
| US20190027346A1 (en) * | 2016-03-14 | 2019-01-24 | Kabushiki Kaisha Toshiba | Processing apparatus and collimator |
| US20180233335A1 (en) * | 2016-03-14 | 2018-08-16 | Kabushiki Kaisha Toshiba | Processing device and collimator |
| US20180237903A1 (en) * | 2016-03-14 | 2018-08-23 | Kabushiki Kaisha Toshiba | Processing device, sputtering device, and collimator |
| USD821039S1 (en) | 2016-06-06 | 2018-06-19 | Joe J. Owens, III | Pet food bowl |
| USD821140S1 (en) | 2016-12-27 | 2018-06-26 | Tristar Products, Inc. | Steamer plate |
| US20180265964A1 (en) * | 2017-03-17 | 2018-09-20 | Kabushiki Kaisha Toshiba | Collimator and processing apparatus |
| USD858468S1 (en) * | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD859333S1 (en) * | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| TWD200242S (en) * | 2018-03-16 | 2019-10-11 | 美商應用材料股份有限公司 | A collimator for use in a physical vapor deposition (pvd) chamber |
| TWD202102S (en) * | 2018-03-16 | 2020-01-11 | 美商應用材料股份有限公司 | A collimator for use in a physical vapor deposition (pvd) chamber |
| TW202102001A (en) * | 2019-05-10 | 2021-01-01 | 美商尼爾森(美國)有限公司 | Content-modification system with use of multiple fingerprint data types feature |
| US11692261B2 (en) * | 2019-07-26 | 2023-07-04 | Applied Materials, Inc. | Evaporator chamber for forming films on substrates |
| USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1009816S1 (en) * | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
Non-Patent Citations (1)
| Title |
|---|
| Search Report for Taiwan Design Application No. 107305411, Feb. 21, 2019, pp. 2. |
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Also Published As
| Publication number | Publication date |
|---|---|
| USD1110975S1 (en) | 2026-02-03 |
| TWD237223S (en) | 2025-04-01 |
| TWD238346S (en) | 2025-05-21 |
| JP1770089S (en) | 2024-05-10 |
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