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TWD211239S - Wafer holder part - Google Patents

Wafer holder part Download PDF

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Publication number
TWD211239S
TWD211239S TW109302374F TW109302374F TWD211239S TW D211239 S TWD211239 S TW D211239S TW 109302374 F TW109302374 F TW 109302374F TW 109302374 F TW109302374 F TW 109302374F TW D211239 S TWD211239 S TW D211239S
Authority
TW
Taiwan
Prior art keywords
wafer holder
wafer
design
holder part
article
Prior art date
Application number
TW109302374F
Other languages
Chinese (zh)
Inventor
相澤聡
丸林哲也
山田清明
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD211239S publication Critical patent/TWD211239S/en

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Abstract

【物品用途】;本設計的物品是晶圓保持器，為一種在半導體製造裝置中，安裝在用以搬送晶圓的晶圓移載機上來使用的晶圓保持器，晶圓是被載置在尖端部與根部之間所形成的凹部中。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Use of article] The article of this design is a wafer holder. It is a wafer holder that is installed on a wafer transfer machine for transporting wafers in semiconductor manufacturing equipment. The wafer is placed In the recess formed between the tip and the root. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

晶圓保持器之部分Wafer holder part

本設計的物品是晶圓保持器，為一種在半導體製造裝置中，安裝在用以搬送晶圓的晶圓移載機上來使用的晶圓保持器，晶圓是被載置在尖端部與根部之間所形成的凹部中。The article of this design is a wafer holder. It is a wafer holder installed on a wafer transfer machine to transport wafers in a semiconductor manufacturing device. The wafer is placed on the tip and root. In the recess formed between.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line exposed in the diagram is a part of this case that does not advocate design.

TW109302374F 2019-11-28 2020-05-04 Wafer holder part TWD211239S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-026361 2019-02-18
JPD2019-26361F JP1665227S (en) 2019-11-28 2019-11-28

Publications (1)

Publication Number Publication Date
TWD211239S true TWD211239S (en) 2021-05-01

Family

ID=71843040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109302374F TWD211239S (en) 2019-11-28 2020-05-04 Wafer holder part

Country Status (3)

Country Link
US (1) USD997892S1 (en)
JP (1) JP1665227S (en)
TW (1) TWD211239S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD228828S (en) 2023-03-23 2023-12-01 復泰科技股份有限公司 Wafer carrier
TWD230594S (en) 2022-05-02 2024-04-01 美商蘭姆研究公司 (美國) Processing chamber purge plate
TWD234110S (en) 2023-04-10 2024-10-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 (荷蘭) End effector

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JP1744835S (en) * 2022-10-13 2023-05-25 robot gripper
USD1077046S1 (en) * 2022-12-01 2025-05-27 Koninklijke Philips N.V. Handle for nanoimprinting machine
USD1107089S1 (en) * 2023-12-08 2025-12-23 Applied Materials, Inc. Substrate-handling robot end effector
USD1106082S1 (en) * 2025-03-06 2025-12-16 Asm Ip Holding B.V. End effector

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US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
JP2005209954A (en) * 2004-01-23 2005-08-04 Kawasaki Heavy Ind Ltd Substrate holding device
US8182009B2 (en) * 2008-03-13 2012-05-22 Xyratex Technology, Ltd. End effector
TWD133946S1 (en) * 2008-07-21 2010-03-21 Ａｓｍ吉尼泰克韓國股份有限公司 Substrate transfer device for semiconductor deposition apparatus
USD673923S1 (en) * 2011-01-20 2013-01-08 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
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USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
SG194239A1 (en) * 2012-04-09 2013-11-29 Semiconductor Tech & Instr Inc End handler
JP2014086472A (en) * 2012-10-19 2014-05-12 Sinfonia Technology Co Ltd Clamp device and workpiece conveyer robot
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
US9536764B2 (en) * 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
JP6594177B2 (en) * 2015-11-24 2019-10-23 平田機工株式会社 Hand parts and hands
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
JP6276317B2 (en) * 2016-03-31 2018-02-07 平田機工株式会社 Hand unit and transfer method
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD230594S (en) 2022-05-02 2024-04-01 美商蘭姆研究公司 (美國) Processing chamber purge plate
TWD234282S (en) 2022-05-02 2024-10-21 美商蘭姆研究公司 (美國) Processing chamber purge plate
USD1107669S1 (en) 2022-05-02 2025-12-30 Lam Research Corporation Processing chamber purge plate
TWD228828S (en) 2023-03-23 2023-12-01 復泰科技股份有限公司 Wafer carrier
TWD234110S (en) 2023-04-10 2024-10-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 (荷蘭) End effector

Also Published As

Publication number Publication date
USD997892S1 (en) 2023-09-05
JP1665227S (en) 2020-08-03

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