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USD1106082S1 - End effector - Google Patents

End effector

Info

Publication number
USD1106082S1
USD1106082S1 US29/992,214 US202529992214F USD1106082S US D1106082 S1 USD1106082 S1 US D1106082S1 US 202529992214 F US202529992214 F US 202529992214F US D1106082 S USD1106082 S US D1106082S
Authority
US
United States
Prior art keywords
end effector
view
ornamental design
effector
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/992,214
Inventor
Masashi Nakano
Senthil Arasu Subas Chandra Bose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM IP Holding BV
Original Assignee
ASM IP Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM IP Holding BV filed Critical ASM IP Holding BV
Priority to US29/992,214 priority Critical patent/USD1106082S1/en
Priority to JP2025016026F priority patent/JP1815650S/en
Application granted granted Critical
Publication of USD1106082S1 publication Critical patent/USD1106082S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top right perspective view of an end effector showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a front view thereof;
FIG. 7 is a rear view thereof; and,
FIG. 8 is a bottom left perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an end effector as shown and described.
US29/992,214 2025-03-06 2025-03-06 End effector Active USD1106082S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/992,214 USD1106082S1 (en) 2025-03-06 2025-03-06 End effector
JP2025016026F JP1815650S (en) 2025-03-06 2025-08-13 End Effector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/992,214 USD1106082S1 (en) 2025-03-06 2025-03-06 End effector

Publications (1)

Publication Number Publication Date
USD1106082S1 true USD1106082S1 (en) 2025-12-16

Family

ID=98004644

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/992,214 Active USD1106082S1 (en) 2025-03-06 2025-03-06 End effector

Country Status (2)

Country Link
US (1) USD1106082S1 (en)
JP (1) JP1815650S (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US20020041102A1 (en) * 2000-07-10 2002-04-11 Nis Krauskopf Robotic end effector for semiconductor wafer processing
US20090169346A1 (en) * 2007-12-31 2009-07-02 Memc Electronic Materials, Inc. Semiconductor wafer carrier blade
US20090250955A1 (en) * 2008-04-07 2009-10-08 Applied Materials, Inc. Wafer transfer blade
US20150086316A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Pneumatic end effector apparatus, substrate transportation systems, and methods for transporting substrates
US20150217456A1 (en) * 2014-02-04 2015-08-06 Asm Ip Holding B.V. Anti-slip end-effector for transporting workpiece
US20160303742A1 (en) * 2015-04-15 2016-10-20 Lam Research Corporation End effector assembly for clean/dirty substrate handling
US20170173799A1 (en) * 2015-12-22 2017-06-22 Varian Semiconductor Equipment Associates, Inc. Self-damping end effector
US9757865B1 (en) * 2017-03-03 2017-09-12 Well Thin Technology, Ltd. Carrier plate assembly for a wafer
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers
US20240190019A1 (en) * 2022-12-09 2024-06-13 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
US20240269867A1 (en) * 2023-02-10 2024-08-15 Diablo Capital, Inc. Electrostatically-Enhanced Friction-Gripping End Effector
USD1077046S1 (en) * 2022-12-01 2025-05-27 Koninklijke Philips N.V. Handle for nanoimprinting machine
TWD239332S (en) * 2023-12-08 2025-07-11 美商應用材料股份有限公司 (美國) Substrate-handling robot end effector
US20250229437A1 (en) * 2024-01-16 2025-07-17 Spts Technologies Limited End effector for carrying a wafer or a wafer assembly

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US20020041102A1 (en) * 2000-07-10 2002-04-11 Nis Krauskopf Robotic end effector for semiconductor wafer processing
US20090169346A1 (en) * 2007-12-31 2009-07-02 Memc Electronic Materials, Inc. Semiconductor wafer carrier blade
US7878562B2 (en) * 2007-12-31 2011-02-01 Memc Electronic Materials, Inc. Semiconductor wafer carrier blade
US20090250955A1 (en) * 2008-04-07 2009-10-08 Applied Materials, Inc. Wafer transfer blade
US20150086316A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Pneumatic end effector apparatus, substrate transportation systems, and methods for transporting substrates
US20150217456A1 (en) * 2014-02-04 2015-08-06 Asm Ip Holding B.V. Anti-slip end-effector for transporting workpiece
US20160303742A1 (en) * 2015-04-15 2016-10-20 Lam Research Corporation End effector assembly for clean/dirty substrate handling
US20170173799A1 (en) * 2015-12-22 2017-06-22 Varian Semiconductor Equipment Associates, Inc. Self-damping end effector
US9757865B1 (en) * 2017-03-03 2017-09-12 Well Thin Technology, Ltd. Carrier plate assembly for a wafer
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers
USD1077046S1 (en) * 2022-12-01 2025-05-27 Koninklijke Philips N.V. Handle for nanoimprinting machine
US20240190019A1 (en) * 2022-12-09 2024-06-13 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
US20240269867A1 (en) * 2023-02-10 2024-08-15 Diablo Capital, Inc. Electrostatically-Enhanced Friction-Gripping End Effector
TWD239332S (en) * 2023-12-08 2025-07-11 美商應用材料股份有限公司 (美國) Substrate-handling robot end effector
US20250229437A1 (en) * 2024-01-16 2025-07-17 Spts Technologies Limited End effector for carrying a wafer or a wafer assembly

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
Coorstek end effectors, posted May 30, 2023 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://www.coorstek.com/en/industries/semiconductor/general-applications-wafer-handling/ (Year: 2023). *
Fabmatics single wafer handling, posted Jul. 19, 2017 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://www.fabmatics.com/products/handling/wafer-handling/wafer-gripper/ (Year: 2017). *
Jabil semiconductor wafer handling system, posted May 27, 2022 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://www.jabil.com/services/precision-automation/semiconductor-wafer-handling.html (Year: 2022). *
Mechatronic end effectors, posted Apr. 16, 2024 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://mechatronic.at/end-effectors (Year: 2024). *
Coorstek end effectors, posted May 30, 2023 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://www.coorstek.com/en/industries/semiconductor/general-applications-wafer-handling/ (Year: 2023). *
Fabmatics single wafer handling, posted Jul. 19, 2017 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://www.fabmatics.com/products/handling/wafer-handling/wafer-gripper/ (Year: 2017). *
Jabil semiconductor wafer handling system, posted May 27, 2022 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://www.jabil.com/services/precision-automation/semiconductor-wafer-handling.html (Year: 2022). *
Mechatronic end effectors, posted Apr. 16, 2024 [online], [retrieved Aug. 13, 2025]. Retrieved from internet, https://mechatronic.at/end-effectors (Year: 2024). *

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