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USD674365S1 - Arm for wafer transportation for manufacturing semiconductor - Google Patents

Arm for wafer transportation for manufacturing semiconductor Download PDF

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Publication number
USD674365S1
USD674365S1 US29/396,039 US201129396039F USD674365S US D674365 S1 USD674365 S1 US D674365S1 US 201129396039 F US201129396039 F US 201129396039F US D674365 S USD674365 S US D674365S
Authority
US
United States
Prior art keywords
arm
manufacturing semiconductor
wafer transportation
wafer
transportation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/396,039
Inventor
Hideki Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAJIWARA, HIDEKI
Application granted granted Critical
Publication of USD674365S1 publication Critical patent/USD674365S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is front perspective view of an arm for wafer transportation for manufacturing semiconductor illustrating my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof; and,
FIG. 6 is a left side view thereof, the right side view being a mirror image.
The broken lines in the drawings form no part of the claimed design.

Claims (1)

  1. The ornamental design for arm for wafer transportation for manufacturing semiconductor, as shown and described.
US29/396,039 2011-01-20 2011-06-24 Arm for wafer transportation for manufacturing semiconductor Active USD674365S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-001004 2011-01-20
JP2011001004 2011-01-20

Publications (1)

Publication Number Publication Date
USD674365S1 true USD674365S1 (en) 2013-01-15

Family

ID=47471227

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/396,039 Active USD674365S1 (en) 2011-01-20 2011-06-24 Arm for wafer transportation for manufacturing semiconductor

Country Status (2)

Country Link
US (1) USD674365S1 (en)
TW (1) TWD147586S (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD743400S1 (en) * 2010-06-11 2015-11-17 Ricoh Company, Ltd. Information storage device
USD797709S1 (en) * 2016-01-20 2017-09-19 World Products, Inc. Curved folded medical monopole antenna
USD868012S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD868013S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD877706S1 (en) * 2017-01-18 2020-03-10 Kokusai Electric Corporation Cassette displacement prevention jig of semiconductor manufacturing apparatus
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6168669B1 (en) * 1998-02-24 2001-01-02 Tokyo Electron Limited Substrate holding apparatus and substrate process system
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6216883B1 (en) * 1998-07-24 2001-04-17 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6409453B1 (en) * 1998-02-18 2002-06-25 Applied Materials, Inc. End effector for wafer handler in processing system
US20030169916A1 (en) * 2002-02-19 2003-09-11 Toshiba Ceramics Co., Ltd. Wafer inspection apparatus
US20040182417A1 (en) * 2003-03-17 2004-09-23 Tokyo Electron Limited Processing system and method for chemically treating a substrate
US7186297B2 (en) * 2000-12-15 2007-03-06 Kabushiki Kaisha Yaskawa Denki Wafer holding apparatus
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
USD589474S1 (en) * 2007-06-06 2009-03-31 Tokyo Electron Limited Wafer holding member
US7611182B2 (en) * 2005-02-25 2009-11-03 Semes Co., Ltd. Wafer transfer apparatus
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US20110146578A1 (en) * 2009-12-17 2011-06-23 Hitachi-Kokusai Electric Inc. Substrate processing apparatus

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6409453B1 (en) * 1998-02-18 2002-06-25 Applied Materials, Inc. End effector for wafer handler in processing system
US6168669B1 (en) * 1998-02-24 2001-01-02 Tokyo Electron Limited Substrate holding apparatus and substrate process system
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6216883B1 (en) * 1998-07-24 2001-04-17 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
US7186297B2 (en) * 2000-12-15 2007-03-06 Kabushiki Kaisha Yaskawa Denki Wafer holding apparatus
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US20030169916A1 (en) * 2002-02-19 2003-09-11 Toshiba Ceramics Co., Ltd. Wafer inspection apparatus
US20040182417A1 (en) * 2003-03-17 2004-09-23 Tokyo Electron Limited Processing system and method for chemically treating a substrate
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US7611182B2 (en) * 2005-02-25 2009-11-03 Semes Co., Ltd. Wafer transfer apparatus
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
USD589474S1 (en) * 2007-06-06 2009-03-31 Tokyo Electron Limited Wafer holding member
US20110146578A1 (en) * 2009-12-17 2011-06-23 Hitachi-Kokusai Electric Inc. Substrate processing apparatus

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11188007B2 (en) 2010-06-11 2021-11-30 Ricoh Company, Ltd. Developer container which discharges toner from a lower side and includes a box section
US12416878B2 (en) 2010-06-11 2025-09-16 Ricoh Company, Limited Information storage system including a plurality of terminals
USD743400S1 (en) * 2010-06-11 2015-11-17 Ricoh Company, Ltd. Information storage device
US9256158B2 (en) 2010-06-11 2016-02-09 Ricoh Company, Limited Apparatus and method for preventing an information storage device from falling from a removable device
USD757161S1 (en) 2010-06-11 2016-05-24 Ricoh Company, Ltd. Toner container
USD758482S1 (en) 2010-06-11 2016-06-07 Ricoh Company, Ltd. Toner bottle
US9599927B2 (en) 2010-06-11 2017-03-21 Ricoh Company, Ltd. Apparatus and method for preventing an information storage device from falling from a removable device
US11429036B2 (en) 2010-06-11 2022-08-30 Ricoh Company, Ltd. Information storage system including a plurality of terminals
US9989887B2 (en) 2010-06-11 2018-06-05 Ricoh Company, Ltd. Apparatus and method for preventing an information storage device from falling from a removable device
US11275327B2 (en) 2010-06-11 2022-03-15 Ricoh Company, Ltd. Information storage system including a plurality of terminals
US10754275B2 (en) 2010-06-11 2020-08-25 Ricoh Company, Ltd. Apparatus and method for preventing an information storage device from falling from a removable device
US11768448B2 (en) 2010-06-11 2023-09-26 Ricoh Company, Ltd. Information storage system including a plurality of terminals
US20180253028A1 (en) 2010-06-11 2018-09-06 Yasufumi Takahashi Apparatus and method for preventing an information storage device from falling from a removable device
US10725398B2 (en) 2010-06-11 2020-07-28 Ricoh Company, Ltd. Developer container having a cap with three portions of different diameters
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD797709S1 (en) * 2016-01-20 2017-09-19 World Products, Inc. Curved folded medical monopole antenna
USD868013S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD868012S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD877706S1 (en) * 2017-01-18 2020-03-10 Kokusai Electric Corporation Cassette displacement prevention jig of semiconductor manufacturing apparatus
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers

Also Published As

Publication number Publication date
TWD147586S (en) 2012-06-11

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