TWD208179S - Part of wafer boat for substrate processing equipment - Google Patents
Part of wafer boat for substrate processing equipment Download PDFInfo
- Publication number
- TWD208179S TWD208179S TW108307123F TW108307123F TWD208179S TW D208179 S TWD208179 S TW D208179S TW 108307123 F TW108307123 F TW 108307123F TW 108307123 F TW108307123 F TW 108307123F TW D208179 S TWD208179 S TW D208179S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- wafer boat
- design
- processing device
- case
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 9
- 238000010586 diagram Methods 0.000 description 2
Images
Abstract
【物品用途】;本設計的物品是基板處理裝置用晶舟，為一種在基板處理裝置中，用以將複數基板以水平狀態保持在基板處理裝置的反應室內的晶舟。;【設計說明】;圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。[Use of article] The article of this design is a wafer boat for a substrate processing device. It is a wafer boat used in a substrate processing device to maintain a plurality of substrates in a horizontal state in the reaction chamber of the substrate processing device. ;[Design explanation];The dotted line part disclosed in the drawing is the part of the design that is not claimed in this case; the one-point chain line in the drawing is surrounded by the scope of the intended claim of this case, and the one-point chain line itself is not claimed in this case. Advocate for the design part.
Description
本設計的物品是基板處理裝置用晶舟，為一種在基板處理裝置中，用以將複數基板以水平狀態保持在基板處理裝置的反應室內的晶舟。The article of this design is a wafer boat for a substrate processing device, which is a wafer boat used in a substrate processing device to hold a plurality of substrates in a horizontal state in the reaction chamber of the substrate processing device.
圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。The dotted line exposed in the diagram is the part of the case that does not advocate design; the one-point chain line in the diagram defines the scope of the case, and the dotted line itself is the part of the case that does not advocate design.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-017637 | 2019-08-07 | ||
| JPD2019-17637F JP1658652S (en) | 2019-08-07 | 2019-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD208179S true TWD208179S (en) | 2020-11-11 |
Family
ID=70335647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108307123F TWD208179S (en) | 2019-08-07 | 2019-11-21 | Part of wafer boat for substrate processing equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD939459S1 (en) |
| JP (1) | JP1658652S (en) |
| TW (1) | TWD208179S (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD222579S (en) | 2021-10-15 | 2022-12-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD223130S (en) | 2021-10-15 | 2023-01-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD223131S (en) | 2021-10-15 | 2023-01-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD227572S (en) | 2021-10-15 | 2023-09-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD227746S (en) | 2021-10-15 | 2023-09-21 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD235000S (en) | 2023-12-19 | 2024-11-21 | 日商三菱電線工業股份有限公司 (日本) | Metal gasket |
| USD1054388S1 (en) | 2021-10-15 | 2024-12-17 | Shin-Etsu Chemical Co., Ltd. | Carrier substrate for handling |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102552458B1 (en) * | 2019-07-31 | 2023-07-06 | 가부시키가이샤 코쿠사이 엘렉트릭 | Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device |
| USD989012S1 (en) | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
| JP1700782S (en) * | 2021-04-14 | 2021-11-29 | Boat for substrate processing equipment | |
| USD1055006S1 (en) * | 2022-03-18 | 2024-12-24 | Applied Materials, Inc. | Support ring for an interlocking process kit for a substrate processing chamber |
| USD1042374S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
| USD1042373S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
| JP1731674S (en) * | 2022-05-30 | 2025-12-15 | Inner tubes for reaction tubes in semiconductor manufacturing equipment | |
| JP1731675S (en) * | 2022-05-30 | 2025-12-15 | Inner tubes for reaction tubes in semiconductor manufacturing equipment | |
| JP1731673S (en) * | 2022-05-30 | 2025-12-15 | Inner tubes for reaction tubes in semiconductor manufacturing equipment | |
| USD1064005S1 (en) * | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| USD1069863S1 (en) * | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD366868S (en) * | 1993-09-29 | 1996-02-06 | Tokyo Electron Kabushiki Kaisha | Wafer boat or rack |
| USD378823S (en) * | 1995-05-30 | 1997-04-15 | Tokyo Electron Limited | Wafer boat |
| USD378675S (en) * | 1995-05-30 | 1997-04-01 | Tokyo Electron Limited | Wafer boat |
| USD380454S (en) * | 1995-05-30 | 1997-07-01 | Tokyo Electron Limited | Wafer boat |
| JP3122364B2 (en) * | 1996-02-06 | 2001-01-09 | 東京エレクトロン株式会社 | Wafer boat |
| TW325588B (en) * | 1996-02-28 | 1998-01-21 | Asahi Glass Co Ltd | Vertical wafer boat |
| KR19990077350A (en) * | 1996-02-29 | 1999-10-25 | 히가시 데쓰로 | Heat treatment boat of semiconductor wafer |
| USD404015S (en) * | 1997-01-31 | 1999-01-12 | Tokyo Electron Ltd. | Wafer boat for use in a semiconductor wafer heat processing apparatus |
| USD411176S (en) * | 1997-08-20 | 1999-06-22 | Tokyo Electron Limited | Wafer boat for use in a semiconductor wafer heat processing apparatus |
| USD409158S (en) * | 1997-08-20 | 1999-05-04 | Tokyo Electron Limited | Wafer boat for use in a semiconductor wafer heat processing apparatus |
| USD404371S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Wafer boat for use in a semiconductor wafer heat processing apparatus |
| KR20000002833A (en) * | 1998-06-23 | 2000-01-15 | 윤종용 | Semiconductor wafer boat |
| US6287112B1 (en) * | 2000-03-30 | 2001-09-11 | Asm International, N.V. | Wafer boat |
| US6341935B1 (en) * | 2000-06-14 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer boat having improved wafer holding capability |
| KR100410982B1 (en) * | 2001-01-18 | 2003-12-18 | 삼성전자주식회사 | Boat for Semiconductor Manufacturing Apparatus |
| JP2002324830A (en) * | 2001-02-20 | 2002-11-08 | Mitsubishi Electric Corp | Substrate heat treatment holder, substrate heat treatment apparatus, semiconductor device manufacturing method, substrate heat treatment holder manufacturing method, and substrate heat treatment holder structure determination method |
| JP3377996B1 (en) * | 2001-12-27 | 2003-02-17 | 東京エレクトロン株式会社 | Heat treatment boat and vertical heat treatment equipment |
| JP4506125B2 (en) * | 2003-07-16 | 2010-07-21 | 信越半導体株式会社 | Vertical boat for heat treatment and manufacturing method thereof |
| US7033168B1 (en) * | 2005-01-24 | 2006-04-25 | Memc Electronic Materials, Inc. | Semiconductor wafer boat for a vertical furnace |
| KR101075512B1 (en) * | 2005-12-06 | 2011-10-21 | 후지쯔 세미컨덕터 가부시키가이샤 | Semiconductor wafer storage case and method of storing wafers |
| TWD119911S1 (en) * | 2006-05-01 | 2007-11-11 | 東京威力科創股份有限公司 | Wafer boat |
| TWD119910S1 (en) * | 2006-05-01 | 2007-11-11 | 東京威力科創股份有限公司 | Wafer boat |
| TWD130137S1 (en) * | 2006-10-25 | 2009-08-01 | 東京威力科創股份有限公司 | Crystal Boat |
| USD600221S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| USD600222S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| USD616396S1 (en) * | 2009-03-12 | 2010-05-25 | Tokyo Electron Limited | Pedestal of heat insulating cylinder for manufacturing semiconductor wafers |
| USD655255S1 (en) * | 2010-06-18 | 2012-03-06 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| USD655682S1 (en) * | 2010-06-18 | 2012-03-13 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| TWD166332S (en) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | Part of the wafer boat for substrate processing equipment |
| TWD163542S (en) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | Wafer boat for substrate processing equipment |
| TWD168827S (en) * | 2013-07-29 | 2015-07-01 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| TWD165429S (en) * | 2013-07-29 | 2015-01-11 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| TWD167988S (en) * | 2013-07-29 | 2015-05-21 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| JP1563649S (en) * | 2016-02-12 | 2016-11-21 | ||
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
-
2019
- 2019-08-07 JP JPD2019-17637F patent/JP1658652S/ja active Active
- 2019-11-21 TW TW108307123F patent/TWD208179S/en unknown
- 2019-12-10 US US29/716,458 patent/USD939459S1/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD222579S (en) | 2021-10-15 | 2022-12-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD223130S (en) | 2021-10-15 | 2023-01-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD223131S (en) | 2021-10-15 | 2023-01-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD227572S (en) | 2021-10-15 | 2023-09-11 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| TWD227746S (en) | 2021-10-15 | 2023-09-21 | 日商信越化學工業股份有限公司 | Career substrate for handling microstructure and thinned wafer |
| USD1054388S1 (en) | 2021-10-15 | 2024-12-17 | Shin-Etsu Chemical Co., Ltd. | Carrier substrate for handling |
| TWD235000S (en) | 2023-12-19 | 2024-11-21 | 日商三菱電線工業股份有限公司 (日本) | Metal gasket |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1658652S (en) | 2020-04-27 |
| USD939459S1 (en) | 2021-12-28 |
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