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JP1658652S - - Google Patents

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Publication number
JP1658652S
JP1658652S JPD2019-17637F JP2019017637F JP1658652S JP 1658652 S JP1658652 S JP 1658652S JP 2019017637 F JP2019017637 F JP 2019017637F JP 1658652 S JP1658652 S JP 1658652S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-17637F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-17637F priority Critical patent/JP1658652S/ja
Priority to TW108307123F priority patent/TWD208179S/en
Priority to US29/716,458 priority patent/USD939459S1/en
Application granted granted Critical
Publication of JP1658652S publication Critical patent/JP1658652S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-17637F 2019-08-07 2019-08-07 Active JP1658652S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-17637F JP1658652S (en) 2019-08-07 2019-08-07
TW108307123F TWD208179S (en) 2019-08-07 2019-11-21 Part of wafer boat for substrate processing equipment
US29/716,458 USD939459S1 (en) 2019-08-07 2019-12-10 Boat for wafer processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-17637F JP1658652S (en) 2019-08-07 2019-08-07

Publications (1)

Publication Number Publication Date
JP1658652S true JP1658652S (en) 2020-04-27

Family

ID=70335647

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-17637F Active JP1658652S (en) 2019-08-07 2019-08-07

Country Status (3)

Country Link
US (1) USD939459S1 (en)
JP (1) JP1658652S (en)
TW (1) TWD208179S (en)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
KR102552458B1 (en) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
USD989012S1 (en) 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
JP1700782S (en) * 2021-04-14 2021-11-29 Boat for substrate processing equipment
JP1724481S (en) 2021-10-15 2022-09-12 Carrier substrate for handling
JP1718541S (en) 2021-10-15 2022-06-29 Carrier board for handling
JP1724567S (en) 2021-10-15 2022-09-12 Carrier substrate for handling
JP1727916S (en) 2021-10-15 2022-10-21 Carrier substrate for handling
JP1718604S (en) 2021-10-15 2022-06-29 Carrier board for handling
USD1054388S1 (en) 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
JP1731674S (en) * 2022-05-30 2025-12-15 Inner tubes for reaction tubes in semiconductor manufacturing equipment
JP1731673S (en) * 2022-05-30 2025-12-15 Inner tubes for reaction tubes in semiconductor manufacturing equipment
JP1731675S (en) * 2022-05-30 2025-12-15 Inner tubes for reaction tubes in semiconductor manufacturing equipment
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
JP1768691S (en) 2023-12-19 2024-04-19 Metal Gasket

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USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
JP3122364B2 (en) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 Wafer boat
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
KR19990077350A (en) * 1996-02-29 1999-10-25 히가시 데쓰로 Heat treatment boat of semiconductor wafer
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
KR20000002833A (en) * 1998-06-23 2000-01-15 윤종용 Semiconductor wafer boat
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
KR100410982B1 (en) * 2001-01-18 2003-12-18 삼성전자주식회사 Boat for Semiconductor Manufacturing Apparatus
JP2002324830A (en) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp Substrate heat treatment holder, substrate heat treatment apparatus, semiconductor device manufacturing method, substrate heat treatment holder manufacturing method, and substrate heat treatment holder structure determination method
JP3377996B1 (en) * 2001-12-27 2003-02-17 東京エレクトロン株式会社 Heat treatment boat and vertical heat treatment equipment
JP4506125B2 (en) * 2003-07-16 2010-07-21 信越半導体株式会社 Vertical boat for heat treatment and manufacturing method thereof
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
CN101326623B (en) * 2005-12-06 2011-04-20 富士通微电子株式会社 Case and method for accepting semiconductor chip
TWD119910S1 (en) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 Wafer boat
TWD119911S1 (en) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 Wafer boat
TWD130137S1 (en) * 2006-10-25 2009-08-01 東京威力科創股份有限公司 Crystal Boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
TWD133942S1 (en) * 2008-03-28 2010-03-21 東京威力科創股份有限公司 Crystal Boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (en) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 Wafer boat for substrate processing equipment
TWD166332S (en) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 Part of the wafer boat for substrate processing equipment
TWD168827S (en) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD167988S (en) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD165429S (en) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
JP1563649S (en) * 2016-02-12 2016-11-21
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Also Published As

Publication number Publication date
USD939459S1 (en) 2021-12-28
TWD208179S (en) 2020-11-11

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