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USD380454S - Wafer boat - Google Patents

Wafer boat Download PDF

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Publication number
USD380454S
USD380454S US29/047,278 US4727895F USD380454S US D380454 S USD380454 S US D380454S US 4727895 F US4727895 F US 4727895F US D380454 S USD380454 S US D380454S
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US
United States
Prior art keywords
wafer boat
view
wafer
boat
cross sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/047,278
Inventor
Hiroyuki Iwai
Katsutoshi Ishii
Hitoshi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHII, KATSUTOSHI, IWAI. HIROYUKI, KATO, HITOSHI
Application granted granted Critical
Publication of USD380454S publication Critical patent/USD380454S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a first embodiment of a wafer boat showing our new design;
FIG. 2 is a rear view of the embodiment of FIG. 1;
FIG. 3 is a top view of the embodiment of FIG. 1;
FIG. 4 is a bottom view of the embodiment of FIG. 1;
FIG. 5 is a left side view of the embodiment of FIG. 1, the right side view being a mirror image and, therefore, not shown;
FIG. 6 is a cross sectional view of the embodiment of FIG. 1 on section line 6--6 in FIG. 1;
FIG. 7 is a cross sectional view of the embodiment of FIG. 1 on section line 7--7 in FIG. 3;
FIG. 8 is a front/top/right side perspective view of the embodiment of FIG. 1;
FIG. 9 is a front view of a second embodiment of a wafer boat showing our new design;
FIG. 10 is a rear view of the embodiment of FIG. 9;
FIG. 11 is a top view of the embodiment of FIG. 9;
FIG. 12 is a bottom view of the embodiment of FIG. 9;
FIG. 13 is a left side view of the embodiment of FIG. 9, the right side view being a mirror image and, therefore, not shown;
FIG. 14 is a cross sectional view of the embodiment of FIG. 9 on section line 14--14 in FIG. 9;
FIG. 15 is a cross sectional view of the embodiment of FIG. 9 on section line 15--15 in FIG. 11; and,
FIG. 16 is a front/top/right side perspective view of the embodiment of FIG. 9.

Claims (1)

  1. The ornamental design for wafer boat, as shown and described.
US29/047,278 1995-05-30 1995-11-30 Wafer boat Expired - Lifetime USD380454S (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7-15171 1995-05-30
JP1517195 1995-05-30
JP1517395 1995-05-30
JP7-15173 1995-05-30

Publications (1)

Publication Number Publication Date
USD380454S true USD380454S (en) 1997-07-01

Family

ID=71525074

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/047,278 Expired - Lifetime USD380454S (en) 1995-05-30 1995-11-30 Wafer boat

Country Status (1)

Country Link
US (1) USD380454S (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404019S (en) 1997-05-15 1999-01-12 Microtome Precision, Inc. Reticle holder
USD424527S (en) 1997-01-31 2000-05-09 Tokyo Elctron Limited Quartz fin heat retaining tube
USD425871S (en) * 1997-01-31 2000-05-30 Tokyo Electron Limited Quartz fin heat retaining tube
USD426521S (en) * 1997-01-31 2000-06-13 Tokyo Electron Limited Quartz fin heat retaining tube
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
USD429224S (en) * 1997-01-31 2000-08-08 Tokyo Electron Limited Quartz fin heat retaining tube
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD769201S1 (en) * 2014-11-20 2016-10-18 Tokyo Electron Limited Wafer boat
USD772183S1 (en) * 2014-11-20 2016-11-22 Tokyo Electron Limited Wafer boat
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
USD791721S1 (en) * 2014-11-20 2017-07-11 Tokyo Electron Limited Wafer boat
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5482559A (en) * 1993-10-21 1996-01-09 Tokyo Electron Kabushiki Kaisha Heat treatment boat
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
US5510146A (en) * 1991-07-16 1996-04-23 Seiko Epson Corporation CVD apparatus, method of forming semiconductor film, and method of fabricating thin-film semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510146A (en) * 1991-07-16 1996-04-23 Seiko Epson Corporation CVD apparatus, method of forming semiconductor film, and method of fabricating thin-film semiconductor device
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
US5482559A (en) * 1993-10-21 1996-01-09 Tokyo Electron Kabushiki Kaisha Heat treatment boat

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD424527S (en) 1997-01-31 2000-05-09 Tokyo Elctron Limited Quartz fin heat retaining tube
USD425871S (en) * 1997-01-31 2000-05-30 Tokyo Electron Limited Quartz fin heat retaining tube
USD426521S (en) * 1997-01-31 2000-06-13 Tokyo Electron Limited Quartz fin heat retaining tube
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
USD429224S (en) * 1997-01-31 2000-08-08 Tokyo Electron Limited Quartz fin heat retaining tube
USD404019S (en) 1997-05-15 1999-01-12 Microtome Precision, Inc. Reticle holder
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD791721S1 (en) * 2014-11-20 2017-07-11 Tokyo Electron Limited Wafer boat
USD772183S1 (en) * 2014-11-20 2016-11-22 Tokyo Electron Limited Wafer boat
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
USD769201S1 (en) * 2014-11-20 2016-10-18 Tokyo Electron Limited Wafer boat
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus

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