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JP1731675S - Inner tubes for reaction tubes in semiconductor manufacturing equipment - Google Patents

Inner tubes for reaction tubes in semiconductor manufacturing equipment

Info

Publication number
JP1731675S
JP1731675S JP2022011411F JP2022011411F JP1731675S JP 1731675 S JP1731675 S JP 1731675S JP 2022011411 F JP2022011411 F JP 2022011411F JP 2022011411 F JP2022011411 F JP 2022011411F JP 1731675 S JP1731675 S JP 1731675S
Authority
JP
Japan
Prior art keywords
tubes
semiconductor manufacturing
manufacturing equipment
reaction
reaction tubes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022011411F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2022011411F priority Critical patent/JP1731675S/en
Priority to TW111305741F priority patent/TWD230208S/en
Priority to US29/861,194 priority patent/USD1019583S1/en
Application granted granted Critical
Publication of JP1731675S publication Critical patent/JP1731675S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本願物品は、半導体製造装置において用いられる反応管の内側に装着して使用されるインナー管である。The article of the present invention is an inner tube that is attached to the inside of a reaction tube used in semiconductor manufacturing equipment.

JP2022011411F 2022-05-30 2022-05-30 Inner tubes for reaction tubes in semiconductor manufacturing equipment Active JP1731675S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022011411F JP1731675S (en) 2022-05-30 2022-05-30 Inner tubes for reaction tubes in semiconductor manufacturing equipment
TW111305741F TWD230208S (en) 2022-05-30 2022-11-18 Part of the inner tube of a reaction tube for semiconductor manufacturing equipment
US29/861,194 USD1019583S1 (en) 2022-05-30 2022-11-28 Inner tube of reaction tube for semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022011411F JP1731675S (en) 2022-05-30 2022-05-30 Inner tubes for reaction tubes in semiconductor manufacturing equipment

Publications (1)

Publication Number Publication Date
JP1731675S true JP1731675S (en) 2025-12-15

Family

ID=84322292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022011411F Active JP1731675S (en) 2022-05-30 2022-05-30 Inner tubes for reaction tubes in semiconductor manufacturing equipment

Country Status (3)

Country Link
US (1) USD1019583S1 (en)
JP (1) JP1731675S (en)
TW (1) TWD230208S (en)

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD552047S1 (en) * 2005-02-28 2007-10-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
TWD124997S1 (en) * 2006-09-12 2008-09-21 東京威力科創股份有限公司 Semiconductor Process Tubes
JP4331768B2 (en) * 2007-02-28 2009-09-16 東京エレクトロン株式会社 Heat treatment furnace and vertical heat treatment equipment
US8023806B2 (en) * 2007-03-20 2011-09-20 Tokyo Electron Limited Heat processing furnace and vertical-type heat processing apparatus
TWD127410S1 (en) * 2007-04-20 2009-02-11 東京威力科創股份有限公司 Process tubes for semiconductor manufacturing
TWD125601S (en) * 2007-05-08 2008-10-21 東京威力科創股份有限公司 Processing tubes for semiconductor manufacturing
TWD143034S1 (en) * 2008-03-28 2011-10-01 東京威力科創股份有限公司 Processing tubes for semiconductor manufacturing
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
US8398773B2 (en) * 2011-01-21 2013-03-19 Asm International N.V. Thermal processing furnace and liner for the same
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
TWD166332S (en) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 Part of the wafer boat for substrate processing equipment
TWD168774S (en) * 2013-06-28 2015-07-01 日立國際電氣股份有限公司 part of reaction tube
TWD167985S (en) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 part of reaction tube
TWD167987S (en) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 part of reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
TWD167986S (en) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 part of reaction tube
TWD168827S (en) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD167988S (en) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
JP1535455S (en) * 2015-02-25 2015-10-19
JP1546512S (en) * 2015-09-04 2016-03-22
JP1546345S (en) * 2015-09-04 2016-03-22
JP1563649S (en) * 2016-02-12 2016-11-21
JP1563524S (en) 2016-03-30 2016-11-21
JP1605460S (en) * 2017-08-09 2021-05-31
JP1605461S (en) * 2017-08-10 2021-05-31
JP1605462S (en) * 2017-08-10 2021-05-31
JP1605982S (en) * 2017-12-27 2021-05-31
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
JP6856576B2 (en) * 2018-05-25 2021-04-07 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Substrate processing equipment, semiconductor equipment manufacturing methods and programs
JP1638282S (en) * 2018-09-20 2019-08-05
JP1640260S (en) * 2018-11-19 2019-09-02
JP1644260S (en) 2019-03-20 2019-10-28
JP1658652S (en) * 2019-08-07 2020-04-27
JP1665228S (en) * 2019-11-28 2020-08-03
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
JP1678273S (en) * 2020-03-10 2021-02-01 reaction tube
JP1678278S (en) * 2020-03-19 2021-02-01 Boat for substrate processing equipment
JP1682719S (en) 2020-06-15 2021-04-05
WO2022064713A1 (en) * 2020-09-28 2022-03-31 株式会社Kokusai Electric Temperature control method, semiconductor device manufacturing method, program, and substrate processing device
JP1700777S (en) * 2021-03-15 2021-11-29 Boat for substrate processing equipment

Also Published As

Publication number Publication date
TWD230208S (en) 2024-03-01
USD1019583S1 (en) 2024-03-26

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