TW202136801A - Holding unit for electronic components, holding device and operation equipment using the same - Google Patents

Abstract

The present invention provides a holding unit which includes a base, a jig, a temperature controller, and a heat insulating member. The jig has a through hole for transfer of the electronic component. As the jig is disposed on the base, the surface of the base is divided into a holding area and a non-holding area by the through hole of the jig. The electronic components are able to be placed on the holding area, and the heat insulating member is disposed on the non-holding area. The heat insulating member prevents loss of temperature from the non-holding area when the temperature controller heats or cools the electronic components on the holding area.

Description

Electronic component bearing unit and its supporting device and operating equipment

The invention relates to an electronic component bearing unit and its application bearing device and working equipment.

Nowadays, electronic component operation equipment is used to hold a plurality of electronic components with a holding unit. The holding unit can be a pre-warming plate or a stage, etc., to perform preset operations (such as pre-warming operation or pre-warming and loading) on electronic components. Sending operation); Take pre-warming operation as an example, electronic components may be in a low temperature or high temperature environment during actual use. In order to ensure the quality of electronic components, the industry must perform thermal testing operations on the electronic components with a testing device after the production is completed. Or cold test operations to eliminate defective products, but to reduce the heating or cooling time of the test device, the industry uses a pre-warming plate with a temperature control or a stage with a temperature control to pre-heat or pre-cool the electronic components to make the electronic components The temperature is raised or lowered to a preset test temperature first, and then the electronic components are transferred to the test device to perform the test operation.

Please refer to FIG. 1, the holding unit 10 includes a preheating plate 11 and a temperature control that can be a heating element 12 , The preheating plate 11 is provided with a plurality of recessed receiving parts 111 for holding the electronic components 13, and the heating element 12 is assembled under the preheating plate 11 for heating the preheating plate 11, so that the preheating plate 11 is heated. The plurality of electronic components 13 in the hot plate 11 are heated to the preset test temperature; however, the high temperature of the preheat plate 11 is not only conducted upwards to the supporting portion 111 and the electronic components 13 are heated, but also transmitted upwards to the two supporting portions 111 The partition wall 112 in between causes the partition wall 112 to exchange heat with the surrounding air outside the preheating plate 11 and loses high temperature, so that it is impossible to ensure that the electronic component 13 is maintained at a predetermined high temperature. In addition, if the industry wants to keep the electronic component 13 at a preset temperature, it is necessary to increase the heating power of the heating element 12, which not only consumes more heating energy, but also increases the preheating operation time.

The first objective of the present invention is to provide an electronic component holding unit, including a base, a fixture, a thermostat and a temperature isolator. The fixture is provided with an opening for moving in or out of the electronic component, and is mounted on the fixture assembly base At this time, the opening of the fixture on the surface of the base divides a bearing area for holding electronic components, and makes other parts of the base surface a non-bearing area. When the controller heats up or cools the electronic components on the supporting area of the pedestal, it uses a temperature isolator to prevent the temperature from being lost from the non-supported area of the pedestal, so as to ensure that the electronic components maintain the pre-heated temperature.

The second objective of the present invention is to provide an electronic component supporting unit, the non-receiving area of the base surface is equipped with a temperature insulating member to prevent temperature loss, without increasing the heating or cooling power, which not only effectively saves energy, but also Reduce the temperature control operation time.

The third object of the present invention is to provide an electronic component holding unit whose base can be replaced with different jigs, and different jigs have openings of different sizes, so that openings of different sizes can be divided into different sizes on the surface of the base. It is convenient to hold electronic components of different sizes. The operator only needs to replace the fixture, without replacing the base, which achieves the practical benefit of cost saving.

The fourth object of the present invention is to provide a bearing device, including a bearing unit and a driving unit. The bearing unit is provided with a base, a fixture, a temperature controller, and a temperature isolator for holding and temperature control electronic components, and the driving unit It is used for driving the bearing unit to move in at least one direction, so as to improve the carrying efficiency.

The fifth object of the present invention is to provide a working equipment, including a machine, a feeding device, a receiving device, a working device, a supporting unit, a conveying device, and a central control device. The feeding device is assembled on the machine and equipped with At least one feeder for holding the electronic components to be operated; the receiving device is installed on the machine, and at least one receiving device is provided for holding the electronic components that have been operated; the operating device is installed on the machine The platform is equipped with at least one operating device for performing preset operations on the electronic components; the bearing unit is assembled on the machine platform and includes a base, a fixture, a thermostat, and a temperature isolator for holding and Temperature control electronic components; the conveying device is arranged on the machine table, and is equipped with at least one moving device for transferring electronic components; the central control device is used to control and integrate the actions of various devices to perform automated operations to achieve improvement Practical benefits of test performance.

In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given with the accompanying drawings. The details are as follows:

Please refer to FIGS. 2 and 3, the electronic component holding unit 20 of the present invention includes a base 21, a fixture 22, a temperature controller 23, and a temperature insulating member 24 for holding and temperature controlling electronic components (not shown).

The base 21 is a plate, the surface of which is used to hold electronic components, and the bottom surface is the receiving surface 211. The base 21 can be made of a material with good conductivity; and the base 21 can be provided with a plurality of exhaust holes according to operation requirements (Not shown in the figure) for the positioning of the adsorption temperature insulating member 24.

The jig 22 is provided with at least one opening 221 for moving in or out of electronic components. When the jig 22 is assembled with the base 21, the opening 221 of the jig 22 defines a receiving area on the surface of the base 21 for holding For electronic components, other parts on the surface of the base 21 are non-receiving areas; further, the inner surface of the opening 221 of the fixture 22 can be a flat surface, an inclined surface, or include an inclined surface and a flat surface, for guiding electronic components or guiding Lead and limit electronic components; in this embodiment, the fixture 22 is provided with a plurality of openings 221, the first end 2211 of the opening 221 communicates with the second end 2212, and the width of the first end 2211 is the same or slightly larger than the electronic component The inner surface of the opening 221 is provided with a flat surface 2213 near the first end 2211 to limit electronic components, and the inner surface of the opening 221 is provided with an inclined surface 2214 near the second end 2211 to guide The electronic component is moved into the opening 221.

In addition, the jig 22 is provided with a bonding surface 222 on the periphery of the opening 221 and located on the bottom surface of the jig 22, and is attached and assembled on the surface of the base 21 by the bonding surface 222. The jig 22 can be assembled in a fixed or separate manner. On the base, the fixable or detachable assembly method is locking, cementing, embedding or crimping assembly, etc., and is not limited to this embodiment; in this embodiment, the fixture 22 is The fixing method is assembled on the base 21, so that the bonding surface 222 of the fixture 22 is attached to the surface of the base 21, and the first end 2211 of the opening 221 is used to divide the supporting area 212 on the surface of the base 21. Other parts on the surface of the base 21 are non-holding areas 213 for holding electronic components.

The thermostat 23 is arranged under the base 21 to control the electronic components to a preset temperature. The thermostat 23 includes a base 231 and a temperature control. The temperature control is a heating element, a cooling chip or a fluid The runner , And arranged on the base 231 for heating or cooling electronic components. In this embodiment, the thermostat 23 includes a base 231 and a heating element 232. The surface of the base 231 is used for mounting the receiving surface 211 of the joint base 21 , The heating element 232 is assembled on the base 231 to heat up the electronic components on the receiving area 212 of the base 21.

The temperature insulating member 24 is arranged in the non-bearing area 213 of the base 21 to prevent temperature loss; the temperature insulating member 24 can be designed in a film or block shape according to the operation requirements; and the temperature insulating member 24 can be a fixed type or a separate type Assembled in the non-receiving area 213 of the base 21 or the bonding surface 222 of the fixture 22, when the base 21 and the fixture 22 are assembled with each other, the temperature insulating member 24 can be located on the non-supporting area of the base 21 Area 213 is not limited to this embodiment ；Fixable or separable assembly methods are bonding, adsorption, or locking; for example, when the holding unit 20 holds a single-size electronic component, the temperature insulating member 24 can be fixed to the base 21 Non-receiving area 213; for example, when the supporting unit 20 holds electronic components of different sizes, the temperature insulating member 24 can be adsorbed or locked to the non-receiving area 213 of the base 21 so as to correspond to the supporting area 212 of the base 21 The size of the non-receiving area 213 is adjusted; for example, the temperature insulating member 24 can be adhered to the bonding surface 222 of the fixture 22. When the base 21 and the fixture 22 are assembled to each other, the temperature insulating member 24 can be attached They are arranged in the non-receiving area 213 of the base 21; in this embodiment, the temperature insulating member 24 is a heat insulating film, and is attached to the non-receiving area 213 of the base 21, and is attached to the fixture 22 The bonding surface 222.

Please refer to Figures 3 and 4, a shifter (not shown) moves the electronic component 30 into the opening 221 of the jig 22. The opening 221 is guided by the inclined surface 2214 to move the electronic component 30 into it, and the flat surface 2213 limits the electronic component 30. For the component 30, since the first end 2211 of the opening 221 divides the supporting area 212 on the surface of the base 21, the electronic component 30 in the opening 221 can be located on the supporting area 212 of the base 21, and the thermostat 23 is activated The heating element 232 in the base body 231, since the base 21 is assembled on the base body 231, the heating element 232 is attached to the base 21 through the base body 231 to heat up the base 21. When the high temperature in the base 21 When conducting upwards, since the receiving area 212 of the base 21 is not equipped with the temperature insulating member 24, the high temperature of the base 21 can be transmitted to the electronic component 30 on the receiving area 212, and the electronic component 30 is heated to the preset test temperature .

However, since the bearing area 212 of the base 21 and the non-bearing area 213 are on the same plane, and the non-bearing area 213 on the peripheral side of each bearing area 212 is covered with a temperature insulating member 24, when the base 21 is hot When it is transmitted upward to the non-bearing area 213, the temperature insulating member 24 on the non-bearing area 213 can be used to block the high temperature from being transmitted to the corresponding part of the fixture 22. In other words, the high temperature of the base 21 will not be transmitted to The partition wall 223 between the opening 221 of the jig 22 and the opening 221 can prevent the high temperature from being lost through the partition wall 223 of the jig 22 to effectively ensure that the electronic component 30 is heated to the preset temperature without increasing the heating element 232 The heating power may increase the heating operation time. Even better, since the high temperature of the base 21 will not be lost through the fixture 22, there is no need to paste the temperature insulating member 24 on the surface of the fixture 22 to save costs and reduce Time sequence of insulation operation.

Please refer to FIG. 5, which is the second embodiment of the supporting unit 20 of the present invention. The design of the same as that of the first embodiment will not be repeated here. Only the differences between the second embodiment and the first embodiment are described. When the unit 20 holds a larger-sized electronic component 30A, the original jig can be disassembled on the base 21, and the non-receiving area 213 and the temperature insulating part of the base 21 can be changed according to the larger-sized electronic component 30A 24 size range For example, cutting or migrating the size or position of the temperature-insulating element 24 can reduce the non-receiving area 213 of the base 21, and increase the supporting area 212 of the base 21 to accommodate larger-sized electronic components 30A. The base 21 can be equipped with a new fixture 22A with a larger opening 221A. The opening 221A of the fixture 22A is used to move in and limit the electronic component 30A of the larger size, so that the electronic component 30A is placed on the support of the base 21 In area 212, when the heating element 232 of the thermostat 23 heats up the base 21, the electronic component 30A on the supporting area 212 of the base 21 can be heated to a preset temperature, and the base 21 can still be used. The temperature insulation member 24 on the non-bearing area 213 prevents high temperature loss.

Furthermore, the temperature insulating member 24 can also be assembled on the bonding surface of the new jig 22A. When the base 21 and the jig 22A are assembled with each other, the temperature insulating member 24 can still be attached to the non-supporting surface of the base 21.置区213。 Set the area 213.

Referring to FIG. 6, the carrying unit 20 of the present invention is applied to the carrying device 4. The carrying device 4 includes a carrying unit 20 and a driving unit 40. The carrying unit 20 is provided with a base 21, a fixture 22, a thermostat 23 and a temperature insulation The component 24 is provided for holding and temperature control electronic components. The driving unit 40 is provided with at least one driving source for driving the supporting unit 20 to move in at least one direction. The driving source can be a robotic arm, a linear conveyor or a rotating shaft, etc., Without being limited to this embodiment, in this embodiment, the driving source is a linear conveyor 41 to carry the supporting unit 20 for linear displacement to a preset operating position, and the supporting unit 20 is aligned during the carrying process. The electronic component 30 performs a preheating or pre-cooling operation to reduce the operation time and thereby improve the production efficiency.

Please refer to Figures 2, 3, and 7, an electronic component operation equipment includes a machine 5, a feeding device 6, a receiving device 7, a working device 8, a supporting unit 20, a conveying device 9 and a central control device (not shown in the figure) ); The feeding device 6 is assembled on the machine 5, and is provided with at least one feeder 61 for holding electronic components to be operated; the receiving device 7 is assembled on the machine 5, and is provided with at least one receiving The feeder 71 is used to hold the electronic components that have been operated; the working device 8 is assembled on the machine 5 and is provided with at least one working device for performing preset operations on the electronic components. In this embodiment, the working device It is a tester, which includes an electrically connected circuit board 81 and a test base 82 to perform test operations on electronic components; the supporting unit 20 is assembled on the machine 5, and includes a base 21, a fixture 22, and a thermostat 23 and the temperature insulation member 24 for holding and temperature control electronic components; the conveying device 9 is arranged on the machine table 5, and is provided with at least one material shifter for transferring at least one electronic component. In this embodiment , The first shifter 91 of the conveying device 9 takes out the electronic components to be operated from the feeder 61 of the feeding device 6 , And transferred to the holding unit 20, the holding unit 20 holds and pre-heats the electronic components to be operated, the first shifter 91 then takes out the pre-heated electronic components to be operated from the holding unit 20 and transfers them to The feeding stage 92 of the conveying device 9, the feeding stage 92 carries the pre-warmed electronic components to be operated to the side of the working device 8, and the second shifter 93 of the conveying device 9 is on the feeding stage 92 Take out the electronic components to be operated and transfer them to the test base 82 to perform the test operation, and transfer the operated electronic components of the test base 82 to the discharge stage 94 of the conveying device 9, and the discharge stage 94 has been loaded Operating electronic components, the third shifter 95 of the conveying device 9 takes out the operated electronic components from the discharge stage 94, and according to the test results, transports the operated electronic components to the receiver 71 of the receiving device 7 It is classified and placed; the central control device is used to control and integrate the actions of various devices to perform automated operations and achieve practical benefits of improving operational performance.

[Learning] 10: Bearing unit 11: Preheating plate 111: Housing Department 112: Barrier 12: Heating parts 13: Electronic components [this invention] 20: bearing unit 21: Pedestal 211: Acceptance 212: bearing area 213: non-holding area 22, 22A: Fixture 221, 221A: opening 2211: first end 2212: second end 2213: straight face 2214: inclined plane 222: Fitting surface 223: The Wall 23: Thermostat 231: Block 232: heating element 24: Temperature insulation 30, 30A: electronic components 4: Carrying device 40: drive unit 41: Linear conveyor 5: Machine 6: Feeding device 61: feeder 7: Receiving device 71: Receiver 8: Operating device 81: circuit board 82: Test Block 9: Conveying device 91: The first shifter 92: Feeding platform 93: Second shifter 94: discharge stage 95: Third shifter

Figure 1: Schematic diagram of the use of conventional housing units. Figure 2: An exploded schematic view of the first embodiment of the holding unit of the present invention. Figure 3: The assembly diagram of the first embodiment of the holding unit of the present invention. Figure 4: A schematic diagram of the use of the first embodiment of the holding unit of the present invention. Figure 5: A schematic diagram of the second embodiment of the holding unit of the present invention. Figure 6: Schematic diagram of the carrying device of the present invention. Figure 7: Schematic diagram of the working equipment of the present invention.

21: Pedestal

212: bearing area

213: non-holding area

22: Fixture

221: open

2213: straight face

2214: inclined plane

223: The Wall

23: Thermostat

231: Block

232: heating element

24: Temperature insulation

30: Electronic components

Claims (10)

An electronic component bearing unit, including: Base Fixture: at least one opening is provided for moving in or out of electronic components, when the fixture is assembled with the base , The opening of the jig divides a holding area on the surface of the base for holding electronic components, And make other parts of the surface of the base non-bearing area; Thermostat: It is set under the base to control the electronic components to a preset temperature; Temperature insulation: is located in the non-bearing area of the base. The electronic component bearing unit according to claim 1, wherein the bearing area and the non-bearing area of the base are located on the same plane. The electronic component bearing unit according to claim 1, wherein the jig can be fixedly or separately assembled on the base. The electronic component bearing unit according to claim 1, wherein the temperature insulating member is in the shape of a film or a block. The electronic component bearing unit according to claim 1, wherein the temperature insulating member can be fixedly or separately assembled on the non-bearing area of the base or the bonding surface of the jig. The electronic component bearing unit according to any one of claims 1 to 5, wherein the fixture is The inner surface of the opening is a flat surface, an inclined surface, or includes the inclined surface and the flat surface. The electronic component receiving unit according to any one of claims 1 to 5, wherein the first end of the opening of the fixture communicates with the second end, and the width dimension of the first end is the same or slightly larger than that of the electronic component The width dimension. The electronic component receiving unit according to any one of claims 1 to 5, wherein the temperature controller includes a base body and a temperature control, and the temperature control is a heating element, a cooling chip or a fluid flow Road, and configured in the base. A bearing device, including: At least one electronic component holding unit as described in claim 1; Drive unit: At least one drive source is provided for driving the supporting unit to move in at least one direction. A kind of work equipment, including: Machine; Feeding device: It is assembled on the machine and is equipped with at least one feeder for holding electronic components to be operated Pieces Receiving device: It is assembled on the machine and is equipped with at least one receptacle to hold the electronic components that have been operated. Pieces Operating device: It is assembled on the machine and is equipped with at least one operating device for performing presets on electronic components Operation; At least one electronic component holding unit as described in claim 1; Conveying device: It is arranged on the machine and is equipped with at least one material shifter for transferring electronic components; Central control device: It is used to control and integrate the actions of various devices and units to perform automated operations.

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