TWI888092B - Electronic module, pressing mechanism, testing device, and processing machine - Google Patents
Electronic module, pressing mechanism, testing device, and processing machine Download PDFInfo
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Description
本發明提供一種可溫控及延長第一、二電子元件使用壽命之電子模組。The present invention provides an electronic module capable of controlling temperature and extending the service life of first and second electronic components.
在現今,電子元件依使用需求而具有不同設計型態,例如堆疊式封裝電子元件或者祼晶型式電子元件等,為確保電子元件之品質,業者以測試裝置對電子元件進行測試作業,測試裝置以測試座承置電子元件,並於測試座之上方設置一壓接治具,壓接治具下壓電子元件,使電子元件於測試座執行電性測試作業;惟,由於電子元件日後會應用於低溫環境或高溫環境,測試裝置並無法測試電子元件於低溫環境或高溫環境之使用良率,以致無法確保出廠品質。再者,當電子元件實際應用於電子設備時,由於電子元件運轉時會產生高熱,在本身並無散熱設計加以持續散熱的情況下,電子元件易於損壞。Nowadays, electronic components have different design types according to usage requirements, such as stacked packaged electronic components or bare-chip electronic components. To ensure the quality of electronic components, the industry uses test equipment to test the electronic components. The test equipment uses a test socket to hold the electronic components, and a crimping fixture is set above the test socket. The crimping fixture presses down the electronic components to perform electrical testing on the test socket. However, since electronic components will be used in low-temperature environments or high-temperature environments in the future, the test equipment cannot test the yield of electronic components in low-temperature environments or high-temperature environments, so the factory quality cannot be ensured. Furthermore, when electronic components are actually used in electronic equipment, since they generate high heat during operation, if there is no heat dissipation design to continuously dissipate the heat, the electronic components are easily damaged.
本發明之目的一,提供一種電子模組,包含至少一第一電子元件 、至少一第二電子元件及溫控單元,第一電子元件設有接點,並電性連接第二電子元件,溫控單元以複數個面板於第二電子元件之至少一方圍構至少一溫控空間,並於至少一面板設有相通溫控空間之通口,以供輸送流體,令流體與第二電子元件作熱交換,以溫控第二電子元件保持預設溫度,進而提高電子模組之使用效能及延長第一、二電子元件之使用壽命。 The first object of the present invention is to provide an electronic module, comprising at least one first electronic component , at least one second electronic component and a temperature control unit, wherein the first electronic component is provided with a contact and is electrically connected to the second electronic component, and the temperature control unit uses a plurality of panels to surround at least one temperature control space on at least one side of the second electronic component, and at least one panel is provided with a through hole connected to the temperature control space for conveying fluid, so that the fluid and the second electronic component perform heat exchange, so as to temperature control the second electronic component to maintain a preset temperature, thereby improving the performance of the electronic module and extending the service life of the first and second electronic components.
本發明之目的二,提供一種電子模組,其溫控單元之複數個面板於第二電子元件周側所圍構之溫控空間可涵蓋第一電子元件,以同時溫控第一電子元件及第二電子元件,進而提高使用效能。The second object of the present invention is to provide an electronic module, wherein the temperature control space surrounded by the plurality of panels of the temperature control unit around the second electronic component can cover the first electronic component, so as to simultaneously control the temperature of the first electronic component and the second electronic component, thereby improving the use efficiency.
本發明之目的三,提供一種電子模組,其溫控單元之溫控空間設有至少一分隔板,以界定第一溫控區及第二溫控區,分隔板貼合第二電子元件 ,令第一溫控區位於第二電子元件之上方,並供輸入/輸出流體,第二溫控區以供容置第二電子元件,且位於第一電子元件之上方;藉以可使液態之流體於第一溫控區獨立流動,進而提高使用之廣泛性。 The third object of the present invention is to provide an electronic module, wherein the temperature control space of the temperature control unit is provided with at least one partition plate to define a first temperature control zone and a second temperature control zone, and the partition plate is attached to the second electronic component, so that the first temperature control zone is located above the second electronic component and is used for inputting/outputting fluid, and the second temperature control zone is used for accommodating the second electronic component and is located above the first electronic component; thereby, liquid fluid can flow independently in the first temperature control zone, thereby improving the wide range of use.
本發明之目的四,提供一種電子模組,其溫控單元於第二溫控區設有至少一導熱件,更佳者,於分隔板與第二電子元件之貼合處設有導熱件,進而利用導熱件提高流體與第二電子元件(甚至與第一電子元件)之熱交換效能。The fourth object of the present invention is to provide an electronic module, wherein the temperature control unit is provided with at least one heat conductive element in the second temperature control zone, and more preferably, a heat conductive element is provided at the joint between the partition plate and the second electronic element, thereby utilizing the heat conductive element to improve the heat exchange efficiency between the fluid and the second electronic element (or even the first electronic element).
本發明之目的五,提供一種電子模組,更包含輸送單元,輸送單元設置至少一輸送管及至少一輸送驅動器,輸送驅動器能夠自動化帶動輸送管位移而連通或分離溫控單元之至少一通口,以供輸送或停送流體,進而提高使用便利性。The fifth object of the present invention is to provide an electronic module, further comprising a transport unit, wherein the transport unit is provided with at least one transport pipe and at least one transport driver, and the transport driver can automatically drive the transport pipe to move and connect or separate at least one port of the temperature control unit to transport or stop the fluid, thereby improving the convenience of use.
本發明之目的六,提供一種壓接機構,包含本發明電子模組、輸送單元及壓接單元,電子模組設置電性連接之第一電子元件及第二電子元件,並以溫控單元於第二電子元件之至少一方圍構溫控空間,且設有相通溫控空間之通口;輸送單元設置輸送管及輸送驅動器,輸送管能夠由輸送驅動器驅動位移而連通或分離電子模組之通口,以供輸送或停送流體;壓接單元設置移動臂及壓接件,移動臂能夠帶動壓接件作至少一方向位移,壓接件以供壓接電子模組;藉以壓接單元壓接電子元件,輸送單元可自動化控制啟閉流體,以利溫控電子模組,進而提高壓接機構之使用效能。The sixth object of the present invention is to provide a crimping mechanism, comprising the electronic module of the present invention, a transport unit and a crimping unit, wherein the electronic module is provided with a first electronic component and a second electronic component which are electrically connected, and a temperature control unit is used to surround a temperature control space on at least one side of the second electronic component, and a through hole is provided to communicate with the temperature control space; the transport unit is provided with a transport pipe and a transport driver, and the transport pipe can be driven by the transport driver The actuator drives the displacement to connect or separate the opening of the electronic module to transport or stop the fluid; the crimping unit is provided with a moving arm and a crimping piece, the moving arm can drive the crimping piece to move in at least one direction, and the crimping piece is used to crimp the electronic module; the crimping unit is used to crimp the electronic component, and the transport unit can automatically control the opening and closing of the fluid to facilitate the temperature control of the electronic module, thereby improving the use efficiency of the crimping mechanism.
本發明之目的七,提供一種測試裝置,包含測試機構及本發明壓接機構,壓接機構包含電子模組、輸送單元及壓接單元,以供壓接及溫控電子模組,測試機構設有至少一測試器,以供承置及測試電子模組;藉以提高測試裝置之使用效能。The seventh object of the present invention is to provide a testing device, including a testing mechanism and the crimping mechanism of the present invention. The crimping mechanism includes an electronic module, a conveying unit and a crimping unit for crimping and temperature controlling the electronic module. The testing mechanism is provided with at least one tester for accommodating and testing the electronic module, thereby improving the performance of the testing device.
本發明之目的八,提供一種作業機,包含機台、供料裝置、收料裝置、本發明測試裝置、移載裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待測之電子模組;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已測之電子模組;本發明測試裝置配置於機台,包含測試機構及壓接機構,以供測試電子模組;移載裝置配置於機台 ,並設有至少一移載器,以供移載電子模組;中央控制裝置以供控制及整合各裝置作動而執行自動化作業。 The eighth object of the present invention is to provide a work machine, including a machine, a feeding device, a receiving device, a testing device of the present invention, a transfer device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic module to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one tested electronic module; the testing device of the present invention is arranged on the machine and includes a testing mechanism and a crimping mechanism for testing electronic modules; the transfer device is arranged on the machine and is provided with at least one transfer device for transferring electronic modules; the central control device is used to control and integrate the actions of each device to perform automated operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:
請參閱圖1,本發明電子模組10之第一實施例,包含至少一第一電子元件11、至少一第二電子元件12及溫控單元。Please refer to FIG. 1 , which shows a first embodiment of an
至少一第一電子元件11設有至少一接點。依作業需求,第一電子元件11可為已封裝之電子元件或者為未封裝之電路板,不受限於本實施例。於本實施例,第一電子元件11為未封裝之電路板,其底面設有複數個接點111,並以頂面作為承接面112。At least one first
至少一第二電子元件12電性連接第一電子元件11。依作業需求,第二電子元件12可為已封裝之電子元件或者為晶片,不受限於本實施例。於本實施例,複數個第二電子元件12為晶片,且電性連接第一電子元件11之承接面112。At least one second
溫控單元以複數個面板於第二電子元件12之至少一方圍構至少一溫控空間,並於至少一面板設有至少一相通溫控空間之通口,以供輸送流體,使溫控單元能夠溫控第二電子元件12。The temperature control unit uses a plurality of panels to surround at least one temperature control space on at least one side of the second
依作業需求,複數個面板可為一體成型或者為複數個獨立板件。面板可為鐵或銅材製作。流體可為液體或氣體;流體之溫度可為高溫流體或低溫流體,更佳者,可視使用需求,而切換流體之溫度。溫控單元可設有單一或複數個通口;例如單一通口可供流體流入及流出;複數個通口可分別供流體流入或流出;依作業需求,通口可設於溫控空間之頂部的面板或者側方的面板。Depending on the work requirements, the multiple panels can be formed as a whole or as multiple independent panels. The panel can be made of iron or copper. The fluid can be a liquid or a gas; the temperature of the fluid can be a high-temperature fluid or a low-temperature fluid, and preferably, the temperature of the fluid can be switched according to the use requirements. The temperature control unit can be provided with a single or multiple ports; for example, a single port can be used for the fluid to flow in and out; multiple ports can be used for the fluid to flow in or out respectively; depending on the work requirements, the port can be provided on the top panel or the side panel of the temperature control space.
於本實施例,溫控單元之複數個面板包含第一面板131、第二面板132及第三面板133,並分別配置於第二電子元件12之兩側方及上方,以圍構一溫控空間134,第一面板131及第二面板132接合於第一電子元件11之承接面112,使第二電子元件12位於溫控空間134,溫控空間134並涵蓋第一電子元件11的承接面112。另於第三面板133之兩側設有呈Z方向配置之一具有第一通口1352之第一凸部1351及一具有第二通口1354之第二凸部1353,第一通口1352及第二通口1354相通溫控空間134,以供分別輸入及輸出為氣體之流體。In this embodiment, the plurality of panels of the temperature control unit include a
依作業需求,第一通口1352及第二通口1354之頂緣亦可與第三面板133保持水平。溫控單元亦可於第一面板131及第二面板132分別開設第一通口1352及第二通口1354,以供輸入及輸出流體,不受限於本實施例。According to the operation requirements, the top edges of the
依作業需求,電子模組10更包含輸送單元,輸送單元設置至少一輸送管,以供輸送流體,輸送管能夠以直接或間接方式連通溫控單元之通口。依作業需求,輸送管能夠以人工方式或自動化方式連通或分離於溫控單元之通口;例如以人工方式將輸送管直接插置於電子模組10之通口。According to the operation requirements, the
更進一步,輸送單元更包含至少一輸送驅動器,輸送驅動器能夠自動化驅動該輸送管作至少一方向位移而連通或分離溫控單元之通口。Furthermore, the transport unit further includes at least one transport driver, which can automatically drive the transport pipe to move in at least one direction to connect or separate the opening of the temperature control unit.
承上述,輸送單元更包含至少一輸送驅動器及至少一輸送部件,輸送驅動器能夠帶動輸送部件作至少一方向位移,輸送部件設有至少一輸送道 ,輸送道之一端裝配輸送管,另一端能夠連通或分離溫控單元之通口。例如輸送管裝配於一輸送部件,輸送部件及輸送管由輸送驅動器帶動作至少一方向位移,使輸送管以輸送部件間接連通該通口。輸送驅動器可為壓接機構之移動臂或獨立作動之輸送臂,不受限於本實施例。 Based on the above, the transport unit further includes at least one transport driver and at least one transport component. The transport driver can drive the transport component to move in at least one direction. The transport component is provided with at least one transport path. One end of the transport path is equipped with a transport pipe, and the other end can connect or separate the opening of the temperature control unit. For example, the transport pipe is assembled on a transport component, and the transport component and the transport pipe are driven by the transport driver to move in at least one direction, so that the transport pipe is indirectly connected to the opening through the transport component. The transport driver can be a moving arm of a crimping mechanism or an independently actuated transport arm, which is not limited to this embodiment.
請參閱圖2,電子模組10應用於電子設備時,以手動方式於溫控單元之第一通口1352及第二通口1354分別直接插置第一輸送管141及第二輸送管142,第一輸送管141經由第一通口1352輸入一為低溫氣體之流體至溫控空間134
,由於第一電子元件11及第二電子元件12於運作時本身會產生高熱,電子模組10利用溫控空間134之低溫氣體與第一電子元件11及第二電子元件12作熱交換,即可迅速溫控第一電子元件11及第二電子元件12保持預設溫度,溫控空間134之已熱交換的低溫氣體則由第二通口1354及第二輸送管142排出,進而增加第一電子元件11及第二電子元件12之使用壽命。
Please refer to Figure 2. When the
請參閱圖3,本發明電子模組10之第二實施例,其大致相同第一實施例,差異在於溫控單元之溫控空間134設有至少一分隔板137,以界定第一溫控區1341及第二溫控區1342,第一溫控區1341位於第二電子元件12之上方,並供輸入流體,第二溫控區1342以供容置第二電子元件12,且涵蓋第一電子元件11之承接面112。於本實施例,電子模組10之第一輸送管141可經由第一通口1352輸入可為液體(例如冷媒)之流體至第一溫控區1341,冷媒沿第一溫控區1341流動,並經由分隔板137而與第二電子元件12作熱交換,以溫控第二電子元件12,第一溫控區1341之已熱交換的冷媒經第二通口1354及第二輸送管142排出。然,第二電子元件12亦可將冷媒之溫度傳導至第一電子元件11,使溫控單元溫控第一電子元件11及第二電子元件12。Please refer to FIG. 3 , which is a second embodiment of the
依作業需求,電子模組10之溫控單元能夠於第二溫控區1342設置至少一導熱件(圖未示出),以輔助傳導溫度。更進一步,溫控單元能夠於分隔板137與第二電子元件12之間設置至少一導熱件(圖未示出)。According to the operation requirements, the temperature control unit of the
依作業需求,電子模組10之溫控單元的其一實施例,複數個面板包含第一面板131、第二面板132、第三面板133及第四面板(例如底板,圖未示出),以於第二電子元件12之上方圍構至少一溫控空間,第四面板接合第二電子元件12,不受限於本實施例。According to the operation requirements, in one embodiment of the temperature control unit of the
依作業需求,請參閱圖4,本發明電子模組10之第三實施例,其大致相同第二實施例,差異在於溫控單元之至少一面板設有至少一散熱片。例如於第三面板133之外表面或/及內表面設有複數片之散熱片,以輔助散熱。於本實施例,電子模組10於溫控單元之第三面板133的頂面設有複數個散熱片138,以供輔助散熱。According to the operation requirements, please refer to FIG. 4 , the third embodiment of the
依作業需求,請參閱圖5,本發明電子模組10之第四實施例,其大致相同第二實施例,差異在於電子模組更包含輸送單元,輸送單元包含至少一輸送管、至少一第一輸送部件及至少一輸送驅動器,至少一輸送管以供輸送流體,輸送管能夠連通或分離於溫控單元之通口,輸送驅動器能夠帶動第一輸送部件作至少一方向位移,第一輸送部件設有至少一輸送道,輸送道之一端裝配輸送管,另一端能夠連通或分離溫控單元之通口。依作業需求,輸送驅動器144可為機械手臂、移動臂、壓接件或輸送臂等,而作至少一方向位移。According to the operation requirements, please refer to FIG. 5 , the fourth embodiment of the
於本實施例,輸送單元包含第一輸送管141、第二輸送管142、第一輸送部件143及輸送驅動器144,輸送驅動器144為輸送臂,以裝配第一輸送部件143,第一輸送部件143設有貫通頂面及底面之第一輸送道1431及第二輸送道1432,第一輸送道1431之一端供裝配第一輸送管141,第二輸送道1432之一端供裝配第二輸送管142,依作業需求,第一輸送部件143於第一輸送道1431及第二輸送道1432間設有貫通頂面及底面之讓位部1433,以供置入壓接件或其他物件。輸送單元以輸送驅動器144帶動第一輸送部件143、第一輸送管141及第二輸送管142同步位移,令第一輸送部件143之第一輸送道1431的另一端能夠套置於第三面板133之第一凸部1351,以及使第二輸送道1432之另一端能夠套置於第三面板133之第二凸部1353,進而自動化使第一輸送管141經第一輸送道1431而間接連通第一凸部1351之第一通口1352,以供輸入流體至第一溫控區1341,以及使第二輸送管142經第二輸送道1432而間接連通第二凸部1353之第二通口1354,以供第一溫控區1341輸出流體,進而提高使用效能及便利性。In this embodiment, the transport unit includes a
請參閱圖6、7,本發明壓接機構20之第一實施例,包含至少一電子模組10、輸送單元及壓接單元。電子模組10可為上述之其一實施例,例舉第二實施例,電子模組10包含至少一第一電子元件11、至少一第二電子元件12及溫控單元,第一電子元件11承置且電性連接第二電子元件12,溫控單元以第一面板131、第二面板132及第三面板133於第二電子元件12之周側方圍構一溫控空間134,溫控空間134以分隔板137區隔出第一溫控區1341及第二溫控區1342,第三面板133設有具第一通口1352之第一凸部1351及具第二通口1354之第二凸部1353,第一通口1352及第二通口1354相通第一溫控區1341,以供分別輸入及輸出流體。Please refer to Figures 6 and 7, the first embodiment of the crimping
壓接單元設置移動臂21及至少一壓接件22,移動臂21可作至少一方向(如Z方向)位移,並供裝配壓接件22,壓接件22以供壓接電子模組10。更進一步,壓接單元之壓接件22可執行壓接電子模組10之作業,或者於壓接件22設有至少一抽取部23,而執行壓接及取放電子模組10之作業。依作業需求,壓接單元於壓接件22配置至少一加熱件(圖未示出)或致冷晶片(圖未示出),以輔助溫控電子模組10。The crimping unit is provided with a moving
輸送單元包含至少一輸送管及至少一輸送驅動器,輸送管以供輸送流體,輸送驅動器能夠作至少一方向位移,並驅動輸送管連通或分離電子模組10之通口。更進一步,輸送驅動器可為壓接單元之移動臂21或壓接件22,而直接或間接於移動臂21或壓接件22裝配輸送管,使移動臂21或壓接件22帶動輸送管同步位移。或者輸送驅動器可獨立配置於機台,以帶動輸送管獨立位移,亦無不可。依作業需求,輸送單元更包含至少一輸送部件,輸送部件設有至少一輸送道,輸送道之一端裝配輸送管,另一端能夠連通或分離溫控單元之通口。於本實施例,輸送單元以壓接單元之移動臂21作為輸送驅動器,並於移動臂21之壓接件22兩側分別設有第二輸送部件145及第三輸送部件146,第二輸送部件145之第三輸送道1451一端供裝配第一輸送管141,另一端能夠套置於第三面板133之第一凸部1351;第三輸送部件146之第四輸送道1461之一端供裝配第二輸送管142,另一端能夠套置於第三面板133之第二凸部1353。The transport unit includes at least one transport pipe and at least one transport driver. The transport pipe is used to transport fluid. The transport driver can move in at least one direction and drive the transport pipe to connect or separate the opening of the
於使用時,壓接單元以移動驅動器(圖未示出)帶動該移動臂21、壓接件22、第一輸送管141、第二輸送管142、第二輸送部件145及第三輸送部件146同步作Z方向位移,令壓接件22之抽取部23吸附電子模組10,使第二輸送部件145之第三輸送道1451的另一端套置於第一凸部1351,以供第一輸送管141經第三輸送道1451而間接連通第一凸部1351之第一通口1352,以及使第三輸送部件146之第四輸送道1461的另一端套置於第二凸部1353,以供第二輸送管142經第四輸送道1461而間接連通第二凸部1353之第二通口1354;因此,第一輸送管141將可為冷媒之流體輸入於電子模組10之第一溫控區1341,使冷媒與第二電子元件12作熱交換,以溫控第二電子元件12保持預設測試溫度,第一溫控區1341之已熱交換的冷媒再由第二通口1354及第二輸送管142排出;壓接單元之移動臂21於移載電子模組10的過程中,即已逐漸溫控電子模組10,以縮短測試作業時間。When in use, the crimping unit drives the moving
請參閱圖8,本發明測試裝置30包含壓接機構20及測試機構,壓接機構20包含電子模組10及壓接單元,測試機構設置至少一測試器,以供承置及測試電子模組10。於本實施例,測試機構之測試器包含電性連接之電路板31及測試座32,壓接機構之移動臂21帶動電子模組10作Z方向位移置入於測試座32,使電子模組10於模擬日後應用場所之溫度環境而於測試座32執行測試作業。Please refer to FIG8 . The
請參閱圖9,本發明壓接機構20之第二實施例,其包含電子模組10、壓接單元及輸送單元,其與第一實施例之差異在於輸送單元之輸送驅動器獨立配置於機台,並連結裝配第一輸送部件作至少一方向位移。於本實施例,當電子模組10置入測試座(圖未示出),輸送單元之輸送驅動器144為獨立之輸送臂,並裝配第一輸送部件143,第一輸送部件143設有第一輸送道1431及第二輸送道1432以供分別裝配第一輸送管141及第二輸送管142,第一輸送道1431與第二輸送道1432之間設有貫通頂面及底面之讓位部1433,以供穿置壓接件22。輸送驅動器144帶動第一輸送部件143、第一輸送管141及第二輸送管142同步位移,令第一輸送部件143之第一輸送道1431的另一端套置於第三面板133之第一凸部1351,以及使第二輸送道1432之另一端套置於第三面板133之第二凸部1353,進而自動化使第一輸送管141經第一輸送道1431而連通第一凸部1351之第一通口1352,以供輸入流體至第一溫控區1341,以及使第二輸送管142經第二輸送道1432而連通第二凸部1353之第二通口1354,以供第一溫控區1341輸出流體,壓接單元之移動臂21帶動壓接件22位移,壓接件22穿置讓位部1433而壓接於電子模組10之第三面板133,使電子模組10於測試座(圖未示出)執行測試作業,進而提高使用效能。Please refer to FIG. 9 , which is a second embodiment of the crimping
請參閱圖6、8、7、10,本發明作業機包含機台40、供料裝置50
、收料裝置60、本發明測試裝置30、移載裝置70及中央控制裝置(圖未示出)
。供料裝置50裝配於機台40,並設有至少一供料器,以容納至少一待測之電子模組10。收料裝置60裝配於機台40,並設有至少一收料器,以容納至少一已測之電子模組10。測試裝置30配置於機台40,包含本發明壓接機構20及測試機構,壓接機構以供壓接電子模組10,測試機構設置至少一測試器,以供承置及測試電子模組10。於本實施例,測試器設有電性連接之電路板31及測試座32,測試座32以供承置及測試電子模組10;移載裝置70裝配於機台40,並設有至少一移載器,以供移載電子模組10;於本實施例,移載裝置70設有第一移載器71,以於供料裝置50之供料器取出待測之電子模組10,並移載至第二移載器72,第二移載器72將待測電子模組10載送至測試裝置30之側方,壓接機構20以移動臂21帶動壓接件22、第一輸送管141及第二輸送管142同步位移,並於第二移載器72取出待測之電子模組10,令第一輸送管141輸送流體於電子模組10作熱交換,以溫控電子模組10,壓接機構20將電子模組10移載至測試座32而執行測試作業,以及將已測電子模組10移入一第三移載器73載出,以供第四移載器74取出已測之電子模組10,並依據測試結果,將已測之電子模組10移載至收料裝置60之收料器處而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to Figures 6, 8, 7, and 10. The operating machine of the present invention includes a
電子模組10
第一電子元件11
接點111
承接面112
第二電子元件12
第一面板131
第二面板132
第三面板133
溫控空間134
第一溫控區1341
第二溫控區1342
第一凸部1351
第一通口1352
第二凸部1353
第二通口1354
分隔板137
散熱片138
第一輸送管141
第二輸送管142
第一輸送部件143
第一輸送道1431
第二輸送道1432
讓位部1433
輸送驅動器144
第二輸送部件145
第三輸送道1451
第三輸送部件146
第四輸送道1461
壓接機構20
移動臂21
壓接件22
抽取部23
測試裝置30
電路板31
測試座32
機台40
供料裝置50
收料裝置60
移載裝置70
第一移載器71
第二移載器72
第三移載器73
第四移載器74
圖1:本發明電子模組之第一實施例圖。 圖2:本發明電子模組第一實施例之使用示意圖。 圖3:本發明電子模組之第二實施例圖。 圖4:本發明電子模組之第三實施例圖。 圖5:本發明電子模組之第四實施例圖。 圖6至圖7:本發明壓接機構第一實施例之使用示意圖。 圖8:本發明壓接機構應用於測試裝置之使用示意圖。 圖9:本發明壓接機構第二實施例之示意圖。 圖10:本發明測試裝置應用於作業機之示意圖。 Figure 1: A diagram of the first embodiment of the electronic module of the present invention. Figure 2: A schematic diagram of the use of the first embodiment of the electronic module of the present invention. Figure 3: A diagram of the second embodiment of the electronic module of the present invention. Figure 4: A diagram of the third embodiment of the electronic module of the present invention. Figure 5: A diagram of the fourth embodiment of the electronic module of the present invention. Figures 6 to 7: Schematic diagrams of the use of the first embodiment of the crimping mechanism of the present invention. Figure 8: Schematic diagram of the use of the crimping mechanism of the present invention applied to a test device. Figure 9: Schematic diagram of the second embodiment of the crimping mechanism of the present invention. Figure 10: Schematic diagram of the test device of the present invention applied to a work machine.
10:電子模組 10: Electronic module
11:第一電子元件 11: First electronic component
12:第二電子元件 12: Second electronic component
134:溫控空間 134: Temperature controlled space
1352:第一通口 1352: First port
1354:第二通口 1354: Second port
141:第一輸送管 141: First delivery pipe
142:第二輸送管 142: Second delivery pipe
Claims (15)
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140312924A1 (en) * | 2013-04-23 | 2014-10-23 | Seiko Epson Corporation | Handler and inspection apparatus |
| TW202101013A (en) * | 2019-05-23 | 2021-01-01 | 日商阿德潘鐵斯特股份有限公司 | Electronic component handling apparatus and electronic component testing apparatus |
| US20230023699A1 (en) * | 2021-07-21 | 2023-01-26 | Advantest Corporation | Test carrier and electronic component testing apparatus |
| TW202403322A (en) * | 2022-03-31 | 2024-01-16 | 日商阿德潘鐵斯特股份有限公司 | Temperature adjustment device, electronic component processing device, electronic component testing device and temperature adjustment method of DUT |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140312924A1 (en) * | 2013-04-23 | 2014-10-23 | Seiko Epson Corporation | Handler and inspection apparatus |
| TW202101013A (en) * | 2019-05-23 | 2021-01-01 | 日商阿德潘鐵斯特股份有限公司 | Electronic component handling apparatus and electronic component testing apparatus |
| US20230023699A1 (en) * | 2021-07-21 | 2023-01-26 | Advantest Corporation | Test carrier and electronic component testing apparatus |
| TW202305379A (en) * | 2021-07-21 | 2023-02-01 | 日商阿德潘鐵斯特股份有限公司 | Test carrier and electronic component testing apparatus |
| TW202403322A (en) * | 2022-03-31 | 2024-01-16 | 日商阿德潘鐵斯特股份有限公司 | Temperature adjustment device, electronic component processing device, electronic component testing device and temperature adjustment method of DUT |
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