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TWI870795B - Processing device of electronic component and processing machine - Google Patents

Processing device of electronic component and processing machine Download PDF

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Publication number
TWI870795B
TWI870795B TW112108703A TW112108703A TWI870795B TW I870795 B TWI870795 B TW I870795B TW 112108703 A TW112108703 A TW 112108703A TW 112108703 A TW112108703 A TW 112108703A TW I870795 B TWI870795 B TW I870795B
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positioning
electronic component
carrier
expansion coefficient
frame
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TW112108703A
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Chinese (zh)
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TW202437848A (en
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張銘德
王彥傑
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鴻勁精密股份有限公司
大陸商鴻勁興業精密科技(蘇州)有限公司
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Priority to TW112108703A priority Critical patent/TWI870795B/en
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Abstract

The processing device of electronic component includes a processing mechanism and a positioning mechanism. The processing mechanism has at least one processing member having a first CTE. The processing member is adapted for working on the electronic component with predetermined process. The positioning mechanism has at least one positioning member having a second CTE which is smaller than the first CTE. The positioning member has a restriction portion to restrict the position of the processing member. During the thermal testing process of the electronic component, the processing member is surrounded by the restriction portion to prevent the processing member from deviation due to thermal deformation. Thus, the processing member can be precisely positioned at the predetermined position.

Description

電子元件作業裝置及作業機Electronic component processing equipment and processing machines

本發明提供一種可確保作業件精確定位於預設作業位置,以提高作業品質之電子元件作業裝置。The present invention provides an electronic component operating device which can ensure that a workpiece is accurately positioned at a preset operating position to improve the operating quality.

在現今,電子元件作業機之作業機構(例如輸送機構或測試機構)設置不同作用之作業器(例如載台、壓接器或測試器等),以供對電子元件執行不同預設作業(例如輸送作業、壓接作業或測試作業等)。由於電子元件日後會應用於高溫場所,為確保電子元件之品質,業者必須對電子元件執行熱測作業 ,在電子元件日趨精密微小之條件下,對於作業器之預設作業位置精準度要求相當高。 Nowadays, the operating mechanism (such as the conveying mechanism or the testing mechanism) of the electronic component processing machine is equipped with operators with different functions (such as a carrier, a crimper or a tester, etc.) to perform different preset operations on the electronic components (such as conveying operations, crimping operations or testing operations, etc.). Since electronic components will be used in high-temperature places in the future, in order to ensure the quality of electronic components, the industry must perform thermal testing operations on electronic components. Under the condition that electronic components are becoming more and more precise and small, the accuracy of the preset operation position of the operator is required to be very high.

以輸送機構之載台而言,載台設有承槽以供承置電子元件,載台裝配於移動座,由移動座帶動載台及電子元件位移至測試器之一方,以供取放電子元件;然為縮短電子元件於測試器內之升溫作業時間,載台會配置加熱件 ,以便於載送電子元件之行程中升溫電子元件;惟,載台之承槽因受熱膨脹變形,導致承槽發生偏移預設取放料位置之情況,以致壓接器無法準確於載台之承槽取出待測電子元件或放置已測電子元件,進而影響作業精準性,甚至可能將電子元件偏斜放置於承槽,導致壓接器壓損電子元件之問題。 As for the carrier of the conveying mechanism, the carrier is provided with a slot for holding electronic components. The carrier is mounted on a moving seat, and the moving seat drives the carrier and the electronic components to move to one side of the tester for taking and placing electronic components. However, in order to shorten the heating time of the electronic components in the tester, the carrier is equipped with a heating element to heat the electronic components during the transportation of the electronic components. However, the slot of the carrier is deformed due to thermal expansion, causing the slot to deviate from the preset position for taking and placing materials, so that the crimper cannot accurately take out the electronic components to be tested or place the tested electronic components in the slot of the carrier, thereby affecting the accuracy of the operation, and may even place the electronic components in the slot at an angle, causing the crimper to damage the electronic components.

以測試機構之壓接器及測試器而言,壓接器及測試器均位於熱測室,以便對電子元件執行熱測作業,壓接器更配置有溫控件,以升溫電子元件至預設熱測溫度,若壓接器因受熱膨脹變形而發生偏移預設壓接位置,即會導致壓接器之中心無法準確對位測試器之中心而放置待測電子元件,或者施以下壓力不平均等,進而影響測試品質;同樣地,若測試器因受熱膨脹變形而發生偏移預設測試位置,亦會導致無法提供壓接器準確放置待測電子元件,進而影響測試品質。As for the crimper and tester of the testing mechanism, both the crimper and the tester are located in the thermal testing room so as to perform thermal testing on the electronic components. The crimper is also equipped with a temperature control unit to heat the electronic components to the preset thermal testing temperature. If the crimper is deformed due to thermal expansion and deviates from the preset crimping position, the center of the crimper cannot be accurately aligned with the center of the tester to place the electronic component to be tested, or the pressure applied is uneven, thereby affecting the test quality. Similarly, if the tester is deformed due to thermal expansion and deviates from the preset test position, the crimper cannot be accurately placed on the electronic component to be tested, thereby affecting the test quality.

因此,如何提高作業器之作業位置精準性及作業品質,著實相當重要。Therefore, it is very important to improve the operating position accuracy and operating quality of the operator.

本發明之目的一,提供一種電子元件作業裝置,包含作業機構及定位機構,作業機構設置承載具及作業件,承載具以供裝配至少一具第一膨脹係數之作業件,作業件能夠對電子元件執行預設作業,定位機構設有至少一具第二膨脹係數之定位具,其第二膨脹係數小於第一膨脹係數,定位具設有至少一框限部,能夠框限作業件之外周面;藉以作業件執行電子元件熱測作業而受熱膨脹變形時,在定位具之第二膨脹係數小於作業件之第一膨脹係數的要件下 ,定位具確實框限於作業件之外周面而形成一擋止層,以擋止作業件偏移,使作業件精確定位於預設作業位置,進而提高作業品質及作業便利性。 The first object of the present invention is to provide an electronic component working device, comprising a working mechanism and a positioning mechanism. The working mechanism is provided with a carrier and a working piece. The carrier is used to assemble at least one working piece with a first expansion coefficient. The working piece can perform a preset operation on the electronic component. The positioning mechanism is provided with at least one positioning tool with a second expansion coefficient, and the second expansion coefficient is smaller than the first expansion coefficient. The positioning tool is provided with at least one limiting part, which can limit the outer peripheral surface of the working piece. When the working piece performs the electronic component thermal measurement operation and is deformed by thermal expansion, the second expansion coefficient of the positioning tool is smaller than the first expansion coefficient of the working piece. The positioning tool is precisely limited to the outer circumference of the workpiece to form a stop layer to prevent the workpiece from deviating, so that the workpiece is accurately positioned at the preset working position, thereby improving the work quality and convenience.

本發明之目的二,提供一種作業機,包含機台、供料裝置、收料裝置、本發明作業裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待作業電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已作業電子元件;本發明作業裝置配置於機台,並設有作業機構及定位機構,作業機構之作業件以供對電子元件執行預設作業,定位機構之定位具以供框限作業件確實定位於預設作業位置;中央控制裝置以控制及整合各裝置作動而執行自動化作業。The second object of the present invention is to provide a working machine, including a machine, a feeding device, a receiving device, the working device of the present invention and a central control device, wherein the feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be processed; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one processed electronic component; the working device of the present invention is arranged on the machine and is provided with a working mechanism and a positioning mechanism, the working piece of the working mechanism is used to perform a preset operation on the electronic component, and the positioning tool of the positioning mechanism is used to limit the working piece to be accurately positioned at the preset working position; the central control device controls and integrates the actions of each device to perform automated operations.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

請參閱圖1~4,本發明作業裝置應用於電子元件作業機,作業機包含機台10、供料裝置20、收料裝置30、作業裝置40及中央控制裝置(圖未示出)。供料裝置20裝配於機台10,並設有至少一供料器21,以容納至少一待作業之電子元件。收料裝置30裝配於機台10,並設有至少一收料器31,以容納至少一已作業之電子元件。中央控制裝置(圖未示出)用以控制及整合各裝置作動 ,以執行自動化作業。 Please refer to Figures 1 to 4. The operating device of the present invention is applied to an electronic component operating machine, which includes a machine 10, a feeding device 20, a receiving device 30, an operating device 40 and a central control device (not shown). The feeding device 20 is mounted on the machine 10 and is provided with at least one feeder 21 to accommodate at least one electronic component to be processed. The receiving device 30 is mounted on the machine 10 and is provided with at least one receiving device 31 to accommodate at least one processed electronic component. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations.

本發明作業裝置40配置於機台10,包含至少一作業機構及至少一定位機構。The operating device 40 of the present invention is disposed on the machine 10 and includes at least one operating mechanism and at least one positioning mechanism.

至少一作業機構設置至少一承載具及至少一作業件,承載具以供裝配至少一具第一膨脹係數之作業件,作業件以供對電子元件執行預設作業。更進一步,承載具為固定式或可移動式,例如承載具為可移動式之移動座或移動臂,例如承載具為固定式之電路板或機台。At least one operating mechanism is provided with at least one carrier and at least one operating part, the carrier is used to assemble at least one operating part with a first expansion coefficient, and the operating part is used to perform a preset operation on the electronic component. Furthermore, the carrier is fixed or movable, for example, the carrier is a movable movable seat or movable arm, for example, the carrier is a fixed circuit board or machine.

依作業需求,作業件可為載台治具、測試座、壓接器或預溫治具等,而分別執行載送作業、測試作業、壓接作業或預溫作業等預設作業;作業件因材質關係而具有較大之第一膨脹係數;例如載台治具之材質為銅;例如拾取件之材質為塑材。According to the operation requirements, the workpiece can be a carrier fixture, a test seat, a crimper or a pre-heating fixture, etc., and perform preset operations such as carrying operations, testing operations, crimping operations or pre-heating operations respectively; the workpiece has a larger first expansion coefficient due to the material; for example, the material of the carrier fixture is copper; for example, the material of the pick-up piece is plastic.

於本實施例,作業裝置40之至少一作業機構包含第一作業機構、第二作業機構及第三作業機構。In this embodiment, at least one operating mechanism of the operating device 40 includes a first operating mechanism, a second operating mechanism, and a third operating mechanism.

第一作業機構為輸送機構,其設置有一為第一移動座411之第一承載具,第一移動座411由第一驅動源412驅動作第一方向(例如X方向)位移,第一驅動源412可為線性馬達、壓缸或包含馬達及至少一傳動組;第一移動座411之頂面裝配複數個為第一載台治具413之第一作業件,第一載台治具413為銅製 ,其導熱性佳且具有較大之第一膨脹係數,各第一載台治具413設有第一容置部414,以供盛裝電子元件,使得第一載台治具413可對電子元件執行載送作業。依作業需求,第一移動座411配置有第一加熱件415,以供於載送行程中升溫複數個第一載台治具413內之複數個電子元件。 The first operating mechanism is a conveying mechanism, which is provided with a first carrier which is a first moving seat 411. The first moving seat 411 is driven by a first driving source 412 to move in a first direction (e.g., X direction). The first driving source 412 can be a linear motor, a cylinder, or includes a motor and at least one transmission group. The top surface of the first moving seat 411 is equipped with a plurality of first operating parts which are first carrier fixtures 413. The first carrier fixtures 413 are made of copper, which has good thermal conductivity and a large first expansion coefficient. Each first carrier fixture 413 is provided with a first accommodating portion 414 for containing electronic components, so that the first carrier fixture 413 can perform a carrying operation on the electronic components. According to the working requirements, the first moving seat 411 is equipped with a first heating element 415 to heat up the multiple electronic components in the multiple first carrier fixtures 413 during the transport process.

第二作業機構為壓接機構,其設置有一為第二移動臂421之第二承載具,第二移動臂421由第二驅動源(圖未示出)驅動作第二、三方向(例如Y-Z方向)位移,第二驅動源可為線性馬達、壓缸或包含馬達及至少一傳動組;第二移動臂421以供帶動複數個為第二壓接器422之第二作業件作同步位移,第二壓接器422之壓座4221為塑材製,並具有較大之第一膨脹係數,以供壓接電子元件 ,第二壓接器422之壓座4221內部設置吸嘴4222,以供吸附或釋放電子元件,因此,第二壓接器422可對電子元件執行壓接及取放料作業。 The second working mechanism is a crimping mechanism, which is provided with a second carrier which is a second moving arm 421. The second moving arm 421 is driven by a second driving source (not shown) to move in the second and third directions (e.g., Y-Z directions). The second driving source can be a linear motor, a cylinder, or a motor and at least one transmission group. The second moving arm 421 is used to drive a plurality of second working parts which are second crimping devices 422 to move synchronously. The pressing seat 4221 of the second crimping device 422 is made of plastic material and has a larger first expansion coefficient for crimping electronic components. , a suction nozzle 4222 is provided inside the pressing seat 4221 of the second crimper 422 for adsorbing or releasing electronic components, so the second crimper 422 can perform crimping and material picking and placing operations on electronic components.

依作業需求,第二移動臂421與複數個第二壓接器422之間配置有浮動器(圖未示出)、溫控器或者浮動器及溫控器;更進一步,溫控器可設置致冷晶片、加熱件或包含具預溫流體之座體。於本實施例,第二移動臂421與複數個第二壓接器422之間配置有第二溫控器423,第二溫控器423設有致冷晶片,可使電子元件處於模擬日後高溫環境下執行熱測作業。According to the operation requirements, a float (not shown), a temperature controller, or a float and a temperature controller are arranged between the second moving arm 421 and the plurality of second crimpers 422; further, the temperature controller can be provided with a cooling chip, a heating element, or a seat body containing a pre-heating fluid. In this embodiment, a second temperature controller 423 is arranged between the second moving arm 421 and the plurality of second crimpers 422. The second temperature controller 423 is provided with a cooling chip, which can make the electronic components perform thermal testing operations in a simulated high temperature environment in the future.

第三作業機構為測試機構,其設置有一為第三電路板431之第三承載具,第三電路板431為固定式配置於一第三連接座432,第三連接座432裝配於機台10,第三電路板431供配置複數個為第三測試座433之第三作業件,第三測試座433為塑材製,並具有較大之第一膨脹係數,且以探針一端電性連接第三電路板431,使第三測試座433能夠對電子元件執行測試作業。The third operating mechanism is a testing mechanism, which is provided with a third carrier for a third circuit board 431. The third circuit board 431 is fixedly arranged on a third connecting seat 432. The third connecting seat 432 is assembled on the machine 10. The third circuit board 431 is provided with a plurality of third operating parts for configuring a third test seat 433. The third test seat 433 is made of plastic material and has a larger first expansion coefficient. One end of the probe is electrically connected to the third circuit board 431, so that the third test seat 433 can perform testing operations on electronic components.

至少一定位機構設有至少一具第二膨脹係數之定位具,第二膨脹係數值小於第一膨脹係數,定位具設有至少一框限部,能夠框限作業件之外周面而形成一擋止層,以擋止作業件受熱膨脹變形偏移。At least one positioning mechanism is provided with at least one positioning tool with a second expansion coefficient, the second expansion coefficient value is smaller than the first expansion coefficient, and the positioning tool is provided with at least one frame limiting portion, which can frame the outer peripheral surface of the workpiece to form a stop layer to prevent the workpiece from being deformed and deviated due to thermal expansion.

依作業需求,定位具以膨脹係數極小之不變鋼製作,亦即不變鋼之第二膨脹係數小於作業件之第一膨脹係數。According to the working requirements, the positioning tool is made of stainless steel with a very small expansion coefficient, that is, the second expansion coefficient of the stainless steel is smaller than the first expansion coefficient of the working piece.

依作業需求,定位具設有為鏤空孔之框限部,或者定位機構設置複數個定位構件而能夠裝配成定位具,複數個定位構件設有複數個相對應之框限凹槽而能夠構成框限部。According to the operation requirements, the positioning tool is provided with a frame portion for the hollow hole, or the positioning mechanism is provided with a plurality of positioning components to be assembled into a positioning tool, and the plurality of positioning components are provided with a plurality of corresponding frame grooves to form the frame portion.

依作業需求,定位機構之定位具裝配於作業機構之承載具或至少一連接座。According to the working requirements, the positioning device of the positioning mechanism is assembled on the carrier or at least one connecting seat of the working mechanism.

依作業需求,定位具之框限部貼合作業件之外周面,或者定位具之框限部與作業件之外周面間具有一容許裕度值,該容許裕度值為作業件受熱膨脹偏移時,定位具將作業件框限於預設作業位置之容許範圍內,以使作業件確實執行預設作業。According to the working requirements, the frame limit part of the positioning tool is attached to the outer circumference of the workpiece, or there is an allowable margin value between the frame limit part of the positioning tool and the outer circumference of the workpiece. When the workpiece expands and deviates due to heat, the positioning tool will limit the workpiece to the allowable range of the preset working position so that the workpiece can actually perform the preset operation.

於本實施例,作業裝置40之至少一定位機構包含第一定位機構、第二定位機構及第三定位機構。In this embodiment, the at least one positioning mechanism of the working device 40 includes a first positioning mechanism, a second positioning mechanism, and a third positioning mechanism.

第一定位機構設有第一定位具44,第一定位具44以不變鋼製作,且第二膨脹係數小於第一作業機構之第一載台治具413的第一膨脹係數,第一定位具44設有複數個為鏤空孔之第一框限部441,複數個第一框限部441供置入複數個第一載台治具413,第一框限部441之內周面貼合第一載台治具413之外周面,使第一框限部441框限第一載台治具413而形成第一擋止層,第一定位具44裝配於第一移動座411,而由第一移動座411帶動同步位移。The first positioning mechanism is provided with a first positioning tool 44, which is made of stainless steel and has a second expansion coefficient that is smaller than the first expansion coefficient of the first carrier fixture 413 of the first operating mechanism. The first positioning tool 44 is provided with a plurality of first frame limiting parts 441 with hollow holes, and the plurality of first frame limiting parts 441 are provided for inserting a plurality of first carrier fixtures 413. The inner circumference of the first frame limiting part 441 fits the outer circumference of the first carrier fixture 413, so that the first frame limiting part 441 frames the first carrier fixture 413 to form a first blocking layer. The first positioning tool 44 is assembled on the first moving seat 411, and is driven by the first moving seat 411 to move synchronously.

依作業需求,定位機構之定位具的頂面可作水平延伸有擋塊,以框限貼合作業件之頂面適當位置,以防止作業件朝向Z方向變形偏移,進而確保作業件之預設作業高度;例如第一定位具44之頂面朝向第一載台治具413的水平方向延伸設有擋塊(圖未示出),擋塊貼合於第一載台治具413之頂面,且未遮蔽第一容置部414,使第一定位具44除了框限第一載台治具413之外周面,以避免第一載台治具413作X-Y方向偏移外,更可框限第一載台治具413之頂面,以避免作Z方向偏移,而可確保第一載台治具413之預設作業高度,進而提高使用效能(例如可防止壓接器過壓電子元件等)。According to the working requirements, the top surface of the positioning tool of the positioning mechanism can be horizontally extended with a block to frame the appropriate position of the top surface of the attached workpiece to prevent the workpiece from deforming and shifting in the Z direction, thereby ensuring the preset working height of the workpiece; for example, the top surface of the first positioning tool 44 is horizontally extended toward the first carrier fixture 413 with a block (not shown), the block is attached to the top surface of the first carrier fixture 413, and does not cover the first accommodating portion 414, so that the first positioning tool 44 not only frames the outer circumference of the first carrier fixture 413 to prevent the first carrier fixture 413 from shifting in the X-Y direction, but also can frame the top surface of the first carrier fixture 413 to prevent it from shifting in the Z direction, thereby ensuring the preset working height of the first carrier fixture 413, thereby improving the use efficiency (for example, it can prevent the crimper from over-pressing electronic components, etc.).

第二定位機構設有第二定位具45,第二定位具45以不變鋼製作,且第二膨脹係數小於第二作業機構之第二壓接器422的第一膨脹係數,第二定位具45設有複數個為階級狀鏤空孔之第二框限部451,複數個第二框限部451供置入複數個第二壓接器422,第二框限部451之內周面貼合第二壓接器422之壓座4221的外周面,使第二框限部451框限第二壓接器422而形成第二擋止層,第二定位具45裝配於第二作業機構之第二溫控器423,並由第二移動臂421帶動同步位移。The second positioning mechanism is provided with a second positioning tool 45, which is made of stainless steel and has a second expansion coefficient that is smaller than the first expansion coefficient of the second crimper 422 of the second operating mechanism. The second positioning tool 45 is provided with a plurality of second frame limiting parts 451 with stepped hollow holes, and the plurality of second frame limiting parts 451 are provided for inserting a plurality of second crimpers 422. The inner circumference of the second frame limiting part 451 is in contact with the outer circumference of the pressing seat 4221 of the second crimper 422, so that the second frame limiting part 451 frames the second crimper 422 to form a second blocking layer. The second positioning tool 45 is assembled on the second temperature controller 423 of the second operating mechanism and is driven to move synchronously by the second moving arm 421.

第三定位機構設有第三定位具46,第三定位具46以不變鋼製作,且第二膨脹係數小於第三作業機構之第三測試座433的第一膨脹係數,第三定位具46設有複數個為鏤空孔之第三框限部461,複數個第三框限部461供置入複數個第三測試座433,第三框限部461之內周面貼合第三測試座433的外周面,使第三框限部461框限第三測試座433而形成第三擋止層,第三定位具46裝配於第三作業機構之第三連接座432。The third positioning mechanism is provided with a third positioning tool 46, which is made of stainless steel and has a second expansion coefficient that is smaller than the first expansion coefficient of the third test seat 433 of the third operating mechanism. The third positioning tool 46 is provided with a plurality of third frame limiting parts 461 with hollow holes, and the plurality of third frame limiting parts 461 are provided for inserting a plurality of third test seats 433. The inner circumference of the third frame limiting part 461 fits the outer circumference of the third test seat 433, so that the third frame limiting part 461 frames the third test seat 433 to form a third blocking layer. The third positioning tool 46 is assembled on the third connecting seat 432 of the third operating mechanism.

依作業需求,作業裝置40於機台10設置測試室47,測試室47配置鼓風機(圖未示出),以供吹送熱風,使測試室47之內部升溫,亦無不可。According to the operation requirements, the operation device 40 is provided with a test chamber 47 on the machine 10. The test chamber 47 is equipped with a blower (not shown) to blow hot air to increase the temperature inside the test chamber 47.

依作業需求,作業裝置40更包含第一輸送器481、第二輸送器482及第三輸送器483,第一輸送器481可作X-Y-Z方向位移,以於供料裝置20及第一載台治具413間移載待測電子元件;第二輸送器482可作X方向位移,以供第二壓接器422置入已測電子元件,並載出已測電子元件;第三輸送器483可作X-Y-Z方向位移,以於第二輸送器482與收料裝置30間移載已測電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置30而分類收置。According to the operation requirements, the operation device 40 further includes a first conveyor 481, a second conveyor 482 and a third conveyor 483. The first conveyor 481 can be displaced in the X-Y-Z direction to transfer the electronic components to be tested between the feeding device 20 and the first carrier fixture 413; the second conveyor 482 can be displaced in the X direction to allow the second crimper 422 to insert the tested electronic components and carry out the tested electronic components; the third conveyor 483 can be displaced in the X-Y-Z direction to transfer the tested electronic components between the second conveyor 482 and the receiving device 30, and according to the test results, the tested electronic components are transported to the receiving device 30 for classification and collection.

請參閱圖1、5~7,作業裝置40以第一輸送器481作X-Y-Z方向位移將供料裝置20之複數個待測電子元件移載至第一作業機構之複數個第一載台治具413的第一容置部414;第一作業機構以第一驅動源412驅動第一移動座411作X方向位移,第一移動座411帶動複數個第一載台治具413、第一定位具44及複數個待測電子元件同步作X方向位移,並於載送行程中,以第一加熱件415升溫待測電子元件;然為避免第一載台治具413因第一膨脹係數大且受熱膨脹變形偏移預設取放料位置,可利用第一定位機構之第一定位具44的第二膨脹係數小於第一載台治具413的第一膨脹係數,且第一定位具44保持固定型態及長度,使第一定位具44之第一框限部441於第一載台治具413之外周面形成第一擋止層;當第一載台治具413受熱膨脹變形欲作水平偏移時,第一定位具44之第一框限部441即擋止第一載台治具413作水平偏移,將第一載台治具413框限於預設取放料位置,使複數個第一載台治具413之中心間距不變,進而使複數個第一載台治具413承載複數個待測電子元件精確位於預設取放料位置。Please refer to Figures 1, 5-7. The operating device 40 uses the first conveyor 481 to move in the X-Y-Z direction to transfer the plurality of electronic components to be tested of the feeding device 20 to the first receiving portion 414 of the plurality of first carrier fixtures 413 of the first operating mechanism; the first operating mechanism drives the first moving seat 411 to move in the X direction with the first driving source 412, and the first moving seat 411 drives the plurality of first carrier fixtures 413, the first positioning fixture 44 and the plurality of electronic components to be tested to move in the X direction synchronously, and during the carrying process, the first heating element 415 is used to heat the electronic components to be tested; however, in order to prevent the first carrier fixture 413 from deviating from the preset pick-up and discharge position due to the large first expansion coefficient and thermal expansion deformation, the first heating element 415 can be used to prevent the first carrier fixture 413 from deviating from the preset pick-up and discharge position due to thermal expansion deformation. The second expansion coefficient of the first positioning tool 44 of a positioning mechanism is smaller than the first expansion coefficient of the first carrier fixture 413, and the first positioning tool 44 maintains a fixed shape and length, so that the first frame limiting portion 441 of the first positioning tool 44 forms a first blocking layer on the outer peripheral surface of the first carrier fixture 413; when the first carrier fixture 413 expands and deforms due to heat and wants to shift horizontally, the first frame limiting portion 441 of the first positioning tool 44 stops the first carrier fixture 413 from shifting horizontally, and limits the first carrier fixture 413 to a preset loading and unloading position, so that the center distance of the plurality of first carrier fixtures 413 remains unchanged, thereby making the plurality of first carrier fixtures 413 carrying the plurality of electronic components to be tested accurately located at the preset loading and unloading positions.

於複數個第一載台治具413承載複數個待測電子元件至第三測試座433之一方,第二作業機構以第二移動臂421帶動第二溫控器423、複數個第二壓接器422及第二定位具45同步作Y-Z方向位移,由於第二溫控器423具有致冷晶片而會使複數個第二壓接器422升溫,然為避免第二壓接器422因第一膨脹係數大且受熱膨脹變形偏移預設壓接位置,可利用第二定位機構之第二定位具45的第二膨脹係數小於第二壓接器422的第一膨脹係數,且第二定位具45保持固定型態及長度,使第二定位具45之第二框限部451於第二壓接器422之壓座4221的外周面形成第二擋止層;當複數個第二壓接器422受熱膨脹變形欲作水平偏移時,第二定位具45之複數個第二框限部451可擋止複數個第二壓接器422作水平偏移 ,將複數個第二壓接器422框限於預設壓接位置,使複數個第二壓接器422之中心間距不變,而可精確於複數個第一載台治具413取出複數個待測電子元件。 When the plurality of first carrier fixtures 413 carry the plurality of electronic components to be tested to one of the third test seats 433, the second operating mechanism drives the second temperature controller 423, the plurality of second crimpers 422 and the second positioning device 45 to synchronously move in the Y-Z direction with the second moving arm 421. Since the second temperature controller 423 has a cooling chip, the plurality of second crimpers 422 will be heated. However, in order to prevent the second crimpers 422 from deviating from the preset crimping position due to the large first expansion coefficient and thermal expansion deformation, the second crimper 422 can be used. The second expansion coefficient of the second positioning fixture 45 of the second positioning mechanism is less than the first expansion coefficient of the second crimping device 422, and the second positioning fixture 45 maintains a fixed shape and length, so that the second frame limiter 451 of the second positioning fixture 45 forms a second stop layer on the outer peripheral surface of the pressing seat 4221 of the second crimping device 422; when the plurality of second crimping devices 422 are deformed by thermal expansion and want to be horizontally offset, the plurality of second frame limiters 451 of the second positioning fixture 45 can stop the plurality of second crimping devices 422 from being horizontally offset, and the plurality of second crimping devices 422 are framed at the preset crimping position, so that the center distance of the plurality of second crimping devices 422 remains unchanged, and the plurality of electronic components to be tested can be accurately taken out from the plurality of first carrier fixtures 413.

複數個第二壓接器422將複數個待測電子元件移載至複數個第三測試座433上方,然為避免第三測試座433因第一膨脹係數大且受熱膨脹變形而偏移預設測試位置,可利用第三定位機構之第三定位具46的第二膨脹係數小於第三測試座433的第一膨脹係數,且第三定位具46保持固定型態及長度,使第三定位具46的第三框限部461於第三測試座433的外周面形成第三擋止層;當複數個第三測試座433受熱膨脹變形欲作水平偏移時,第三定位具46之複數個第三框限部461即擋止複數個第三測試座433作水平偏移,將複數個第三測試座433框限於預設測試位置,使複數個第三測試座433之中心間距不變,以供複數個第二壓接器422精確置入且壓接複數個待測電子元件,複數個第三測試座433對複數個待測電子元件執行測試作業,進而提高測試品質。於測試完畢,複數個第二壓接器422將複數個已測電子元件移入第二輸送器482,第二輸送器482輸出複數個已測電子元件,以供第三輸送器483取出複數個已測電子元件,第三輸送器483依據測試結果,將已測之電子元件輸送至收料裝置30而分類收置。The plurality of second crimpers 422 transfer the plurality of electronic components to be tested to the top of the plurality of third test seats 433. However, in order to prevent the third test seat 433 from deviating from the preset test position due to the large first expansion coefficient and thermal expansion deformation, the second expansion coefficient of the third positioning tool 46 of the third positioning mechanism can be smaller than the first expansion coefficient of the third test seat 433, and the third positioning tool 46 maintains a fixed shape and length, so that the third frame portion 461 of the third positioning tool 46 forms a third blocking layer on the outer peripheral surface of the third test seat 433; When the plurality of third test sockets 433 are deformed due to thermal expansion and want to be horizontally offset, the plurality of third frame portions 461 of the third positioning device 46 prevent the plurality of third test sockets 433 from being horizontally offset, and frame the plurality of third test sockets 433 at the preset test position, so that the center distance of the plurality of third test sockets 433 remains unchanged, so that the plurality of second crimpers 422 can be accurately placed and crimped to the plurality of electronic components to be tested, and the plurality of third test sockets 433 perform testing operations on the plurality of electronic components to be tested, thereby improving the test quality. After the test is completed, the plurality of second crimpers 422 move the plurality of tested electronic components into the second conveyor 482, and the second conveyor 482 outputs the plurality of tested electronic components for the third conveyor 483 to take out the plurality of tested electronic components. The third conveyor 483 transports the tested electronic components to the receiving device 30 for classification and storage according to the test results.

10:機台 20:供料裝置 21:供料器 30:收料裝置 31:收料器 40:作業裝置 411:第一移動座 412:第一驅動源 413:第一載台治具 414:第一容置部 415:第一加熱件 421:第二移動臂 422:第二壓接器 4221:壓座 4222:吸嘴 423:第二溫控器 431:第三電路板 432:第三連接座 433:第三測試座 44:第一定位具 441:第一框限部 45:第二定位具 451:第二框限部 46:第三定位具 461:第三框限部 47:測試室 481:第一輸送器 482:第二輸送器 483:第三輸送器 10: machine 20: feeding device 21: feeder 30: receiving device 31: receiving device 40: working device 411: first moving seat 412: first driving source 413: first carrier fixture 414: first accommodating part 415: first heating element 421: second moving arm 422: second crimper 4221: crimping seat 4222: nozzle 423: second temperature controller 431: third circuit board 432: third connecting seat 433: third test seat 44: first positioning device 441: first frame limiter 45: second positioning device 451: second frame limiter 46: third positioning device 461: third frame limiter 47: Test room 481: First conveyor 482: Second conveyor 483: Third conveyor

圖1:本發明作業裝置配置於作業機之示意圖。 圖2:作業裝置之第一作業機構及第一定位機構的示意圖。 圖3:作業裝置之第二作業機構及第二定位機構的示意圖。 圖4:作業裝置之第三作業機構及第三定位機構的示意圖。 圖5至圖7:作業裝置之使用示意圖。 Figure 1: Schematic diagram of the working device of the present invention configured on the working machine. Figure 2: Schematic diagram of the first working mechanism and the first positioning mechanism of the working device. Figure 3: Schematic diagram of the second working mechanism and the second positioning mechanism of the working device. Figure 4: Schematic diagram of the third working mechanism and the third positioning mechanism of the working device. Figures 5 to 7: Schematic diagrams of the use of the working device.

411:第一移動座 411: First mobile seat

412:第一驅動源 412: The first driving source

413:第一載台治具 413: The first carrier fixture

414:第一容置部 414: First accommodating portion

415:第一加熱件 415: First heating element

44:第一定位具 44: First positioning device

441:第一框限部 441: First frame limit part

Claims (9)

一種電子元件作業裝置,包含:至少一作業機構:設置至少一承載具及至少一作業件,該承載具以供裝配至少一具第一膨脹係數之該作業件,該作業件能夠對電子元件執行預設作業;至少一定位機構:設有至少一具第二膨脹係數之定位具,該第二膨脹係數值小於該第一膨脹係數,該定位具設有至少一框限部,能夠框限該作業件而形成擋止層,以擋止該作業件受熱膨脹變形偏移,其中,該定位機構設置複數個定位構件而能夠裝配成該定位具,該複數個定位構件設有複數個相對應之框限凹槽而能夠構成該框限部。 An electronic component operation device comprises: at least one operation mechanism: at least one carrier and at least one operation piece are provided, the carrier is used to assemble at least one operation piece with a first expansion coefficient, and the operation piece can perform a preset operation on the electronic component; at least one positioning mechanism: at least one positioning tool with a second expansion coefficient is provided, the second expansion coefficient value is less than the first expansion coefficient, the positioning tool is provided with at least one frame limit part, which can frame the operation piece to form a stop layer to prevent the operation piece from being deformed and offset due to thermal expansion, wherein the positioning mechanism is provided with a plurality of positioning components to be assembled into the positioning tool, and the plurality of positioning components are provided with a plurality of corresponding frame limit grooves to form the frame limit part. 如請求項1所述之電子元件作業裝置,其該定位機構之該定位具為不變鋼製作。 As for the electronic component processing device described in claim 1, the positioning tool of the positioning mechanism is made of stainless steel. 如請求項1所述之電子元件作業裝置,其該定位機構之該定位具設有為鏤空孔之該框限部。 As described in claim 1, the positioning device of the positioning mechanism is provided with a frame portion for a hollow hole. 如請求項1所述之電子元件作業裝置,其該定位機構之該定位具設有複數個該框限部,以供框限複數個該作業件。 As described in claim 1, the positioning device of the positioning mechanism is provided with a plurality of the frame limiting parts for framing a plurality of the working pieces. 如請求項1所述之電子元件作業裝置,其該定位機構之該定位具裝配於該作業機構之該承載具或連接座。 As described in claim 1, the positioning device of the positioning mechanism is mounted on the carrier or connector of the operating mechanism. 如請求項1所述之電子元件作業裝置,其該定位具之該框限部貼合該作業件之外周面。 As described in claim 1, the frame portion of the positioning device is in contact with the outer peripheral surface of the workpiece. 如請求項1所述之電子元件作業裝置,其該定位具之該框限部與該作業件之外周面間具有一容許裕度值。 As described in claim 1, the electronic component processing device has an allowable margin value between the frame portion of the positioning tool and the outer peripheral surface of the workpiece. 如請求項1至7中任一項所述之電子元件作業裝置,其該作業機構之該承載具為固定式或可移動式。 For the electronic component operating device described in any one of claim items 1 to 7, the carrier of the operating mechanism is fixed or movable. 一種作業機,包含:機台;供料裝置:配置於該機台,並設有至少一供料器,以供容置至少一待作業電子元件;收料裝置:配置於該機台,並設有至少一收料器,以供容置至少一已作業電子元件;至少一如請求項1所述之電子元件作業裝置:配置於該機台;中央控制裝置:以控制及整合各裝置作動而執行自動化作業。 A processing machine comprises: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be processed; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one processed electronic component; at least one electronic component processing device as described in claim 1: arranged on the machine; a central control device: for controlling and integrating the actions of various devices to perform automated operations.
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TW201913111A (en) * 2017-08-31 2019-04-01 鴻勁精密股份有限公司 Testing device with temperature control testing area unit and test handler using the same capable of improving test quality
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017135257A1 (en) * 2016-02-01 2017-08-10 芝浦メカトロニクス株式会社 Electronic component mounting device and mounting method, and method for manufacturing package component
TW201913111A (en) * 2017-08-31 2019-04-01 鴻勁精密股份有限公司 Testing device with temperature control testing area unit and test handler using the same capable of improving test quality
CN112352179A (en) * 2018-06-29 2021-02-09 3M创新有限公司 Apparatus and method for maintaining alignment of optical ferrules during thermal expansion or contraction

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