TW201815538A - Substrate breaking device and substrate breaking method - Google Patents

Abstract

The invention can remove the end material without damaging the surface to be exposed of the substrate.

The substrate cutting device of the present invention includes a table 2, a pressing device 1, and an air blowing device 3. The table 2 supports the bonding substrate G; the pressing device 1 presses the end portion from the first substrate G1 side to cut the end material GL along the scribe line S; the air blowing device 3 generates an air flow FL to make the end material GL from the first 1 The main body of the substrate G1 is peeled and moved.

Description

   Substrate breaking device and substrate breaking method   

The present invention relates to a substrate cutting device, and more particularly, to a cutting substrate having a first substrate with a scribe line formed on the surface for cutting off the end portion, and a bonded substrate bonded to a second substrate on the back surface of the first substrate. Device. At the same time, the present invention is also related to a substrate cutting method.

The liquid crystal device is composed of a first substrate and a second substrate with a liquid crystal layer sandwiched therebetween, and a bonding substrate bonded with a sealing material. For the bonded substrate as described above, a color filter is formed on one of the substrates (eg, the first substrate), and a thin film transistor (TFT) and a connection are formed on the other substrate (eg, the second substrate). Terminal.

In the above-mentioned bonded substrate, in order to connect to an external electronic device, the connection terminals formed on the second substrate must be exposed. In a bonded substrate which is actually a liquid crystal device, a method for separating a substrate in which a surface on which a connection terminal is formed is exposed (the inner side surface of one of the bonded substrates is exposed) is disclosed in Patent Document 1.

In Patent Document 1, first, when the scribe line is formed, the arrangement position of the cutter where the scribe line is formed on the first substrate is staggered from the arrangement position of the cutter where the scribe line is formed on the second substrate. To form an engraved line. Then, when the bonded substrate (end material) serving as the cut-off side is separated from the bonded substrate serving as the device side to expose the connection terminal, the chuck is held while the end material is held by a chuck member. The component is away from the bonding substrate which becomes the device side.

Patent Document 1: Japanese Patent Application Publication No. 2012-250871.

As described above, in the case where the end material is removed by holding and moving the end material by the chuck member, the position of the chuck member must be accurately adjusted so that the end material is not forced to form a bonded substrate on the device side. Faces with connection terminals. Because if the end material is moved in a state where the end material is strongly pressed to form the surface of the connection terminal, the connection terminal will be damaged (for example, a scratch is formed on the connection terminal).

That is, in the conventional method of separating end materials, the position of the chuck member needs to be adjusted with high accuracy. Furthermore, when the end material is formed only on one of the bonded substrates, there is a problem that the end material cannot be held by the chuck member.

The purpose of the present invention is to remove the end material after the scribe line is formed, so that the inner surface of any substrate bonded to the substrate is exposed. Using a simpler method, removing the end material does not cause the surface of the substrate to be exposed. damage.

A substrate cutting device according to one aspect of the present invention is a cutting device having a first substrate on which a scribe line is formed on the surface for cutting off the end portion, and a bonded substrate bonded to a second substrate on the back surface of the first substrate .

The substrate breaking device includes a table, a pressing device, and an air blowing device.

The worktable supports laminating substrates.

The pressing device presses the end portion from the first substrate side so that the end portion is divided along the score line.

The air blowing device generates an air flow to peel and move the end portion from the main body portion of the first substrate.

Unlike the conventional method of maintaining the end portion moving from the main body portion of the first substrate, this device peels the end portion from the main body portion of the first substrate and moves it by the airflow generated by the air blowing device.

With this breaking method, when the end portion is moved from the body portion of the first substrate, the position of the end portion during the movement is not accurately adjusted, and it is not pressed against the surface of the second substrate. In this way, when the end portion is separated from the bonded substrate, the end portion does not damage the exposed surface of the second substrate.

The air blowing device has a nozzle arranged above the end portion of the main body portion and diagonally near the end portion of the main body portion. Here, the blowing device has the above-mentioned nozzle, and for the end portion and / or the main body portion, it can provide the most suitable airflow for the end portion to move from the main body portion.

With regard to a substrate cutting method according to another aspect of the present invention, the substrate cutting method includes a first substrate having a scribe line formed on the surface for cutting off an end portion, and a bonded substrate having a second substrate bonded to a back surface of the first substrate. method. In addition, it has the following steps.

a: Support the support steps of laminating substrates on the workbench.

b: A step of breaking the end portion along the scribe line by pressing the end portion from the first substrate side.

c: An air blowing step in which an end portion is peeled off and moved from the main body portion of the first substrate by generating an air flow.

In the air blowing step, air can be blown out obliquely in the main body portion from above the position away from the end portion toward the vicinity of the end portion of the main body portion.

In the present invention, in the case where the end portion is removed after the scribe line is formed to expose the inner side surface of the second substrate to which the substrate is bonded, a simpler method is used, without applying excessive pressure to the surface to be exposed of the second substrate and Remove the end material.

1‧‧‧Pressing device

11‧‧‧Pressing section

11a‧‧‧Pressing surface

2‧‧‧Workbench

3‧‧‧ blowing device

31‧‧‧Nozzle

33‧‧‧Gas supply device

FL‧‧‧Airflow

G‧‧‧ Laminated substrate

G1‧‧‧The first substrate

G2‧‧‧The second substrate

GL‧‧‧End material

S‧‧‧ scribed

FIG. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining a pressing step of a substrate cutting method.

FIG. 3 is a schematic diagram for explaining a blowing step of the substrate breaking method.

FIG. 4 is a schematic view showing a state where the end material is separated in the blowing step.

FIG. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention. This device is a device for removing the end material GL located at the end of the surface of one of the substrates G to which the substrate is bonded. As shown in FIG. 1, the bonded substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the back surface of the first substrate G1. Here, a score line S is formed on the surface of the first substrate G1, and the end material GL is removed along the score line S.

The breaking device includes a pressing device 1, a table 2, and an air blowing device 3. The pressing device 1 is supported by a gantry member and the like not shown in the drawing in a vertical direction on the paper surface of FIG. 1. The pressing device 1 is freely raised and lowered by the driving member M1 and includes a pressing portion 11. The table 2 is arranged such that the first substrate G1 is above, and supports the bonding substrate G. In addition, the bonding substrate G is disposed with the end material GL at a position further outside the end surface of the table 2, that is, the support material of the table 2 does not exist below the end material GL. The table 2 is moved in the left-right direction in FIG. 1 by including a drive member M2 such as a drive motor or a guide member.

The pressing portion 11 of the pressing device 1 presses the end material GL on the bonded substrate G from the first substrate G1 side by the pressing surface 11 a. In this way, the end material GK will be cut along the score line S. The pressing portion 11 is formed of a resin or the like having lower rigidity than the first substrate G1. Therefore, the pressing portion 11 can be elastically deformed when the end material GL is pressed.

The air blowing device 3 generates an air flow (for example, nitrogen in the air) FL by obliquely facing the main surface of the body portion of the first substrate G1, and removes the end material GL separated by the pressing of the pressing portion 11 from the first substrate G1. The main body (the first substrate G1 other than the end material GL) is peeled and moved.

The air blowing device 3 has a nozzle 31 arranged near the end of the main body portion obliquely above the end (close to the end material GL) of the main body portion of the first substrate G1. The air blowing device 3 controls a gas supply device 33 connected to the nozzle 31 so that an air flow FL having a predetermined flow velocity and pressure is generated from the nozzle 31. Thereby, the air blowing device 3 can provide an optimal airflow for the end material GL to move it from the first substrate G1.

The gas flow rate or pressure of the gas stream FL can be appropriately adjusted based on, for example, the size or weight of the end material GL.

In addition, the number of the nozzles 31 is not limited to one. For example, a plurality of nozzles may be arranged along the width direction of the first substrate G1. The nozzle 31 may be moved in the width direction of the first substrate G1. Accordingly, the air flow FL is supplied to the entire width direction of the first substrate G1 (the end material GL), and the posture of the end material GL can be controlled while being separated from the main body of the first substrate G1.

Next, a method of cutting the end material GL of the first substrate G1 from the bonded substrate G and removing the end material GL from the first substrate G1 will be described.

First, a bonded substrate G on which the first substrate G1 and the second substrate G2 are bonded is prepared, and an scribe line forming apparatus (not shown in the figure) is used to bond the surface of the first substrate G1 (not bonded to the second substrate). The surface on the side), forming a score line S.

Next, the supporting substrate G is supported on the supporting surface of the table 2. Here, when the bonding substrate G is supported on the table 2, it is supported as follows. That is, as shown in FIG. 1, the first substrate G1 on which the scribe line S is formed on the surface is arranged above, and the scribe line S and the end portion (which is a part of the end material GL) are positioned on the table 2 The support substrate G is arranged in a manner to be positioned further outside. The end material GL is disposed directly below the pressing portion 11.

Then, as shown in Fig. 2, the pressing portion 11 is lowered, and the end material GL is pressed downward by the pressing surface 11a. At this time, because there is no supporting surface of the table 2 under the end material GL, the portion of the end material GL is pressed by the pressing portion 11, and a crack formed immediately below the scribe line S of the first substrate extends in the thickness direction of the substrate. So that the end material GL is completely cut off.

Thereafter, as shown in FIG. 3, the pressing portion 11 is raised, and a gas is supplied from the gas supply device 33 to the nozzle 31 to generate an air flow FL. The nozzle 31 is arranged near the end (or the main surface) of the main body portion obliquely (that is, at a non-vertical angle), so the air flow FL has a component parallel to the main surface of the first substrate G1.

Due to the wind pressure of the components of the above-mentioned air flow FL parallel to the main surface of the first substrate G1, the end material is cut away from the body portion of the first substrate G1 as shown in FIG. 4 and further away from the first substrate G1 mobile.

In this way, due to the air flow FL, the end material GL does not need to be kept moving by some members, but is separated from the main body portion of the first substrate in a non-contact manner. Therefore, in the separation of the end material GL, since the exposed surface of the second substrate G2 is not pressed by the end material GL, the end material GL does not damage the exposed surface.

The present invention is not limited to the embodiments described above, and various modifications or corrections can be made without going beyond the scope of the present invention.

In the above embodiment, although air or nitrogen is used as the gas for moving the end material GL, the environment (air) for separating the end material GL may be used, and other gases (for example, inert gas such as argon) are used. ).

Claims (4)

A substrate breaking apparatus system having a surface formed with a cut off of the first substrate to the end portion of the scribe line, the breaking means and the sub-substrate bonded to the second substrate 2 of the back surface of the first substrate together, comprising: The table supports the bonding substrate; the pressing device presses the end portion from the first substrate side so that the end portion is divided along the scribe line; and the air blowing device generates airflow to make the above The end portion is peeled from the body portion of the first substrate and moved.     For example, the substrate breaking device of the first patent application range, wherein the air blowing device has a nozzle arranged above the end portion of the main body portion and diagonally near the end portion of the main body portion.         A substrate cutting method is a method for cutting a bonded substrate having a first substrate with a scribe line formed on the surface for cutting off an end portion, and a bonded substrate bonded to a second substrate on the back surface of the first substrate, including: A support step to support the above-mentioned bonded substrate on the table; a breaking step to break the end along the scribe line by pressing the end portion from the first substrate side; and an air blowing step by generating The air flow peels and moves the end portion from the main body portion of the first substrate.         For example, the method for cutting a substrate according to item 3 of the patent application, wherein the above-mentioned blowing step is to blow the air stream obliquely from above the end portion of the main body portion toward the end portion of the main body portion.