TWI725201B - Substrate breaking device and substrate breaking method - Google Patents

Abstract

The invention can remove the end material without damaging the surface of the substrate to be exposed.

The substrate cutting device of the present invention includes a table 2, a pressing device 1, and an air blowing device 3. The workbench 2 supports the bonded substrate G; the pressing device 1 presses the end from the side of the first substrate G1 to break the end material GL along the scribe line S; the air blowing device 3 generates an airflow FL to make the end material GL from the first substrate G1 side 1 The main body of the substrate G1 is peeled off and moved.

Description

Substrate breaking device and substrate breaking method

The present invention is a substrate cutting device, in particular, it relates to the cutting of a first substrate having a scribe line formed on the surface for cutting off the end, and a second substrate bonded to the back of the first substrate. Device. At the same time, the present invention is also related to the substrate breaking method.

The liquid crystal device is composed of a bonded substrate in which a first substrate and a second substrate sandwich a liquid crystal layer, and are bonded with a sealing material. For the above-mentioned laminated substrates, one of the above-mentioned substrates (for example: the first substrate) is formed with a color filter, and the other substrate (for example: the second substrate) is formed with a TFT (Thin Film Transistor) and connection Terminal.

In the above-mentioned bonded substrate, in order to connect to an external electronic device, it is necessary to expose the connection terminal formed on the second substrate. In practically a laminated substrate of a liquid crystal device, a method for separating the substrate in which the surface on which the connection terminal is formed is exposed (exposing the inner surface of one of the laminated substrates) is disclosed in Patent Document 1.

In Patent Document 1, first, when the scribe line is formed, the position of the cutter that forms the scribe line on the first substrate is shifted from the position of the cutter that forms the scribe line on the second substrate. , Form a score line. Then, when separating the bonded substrate (end material) on the side to be cut from the bonded substrate on the device side to expose the connection terminals, the chuck is held in a state where the end material is held by a chuck member The component is far away from the bonding substrate on the device side.

Patent Document 1: JP 2012-250871 A.

As mentioned above, when the end material is removed by the method of holding the end material by the chuck member and moving, the position of the chuck member must be accurately adjusted so that the end material will not be forced into the formation of the bonding substrate on the device side There is a connection terminal surface. This is because if the end material is moved in a state where the end material is strongly pressed on the surface where the connection terminal is formed, the connection terminal will be damaged (for example, scratches are formed on the connection terminal).

That is, in the conventional method for separating end materials, the position of the chuck member needs to be adjusted with high precision. Furthermore, when the end material is formed only on one of the substrates of the bonded substrate, there is a problem that the end material cannot be held by the chuck member.

The purpose of the present invention is to remove the end material after the scribing line is formed, so that the inner side of any substrate of the bonded substrate is exposed, using a simpler method to remove the end material without causing the substrate to be exposed. damage.

Regarding a part of the substrate cutting device of the present invention, it is a cutting device having a first substrate on which a scribe line for cutting off the end is formed, and a bonding substrate that is bonded to a second substrate on the back of the first substrate .

The substrate breaking device is equipped with a table, a pressing device, and an air blowing device.

The workbench supports the bonding of the substrate.

The pressing device presses the end from the side of the first substrate to break the end along the scribe line.

The air blowing device generates air flow to peel off the end from the main body of the first substrate and move it.

This device is different from the conventional way of keeping the end moving from the main body of the first substrate, but uses the air flow generated by the blowing device to peel and move the end from the main body of the first substrate.

With this breaking method, when the end is moved from the main body of the first substrate, even if the moving position of the end is not accurately adjusted, it will not be pressed against the surface of the second substrate. In this way, when the end portion is separated from the bonded substrate, the end portion will not damage the exposed surface of the second substrate.

The blowing device has a nozzle arranged above the end of the main body and obliquely to the position near the end of the main body. Here, the blowing device has the above-mentioned nozzle to provide the most suitable air flow for the end and/or the main body to move the end from the main body.

Regarding another part of the substrate cutting method of the present invention, the cutting of a first substrate with a scribe line formed on the surface for cutting off the end and a bonded substrate with a second substrate bonded to the back of the first substrate method. Moreover, it has the following steps.

a: Support the supporting steps of bonding the substrate to the workbench.

b: A cutting step in which the end is divided along the scribe line by pressing the end from the side of the first substrate.

c: The blowing step of peeling and moving the end from the main body of the first substrate by generating air flow.

In the blowing step, the air flow can be blown obliquely from above the position away from the end of the main body to the vicinity of the end of the main body.

The present invention adopts a simpler method without applying excessive pressure on the surface of the second substrate to be exposed when the end portion is removed after the scribe line is formed to expose the inner surface of the second substrate to be bonded to the substrate. Remove the end material.

1‧‧‧Pressing device

11‧‧‧Pressing part

11a‧‧‧Pressing surface

2‧‧‧Working table

3‧‧‧Blowing device

31‧‧‧Nozzle

33‧‧‧Gas supply device

FL‧‧‧Airflow

G‧‧‧Laminated substrate

G1‧‧‧The first substrate

G2‧‧‧Second substrate

GL‧‧‧End Material

S‧‧‧Scribe

Fig. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram for explaining the pressing step of the substrate breaking method.

Fig. 3 is a schematic diagram for explaining the blowing step of the substrate cutting method.

Fig. 4 is a schematic diagram showing the situation where the end material is separated during the blowing step.

Fig. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention. This device is for removing the end material GL located at the end of the surface of one of the substrates G attached. The bonded substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the back surface of the first substrate G1 as shown in FIG. 1. Here, a scribe line S is formed on the surface of the first substrate G1, and the end material GL is removed along the scribe line S.

The breaking device includes a pressing device 1, a workbench 2, and a blowing device 3. The pressing device 1 is supported by a gantry member that is not shown in the drawings in the vertical direction of the paper in FIG. 1. The pressing device 1 can be lifted and lowered freely by the driving member M1 and has a pressing portion 11. The workbench 2 is arranged with the first substrate G1 above, and supports the bonding of the substrate G. In addition, the bonded substrate G is arranged in such a way that the end material GL is arranged at a position further outside the end surface of the worktable 2, that is, the support surface of the worktable 2 does not exist under the end material GL. The worktable 2 can be moved in the left-right direction in FIG. 1 by including a driving member M2 such as a driving motor or a guide member.

The pressing portion 11 of the pressing device 1 presses the end material GL from the side of the first substrate G1 by the pressing surface 11a with respect to the bonded substrate G. In this way, the end material GK will be broken along the score line S. The pressing portion 11 is formed of resin or the like having lower rigidity than the first substrate G1. Therefore, the pressing portion 11 can be elastically deformed when pressing the end material GL.

The air blowing device 3 generates an air flow (for example, nitrogen in the air) FL diagonally facing the main surface of the main body of the first substrate G1, and removes the end material GL separated by the pressing of the pressing part 11 from the first substrate G1 The main body (the first substrate G1 except for the end material GL) peels off and moves.

The blowing device 3 has a nozzle 31 arranged obliquely near the end of the main body of the first substrate G1 above the end of the main body (close to the end material GL). The blowing device 3 controls the gas supply device 33 connected to the nozzle 31 to generate a flow FL with a specified flow rate and pressure from the nozzle 31. Thus, the air blowing device 3 can provide an optimal air flow for the end material GL to move from the first substrate G1.

The gas flow rate or pressure of the gas flow FL can be appropriately adjusted based on, for example, the size or weight of the end material GL.

In addition, the number of nozzles 31 is not limited to one. For example, a plurality of nozzles may be arranged along the width direction of the first substrate G1. In addition, the nozzle 31 may be moved in the width direction of the first substrate G1. In this way, the air flow FL is supplied to the entire width direction of the first substrate G1 (end material GL), and the end material GL can be separated from the main body of the first substrate G1 while controlling the posture of the end material GL.

Next, a method of separating the end material GL of the first substrate G1 from the bonded substrate G and removing the end material GL from the first substrate G1 will be described.

First, prepare the bonding substrate G to which the first substrate G1 and the second substrate G2 are bonded, and use a scribe line forming device not shown in the figure to apply it to the surface of the first substrate G1 (not bonded to the second substrate). On the surface of the joint side), a scribe line S is formed.

Then, support and attach the substrate G to the supporting surface of the workbench 2. Here, when the laminated substrate G is supported on the workbench 2, it is supported in the following manner. That is, as shown in FIG. 1, the first substrate G1 on which the scribe line S is formed on the surface is arranged above, and the scribe line S and the end (part of the end material GL) are positioned on the table 2 The way to support the position on the outer side of the surface is to arrange and attach the substrate G. In addition, the end material GL is arranged at a position directly below the pressing portion 11.

Then, as shown in Fig. 2, the pressing portion 11 is lowered, and the end material GL is pressed downward by the pressing surface 11a. At this time, because there is no supporting surface of the table 2 under the end material GL, the pressing portion 11 presses the part of the end material GL, and the crack formed directly under the scribe line S of the first substrate extends in the thickness direction of the substrate , So that the end material GL is completely cut off.

After that, as shown in FIG. 3, the pressing portion 11 is raised, and gas is supplied to the nozzle 31 by the gas supply device 33 to generate an air flow FL. Since the nozzle 31 is arranged obliquely (that is, at a non-perpendicular angle) near the end (or main surface) of the main body, the air flow FL has a component parallel to the main surface of the first substrate G1.

Due to the wind pressure of the components of the above-mentioned air flow FL parallel to the main surface of the first substrate G1, the end material is cut away from the main body of the first substrate G1 as shown in FIG. 4, and in a direction away from the first substrate G1 mobile.

In this way, due to the airflow FL, the end material GL does not need to be kept moving by some members, but is separated from the main body of the first substrate in a non-contact manner. Therefore, in the separation of the end material GL, since the exposed surface of the second substrate G2 is not pressed by the end material GL, the end material GL does not damage the exposed surface.

The present invention is not limited to the above-mentioned embodiments, and various modifications or corrections can be made without exceeding the scope of the present invention.

In the above-mentioned embodiment, although air or nitrogen is used as the gas to move the end material GL, it can also be regarded as the environment (air) for performing the separation of the end material GL, and other gases (such as Argon) and other inert gases can be used. ).

1‧‧‧Pressing device

11‧‧‧Pressing part

11a‧‧‧Pressing surface

2‧‧‧Working table

3‧‧‧Blowing device

31‧‧‧Nozzle

33‧‧‧Gas supply device

G‧‧‧Laminated substrate

G1‧‧‧The first substrate

G2‧‧‧Second substrate

GL‧‧‧End Material

S‧‧‧Scribe

M1‧‧‧Drive member

M2‧‧‧Drive member

Claims (4)

A substrate breaking apparatus system having a surface formed with a cut off of the first substrate to the end portion of the scribe line, the breaking means and the sub-substrate bonded to the second substrate 2 of the back surface of the first substrate together, comprising: A workbench that supports the laminated substrate; a pressing device that presses the end from the side of the first substrate to break the end along the scribe line; and an air blowing device that generates airflow to make the The end part is peeled from the main body part of the first substrate and moves. Such as the substrate cutting device of the first item of the scope of patent application, wherein the blowing device has a nozzle arranged above the end of the main body and obliquely toward the vicinity of the end of the main body. A method for separating a substrate is a method of separating a bonded substrate having a first substrate on which a scribe line for cutting off the end is formed, and a second substrate bonded to the back of the first substrate. The method includes: The supporting step, supporting the above-mentioned bonded substrate on the workbench; the breaking step, by pressing the end from the side of the first substrate, so that the end is broken along the scribe line; and the blowing step, by generating The air flow separates and moves the end portion from the main body portion of the first substrate. For example, in the substrate cutting method of item 3 of the scope of patent application, the blowing step is to blow the air flow obliquely near the end of the main body from above the position away from the end of the main body.

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