JP2015164895A - Parting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a parting device capable of cutting out unit products at a break part without turning a strip-like substrate cut out from a mother substrate, by 90 degrees.SOLUTION: Strip-like substrates Wa, in which a plurality of unit products W1 separated by scribe lines L1 to L4 are arrayed in one row along the longitudinal direction, are cut out from a mother substrate W, and the cut-out strip-like substrates Wa are transported, while keeping their positions, along a substrate longitudinal direction to a break part C by a transportation part D, and are sequentially parted from the scribe lines L1 to L4 so that the unit products W1 are parted.

Description

  The present invention relates to a mother substrate cutting apparatus made of a brittle material such as a glass substrate. In particular, the present invention relates to a cutting apparatus that cuts out a strip-shaped substrate from a scribe line formed on a large-sized mother substrate and divides a unit product from the strip-shaped substrate. Here, the strip-shaped substrate refers to a substrate in which a plurality of unit substrates (unit products) are arranged in a line. In the strip-shaped substrate, the direction in which the unit substrates are arranged is the longitudinal direction.

  When cutting a strip-shaped substrate from a mother substrate such as a glass substrate, as shown in FIG. 19, the cutter wheels 20 and 21 arranged in directions orthogonal to each other are rolled against the mother substrate W so as to cross each other. A plurality of vertical and horizontal scribe lines Sa and Sb (only one is shown in FIG. 19) are formed, and then the substrate W is broken by the break bar 22 from the vertical scribe line Sb. There is known a method of forming a unitary substrate Wa, rotating the strip-shaped substrate Wa 90 degrees, and breaking along a scribe line Sa with a break bar 23 to take out a unit product W1 (for example, Patent Document 1).

  In a processing apparatus that performs this dividing method, a rotation mechanism that rotates the strip-shaped substrate W by 90 degrees while maintaining a horizontal posture on the mounting plane is used together with a transport mechanism that transports the substrate in a linear direction.

JP 2006-315901 A

  In the above-described conventional dividing method, first, since a rotation mechanism for rotating the strip-shaped substrate W by 90 degrees while maintaining the horizontal posture on the mounting plane is necessary, a turntable is provided, and therefore However, when the strip-shaped substrate is rotated, fine adjustment work of the angular position accompanying the rotation is required, which increases the manufacturing equipment cost and lengthens the manufacturing line.

  Therefore, in the present invention, when the unit product is taken out from the mother substrate, it is transported while maintaining the longitudinal direction of the strip substrate in one direction without using a rotating mechanism that rotates the strip substrate. It is an object of the present invention to provide a mother board cutting apparatus for performing a cutting process.

  In order to achieve the above object, the present invention takes the following technical means. That is, in the cutting apparatus of the present invention, a strip-like substrate in which a plurality of unit products separated from the mother substrate by a scribe line are arranged in a line along the longitudinal direction is cut out by the first break portion, and the cut strip-like substrate While maintaining the posture of the substrate without changing the orientation of the substrate, the unit product was taken out by being transported to the second break portion by the transport portion along the longitudinal direction of the substrate and sequentially being cut off from the scribe line.

  According to the cutting apparatus of the present invention, the strip-shaped substrate cut out from the mother substrate is transported to the break portion along the longitudinal direction of the substrate without being rotated and divided into unit products while maintaining the posture. Therefore, the mechanism for rotating the strip-shaped substrate by 90 degrees as in the prior art can be omitted, which can reduce the equipment cost and make the production line more compact. effective.

  According to this apparatus, the strip-shaped substrate cut out from the mother substrate is transported to the break portion along the substrate longitudinal direction while maintaining its posture, and is divided into unit products. The mechanism for rotating the substrate 90 degrees can be omitted, which can save the equipment and reduce the cost, and can make the production line compact.

It is a top view which shows roughly an example of the cutting device of this invention. It is a front view of the scribe part in the said cutting device. It is the schematic of the break part in the said cutting device. It is explanatory drawing which shows the 1st procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 2nd procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 3rd procedure of the parting method using the parting apparatus of this invention. It is explanatory drawing which shows the 4th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 5th procedure of the parting method using the parting apparatus of this invention. It is explanatory drawing which shows the 6th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 7th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 8th procedure of the parting method using the parting apparatus of this invention. It is explanatory drawing which shows the 9th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 10th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 11th procedure of the parting method using the parting apparatus of this invention. It is explanatory drawing which shows the 12th procedure of the parting method using the parting apparatus of this invention. It is explanatory drawing which shows the 13th procedure of the cutting method using the cutting apparatus of this invention. It is explanatory drawing which shows the 14th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the 15th procedure of the cutting method using the cutting device of this invention. It is explanatory drawing which shows the cutting-out means of the conventional strip-shaped board | substrate.

  Hereinafter, details of the cutting apparatus according to the present invention will be described in detail with reference to FIGS. FIG. 1 is a plan view showing an example of a cutting apparatus 1 according to the present invention. The cutting apparatus 1 includes a scribe portion A for processing a scribe line on a mother substrate W, a first break portion B for dividing the mother substrate W into strips from the scribe line, and a strip-shaped substrate Wa (see FIG. 11)) and a transport unit for receiving the strip-shaped substrate Wa divided by the first break unit B and transporting it to the second break unit C along the longitudinal direction of the substrate. D.

  The scribe part A (see FIG. 2) includes a pair of left and right columns 2, 2 and a horizontal beam (also called a beam) 3 bridged by these columns 2, 2, and the horizontal beam 3 is arranged along the X direction. Yes. A plurality of, in the present embodiment, four scribe heads 4 are provided on the cross beam 3 so as to be movable along the guide 5 in the X direction. The number of scribe heads 4 is set in accordance with the number of unit products W1 formed on a strip-shaped substrate Wa described later. A cutter wheel 6 for processing vertical and horizontal scribe lines on the mother substrate W is attached to the lower end of the scribe head 4. The cutter wheel 6 is attached so that its rolling direction can be switched to both the X direction and the Y direction orthogonal to the X direction on a plane by a switching mechanism (not shown) built in the scribe head 4.

  Below the scribe head 4, there is disposed a table 7 with a Y-direction transport roller that supports the placed mother substrate W and transports the placed substrate W from the table 7 in the Y direction. In addition, in order to accurately perform linear conveyance, the upper end side of the mother substrate W is gripped on one side of the table 7 (the side opposite to the first break portion B side for carrying out the substrate), and the Y-direction conveyance roller of the table 7 A chuck mechanism (not shown) for transporting the mother substrate W in the Y direction may be provided in conjunction with the transport movement. The mother substrate W can be moved back and forth in the Y direction by these transport mechanisms.

  The first break portion B and the second break portion C (see FIG. 3) use a general break mechanism that divides the substrate by applying an external force along the scribe line to bend the substrate. Although a detailed description of the mechanism is omitted, a plate-like break bar 10 that extends long along the scribe line S below the surface opposite to the surface on which the scribe line S of the substrate W is provided (the lower surface in this embodiment). A pair of presser bars or rollers 11 are provided on the left and right sides of the scribe line S on the upper surface side of the substrate W. Then, the break bar 10 is raised to bend the substrate W slightly in an inverted V shape, so that the scribe line (crack) penetrates in the depth direction and is divided.

  The break bar of the first break part B is extended along the X direction so that the mother substrate W can be divided from a scribe line in the lateral direction (X direction) described later, and between the scribe part A and the transport part D. is set up. The break bar of the second break part C extends in the Y direction so that the divided strip-shaped substrate Wa can be divided from the scribe line in the vertical direction (Y direction), and is installed on the carry-out side of the transfer part D. .

The transport unit D includes a Y-direction transport roller (not shown) that moves the strip-shaped substrate divided by the first break unit B in the Y direction (direction perpendicular to the longitudinal direction of the strip-shaped substrate), and the X direction (strip). The strip is formed by a table having an X-direction transport roller (not shown) that is moved in the same direction as the longitudinal direction of the substrate, and is first cut by the first break portion B by operating the Y-direction transport roller. After the substrate is received and stopped at a predetermined fixed position, the X-direction transport roller is subsequently operated and carried out to the second break portion C side.
Therefore, as shown in FIG. 1, the scribe part A, the first break part B, and the part of the transport part D that receives the strip-shaped substrate Wa are arranged in the Y direction so that the substrates are transported in this order, The part D and the second break part C are arranged in the X direction so that the substrates are transported in this order.
The transport mechanism is not limited to the above-described transport roller, and may be moved by, for example, a robot arm that can suck the substrate.

  Further, the first break portion B and the table 7 are omitted in FIGS. 4 to 18 in order to avoid complication of the drawings.

Next, a cutting method using the cutting device 1 will be described.
As shown in FIGS. 1 and 2, a mother substrate W is disposed on the table 7 of the scribe part A in advance. There is no particular limitation on the pre-process until it is placed on the table 7. For example, a driving mechanism (such as the ball screw 9 and the rail 8 in FIG. 2) for moving in the X and Y directions is provided on the table 7 itself. The mother substrate may be moved to the origin position for starting the cutting process according to the present invention by moving the table 7 in the X direction or the Y direction.
In FIG. 1, a virtual line drawn with a two-dot chain line on the mother substrate W indicates a scribe planned line, and W1 indicates an area of a unit product that is finally cut off from the scribe planned line.

  As shown in FIG. 4, the mother substrate W is moved below the scribe head 4, and the cutter wheel of one scribe head 4 at the right end is moved to the lower side of the mother substrate W (the side on the near side of the mother substrate W in FIG. ) While being pressed along the first scribe line L1 (see FIG. 1) extending in the lateral direction (X direction) in the vicinity of). As a result, the first horizontal scribe line S1 that separates the end material region 13 in the lower side portion of the mother substrate W is processed.

  Thereafter, as shown in FIG. 5, the end material region 13 is divided from the first scribe line S1 by a first break portion B (see FIG. 1 for omission in FIG. 5), and the end material is discarded to the outside. At this time, it may be discarded by being grasped by a robot arm or the like, or may be removed by blowing with compressed air.

  Next, after switching the rolling direction of the cutter wheels of all the scribe heads 4 to the Y direction, as shown in FIGS. 6 and 7, the mother substrate W is already divided by using all the four scribe heads 4. Scribing simultaneously in the vertical direction (Y direction) from the lower side to the second planned scribe line L2 in the horizontal direction that will form one side (upper side) along the longitudinal direction of the strip-shaped substrate Wa after dividing. To do. At this time, the cutter wheel 4 stops, and scribing is performed by moving the mother substrate W in the Y direction by the Y-direction transport roller of the table 7. Thus, the vertical second scribe line S2 that forms the substantial right side of the unit product is processed.

  Next, as shown in FIG. 8 and FIG. 9, by substantially scribing in the vertical direction from the lower side of the mother substrate W to the second horizontal scribe line L <b> 2 with four scribe heads 4 in the same manner, A vertical third scribe line S3 that forms a typical left side is processed. The second scribe line S2 and the third scribe line S3 may be processed in reverse order.

  Next, as shown in FIG. 10, along the second horizontal scribe line L2 (see FIG. 9), the cutter wheel of the scribe head 4 at the right end is moved in the X direction to perform scribing. Four scribe lines S4 are formed.

Thereafter, as shown in FIG. 11, the mother substrate W is moved in the Y direction by the Y-direction transport roller of the table 7 and the Y-direction transport roller of the transport unit D, and the mother substrate W is moved from the back side of the fourth scribe line S. By dividing in the X direction at the first break portion B (see FIG. 1), the first strip-shaped substrate Wa is completely divided and cut out.
The strip-shaped substrate Wa cut out has a rectangular shape in which four unit products W1 divided by scribe lines S2 and S3 in the vertical direction (Y direction) are arranged in a line along the longitudinal direction. It is cut out in a posture in which the direction is directed to the X direction.

  The cut strip-shaped substrate Wa is kept in a posture in which the longitudinal direction is directed to the X direction, and the Y transport roller of the transport unit D is used to transfer the predetermined portion of the transport unit D in the direction perpendicular to the longitudinal direction of the substrate (−Y direction). It is conveyed to the fixed position. The strip-shaped substrate Wa transferred to the fixed position of the transport unit D is subsequently transported in the X direction while maintaining the posture in which the longitudinal direction is directed to the X direction, and transported to the second scribe unit C to be unit products. Sequentially divided into W1.

Further, after the first strip-shaped substrate Wa is cut out, the next strip-shaped substrate Wa is divided from the mother substrate W through the same procedure as described above. That is, after the first strip-shaped substrate Wa is cut out, as shown in FIG. 11, the cutter wheel of the scribe head 4 at the right end is scribed along the third horizontal scribe line L3 (see FIG. 1). Thus, the fifth horizontal scribe line S5 is processed. Thereafter, as shown in FIG. 12, the end material 14 is divided from the fifth scribe line S5 and discarded to the outside.
Note that the end material region may not be provided by matching the third horizontal scribe planned line L3 and the second horizontal scribe planned line L2 in the strip-shaped substrate processed immediately before. In that case, the fifth scribe line S5 is already formed.

  Next, as shown in FIGS. 13 and 14, by using all four scribe heads 4, by scribing in the vertical direction from the already divided lower side of the mother substrate W to the fourth horizontal scribe line L4, A sixth vertical scribe line S6 that forms the substantial right side of the unit product W1 is formed.

Next, as shown in FIGS. 15 and 16, the four scribe heads 4 substantially scribe the unit product by scribing in the vertical direction from the already divided lower side of the mother substrate W to the fourth horizontal scribe line L4. 7th scribe line S7 which forms a right side is processed.
In this case, the sixth scribe line S6 and the seventh scribe line S7 may be formed in the reverse order.

  Thereafter, as shown in FIG. 17, the eighth horizontal scribe line S8 is formed by scribing the cutter wheel of the scribe head 4 at the right end along the fourth horizontal scribe line L4 (see FIG. 1). To do.

  Next, as shown in FIG. 18, the next strip-shaped substrate Wa is completely divided and cut out by dividing the mother substrate W from the eighth scribe line at the first break portion B (see FIG. 1).

  As described above, the strip-shaped substrate Wa cut out from the mother substrate W is transported in the −Y direction while maintaining its orientation without changing the orientation, and then is directed toward the second break unit C by the transport unit D. Since it is conveyed in the direction and sequentially divided into unit products W1, only linear movement is carried. A conventional rotating mechanism (turntable) for rotating the strip-shaped substrate by 90 degrees can be omitted, so that the equipment cost can be reduced and the production line can be made compact. . Further, it is not necessary to finely adjust the angle associated with the rotation of the strip-shaped substrate.

  In the above embodiment, the mother substrate W is moved in the Y direction to process the vertical scribe line, but conversely, the horizontal beam 3 and the support column 2 that support the scribe head 4 may be moved so as to be scribed. Good. Moreover, although the horizontal scribe line was processed with one cutter wheel at the right end, it may be processed using another cutter wheel.

  While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.

  The cutting apparatus of the present invention is used when a strip-shaped substrate is formed from a mother substrate made of a brittle material such as a glass substrate and further divided into unit products.

A scribe section B first break section C second break section D transport section L1 first horizontal scribe line L2 second horizontal scribe line
L3 3rd horizontal scribe line L4 4th horizontal scribe line S1 1st scribe line S2 2nd scribe line S3 3rd scribe line S4 4th scribe line W Mother board W
Wa Strip-shaped substrate W1 Unit product 1 Cutting device 4 Scribe head 6 Cutter wheel 7 Table 13 End material

Claims (1)

A first break portion that cuts out a strip-shaped substrate in which a plurality of unit products separated by a scribe line from the mother substrate are arranged in a line along the longitudinal direction;
A transport unit for transporting in the longitudinal direction while maintaining the posture without changing the direction of the strip-shaped substrate cut out by the first break unit;
A second break unit that sequentially cuts out the unit substrates from the strip-shaped substrate conveyed by the conveyance unit;
The cutting apparatus characterized by having.