TWI849035B - Breaking method and splitting method - Google Patents

Abstract

The present invention provides a breaking method that can easily and well break along a scribe line formed on a bonded substrate, and a cracking method applied to the breaking method. The breaking method of the present invention is to break a substrate 10 formed by bonding a first substrate 11 and a second substrate 12 by a sealing material SL, and includes: forming a first scribe line L1 on a surface 11a of the first substrate 11 at a position opposite to the sealing material SL; forming a second scribe line L1 on a surface 12a of the second substrate 12 at a position opposite to the sealing material SL. L2; pressing the area including the first scribe line L1 so that the second vertical crack C2 penetrates along the second scribe line L2; and pulling the areas of the substrate 10 separated by the first scribe line L1 and the second scribe line L2 away from each other in a direction parallel to the substrate 10, thereby separating the substrate 10 along the first scribe line L1 and the second scribe line L2.

Description

Breaking method and splitting method

The present invention relates to a separation method for forming a scribe line to separate a bonded substrate, and a bonded substrate cleaving method applied to the separation method.

In the past, the breaking of brittle material substrates such as glass substrates was performed by a scribing step of forming a scribing line on the surface of the substrate and a cracking step of applying a predetermined force to the surface of the substrate along the formed scribing line. In the scribing step, the scribing wheel is pressed against the surface of the substrate while being moved along the predetermined line.

The following patent document 1 describes a cleavage method, which is to cleave a substrate formed by bonding a first substrate and a second substrate along a first scribe line formed on the surface of the first substrate and a second scribe line formed on the surface of the second substrate. The second scribe line formed on the surface of the second substrate is formed at the same position as the first scribe line in a plan view. In this cleavage method, if an impact is applied to a guide rod placed on the first scribe line toward the first substrate, the second substrate is cleaved along the second scribe line. Afterwards, a part or all of one side region bounded by the first scribe line and the second scribe line is supported by a supporting member, and the other side region bounded by the first scribe line and the second scribe line is configured to protrude from one end of the supporting member. Then, the first substrate is fractured along the first scribe line by pressing the other side region with a fracture bar.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2017-013239

In the case of a bonded substrate, the first substrate and the second substrate are bonded together by a sealing material at the crack position. In such a substrate, in the substrate formed after the scribing lines in the first substrate and the second substrate, it is difficult for the vertical cracks to fully penetrate into the substrate along the scribing lines. If the substrate is subjected to a cracking step when the vertical cracks have not fully penetrated, there is a risk that the edge of the substrate after cracking will have finer cracks or damage, resulting in a reduction in the strength of the substrate. The cracking method of Patent Document 1 cracks the bonded substrate, but does not disclose a cracking step of the bonded substrate that takes into account the penetration of the vertical cracks into each substrate. Furthermore, as in Patent Document 1, if the bonded substrate is cracked by pressing from one direction, there is a possibility that the end faces of the substrate will contact each other during cracking, resulting in substrate defects and other degradation of product quality. In particular, when at least a part of the product shape includes a curved portion, the end faces of the substrate will contact each other in the curved portion, resulting in substrate defects, so the cracking method of Patent Document 1 cannot be adopted.

In view of this topic, the purpose of the present invention is to provide a breaking method that can easily and well break along the scribe lines formed on the bonded substrate, and a cleaving method applied to the breaking method.

The first aspect of the present invention is a method for separating substrates formed by bonding a first substrate and a second substrate together with a sealing material. The method of this aspect includes: pressing a scribing wheel against a position on the surface of the first substrate opposite to the sealing material while moving the scribing wheel to form a first scribing line on the surface of the first substrate; pressing a scribing wheel against a position on the surface of the second substrate opposite to the sealing material while moving the scribing wheel to form a second scribing line on the surface of the second substrate; pressing an area including the first scribing line formed on the surface of the first substrate to cause a vertical crack to penetrate along the second scribing line to the second scribing line; The second substrate; the regions of the substrate separated by the first scribe line and the second scribe line are pulled apart from each other in a direction parallel to the surface of the substrate, thereby separating the substrate along the first scribe line and the second scribe line; the first vertical crack formed along the first scribe line has a permeability of 70-100%; the step of forming the second scribe line is performed after the step of forming the first scribe line; the second vertical crack formed along the second scribe line has a permeability lower than the vertical crack of the first scribe line.

Regarding the bonded substrate in which the first substrate and the second substrate are bonded with a sealing material, the vertical cracks will penetrate well in the substrate where the scribe line is formed first, but it is difficult for the vertical cracks to fully penetrate in the substrate where the scribe line is formed later. In this regard, by the above-mentioned structure, after the scribe line is temporarily formed before the second substrate, a force is applied to the second substrate through the first substrate, so that the vertical cracks penetrate into the second substrate along the second scribe line formed later. As a result, the second substrate becomes easy to separate along the second scribe line. In this way, the substrates can be easily separated along the first scribe line and the second scribe line.

In addition, deeper vertical cracks can be formed along the first and second scribe lines in advance, and the areas of the substrate separated by the first and second scribe lines can be pulled apart from each other in a direction parallel to the surface of the substrate, thereby separating the substrates. Therefore, when separating the substrates, there is no situation where the end faces of the substrates touch each other, and there is no need to worry about cracks or damage to the substrates. Therefore, the strength of the substrate will not be reduced, and it can be finely processed into a high-quality product.

In the segmentation method of this aspect, the first scribe line and the second scribe line can form a scribe line including a curve.

With this structure, the vertical crack can be properly penetrated into both the first and second scribe lines. Therefore, even when the first and second scribe lines include curves, the substrate can be pulled apart along the first and second scribe lines to prevent the end faces of the substrate from contacting, thereby smoothly separating the substrate. Therefore, the above-mentioned separation method can be applied to the separation of a variety of substrates.

The breaking method of this aspect can be constructed as follows: in the step of making the vertical crack penetrate into the second substrate, the elastic member is brought into close contact with the first scribe line, and the area including the first scribe line is pressed.

With this structure, the elastic member is in close contact with the area along the first scribe line, and the entire range of the area can be uniformly applied with pressure. In this way, the second scribe line formed on the surface of the second substrate can be uniformly applied with force. Therefore, in the step of making the vertical crack penetrate into the second substrate, the vertical crack can be easily penetrated into the second substrate along the second scribe line. In this way, the substrates can be easily separated along the first scribe line and the second scribe line.

In this case, the structure can be as follows: force is applied to the fixing member used to fix the elastic member, and the area including the first scoring line is pressed.

Thus, the force applied to the fixed member is fully applied to the elastic member, so that the elastic member is uniformly and closely attached to the entire area along the first scribe line. Thus, the pressure can be uniformly applied to the entire range of the area along the first scribe line, and the second scribe line formed on the surface of the second substrate can be reliably and uniformly applied. As a result, the vertical cracks can more easily penetrate into the second substrate along the second scribe line. Thus, the substrates can be easily separated along the first scribe line and the second scribe line.

The second aspect of the present invention is a cleavage method, which is to cleave a substrate formed by bonding the first substrate and the second substrate via the sealing material along a first scribe line formed on the first substrate at a position opposite to the sealing material and a second scribe line formed on the second substrate after the first scribe line at a position opposite to the sealing material. The cleavage method of this aspect includes: pressing an area including the first scribe line to allow a vertical crack to penetrate along the second scribe line to the second substrate; and pulling areas of the substrate separated by the first scribe line and the second scribe line away from each other in a direction parallel to the surface of the substrate, thereby cleaving the substrate along the first scribe line and the second scribe line. 2. The step of separating the substrate along the above-mentioned scribe line; the permeability of the first vertical crack formed along the above-mentioned scribe line is 70-100%; the step of forming the above-mentioned second scribe line is performed after the step of forming the above-mentioned first scribe line; the permeability of the second vertical crack formed along the above-mentioned second scribe line is lower than the permeability of the vertical crack along the above-mentioned first scribe line.

According to this structure, the same effect as the first aspect is achieved.

As described above, according to the present invention, a breaking method that can easily and well break along the scribe lines formed on the bonded substrate and a cleaving method applied to the breaking method can be provided.

The effect or significance of the present invention becomes clearer through the description of the implementation form shown below. However, the implementation form shown below is only an example of the implementation of the present invention, and the present invention is not limited to anything described in the following implementation form.

1: Grating wheel

10: Substrate

11: 1st substrate

11a: Surface of the first substrate

12: Second substrate

12a: Surface of the second substrate

L1: 1st scale line

L2: 2nd scale line

13: Elastic components

14: Fixed components (plate components)

15: Impact components

41: 1st substrate

41a: Surface

42: Second substrate

42a: Surface

43: Plate components

44: Elastic components

45: Hammer

100: Engraving device

101: Mobile station

102: Ball screw

103:Guide rails

104: Motor

105: Loading unit

106: Camera

107: Bridge

108a, 108b: Pillars

109: Track

110: Mobile unit

120: Engraving head

121: Supporting part

130: Holding unit

C1: 1st vertical crack

C2: Second vertical crack

F: Sealing material

G1: 1st vertical crack

G2: Second vertical crack

H: Auxiliary line

H1: Auxiliary line of evaluation object

R: Liquid crystal injection area

S:Production line

S1: Evaluation product line

SL: Sealing material

[Figure 1] is a diagram schematically showing the structure of the engraving device in the implementation form.

[Figure 2] is a flow chart showing the segmentation method of the implementation form.

[Figure 3] (a) to (f) are side views schematically showing the process of implementing the segmentation method.

[Figure 4] (a)~(e) are schematic diagrams used to illustrate the verification of the segmentation method of the implementation form.

[Figure 5] (a)~(d) are schematic diagrams used to illustrate the verification of the segmentation method of the implementation form.

Below, the implementation form of the present invention is described with reference to the drawings. Furthermore, in each figure, for the sake of convenience, the mutually orthogonal X-axis, Y-axis and Z-axis are labeled. The Z-axis represents the upper and lower sides in the vertical direction. In the following text, the upper side and the lower side respectively refer to the positive side of the Z-axis and the negative side of the Z-axis.

This embodiment is about a method for separating a bonded substrate 10 formed by bonding a first substrate 11 and a second substrate 12. Hereinafter, in this specification, "bonded substrate 10" is referred to as "substrate 10". In addition, in this embodiment, unless otherwise specified, "separating substrate 10" or "separating substrate 10" means separating or separating the first substrate 11 and the second substrate 12 at the same time.

First, the structure of the scribing device 100 for forming scribing lines on the substrate 10 is described. In this embodiment, the first scribing line L1 is first formed on the surface 11a of the first substrate 11, and then the second scribing line L2 is formed on the surface 12a of the second substrate 12.

FIG. 1 schematically shows the structure of the engraving device 100 of the embodiment 1. The engraving device 100 has a moving table 101 and an engraving head 120. The moving table 101 is screwed with a ball screw 102. The moving table 101 is supported by a pair of guide rails 103 so as to be movable along the Y-axis direction. The ball screw 102 is rotated by the drive of a motor, whereby the moving table 101 moves along the pair of guide rails 103 in the Y-axis direction.

A motor 104 is provided on the upper surface of the moving stage 101. The motor 104 rotates the upper mounting portion 105 in the XY plane and positions it at a predetermined angle. The mounting portion 105 that can be horizontally rotated by the motor 104 is provided with a vacuum adsorption means not shown. The substrate 10 mounted on the mounting portion 105 is held on the mounting portion 105 by the vacuum adsorption means.

The scribing device 100 has two cameras 106 above the substrate 10 placed on the mounting portion 105 for photographing the alignment marks formed on the substrate 10. In addition, a bridge 107 is provided on the pillars 108a and 108b in a manner that spans the moving stage 101 and the mounting portion 105 above it.

A rail 109 is installed on the bridge 107. The rail 109 is connected to the engraving head 120 via the moving part 110, and is arranged in such a way that the engraving head 120 moves along the X-axis direction by sliding the moving part 110 on the rail 109.

When using the scribing device 100 to form scribing lines on the substrate 10, firstly, the holder unit 130 on which the scribing wheel 1 is mounted is mounted on the support portion 121 of the scribing head 120.

Next, the scribing device 100 positions the substrate 10 by means of a pair of cameras 106. Then, the scribing device 100 moves the scribing head 120 to a predetermined position, applies a predetermined load to the scribing wheel 1, and makes it contact with the surface 11a of the first substrate 11. Thereafter, the scribing device 100 moves the scribing head 120 along the X-axis direction, thereby forming the first scribing line L1 on the surface 11a of the first substrate 10. Furthermore, the scribing device 100 rotates the carrier 105 or moves it along the Y-axis direction as needed, and forms the first scribing line L1 in the same manner as in the above case.

When the second scribe line L2 is formed on the surface 12a of the second substrate 12, the substrate 10 is reversed by a reversing mechanism (not shown) so that the surface 12a of the substrate 12 is located at the top. In this state, the second scribe line L2 is formed on the surface 12a of the second substrate 12 using the scribing wheel 1 in the same manner as described above.

In the above-mentioned embodiment, the scribing device 100 is shown in which the scribing head 120 moves along the X-axis direction and the carrier 105 moves and rotates along the Y-axis direction, but the scribing device 100 may be a device in which the scribing head 120 and the carrier 105 move relative to each other. For example, the scribing device 100 may be a device in which the scribing head 120 is fixed and the carrier 105 moves and rotates along the X-axis and Y-axis directions. In this case, the camera 106 may be fixed to the scribing head 120.

The substrate breaking method of this embodiment is composed of the following steps: after forming the first scribe line L1 and the second scribe line L2 using the above-mentioned scribing device 100, the second vertical crack C2 is made to penetrate into the second substrate 12 along the second scribe line L2; and the substrate 10 is separated along the first scribe line L1 and the second scribe line L2. Here, the above-mentioned action of "making the second vertical crack C2 penetrate into the second substrate 12 along the second scribe line L2" is referred to as "pre-breaking". Furthermore, the first vertical crack C1 and the second vertical crack C2 are illustrated in Figures 3(b) and (c).

FIG2 is a flow chart showing a method for cutting the substrate 10.

The substrate 10 is divided by the following steps: forming the first scribe line L1 on the first substrate 11 (S11); forming the second scribe line L2 on the second substrate 12 (S12); pre-breaking the second substrate 12 (S13); and separating the substrate 10 along the first scribe line L1 and the second scribe line L2 (S14). The steps of forming scribe lines in steps S11 and S12 are performed using the above-mentioned dividing device 100.

Next, the method for separating the substrate shown in FIG. 2 , especially steps S13 and S14 of FIG. 2 , is described in detail with reference to FIG. 3 (a) to (f).

Figures 3(a) to (f) are schematic side views of the process of the substrate 10 breaking method. Figure 3(a) is a schematic view when observing the vicinity of the engraving position from the negative side of the Y axis, and Figures 3(b) to (f) are schematic views when observing the vicinity of the engraving position of the substrate 10 from the negative side of the X axis.

Figures 3(a) to (c) show the steps of forming a scribe line, which is performed by the scribe device 100 described with reference to Figure 1. Figure 3(d) shows the step of pre-breaking the second substrate 12. Figures 3(e) and (f) show the step of separating the substrate 10.

Furthermore, the substrate 10 is formed by bonding the first substrate 11 and the second substrate 12 via a sealing material SL. As such a substrate 10, for example, a color filter (CF) is formed on the first substrate 11 and a thin film transistor (TFT) is formed on the second substrate 12. In this case, a liquid crystal injection region R is formed by the sealing material SL, the first substrate 11, and the second substrate 12, and liquid crystal is injected into the liquid crystal injection region R.

The sealing material SL may be an adhesive made of a resin material such as an epoxy resin. When the sealing material SL is made of a UV-curing resin, the first substrate 11 is overlapped on the upper surface of the second substrate 12 while the sealing material SL is applied to the surface of the second substrate 12, and then irradiated with ultraviolet rays. As a result, the sealing material SL is cured, and the first substrate 11 and the second substrate 12 are bonded together via the sealing material SL. In addition, the sealing material SL may also be made of a thermosetting resin. In this case, the sealing material SL is cured by heating, and the first substrate 11 and the second substrate 12 are bonded together via the sealing material SL. If the sealing material SL is cured, it has a higher hardness.

As shown in FIG3(a), the scribing wheel 1 is pressed against the surface 11a of the first substrate 11 while the scribing wheel 1 is moved along the positive direction of the X-axis to form the first scribing line L1. At this time, the scribing wheel 1 is pressed against the position directly above the sealing material SL, and the first scribing line L1 is formed along the sealing material SL on the surface 11a of the first substrate 11. Thus, as shown in FIG3(b), the first vertical crack C1 is formed on the first substrate 11 along the first scribing line L1. The first vertical crack C1 penetrates into the interior of the first substrate 11 toward the sealing material SL. Its penetration is 70~100%, which is high penetration. Furthermore, this step is equivalent to step S11 of FIG2.

Next, the substrate 10 is reversed by a reversing mechanism (not shown) so that the surface 12a of the second substrate 12 is located at the top. In this state, as shown in FIG3(a), the scribing wheel 1 is pressed against the surface 12a of the second substrate 12 while the scribing wheel 1 is moved along the positive direction of the X axis, thereby forming the second scribing line L2. Thus, as shown in FIG3(c), a second vertical crack C2 is formed on the second substrate 12 along the second scribing line L2. The second vertical crack C2 penetrates into the interior of the second substrate 12 toward the sealing material SL. The penetration of the second vertical crack C2 in the second substrate 12 is much lower than that of the first substrate 11, and the penetration is 15-30%. Furthermore, this step is equivalent to step S12 in Figure 2.

Next, the second substrate 12 is pre-cracked. Specifically, the substrate 10 is turned over again, as shown in FIG3(d), so that the surface 11a of the first substrate 11 is located at the top. Then, the elastic member 13 fixed to the fixing member 14 is placed on the surface 11a of the first substrate 11 in a manner covering the area including the first scribe line L1. If a force toward the first substrate 11 is applied to the fixing member 14 by the impact member 15, the second vertical crack C2 formed along the second scribe line L2 penetrates toward the sealing material SL. In FIG3(d), the circled portion is the second vertical crack C2 that has newly penetrated into the interior of the second substrate 12 by the force applied by the impact member 15. Furthermore, this step is equivalent to step S13 in Figure 2.

The elastic member 13 is, for example, rubber or resin. The fixed member 14 is a plate-shaped member having a higher hardness than the elastic member 13. The impact member 15 is a member heavier than the fixed member 14, which can move from a position away from the fixed member 14 to the fixed member 14, collide with the fixed member 14 and apply force to the substrate 10.

Furthermore, when the second substrate 12 is pre-cracked, the substrate 10 is placed on a mounting table. A buffer material is arranged between the mounting table and the substrate 10. The buffer material is made of, for example, paper or rubber.

After the second substrate 12 is pre-cracked, the substrate 10 is separated. Specifically, as shown in FIG3(e), along the first scribe line L1 and the second scribe line L2, the substrates 10 are pulled apart from each other in a direction parallel to the surface 11a of the first substrate 11. The separation by pulling can be performed manually or mechanically. Thus, as shown in FIG3(f), the separation of the substrate 10 is completed. Furthermore, this step is equivalent to step S14. Thus, the bonded substrate 10 is separated.

<Verification>

The inventors of this application have verified the effect of using the above-mentioned segmentation method. The verification and verification results are described below with reference to Figures 4(a) to 5(d).

In this verification, a substrate 40 formed by bonding a first substrate 41 and a second substrate 42 was used, and the case where the scribe line formed by the first substrate 41 and the second substrate 42 along the sealing material F was a curved line was verified. At this time, a circular scribe line and a so-called auxiliary line H were formed on each of the first substrate 41 and the second substrate 42. For the convenience of explanation, the circular scribe line is referred to as a "product line S".

Here, the so-called auxiliary line H is a scribing line formed outside the product line S in order to smoothly separate the first substrate 41 and the second substrate 42 along the product line S when the substrate is separated along the product line S that specifies the shape of the product obtained by separating the substrate 40. When separating the closed curved product, the bonded substrate 40 is first pulled apart along the auxiliary line H to separate. Thus, the extended vertical crack is induced from the separated auxiliary line H, and the first vertical crack G1 of the first substrate 41 and the second vertical crack G2 of the second substrate 42 are separated along the product line S. Thus, the product specified by the closed curved product line S is easily taken out.

Furthermore, the auxiliary line formed on the first substrate 41 and the auxiliary line formed on the second substrate 42 are both referred to as "auxiliary line H". The same is true for "product line S".

[Verification 1]

[condition]

A scribing wheel is used to form scribing lines on the surface of the bonded substrate under the following conditions.

‧Bonding substrates...1st substrate 0.2mm 2nd substrate 0.2mm

‧Shape of the engraved line (product line)...circular

‧Sealing material...WORLD ROCK 723K1 manufactured by Xieli Chemical Industry Co., Ltd.

Thickness 10μm

‧Travel load...0.06MPa

‧Travel speed...30mm/sec

‧Scribing wheel...diameter 2.0mm, blade tip angle 115 degrees

Number of grooves: 360, groove depth: 3μm

‧Elastic components...Material: rubber

‧Plate components...weight 45g, size 50×50mm

‧Hammer...weight 441g, diameter 48mm

The above-mentioned bonded substrate 40 (hereinafter referred to as substrate 40) forms product lines S on the surface 41a of the first substrate 41 and the surface 42a of the second substrate 42. Then, as shown in Figures 4 (a) and (b), the elastic member 44 attached to the plate member 43 is placed along the product line S. In this state, the second substrate 42 is pre-cracked by dropping a hammer 45 from above. Thereafter, the substrate 40 is separated along the product line S by the operator's hand.

Furthermore, in this verification, the plate member 43, the elastic member 44, and the hammer 45 in the above conditions are respectively equivalent to the fixed member 14, the elastic member 13, and the impact member 15 described with reference to the above FIG. 3(d).

In verification 1, the first substrate 41 and the second substrate 42 formed with the product line S and the auxiliary line H as shown in FIG4(c) are used. Furthermore, as shown by the dotted line in FIG4(d), the semicircle on the positive side of the Y axis of the product line S and the auxiliary line H on the positive side of the Y axis connected to the tangent of the product line S are evaluated to see whether the substrate 40 can be separated. The dotted line parts in FIG4(d) are respectively referred to as the evaluation object product line S1 and the evaluation object auxiliary line H1.

In Verification 1, the plate member 43 is an opaque one. Furthermore, in Verification 1, as shown in FIG4(e), the elastic member 44 is only placed on the product line S, and not on the auxiliary line H. Furthermore, in FIG4(e), the elastic member 44 is represented by a one-point chain line.

In this state, the hammer 45 is dropped from a predetermined height to the surface of the plate member 43 to pre-crack the second substrate 42. At this time, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from a height of 20 mm from the surface of the plate member 43.

Then, after pre-breaking the second substrate 42, the substrate 40 is separated along the product line S.

[Results of Verification 1]

After the second substrate 42 is pre-cracked, the substrate 40 is not separated along the evaluation object product line S1 in Figure 4 (d), but after separation along the auxiliary line H, the separation of the product line S can be achieved. In this case, after the second substrate 42 is pre-cracked, the substrate 40 can be easily separated.

[Verification 2]

[condition]

In Verification 2, the plate member 43 is set to be transparent. Also, as shown in FIG5(a), the shape of the auxiliary line H is different from that in Verification 1. In this case, the dotted line portion of FIG5(b) is used as the evaluation object product line S1 and the evaluation object auxiliary line H1.

Verification 2 is the same as Verification 1. The elastic member 44 is only placed on the product line S and not on the auxiliary line H (see Figure 4(e)). Other conditions are the same as Verification 1.

In this state, the second substrate 42 is pre-cracked by dropping the hammer 45 from a predetermined height to the surface 41a of the first substrate 41. At this time, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from the heights of 50 mm, 40 mm, 30 mm, and 20 mm from the surface 41a of the first substrate 41.

Then, after pre-breaking the second substrate 42, the substrate 40 is separated along the product line S.

[Results of Verification 2]

When the hammer 45 is dropped from any height to pre-crack the second substrate 42, the substrate 40 is not separated along the evaluation object product line S1 in FIG. 5(b). In this case, after the second substrate 42 is pre-cracked, the evaluation object auxiliary line H1 is separated, and then the substrate 40 is separated along the evaluation object product line S1, thereby separating the substrate 40.

Furthermore, no cracks other than vertical cracks formed along the evaluation object auxiliary line H1 and the evaluation object product line S1 were generated in any case.

[Verification 3]

[condition]

In Verification 1 and Verification 2, the elastic member 44 is placed only on the product line S. In Verification 3, the elastic member 44 is also placed on the auxiliary line H. That is, the product line S and the auxiliary line H are pre-broken.

In this case, the shape of the auxiliary line H is shown in FIG5(a), which is the same as that of Verification 2. As shown in FIG5(c), the elastic member 44 is placed on the product line S and the auxiliary line H. Other conditions are the same as those of Verification 1. That is, the plate member 43 is an opaque one. In addition, FIG5(c) is the same as FIG4(e), and the elastic member 44 is represented by a one-point chain line.

In this state, the second substrate 42 is pre-cracked by dropping the hammer 45 from a predetermined height to the surface of the plate member 43. At this time, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from the surface of the plate member 43 at heights of 20 mm, 15 mm, 10 mm, and 5 mm.

Then, after pre-breaking the second substrate 42, the substrate 40 is separated along the product line S.

[Results of Verification 3]

When the hammer 45 is dropped from any height for pre-breaking, a crack that deviates from a part of the evaluation object auxiliary line H of the substrate 40 is generated. This kind of crack does not help the breaking of the substrate 40, and there is a risk of causing partial cracking or damage to the product when the substrate 40 is broken, so it is not a preferred crack.

[Verification 4]

[condition]

In Verification 4, the elastic member 44 is placed only on the auxiliary line H. That is, only the auxiliary line H is pre-fractured.

In this case, the shape of the auxiliary line H is shown in FIG5(a), which is the same as the auxiliary line H in Verification 2. As shown in FIG5(d), only the elastic member 44 is placed on the auxiliary line H. Other conditions are the same as those in Verification 1. However, a transparent plate member 43 is used.

In this state, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from a height of 5 mm from the surface of the plate member 43.

After pre-breaking the second substrate 42, the substrate 40 is separated along the product line S.

[Results of Verification 4]

The auxiliary line H1 of the self-evaluation object produced cracks inside the product, and the substrate 40 could not be separated.

[Verification 5]

In order to improve the accuracy of pre-fracture, that is, the penetration of the second vertical crack G2 in the second substrate 42, the following verification is performed.

Substrate 40 is replaced with pressure-sensitive paper and placed on the mounting table, and an elastic member and a plate member are placed on the pressure-sensitive paper. At this time, the transparent plate member 43 and elastic member 44 are used as in Verification 2. Then, hammer 45 is dropped from a height of 30 mm, 20 mm, and 10 mm from the surface of plate member 43. At this time, a cylindrical and hollow member (not shown) having a diameter larger than that of hammer 45 is placed on plate member 43, and the cylindrical member is used as a guide for hammer 45. That is, the guide is arranged so that the center of the elastic member is consistent with the center of the guide, and hammer 45 is dropped inside the cylindrical member of the fixed guide, so that hammer 45 collides with plate member 43. Thus, the shape of the elastic member 44 is transferred to the pressure-sensitive paper.

[Results of Verification 5]

When the hammer 45 is dropped from a height of 10 mm, the trace of the elastic member 44 transferred to the pressure-sensitive paper is uneven. Therefore, it is believed that when the hammer 45 is dropped from a height of 10 mm, even if a guide is used, the impact applied from the elastic member 44 to the substrate 40 is uneven.

When the hammer 45 is dropped from a height of 20 mm or 30 mm, the trace of the elastic member 44 transferred to the pressure-sensitive paper is formed uniformly. The reason is believed to be that the hammer 45 can be reliably contacted with the center of the elastic member 44 by the guide, and the impact can be uniformly applied from the elastic member to the substrate.

[Verification 6]

Under the same conditions as Verification 1, a product line S is formed on the surface 41a of the first substrate 41 and the surface of the second substrate 42. Afterwards, the second substrate 42 is not pre-cracked as in Verifications 1 to 4, but the substrate 40 is separated.

[Results of Verification 6]

A defect called a corner residue is generated at the boundary between the evaluation object auxiliary line H1 and the first substrate 41, or a crack is generated on the inner side of the product line, resulting in the substrate being damaged, and it is difficult to separate the substrate 40.

[Summary of verification]

Based on the results of verification 1 and verification 2 of separating the substrate 40 after pre-breaking the second substrate 42, and verification 6 of separating the substrate 40 without pre-breaking the second substrate 42, it can be confirmed that in the bonded substrate 40, if the second substrate 42 is pre-broken, the substrate 40 can be separated along the auxiliary line H and the product line S.

If we compare Verification 1 and Verification 2, which only pre-cracked the product line S, with Verification 3, which also pre-cracked the auxiliary line H, we can see that in Verification 3, cracks occurred in the substrate 40 when the substrate 40 was separated. This confirms that it is appropriate not to pre-crack the auxiliary line H, but to pre-crack only the product line S.

If we compare Verification 1 and Verification 2, which only pre-cracked the product line S, with Verification 4, which only pre-cracked the auxiliary line H, we can see that in Verification 4, cracks also occurred inside the product line S and could not be separated. This confirms that it is appropriate not to pre-crack the auxiliary line H, but to pre-crack only the product line S.

In Verification 1 and Verification 2, the shapes of the auxiliary line H are different for verification, but in both cases, the substrate 40 can be separated after the second substrate 42 is pre-cracked. Therefore, it is believed that the difference in the shape of the auxiliary line H will not affect the pre-crack much.

If the results of verification 1 and verification 2 are compared, verification 2 using the transparent plate member 43 can easily separate the substrate 40. The reason is believed to be that when the elastic member 44 is placed on the product line S, the plate member 43 is transparent, so the elastic member 44 can be placed while confirming the position of the product line S. It is inferred that during pre-breaking, if the elastic member 44 is surely placed in the area including the product line S, the pre-breaking can be performed well, and the substrate 40 can be easily separated.

According to the results of Verification 5, it can be confirmed that when the hammer 45 is dropped, if a guide member (a cylindrical member) is used, the hammer 45 can reliably collide with the center of the area including the product line S. Based on this, it is believed that the guide can improve the reproducibility of the collision position of the hammer 45, and can evenly apply force to the substrate 40, so that the second vertical crack G2 can easily penetrate along the product line S to the second substrate 42.

<Effects of implementation form>

In the substrate 10 formed by bonding the first substrate 11 and the second substrate 12 via the sealing material SL, there is a situation where the penetration of the second vertical crack C2 of the substrate where the scribe line is formed later is low. In this state, when a predetermined force is applied to the substrate 10 to perform the cracking step, there is a risk that the cross section of the substrate 10 will crack or be damaged.

In this regard, as shown in FIG. 2 and FIG. 3 (a) to (e), in the above-mentioned structure, after forming the first scribe line L1 on the surface 11a of the first substrate 11 and forming the second scribe line L2 on the surface 12a of the second substrate 12, the second substrate 12 is pre-cracked. Thereby, the second vertical crack C2 generated in the second substrate 12 can penetrate toward the sealing material SL. Thereby, the second substrate 12 becomes a state that can be easily separated along the second scribe line L2. Thereby, the substrate 10 can be easily separated along the first scribe line L1 and the second scribe line L2.

Furthermore, when the second substrate 12 is pre-cracked in the above manner, the second vertical crack C2 initially generated in the second substrate 12 is extended along the thickness direction to become a deeper vertical crack, thereby separating the substrate 10. Therefore, when separating the substrate 10, there is no need to worry about cracking or damage of the substrate 10. Therefore, the strength of the substrate 10 will not be reduced, and it can be processed into a high-quality product.

Furthermore, as shown in FIG3(f), when the substrate 10 is separated, the regions of the substrate 10 separated by the first scribe line L1 and the second scribe line L2 are pulled apart from each other in a direction parallel to the surface 11a of the first substrate 11. Thus, there is no situation where the separated cross sections touch each other, and the ends of the surface of the separated substrate 10 are not prone to defects or cracks. Thus, the strength of the substrate 10 is not reduced, and it can be processed into a high-quality product.

Furthermore, even when the first scribe line L1 and the second scribe line L2 include curves, the substrate 10 can be separated smoothly along the first scribe line L1 and the second scribe line L2.

As shown in FIG3(d), when the second substrate 12 is pre-cracked, the elastic member 13 is brought into close contact with the area along the first scribe line L1. Thus, the impact member 15 can be used to uniformly apply pressure to the entire range of the area. In addition, force can be uniformly applied to the second scribe line L2 formed on the surface 12a of the second substrate 12. Thus, the second vertical crack C2 initially generated along the second scribe line L2 can easily penetrate into the second substrate 12. Thus, the substrate 10 can be easily separated along the first scribe line L1 and the second scribe line L2.

Furthermore, the elastic member 13 is fixed to the fixed member 14. Therefore, the elastic member 13 can be fully applied from the fixed member 14, so that the elastic member 13 is uniformly and closely attached to the entire area along the first scribe line L1. Thereby, the entire range of the area along the first scribe line L1 can be uniformly applied with pressure, and the second scribe line L2 formed on the surface of the second substrate 12 can be reliably and uniformly applied. As a result, the second vertical crack C2 generated along the second scribe line L2 can more easily penetrate into the second substrate 12. Thereby, the substrate 10 can be easily separated along the first scribe line L1 and the second scribe line L2.

Furthermore, in the above-mentioned embodiment, as shown in FIG. 3(c), after forming the first scribe line L1 on the surface 11a of the first substrate 11, the substrate 10 is reversed to form the second scribe line L2 on the surface 12a of the second substrate 12, but the present invention is not limited thereto. For example, the following configuration may be adopted: two scribing wheels 1 are prepared, one of the scribing wheels 1 is used to form the first scribe line L1 on the surface 11a of the first substrate 11, and the other scribing wheel 1 is used to form the second scribe line L2 on the surface 12a of the second substrate 12. That is, the first scribe line L1 and the second scribe line L2 may be formed simultaneously and in parallel.

In this case, if the scribing wheel 1 on the second substrate 12 side is transferred behind the scribing wheel 1 on the first substrate 11 side by a predetermined distance, the second scribing line L2 is formed on the surface 12a of the second substrate 12 after the first scribing line L1 is formed on the surface 11a of the first substrate 11, so the penetration of the second vertical crack C2 generated in the second substrate 12 may become shallow. Therefore, in this case, by pre-crack the second substrate 12 as in the above-mentioned embodiment, the substrate 10 can be easily and well separated along the first scribing line L1 and the second scribing line L2.

Furthermore, the first scribe line L1 and the second scribe line L2 may be composed of only straight lines, or may include a curved line in part thereof. Furthermore, a part of the product shape formed by the first scribe line L1 and the second scribe line L2 may include a concave portion on the product side.

In addition, the implementation form of the present invention can be appropriately modified in various ways within the scope of the technical concept shown in the scope of the patent application.

1: Grating wheel

10: Substrate

11: 1st substrate

11a: Surface of the first substrate

12: Second substrate

12a: Surface of the second substrate

13: Elastic components

14: Fixed components (plate components)

15: Impact components

C1: 1st vertical crack

C2: Second vertical crack

L1: 1st scale line

L2: 2nd scale line

R: Liquid crystal injection area

SL: Sealing material

Claims (5)

A method for separating substrates formed by bonding a first substrate and a second substrate by a sealing material, wherein the method comprises: pressing a scribing wheel against a position of the surface of the first substrate opposite to the sealing material, while moving the scribing wheel, to form a first scribing line on the surface of the first substrate; pressing the scribing wheel against a position of the surface of the second substrate opposite to the sealing material, while moving the scribing wheel, to form a second scribing line on the surface of the second substrate; pressing an area including the first scribing line formed on the surface of the first substrate, so that the scribing wheel is pressed against the surface of the second substrate, and the scribing wheel is pressed against the surface of the second substrate. The step of vertical cracks penetrating into the second substrate along the second scribe line; and the step of separating the substrate along the first scribe line and the second scribe line by pulling the regions of the substrate separated by the first scribe line and the second scribe line away from each other in a direction parallel to the surface of the substrate; the first vertical crack formed along the first scribe line has a penetration of 70-100%; the step of forming the second scribe line is performed after the step of forming the first scribe line; the penetration of the second vertical crack formed along the second scribe line is lower than the penetration of the vertical crack of the first scribe line. The segmentation method of claim 1, wherein the first scale line and the second scale line are scale lines including curves. A breaking method as claimed in claim 1 or 2, wherein in the step of causing the vertical crack to penetrate into the second substrate, the elastic member is brought into close contact with the first scribe line, and the area including the first scribe line is pressed. A separation method as claimed in claim 3, wherein a force is applied to a fixing member for fixing the elastic member, and the area including the first scoring line is pressed. A cleavage method is to cleave a substrate formed by laminating the first substrate and the second substrate via the sealing material along a first scribe line formed on the first substrate at a position opposite to the sealing material and a second scribe line formed on the second substrate after the first scribe line at a position opposite to the sealing material, wherein the method comprises: pressing an area including the first scribe line to allow a vertical crack to penetrate along the second scribe line to the second substrate; and and the regions of the substrate separated by the second scribe line are pulled apart from each other in a direction parallel to the surface of the substrate, thereby separating the substrate along the first scribe line and the second scribe line; the permeability of the first vertical crack formed along the first scribe line is 70-100%; the step of forming the second scribe line is performed after the step of forming the first scribe line; the permeability of the second vertical crack formed along the second scribe line is lower than the permeability of the vertical crack of the first scribe line.

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