GB2174543B - Apparatus and method for improved packaging of semiconductor devices - Google Patents

Apparatus and method for improved packaging of semiconductor devices

Info

Publication number: GB2174543B
Authority: GB; United Kingdom
Prior art keywords: semiconductor devices; improved packaging; packaging; improved; semiconductor
Prior art date: 1985-04-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB08609260A

Other languages

English (en)

Other versions

GB2174543A (en

GB8609260D0 (en

Inventor

De Martiis Carlo Cognetti

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

STMicroelectronics SRL

Original Assignee

SGS Microelettronica SpA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-04-26

Filing date

1986-04-16

Publication date

1988-11-16

1986-04-16 Application filed by SGS Microelettronica SpA filed Critical SGS Microelettronica SpA

1986-05-21 Publication of GB8609260D0 publication Critical patent/GB8609260D0/en

1986-11-05 Publication of GB2174543A publication Critical patent/GB2174543A/en

1988-11-16 Application granted granted Critical

1988-11-16 Publication of GB2174543B publication Critical patent/GB2174543B/en

Status Expired legal-status Critical Current

Classifications

- H10W72/90—
- H10W76/157—
- H10W95/00—

GB08609260A 1985-04-26 1986-04-16 Apparatus and method for improved packaging of semiconductor devices Expired GB2174543B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
IT8520504A IT1215268B (it)	1985-04-26	1985-04-26	Apparecchio e metodo per il confezionamento perfezionato di dispositivi semiconduttori.

Publications (3)

Publication Number	Publication Date
GB8609260D0 GB8609260D0 (en)	1986-05-21
GB2174543A GB2174543A (en)	1986-11-05
GB2174543B true GB2174543B (en)	1988-11-16

Family

ID=11167929

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB08609260A Expired GB2174543B (en)	1985-04-26	1986-04-16	Apparatus and method for improved packaging of semiconductor devices

Country Status (6)

Country	Link
JP (1)	JPH0658924B2 (de)
DE (1)	DE3614087C2 (de)
FR (1)	FR2581247B1 (de)
GB (1)	GB2174543B (de)
IT (1)	IT1215268B (de)
NL (1)	NL193513C (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4959706A (en) *	1988-05-23	1990-09-25	United Technologies Corporation	Integrated circuit having an improved bond pad
DE69420841T2 (de) *	1994-07-13	2000-01-05	United Microelectronics Corp., Hsinchu	Verfahren zur Eliminierung des Antenneneffekts während der Fabrikation
DE69426293T2 (de) *	1994-07-13	2001-04-05	United Microelectronics Corp., Hsinchu	Verfahren zur Reduzierung des Antenneneffekts während der Fabrikation
US6888240B2 (en)	2001-04-30	2005-05-03	Intel Corporation	High performance, low cost microelectronic circuit package with interposer
US6894399B2 (en)	2001-04-30	2005-05-17	Intel Corporation	Microelectronic device having signal distribution functionality on an interfacial layer thereof
US7071024B2 (en) *	2001-05-21	2006-07-04	Intel Corporation	Method for packaging a microelectronic device using on-die bond pad expansion
US7183658B2 (en)	2001-09-05	2007-02-27	Intel Corporation	Low cost microelectronic circuit package
EP1424730B1 (de) *	2002-11-29	2008-10-08	Infineon Technologies AG	Halbleiterchip mit Anschlusskontaktflächen und Anordnung eines solchen Halbleiterchips auf einem Träger

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3458925A (en) *	1966-01-20	1969-08-05	Ibm	Method of forming solder mounds on substrates
FR1569479A (de) *	1967-07-13	1969-05-30
NL169122C (nl) *	1970-02-26	1982-06-01	Toyo Electronics Ind Corp	Halfgeleiderelement, omvattende een halfgeleiderplaatje met een door een isolerende laag bedekt hoofdvlak en met elektroden die zich ononderbroken uitstrekken over delen van de isolerende laag en aangrenzende delen van zijvlakken van het halfgeleiderplaatje, alsmede werkwijze voor het bevestigen van het halfgeleiderelement op een van aansluitklemmen voorziene montageplaat.
JPS5420120B2 (de) *	1971-12-23	1979-07-20
CA954635A (en) *	1972-06-06	1974-09-10	Microsystems International Limited	Mounting leads and method of fabrication
JPS5091269A (de) *	1973-12-12	1975-07-21
JPS5851425B2 (ja) *	1975-08-22	1983-11-16	株式会社日立製作所	ハンドウタイソウチ
JPS5445574A (en) *	1977-09-17	1979-04-10	Tdk Corp	Connection method of integrated circuit

1985
- 1985-04-26 IT IT8520504A patent/IT1215268B/it active
1986
- 1986-04-16 GB GB08609260A patent/GB2174543B/en not_active Expired
- 1986-04-25 NL NL8601073A patent/NL193513C/nl not_active IP Right Cessation
- 1986-04-25 FR FR868606060A patent/FR2581247B1/fr not_active Expired - Lifetime
- 1986-04-25 DE DE3614087A patent/DE3614087C2/de not_active Expired - Fee Related
- 1986-04-26 JP JP61097803A patent/JPH0658924B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
GB2174543A (en)	1986-11-05
FR2581247A1 (fr)	1986-10-31
IT1215268B (it)	1990-01-31
DE3614087C2 (de)	1999-05-06
DE3614087A1 (de)	1986-10-30
IT8520504A0 (it)	1985-04-26
JPH0658924B2 (ja)	1994-08-03
FR2581247B1 (fr)	1991-03-29
NL8601073A (nl)	1986-11-17
JPS61251047A (ja)	1986-11-08
GB8609260D0 (en)	1986-05-21
NL193513B (nl)	1999-08-02
NL193513C (nl)	1999-12-03

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Legal Events

Date	Code	Title	Description
2002-12-04	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20020416