WO2019032078A1 - Procédé de refroidissemetn à air de dispositifs informatiques - Google Patents
Procédé de refroidissemetn à air de dispositifs informatiques Download PDFInfo
- Publication number
- WO2019032078A1 WO2019032078A1 PCT/UA2018/000084 UA2018000084W WO2019032078A1 WO 2019032078 A1 WO2019032078 A1 WO 2019032078A1 UA 2018000084 W UA2018000084 W UA 2018000084W WO 2019032078 A1 WO2019032078 A1 WO 2019032078A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- computing device
- air
- separating surface
- flow
- cold air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G12—INSTRUMENT DETAILS
- G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
- G12B15/00—Cooling
- G12B15/04—Cooling by currents of fluid, e.g. air, in open cycle
Definitions
- the invention relates to the field of computing in general, and to cooling devices in particular, with the result that can be used in the design and manufacture of computers, servers, information processing systems, the manufacture of components for them and in other industries.
- computing device refers to devices for processing graphic information that contain a graphic processor — video cards, central processors, memory modules, information storage modules, and other information processing modules as part of computers and servers , and those that can be used separately.
- Modern computing devices such as graphic adapters (video cards), processors, memory modules, etc., contain
- SUBSTITUTE SHEET (RULE 26) integrated circuits - chips, and other parts that produce a fairly large amount of heat during normal operation.
- the largest number of emit chips and usually their surface is not enough to utilize the heat generated by them.
- heat-removing elements are installed on the chip - radiators that are made from materials with high thermal conductivity - aluminum, for example.
- a radiator can have many fins through which air passes for cooling. The presence of fins significantly increases the area of cooling, but this is not enough in the current environment, when the power of computing devices is constantly growing.
- a fan is installed on the radiator, which acts as a propeller of the cooling medium — air. Under the condition of a constant cooling area, an increase in the velocity of the coolant, air, again makes it possible to significantly increase the cooling efficiency of the device.
- the disadvantage of the aforementioned devices is that the use of electronic components, in particular video cards, which emit part or all of the air that is used for cooling, into the body in which they are located, and from there take up the air for cooling during high or maximum loads on the component, becomes very problematic, and with the amount of use of more than one component in a single package, in general, sometimes it becomes impossible because of the large or excessive heating of the computing processors and other parts of the device or electronic component. This is due to the fact that inside the case in which the components are located, there is an intensive mixing of the cooling flows.
- the basis of the invention is to improve the method and improve the efficiency of cooling computing devices by separating the flow of cold air, which is directed to the heating element of the computing device, and heated air, which is removed from the device after it is cooled.
- the problem is solved by a method that allows air cooling of computing devices by directing the flow of cold air to the heating element of the computing device, according to which the computing device is installed on the separating surface so that the flow of cold air is directed through the hole in the separating surface and goes to the heating element the computational device, after which the heated air is removed outside the device, according to which you the numeral device is mounted on the separating surface in such a way that
- FIG. 1 Schematic view of the computing device.
- FIG. 2 Schematic diagram of the computing device.
- FIG. 3 Schematic cooling circuit, option 1
- FIG. 4 Schematic cooling circuit, option 2
- a modern computing device such as a video card (FIG. 2), contains a circuit board 1, on which components are located, chips, in particular, a graphics processor 2, on top of the processor, which is a heat source, usually mounted a heat diffuser - radiator 3, which may have many edges.
- a graphics processor 2 on top of the processor, which is a heat source, usually mounted a heat diffuser - radiator 3, which may have many edges.
- a fan 4 is additionally mounted on the radiator, which is mounted on the lid 5.
- Also separating surface 6 has a vent 7 through which cold air 8 passes through the duct 11, fan 10 and the bounding surface 12 heats up and the heated air 9 falls on the other side of the surface.
- the proposed method allows to significantly separate the air flow, which in turn leads to a significant reduction or disappearance of the effect of mixing air flow, resulting in increased cooling efficiency of the computing device.
- option 2 for supplying cold air or discharging heated air can be used together or in different versions and in different order, either the coolant propellants, or the air duct, or restricting surfaces so as to supply or vent air to the vent or computing device.
- air ducts, fans and limiting surfaces can occur in different ways, while the air duct can be installed on the vent hole or limiting surface, and in the absence of a fan between them, and the fan, in turn, can be installed at either end duct, and in other versions.
- this invention allows to significantly increase the cooling efficiency of computing devices, and in some cases even create an opportunity for their use.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
L'invention concerne un procédé de refroidissement d'objets dégageant de la chaleur et notamment de dispositifs informatiques et consiste en ce qu'un flux d'air froid est dirigé contre l'élément chauffant du dispositif informatique, ledit dispositif informatique étant monté sur une surface de séparation de telle sorte que le flux d'air froid soit dirigée par l'orifice dans la surface de séparation sur l'élément chauffant du dispositif informatique, après que l'air chauffé est évacué en dehors des limites du dispositif. Le dispositif peut être aussi muni de conduites d'air supplémentaires et de dispositifs de déplacement d'agent caloporteur montés à l'entrée et à la sortie de l'agent caloporteur, ce qui assure une augmentation de l'efficacité de refroidissement de dispositifs informatiques.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| UAA201708307 | 2017-08-11 | ||
| UA201708307 | 2017-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019032078A1 true WO2019032078A1 (fr) | 2019-02-14 |
Family
ID=65272565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/UA2018/000084 Ceased WO2019032078A1 (fr) | 2017-08-11 | 2018-07-31 | Procédé de refroidissemetn à air de dispositifs informatiques |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2019032078A1 (fr) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1112592A1 (ru) * | 1983-04-08 | 1984-09-07 | Предприятие П/Я Г-4152 | Устройство дл охлаждени |
| RU2251827C2 (ru) * | 2001-03-03 | 2005-05-10 | Залман Тек Ко.,Лтд | Радиатор и радиаторное устройство, в котором используется такой радиатор |
| RU65712U1 (ru) * | 2007-05-03 | 2007-08-10 | Андрей Вадимович Миронов | Радиоэлектронный блок |
| RU77530U1 (ru) * | 2008-06-24 | 2008-10-20 | Федеральное государственное унитарное предприятие "Производственное объединение "Уральский оптико-механический завод" имени Э.С. Яламова" | Воздуховод для корпуса с оборудованием |
| RU139892U1 (ru) * | 2013-11-21 | 2014-04-27 | Открытое акционерное общество "Омский научно-исследовательский институт приборостроения" (ОАО "ОНИИП") | Устройство обеспечения теплового режима радиоэлектронной аппаратуры |
| RU175723U1 (ru) * | 2017-06-05 | 2017-12-15 | Максим Антонович Варюхин | Вычислительный блок электронного вычислительного устройства |
-
2018
- 2018-07-31 WO PCT/UA2018/000084 patent/WO2019032078A1/fr not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1112592A1 (ru) * | 1983-04-08 | 1984-09-07 | Предприятие П/Я Г-4152 | Устройство дл охлаждени |
| RU2251827C2 (ru) * | 2001-03-03 | 2005-05-10 | Залман Тек Ко.,Лтд | Радиатор и радиаторное устройство, в котором используется такой радиатор |
| RU65712U1 (ru) * | 2007-05-03 | 2007-08-10 | Андрей Вадимович Миронов | Радиоэлектронный блок |
| RU77530U1 (ru) * | 2008-06-24 | 2008-10-20 | Федеральное государственное унитарное предприятие "Производственное объединение "Уральский оптико-механический завод" имени Э.С. Яламова" | Воздуховод для корпуса с оборудованием |
| RU139892U1 (ru) * | 2013-11-21 | 2014-04-27 | Открытое акционерное общество "Омский научно-исследовательский институт приборостроения" (ОАО "ОНИИП") | Устройство обеспечения теплового режима радиоэлектронной аппаратуры |
| RU175723U1 (ru) * | 2017-06-05 | 2017-12-15 | Максим Антонович Варюхин | Вычислительный блок электронного вычислительного устройства |
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