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WO2019032079A1 - Boîtier pour dispositif informatique - Google Patents

Boîtier pour dispositif informatique Download PDF

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Publication number
WO2019032079A1
WO2019032079A1 PCT/UA2018/000085 UA2018000085W WO2019032079A1 WO 2019032079 A1 WO2019032079 A1 WO 2019032079A1 UA 2018000085 W UA2018000085 W UA 2018000085W WO 2019032079 A1 WO2019032079 A1 WO 2019032079A1
Authority
WO
WIPO (PCT)
Prior art keywords
computing device
air
compartment
compartments
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/UA2018/000085
Other languages
English (en)
Russian (ru)
Inventor
Сергей Сергеевич ТОВАРНИЦКИЙ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2019032079A1 publication Critical patent/WO2019032079A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B15/00—Cooling
    • G12B15/04—Cooling by currents of fluid, e.g. air, in open cycle

Definitions

  • the invention relates to the field of computing technology in general, and to cooling devices, as a result of which can be used in the design and manufacture of computers, servers, information processing systems, the manufacture of components for them and in other industries.
  • computing device refers to devices for processing graphic information that contain a graphic processor — video cards, central processors, memory modules, information storage modules, and other information processing modules as part of computers and servers , and those that can be used separately.
  • Modern computing devices such as graphic adapters (video cards), processors, memory modules, etc., contain
  • SUBSTITUTE SHEET (RULE 26) integrated circuits - chips, and other parts that produce a fairly large amount of heat during normal operation.
  • the largest number of emit chips and usually their surface is not enough to utilize the heat generated by them.
  • heat-removing elements are installed on the chip - radiators that are made from materials with high thermal conductivity - aluminum, for example.
  • a radiator can have many fins through which air passes for cooling. The presence of fins significantly increases the area of cooling, but this is not enough in the current environment, when the power of computing devices is constantly growing.
  • a fan is installed on the radiator, which acts as a propeller of the cooling medium — air. Under the condition of a constant cooling area, an increase in the velocity of the coolant, air, again makes it possible to significantly increase the cooling efficiency of the device.
  • the disadvantage of the aforementioned devices is that the use of electronic components, in particular video cards, which emit part or all of the air that is used for cooling, into the body in which they are located, and from there take away the air for cooling under high or maximum loads on the video card quite problematic, and with the use of more than one video card in one package, it is sometimes impossible at all due to the large or excessive heating of graphics processors and other parts in ideo card or electronic component. This is due to the fact that inside there is an intensive mixing of the cooling air flow, even with the active ventilation of the whole body, therefore, as a result,
  • SUBSTITUTE SHEET (RULE 26) for cooling electronic devices inside the case, not only the air drawn in from the outside, but also part of the heated air is used.
  • the basis of the claimed invention is the task of developing a device that will more efficiently cool video cards and other electronic components and, as a result, make them more stable, save resources, reduce the temperature of operation of chips (graphics processor, etc.) and the card as a whole, and in some cases it will make the operation of the computing device possible as such.
  • a device that is made in the form of a housing for an arbitrary-shaped computing device, with ventilation openings for taking in cold outside air and removing heated air from the housing in which at least one computing device is located, which has several compartments, at least at least two of which are adjacent or interconnected duct, which are connected to the external space, or to other compartments, which in turn are connected to outside These space vents or ducts
  • REPLACEMENT VICT (RULE 26) arbitrary shape and size according to which the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving due to the convection movement of the coolant, and due to the propellants that are installed on the computing device, from one compartment through the vent hole falls on the heating element of the computing device is heated, and the air heated thereafter enters another compartment, from which it is removed through the vent hole to the outside, according to which the computing device is installed on the border of these two compartments in such a way that the flow of cold air from the outside, moving due to the convection movement of the coolant, and due to air propellers that are installed on the computing device, and due to at least one other propeller from one compartment through the vent hole enters the heating element of the computing device, heats up, and the heated after that air enters the second compartment, from which from the vent and at least one coolant propulsion device is brought out, according to which the computing device is installed on the border of these two compartments in such
  • Flows, or one of the flows of cold or heated air for cooling individual electronic components can be combined for two or more components, while the flows of cold and heated air also do not mix with each other.
  • FIG. 1 Schematic view of 4electronic device
  • FIG. 2 Schematic diagram of the electronic device 4
  • FIG. 3 Exterior view of the housing for computing devices, front view
  • FIG. 4 Exterior view of the housing for computing devices, rear view
  • FIG. 5 Schematic cooling circuit, option 1
  • FIG. 6 Schematic cooling circuit, option 2
  • FIG. 7 Schematic cooling circuit, option 3
  • a modern computing device such as a video card
  • Fig. 1, Fig. 2 have a wiring board 1, on which components are located, chips, in particular, a graphics processor 2, on top of the processor, which is a heat source, usually mounted a heat diffuser - radiator 3, which may have many ribs.
  • a heat diffuser - radiator 3 which may have many ribs.
  • at least one fan 4 is additionally mounted on the radiator, which is mounted on the lid 5.
  • the cold air flow 13 gets to the duct 10 and then passes through the blowing fan 8, then through the ventilation hole in the housing 12 to the compartment 6 from which air through an opening between compartments 6 and 7 gets to compartment 7, from which a stream of heated air 14 gets to the suction fan 9 and further to air duct 11 and is discharged outside.
  • the computing device is placed in the housing 12 (Fig. 6) in such a way that the cold air is drawn by the computing device for cooling from one compartment 6, and the heated air is withdrawn through another compartment 7.
  • At least one injection fan 8 is installed with duct 10, of arbitrary shape and length
  • at least one suction fan 9 is installed with duct 11, of arbitrary shape and length.
  • SUBSTITUTE SHEET (RULE 26) occur in different ways, while the duct can be installed on the vent hole and in the absence of a fan between them, and the fan, in turn, can be installed on either end of the duct.
  • one case can be divided into a huge number of compartments, some of which can be combined with each other, and one compartment can be adjacent to many others.
  • this invention allows to significantly increase the cooling efficiency of computing devices, and in some cases even create an opportunity for their use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne le domaine des équipements informatiques et porte sur le refroidissement des équipements pendant le fonctionnement de ceux-ci. Le boîtier pour dispositif informatique comprend au moins deux compartiments à la frontière desquels est monté un dispositif informatique de manière à ce que le flux d'air froid provenant de l'extérieur se déplace grâce au mouvement par convection du caloporteur et grâce à des dispositifs de déplacement d'air passe par un orifice de ventilation et tombe sur l'élément chauffant du dispositif informatique, se réchauffe et passe ensuite dans le deuxième compartiment depuis lequel il évacué vers l'extérieur par l'orifice de ventilation, le boîtier pouvant être muni de dispositif s supplémentaires de déplacement d'air et de conduites supplémentaires pour améliorer et augmenter l'efficacité de la ventilation.
PCT/UA2018/000085 2017-08-11 2018-07-31 Boîtier pour dispositif informatique Ceased WO2019032079A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
UA201708308 2017-08-11
UAA201708308 2017-08-11

Publications (1)

Publication Number Publication Date
WO2019032079A1 true WO2019032079A1 (fr) 2019-02-14

Family

ID=65272633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/UA2018/000085 Ceased WO2019032079A1 (fr) 2017-08-11 2018-07-31 Boîtier pour dispositif informatique

Country Status (1)

Country Link
WO (1) WO2019032079A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409419A (en) * 1992-04-08 1995-04-25 Schroff Gmbh Ventilator insert
US5876278A (en) * 1997-05-29 1999-03-02 Cheng; Henry Cooling device
RU2239226C2 (ru) * 2002-07-23 2004-10-27 Эбит Компьютер Корпорейшн Рассеивающее тепло устройство для интерфейсных плат
RU2251827C2 (ru) * 2001-03-03 2005-05-10 Залман Тек Ко.,Лтд Радиатор и радиаторное устройство, в котором используется такой радиатор
RU139892U1 (ru) * 2013-11-21 2014-04-27 Открытое акционерное общество "Омский научно-исследовательский институт приборостроения" (ОАО "ОНИИП") Устройство обеспечения теплового режима радиоэлектронной аппаратуры
RU2557782C2 (ru) * 2010-09-20 2015-07-27 Амазон Текнолоджис, Инк. Система притока воздуха для внешних запоминающих устройств

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409419A (en) * 1992-04-08 1995-04-25 Schroff Gmbh Ventilator insert
US5876278A (en) * 1997-05-29 1999-03-02 Cheng; Henry Cooling device
RU2251827C2 (ru) * 2001-03-03 2005-05-10 Залман Тек Ко.,Лтд Радиатор и радиаторное устройство, в котором используется такой радиатор
RU2239226C2 (ru) * 2002-07-23 2004-10-27 Эбит Компьютер Корпорейшн Рассеивающее тепло устройство для интерфейсных плат
RU2557782C2 (ru) * 2010-09-20 2015-07-27 Амазон Текнолоджис, Инк. Система притока воздуха для внешних запоминающих устройств
RU139892U1 (ru) * 2013-11-21 2014-04-27 Открытое акционерное общество "Омский научно-исследовательский институт приборостроения" (ОАО "ОНИИП") Устройство обеспечения теплового режима радиоэлектронной аппаратуры

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