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WO2019032080A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2019032080A1
WO2019032080A1 PCT/UA2018/000086 UA2018000086W WO2019032080A1 WO 2019032080 A1 WO2019032080 A1 WO 2019032080A1 UA 2018000086 W UA2018000086 W UA 2018000086W WO 2019032080 A1 WO2019032080 A1 WO 2019032080A1
Authority
WO
WIPO (PCT)
Prior art keywords
computing device
coolant
vent hole
air
cold air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/UA2018/000086
Other languages
English (en)
Russian (ru)
Inventor
Сергей Сергеевич ТОВАРНИЦКИЙ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2019032080A1 publication Critical patent/WO2019032080A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B15/00—Cooling
    • G12B15/04—Cooling by currents of fluid, e.g. air, in open cycle

Definitions

  • the invention relates to the field of computing in general, and to cooling devices in particular, with the result that can be used in the design and manufacture of computers, servers, information processing systems, the manufacture of components for them and in other industries.
  • computing device means information processing devices that contain a graphics processor — video cards, central processors, memory modules, information storage modules, and other information processing modules, both in computers and servers and those that can be used separately.
  • Modern computing devices such as graphic adapters (video cards), processors, memory modules, etc., contain
  • SUBSTITUTE SHEET (RULE 26) integrated circuits - chips, and other parts that produce a fairly large amount of heat during normal operation.
  • the largest number of emit chips and usually their surface is not enough to utilize the heat generated by them.
  • heat-removing elements are installed on the chip - radiators that are made from materials with high thermal conductivity - aluminum, for example.
  • a radiator can have many fins through which air passes for cooling. The presence of fins significantly increases the area of cooling, but this is not enough in the current environment, when the power of computing devices is constantly growing.
  • a fan is installed on the radiator, which acts as a propeller of the cooling medium — air. Under the condition of a constant cooling area, an increase in the velocity of the coolant, air, again makes it possible to significantly increase the cooling efficiency of the device.
  • the disadvantage of the aforementioned devices is that the use of electronic components, in particular video cards, which emit part or all of the air that is used for cooling, into the body in which they are located, and from there take away the air for cooling under high or maximum loads on the video card quite problematic, and with the use of more than one video card in one package, it is sometimes impossible at all due to the large or excessive heating of graphics processors and other parts in ideo card or electronic component. This happens due to the fact that inside there is an intensive mixing of the cooling air flow even with active ventilation of the entire body, therefore, as a result, not only the air collected from the outside, but also part of the heated air is used to cool the electronic devices.
  • the basis of the claimed invention is the task of developing a device that will more efficiently cool video cards and other electronic components and, as a result, make them more stable, save resources, lower the temperature of the chips (graphics processor, etc.) and the component as a whole, and in some cases will make the computing device work as such.
  • the problem is solved using a device for cooling computing devices, which is made in the form of a flat or arbitrary surface with an arbitrary-shaped vent hole, according to which at least one computing device is mounted on the surface in such a way that the flow of cold air moving on one side of the surface due to the convection movement of the coolant, and due to the coolant propellants, which are installed on the computing device through the ventilation the hole gets on the heating element of the computing device, cools it and then goes to the other side of the surface, according to which at least one computing device is mounted on the surface in such a way that the flow of cold air moving from one side of the surface due to the convection movement of the heat carrier and the account of the coolant propulsion, which is installed on the computing device, and at the expense of at least one heat carrier propulsion, which is installed
  • SUBSTITUTE SHEET (RULE 26) on the surface or the vent hole, through the vent hole gets on the heating element of the computing device, cools it and then leaves through at least one coolant propeller that is installed on the surface or the vent hole on the other side of the surface, according to which at least one computing device in such a way that the flow of cold air, moving on one side of the surface due to the convection movement of the heat carrier
  • coolant propellants which are installed on the computing device, through the limiting surface and the vent hole gets onto the heating element of the computing device, it cools it and then goes through the limiting surface to the other side of the surface device in such a way that the flow of cold air, moving on one side of the surface through the duct, due to the convection motion of the heat the carrier, and at the expense of the coolant propellants, which are installed on the computing device, through the vent hole gets on the heating element of the computing device, cools it and then goes through the air duct to the other side of the surface.
  • FIG. 1 Schematic view of the cooling device, top view.
  • FIG. 2 Schematic view of the cooling device, bottom view.
  • FIG. 3 Schematic diagram of the operation of the device for cooling, option 1
  • FIG. 4 Schematic diagram of the operation of the device for cooling, option 2
  • a modern computing device for example, a video card 13 (FIG. 2), has in itself (FIG. 4) a circuit board 1 on which components are located, chips, in particular, a graphics processor 2, on top of a processor that is a heat source, usually a diffuser is mounted heat - radiator 3, which can have many fins. To improve efficiency, at least one fan 4 is additionally mounted on the radiator, which is mounted on the lid 5. Also, the separating surface b has a ventilation hole 7
  • the computing device 13 is placed directly on or below the surface 6 (FIG. 1, FIG. 2) in such a way that the cold air is drawn from the computing device for cooling from one side of the surface b, and the output of heated air is carried out on the other side of the surface.
  • the proposed design allows you to significantly separate the air flow, which in turn leads to a significant reduction or disappearance of the effect of mixing air flow, resulting in increased cooling efficiency of the computing device.
  • At least from one side directly onto the surface 6, or to the vent 7, or to the computing device, which is placed on the surface 6, can be mounted together or in different versions and in different order , and bounding surfaces in such a way as to vent or inject air to the air vent 7 or computing device.
  • SUBSTITUTE SHEET (RULE 26) cooling efficiency compared to option 1, because it increases the speed of the coolant and allows you to take in cold air and emit heated at arbitrary points in space, thereby minimizing or making it impossible the effect of mixing flows.
  • air ducts, fans and limiting surfaces can occur in different ways, while the air duct can be installed on the vent hole or limiting surface, and in the absence of a fan between them, and the fan, in turn, can be installed at either end duct, and in other versions.
  • this invention allows to significantly increase the cooling efficiency of computing devices, and in some cases even create an opportunity for their use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Le dispositif de refroidissement de dispositifs électroniques se présente sous forme d'une surface plane ou de forme arbitraire avec une ouverture de ventilation de forme arbitraire. Le dispositif informatique est monté sur la surface de sorte que la prise d'air froid par le dispositif informatique d'un côté de la surface s'effectue grâce au mouvement par convection d'un caloporteur et grâce à des propulseurs de caloporteur montés sur le dispositif informatique. Le flux d'air froid traverse l'ouverture de ventilation et vient tomber sur le caloporteur du dispositif informatique, le refroidit et l'air chaud est évacué vers l'autre côté de la surface. Le dispositif de refroidissement permet d'améliorer l'efficacité de refroidissement grâce à la séparation des flux d'air chaud et froid ce qui élimine ou réduit sensiblement le mélange entre flux d'air.
PCT/UA2018/000086 2017-08-11 2018-07-31 Dispositif de refroidissement Ceased WO2019032080A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
UAA201708309 2017-08-11
UA201708309 2017-08-11

Publications (1)

Publication Number Publication Date
WO2019032080A1 true WO2019032080A1 (fr) 2019-02-14

Family

ID=65271285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/UA2018/000086 Ceased WO2019032080A1 (fr) 2017-08-11 2018-07-31 Dispositif de refroidissement

Country Status (1)

Country Link
WO (1) WO2019032080A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409419A (en) * 1992-04-08 1995-04-25 Schroff Gmbh Ventilator insert
US5876278A (en) * 1997-05-29 1999-03-02 Cheng; Henry Cooling device
RU2239226C2 (ru) * 2002-07-23 2004-10-27 Эбит Компьютер Корпорейшн Рассеивающее тепло устройство для интерфейсных плат
RU2251827C2 (ru) * 2001-03-03 2005-05-10 Залман Тек Ко.,Лтд Радиатор и радиаторное устройство, в котором используется такой радиатор
RU139892U1 (ru) * 2013-11-21 2014-04-27 Открытое акционерное общество "Омский научно-исследовательский институт приборостроения" (ОАО "ОНИИП") Устройство обеспечения теплового режима радиоэлектронной аппаратуры

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409419A (en) * 1992-04-08 1995-04-25 Schroff Gmbh Ventilator insert
US5876278A (en) * 1997-05-29 1999-03-02 Cheng; Henry Cooling device
RU2251827C2 (ru) * 2001-03-03 2005-05-10 Залман Тек Ко.,Лтд Радиатор и радиаторное устройство, в котором используется такой радиатор
RU2239226C2 (ru) * 2002-07-23 2004-10-27 Эбит Компьютер Корпорейшн Рассеивающее тепло устройство для интерфейсных плат
RU139892U1 (ru) * 2013-11-21 2014-04-27 Открытое акционерное общество "Омский научно-исследовательский институт приборостроения" (ОАО "ОНИИП") Устройство обеспечения теплового режима радиоэлектронной аппаратуры

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