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WO2015149369A1 - Carte de circuit imprimé - Google Patents

Carte de circuit imprimé Download PDF

Info

Publication number
WO2015149369A1
WO2015149369A1 PCT/CN2014/074844 CN2014074844W WO2015149369A1 WO 2015149369 A1 WO2015149369 A1 WO 2015149369A1 CN 2014074844 W CN2014074844 W CN 2014074844W WO 2015149369 A1 WO2015149369 A1 WO 2015149369A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal screw
thin film
film resistor
screw hole
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/074844
Other languages
English (en)
Chinese (zh)
Inventor
魏晓敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/CN2014/074844 priority Critical patent/WO2015149369A1/fr
Priority to CN201490000030.6U priority patent/CN203859939U/zh
Publication of WO2015149369A1 publication Critical patent/WO2015149369A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

  • the present application relates to the field of circuits, and in particular, to a printed circuit board.
  • a printed wiring board is a support of an electronic component.
  • Today's electronic products continue to develop in a light, thin, and small direction, making the application of small-sized thin film resistors more and more widespread.
  • the present application aims to solve at least one of the above technical problems at least to some extent.
  • the present application provides a printed circuit board, including: a substrate and an attachment plate, the substrate is provided with a groove body, the surface of the groove body is covered with a first conductive layer, and the second plate is disposed on the adhesion plate a layer and a thin film resistor mounted on the attaching plate, the electrode of the thin film resistor is electrically connected to the second conductive layer, and the first metal screw hole electrically connected to the first conductive layer is opened on the substrate,
  • the attachment plate is provided with a second metal screw hole electrically connected to the second conductive layer, and the first metal screw hole is fixed to the second metal screw hole by a metal screw.
  • the number of the first metal screw holes, the second metal screw holes and the metal screws are matched with the number of electrodes of the thin film resistor.
  • the first metal screw hole, the second metal screw hole and the metal screw are made of copper.
  • the film resistor can be embedded in the groove of the substrate by using the adhesive plate, so that the partial film resistance obtained by cutting in the whole plate can be applied to the printed circuit board without the need to embed the entire film resistor material.
  • the printed circuit board saves the thin film resistor material, and the electrical connection of the thin film resistors on the attached board is realized by the electrical connection structure.
  • FIG. 1 is a schematic structural view of a printed circuit board in front of a metal screw according to an embodiment of the present application.
  • FIG. 2 is a schematic structural view of a printed circuit board assembled with metal screws according to an embodiment of the present application.
  • Orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present application and simplified description, and does not indicate or imply that the device or component referred to has a specific orientation, is constructed in a specific orientation, and Operation is therefore not to be construed as limiting the application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first”, “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components.
  • installation shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components.
  • the first feature is “on” or “on” the second feature, unless otherwise explicitly stated and defined.
  • “Bottom” may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features therebetween.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is less than the second feature.
  • the embodiment provides a printed circuit board, including: a substrate 1 and an attachment plate 2, wherein the substrate 1 is provided with a groove body 11, and the surface of the groove body 11 is covered with a first conductive layer. 12, the second conductive layer 21 and the thin film resistor 3 mounted on the adhesive plate 2 are disposed on the attachment plate 2, and the electrode of the thin film resistor 3 is electrically connected to the second conductive layer 21, and the substrate 1 is opened and first
  • the first metal screw hole 121 is electrically connected to the conductive layer 12, and the second metal screw hole 211 is electrically connected to the second conductive layer 21, and the first metal screw hole 121 passes through the metal screw 4 and the second metal screw.
  • the hole 211 is fixed.
  • the number of the first metal screw holes 121, the second metal screw holes 211, and the metal screws 4 is matched with the number of electrodes of the thin film resistor 3.
  • the first metal screw hole 121, the second metal screw hole 211, and the metal screw 4 are made of copper.
  • the film resistor can be embedded in the cavity of the substrate by using the adhesive plate, so that the partial film resistance obtained by cutting in the whole plate can be applied to the printed circuit board without the entire film resistor material being buried in the printed circuit board. , saving thin film electricity
  • the resistive material is additionally provided by an electrical connection structure to realize electrical connection of the thin film resistors on the attached board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une carte de circuit imprimé. Une plaque de fixation utilisée peut insérer une résistance à couche mince dans un corps à fente d'un substrat, ce qui permet de mettre en œuvre l'application d'une partie de la résistance à couche mince obtenue lorsqu'une carte entière est coupée dans la totalité de la carte. Il n'est pas nécessaire d'insérer la totalité d'un matériau de résistance à couche mince dans la carte de circuit imprimé, ce qui permet d'économiser le matériau de résistance à couche mince. En outre, par agencement d'une structure de connexion électrique, une connexion électrique de la résistance à couche mince sur la plaque de fixation est réalisée.
PCT/CN2014/074844 2014-04-04 2014-04-04 Carte de circuit imprimé Ceased WO2015149369A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2014/074844 WO2015149369A1 (fr) 2014-04-04 2014-04-04 Carte de circuit imprimé
CN201490000030.6U CN203859939U (zh) 2014-04-04 2014-04-04 印刷线路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/074844 WO2015149369A1 (fr) 2014-04-04 2014-04-04 Carte de circuit imprimé

Publications (1)

Publication Number Publication Date
WO2015149369A1 true WO2015149369A1 (fr) 2015-10-08

Family

ID=51609782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/074844 Ceased WO2015149369A1 (fr) 2014-04-04 2014-04-04 Carte de circuit imprimé

Country Status (2)

Country Link
CN (1) CN203859939U (fr)
WO (1) WO2015149369A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203859939U (zh) * 2014-04-04 2014-10-01 魏晓敏 印刷线路板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101853840A (zh) * 2009-04-01 2010-10-06 日月光半导体制造股份有限公司 内埋式线路基板的结构及其制造方法
US7830241B2 (en) * 2006-03-21 2010-11-09 Industrial Technology Research Institute Film resistor embedded in multi-layer circuit board and manufacturing method thereof
CN201733517U (zh) * 2010-06-18 2011-02-02 深南电路有限公司 一种电路板
CN202111940U (zh) * 2011-07-15 2012-01-11 深圳市星之光实业有限公司 一种埋入式元器件电路板
CN103188882A (zh) * 2011-12-31 2013-07-03 深南电路有限公司 一种电路板及其制作方法
CN203859939U (zh) * 2014-04-04 2014-10-01 魏晓敏 印刷线路板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7830241B2 (en) * 2006-03-21 2010-11-09 Industrial Technology Research Institute Film resistor embedded in multi-layer circuit board and manufacturing method thereof
CN101853840A (zh) * 2009-04-01 2010-10-06 日月光半导体制造股份有限公司 内埋式线路基板的结构及其制造方法
CN201733517U (zh) * 2010-06-18 2011-02-02 深南电路有限公司 一种电路板
CN202111940U (zh) * 2011-07-15 2012-01-11 深圳市星之光实业有限公司 一种埋入式元器件电路板
CN103188882A (zh) * 2011-12-31 2013-07-03 深南电路有限公司 一种电路板及其制作方法
CN203859939U (zh) * 2014-04-04 2014-10-01 魏晓敏 印刷线路板

Also Published As

Publication number Publication date
CN203859939U (zh) 2014-10-01

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