WO2015149369A1 - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- WO2015149369A1 WO2015149369A1 PCT/CN2014/074844 CN2014074844W WO2015149369A1 WO 2015149369 A1 WO2015149369 A1 WO 2015149369A1 CN 2014074844 W CN2014074844 W CN 2014074844W WO 2015149369 A1 WO2015149369 A1 WO 2015149369A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal screw
- thin film
- film resistor
- screw hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Definitions
- the present application relates to the field of circuits, and in particular, to a printed circuit board.
- a printed wiring board is a support of an electronic component.
- Today's electronic products continue to develop in a light, thin, and small direction, making the application of small-sized thin film resistors more and more widespread.
- the present application aims to solve at least one of the above technical problems at least to some extent.
- the present application provides a printed circuit board, including: a substrate and an attachment plate, the substrate is provided with a groove body, the surface of the groove body is covered with a first conductive layer, and the second plate is disposed on the adhesion plate a layer and a thin film resistor mounted on the attaching plate, the electrode of the thin film resistor is electrically connected to the second conductive layer, and the first metal screw hole electrically connected to the first conductive layer is opened on the substrate,
- the attachment plate is provided with a second metal screw hole electrically connected to the second conductive layer, and the first metal screw hole is fixed to the second metal screw hole by a metal screw.
- the number of the first metal screw holes, the second metal screw holes and the metal screws are matched with the number of electrodes of the thin film resistor.
- the first metal screw hole, the second metal screw hole and the metal screw are made of copper.
- the film resistor can be embedded in the groove of the substrate by using the adhesive plate, so that the partial film resistance obtained by cutting in the whole plate can be applied to the printed circuit board without the need to embed the entire film resistor material.
- the printed circuit board saves the thin film resistor material, and the electrical connection of the thin film resistors on the attached board is realized by the electrical connection structure.
- FIG. 1 is a schematic structural view of a printed circuit board in front of a metal screw according to an embodiment of the present application.
- FIG. 2 is a schematic structural view of a printed circuit board assembled with metal screws according to an embodiment of the present application.
- Orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present application and simplified description, and does not indicate or imply that the device or component referred to has a specific orientation, is constructed in a specific orientation, and Operation is therefore not to be construed as limiting the application.
- first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
- features defining “first”, “second” may explicitly or implicitly include one or more of the features.
- the meaning of “plurality” is two or more, unless specifically defined otherwise.
- the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components.
- installation shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components.
- the first feature is “on” or “on” the second feature, unless otherwise explicitly stated and defined.
- “Bottom” may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features therebetween.
- the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
- the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is less than the second feature.
- the embodiment provides a printed circuit board, including: a substrate 1 and an attachment plate 2, wherein the substrate 1 is provided with a groove body 11, and the surface of the groove body 11 is covered with a first conductive layer. 12, the second conductive layer 21 and the thin film resistor 3 mounted on the adhesive plate 2 are disposed on the attachment plate 2, and the electrode of the thin film resistor 3 is electrically connected to the second conductive layer 21, and the substrate 1 is opened and first
- the first metal screw hole 121 is electrically connected to the conductive layer 12, and the second metal screw hole 211 is electrically connected to the second conductive layer 21, and the first metal screw hole 121 passes through the metal screw 4 and the second metal screw.
- the hole 211 is fixed.
- the number of the first metal screw holes 121, the second metal screw holes 211, and the metal screws 4 is matched with the number of electrodes of the thin film resistor 3.
- the first metal screw hole 121, the second metal screw hole 211, and the metal screw 4 are made of copper.
- the film resistor can be embedded in the cavity of the substrate by using the adhesive plate, so that the partial film resistance obtained by cutting in the whole plate can be applied to the printed circuit board without the entire film resistor material being buried in the printed circuit board. , saving thin film electricity
- the resistive material is additionally provided by an electrical connection structure to realize electrical connection of the thin film resistors on the attached board.
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
印刷线路板 技术领域 Printed circuit board
[0001] 本申请涉及电路领域, 尤其涉及一种印刷线路板。 [0001] The present application relates to the field of circuits, and in particular, to a printed circuit board.
背景技术 Background technique
[0002] 印刷线路板是电子元器件的支撑体。 现今电子产品不断朝轻、 薄、 小方向发展, 使 得体积小的薄膜电阻的应用越来越广泛。 [0002] A printed wiring board is a support of an electronic component. Today's electronic products continue to develop in a light, thin, and small direction, making the application of small-sized thin film resistors more and more widespread.
[0003] 由于一般是将整张薄膜电阻材料埋入电路板内, 而不能分别将部分薄膜电阻材料埋 入, 而应用时只会用到薄膜电阻材料的部分, 造成薄膜电阻材料的浪费。 [0003] Since the entire thin film resistive material is generally buried in the circuit board, a part of the thin film resistive material cannot be buried separately, and only a portion of the thin film resistive material is used in the application, resulting in waste of the thin film resistive material.
发明内容 Summary of the invention
[0004] 本申请旨在至少在一定程度上解决上述技术问题之一。 The present application aims to solve at least one of the above technical problems at least to some extent.
[0005] 本申请提供一种印刷线路板, 包括: 基板以及附着板, 所述基板上开设有槽体, 该 槽体表面覆设有第一导电层, 所述附着板上设置有第二导电层以及贴装于该附着板上的薄膜 电阻, 该薄膜电阻的电极与所述第二导电层电连接, 所述基板上开设有与所述第一导电层电 连接的第一金属螺孔, 所述附着板上开设有与所述第二导电层电连接的第二金属螺孔, 所述 第一金属螺孔通过金属螺丝与所述第二金属螺孔相固定。 [0005] The present application provides a printed circuit board, including: a substrate and an attachment plate, the substrate is provided with a groove body, the surface of the groove body is covered with a first conductive layer, and the second plate is disposed on the adhesion plate a layer and a thin film resistor mounted on the attaching plate, the electrode of the thin film resistor is electrically connected to the second conductive layer, and the first metal screw hole electrically connected to the first conductive layer is opened on the substrate, The attachment plate is provided with a second metal screw hole electrically connected to the second conductive layer, and the first metal screw hole is fixed to the second metal screw hole by a metal screw.
[0006] 进一步地, 所述第一金属螺孔、 第二金属螺孔及金属螺丝的数量均与所述薄膜电阻 的电极数量相匹配。 [0006] Further, the number of the first metal screw holes, the second metal screw holes and the metal screws are matched with the number of electrodes of the thin film resistor.
[0007] 进一步地, 所述第一金属螺孔、 第二金属螺孔及金属螺丝均采用铜材质。 [0007] Further, the first metal screw hole, the second metal screw hole and the metal screw are made of copper.
[0008] 本申请的有益效果是: [0008] The beneficial effects of the application are:
通过提供一种印刷线路板, 采用附着板可将薄膜电阻埋入基板的槽体中, 从而可实现整板中 切割所得部分薄膜电阻在印刷线路板的应用, 而无需整张薄膜电阻材料埋入印刷线路板, 节 约了薄膜电阻材料, 另外, 通过电连接结构设置, 实现附着板上薄膜电阻的电连接。 By providing a printed circuit board, the film resistor can be embedded in the groove of the substrate by using the adhesive plate, so that the partial film resistance obtained by cutting in the whole plate can be applied to the printed circuit board without the need to embed the entire film resistor material. The printed circuit board saves the thin film resistor material, and the electrical connection of the thin film resistors on the attached board is realized by the electrical connection structure.
附图说明 DRAWINGS
[0009] 图 1为本申请实施例的印刷线路板装配金属螺丝前的结构示意图。 1 is a schematic structural view of a printed circuit board in front of a metal screw according to an embodiment of the present application.
[0010] 图 2为本申请实施例的印刷线路板装配金属螺丝后的结构示意图。 2 is a schematic structural view of a printed circuit board assembled with metal screws according to an embodiment of the present application.
具体实施方式 detailed description
[0011] 下面详细描述本申请的实施例, 所述实施例的示例在附图中示出, 其中自始至终相同 或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。 下面通过参考附图描述 的实施例是示例性的, 旨在用于解释本申请, 而不能理解为对本申请的限制。 [0012] 在本申请的描述中, 需要理解的是, 术语 "中心"、 "纵向"、 "横向"、 "长度"、 "宽 度"、 "厚度"、 "上"、 "下"、 "前"、 "后"、 "左"、 "右"、 "竖直"、 "水平"、 "顶"、 "底" "内"、 "外"、 "顺时针"、 "逆时针"等指示的方位或位置关系为基于附图所示的方位或位置 关系, 仅是为了便于描述本申请和简化描述, 而不是指示或暗示所指的装置或元件必须具有 特定的方位、 以特定的方位构造和操作, 因此不能理解为对本申请的限制。 The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative, and are not to be construed as limiting. [0012] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "previous"",""back","left","right","vertical","horizontal","top","bottom","inside","outside","clockwise","counterclockwise", etc. Orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present application and simplified description, and does not indicate or imply that the device or component referred to has a specific orientation, is constructed in a specific orientation, and Operation is therefore not to be construed as limiting the application.
[0013] 此外, 术语 "第一"、 "第二"仅用于描述目的, 而不能理解为指示或暗示相对重要 性或者隐含指明所指示的技术特征的数量。 由此, 限定有 "第一"、 "第二" 的特征可以明示 或者隐含地包括一个或者更多个该特征。 在本申请的描述中, "多个" 的含义是两个或两个 以上, 除非另有明确具体的限定。 In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first", "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless specifically defined otherwise.
[0014] 在本申请中, 除非另有明确的规定和限定, 术语 "安装"、 "相连"、 "连接"、 "固 定"等术语应做广义理解, 例如, 可以是固定连接, 也可以是可拆卸连接, 或一体地连接; 可以是机械连接, 也可以是电连接; 可以是直接相连, 也可以通过中间媒介间接相连, 可以 是两个元件内部的连通。 对于本领域的普通技术人员而言, 可以根据具体情况理解上述术语 在本申请中的具体含义。 [0014] In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
[0015] 在本申请中, 除非另有明确的规定和限定, 第一特征在第二特征之 "上" 或之[0015] In the present application, the first feature is "on" or "on" the second feature, unless otherwise explicitly stated and defined.
"下"可以包括第一和第二特征直接接触, 也可以包括第一和第二特征不是直接接触而是通 过它们之间的另外的特征接触。 而且, 第一特征在第二特征 "之上"、 "上方"和 "上面"包 括第一特征在第二特征正上方和斜上方, 或仅仅表示第一特征水平高度高于第二特征。 第一 特征在第二特征 "之下"、 "下方"和 "下面"包括第一特征在第二特征正上方和斜上方, 或 仅仅表示第一特征水平高度小于第二特征。 "Bottom" may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features therebetween. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is less than the second feature.
[0016] 下面通过具体实施方式结合附图对本申请作进一步详细说明。 [0016] The present application will be further described in detail below with reference to the accompanying drawings.
[0017] 请参考图 1-2, 本实施例提供一种印刷线路板, 包括: 基板 1 以及附着板 2, 基板 1 上开设有槽体 11, 该槽体 11表面覆设有第一导电层 12, 附着板 2上设置有第二导电层 21 以及贴装于该附着板 2上的薄膜电阻 3, 该薄膜电阻 3 的电极与第二导电层 21 电连接, 基 板 1上开设有与第一导电层 12电连接的第一金属螺孔 121, 附着板 2上开设有与第二导电 层 21 电连接的第二金属螺孔 211, 第一金属螺孔 121通过金属螺丝 4与第二金属螺孔 211 相固定。 第一金属螺孔 121、 第二金属螺孔 211及金属螺丝 4的数量均与薄膜电阻 3的电极 数量相匹配。 第一金属螺孔 121、 第二金属螺孔 211及金属螺丝 4均采用铜材质。 [0017] Please refer to FIG. 1-2, the embodiment provides a printed circuit board, including: a substrate 1 and an attachment plate 2, wherein the substrate 1 is provided with a groove body 11, and the surface of the groove body 11 is covered with a first conductive layer. 12, the second conductive layer 21 and the thin film resistor 3 mounted on the adhesive plate 2 are disposed on the attachment plate 2, and the electrode of the thin film resistor 3 is electrically connected to the second conductive layer 21, and the substrate 1 is opened and first The first metal screw hole 121 is electrically connected to the conductive layer 12, and the second metal screw hole 211 is electrically connected to the second conductive layer 21, and the first metal screw hole 121 passes through the metal screw 4 and the second metal screw. The hole 211 is fixed. The number of the first metal screw holes 121, the second metal screw holes 211, and the metal screws 4 is matched with the number of electrodes of the thin film resistor 3. The first metal screw hole 121, the second metal screw hole 211, and the metal screw 4 are made of copper.
[0018] 这样, 采用附着板可将薄膜电阻埋入基板的槽体中, 从而可实现整板中切割所得部 分薄膜电阻在印刷线路板的应用, 而无需整张薄膜电阻材料埋入印刷线路板, 节约了薄膜电 阻材料, 另外, 通过电连接结构设置, 实现附着板上薄膜电阻的电连接。 [0018] In this way, the film resistor can be embedded in the cavity of the substrate by using the adhesive plate, so that the partial film resistance obtained by cutting in the whole plate can be applied to the printed circuit board without the entire film resistor material being buried in the printed circuit board. , saving thin film electricity The resistive material is additionally provided by an electrical connection structure to realize electrical connection of the thin film resistors on the attached board.
[0019] 在本说明书的描述中, 参考术语 "一个实施方式"、 "一些实施方式"、 "一个实施 例"、 "一些实施例"、 "示例"、 "具体示例"、 或 "一些示例"等的描述意指结合该实施例或 示例描述的具体特征、 结构、 材料或者特点包含于本申请的至少一个实施例或示例中。 在本 说明书中, 对上述术语的示意性表述不一定指的是相同的实施例或示例。 而且, 描述的具体 特征、 结构、 材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。 [0019] In the description of the present specification, the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" are referred to. The descriptions of the equivalents, such as the specific features, structures, materials or features described in connection with the embodiments or examples, are included in at least one embodiment or example of the present application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
[0020] 以上内容是结合具体的实施方式对本申请所作的进一步详细说明, 不能认定本申请 的具体实施只局限于这些说明。 对于本申请所属技术领域的普通技术人员来说, 在不脱离本 申请构思的前提下, 还可以做出若干简单推演或替换。 [0020] The above is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the application is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201490000030.6U CN203859939U (en) | 2014-04-04 | 2014-04-04 | Printed circuit board |
| PCT/CN2014/074844 WO2015149369A1 (en) | 2014-04-04 | 2014-04-04 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/074844 WO2015149369A1 (en) | 2014-04-04 | 2014-04-04 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015149369A1 true WO2015149369A1 (en) | 2015-10-08 |
Family
ID=51609782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2014/074844 Ceased WO2015149369A1 (en) | 2014-04-04 | 2014-04-04 | Printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203859939U (en) |
| WO (1) | WO2015149369A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015149369A1 (en) * | 2014-04-04 | 2015-10-08 | 魏晓敏 | Printed circuit board |
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| CN202111940U (en) * | 2011-07-15 | 2012-01-11 | 深圳市星之光实业有限公司 | Embedded type component circuit board |
| CN103188882A (en) * | 2011-12-31 | 2013-07-03 | 深南电路有限公司 | Circuit board and manufacture method thereof |
| CN203859939U (en) * | 2014-04-04 | 2014-10-01 | 魏晓敏 | Printed circuit board |
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2014
- 2014-04-04 WO PCT/CN2014/074844 patent/WO2015149369A1/en not_active Ceased
- 2014-04-04 CN CN201490000030.6U patent/CN203859939U/en not_active Expired - Fee Related
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| US7830241B2 (en) * | 2006-03-21 | 2010-11-09 | Industrial Technology Research Institute | Film resistor embedded in multi-layer circuit board and manufacturing method thereof |
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| CN201733517U (en) * | 2010-06-18 | 2011-02-02 | 深南电路有限公司 | Circuit board |
| CN202111940U (en) * | 2011-07-15 | 2012-01-11 | 深圳市星之光实业有限公司 | Embedded type component circuit board |
| CN103188882A (en) * | 2011-12-31 | 2013-07-03 | 深南电路有限公司 | Circuit board and manufacture method thereof |
| CN203859939U (en) * | 2014-04-04 | 2014-10-01 | 魏晓敏 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203859939U (en) | 2014-10-01 |
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