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WO2014075324A1 - 液晶面板及其制作方法和cf基板的制作方法 - Google Patents

液晶面板及其制作方法和cf基板的制作方法 Download PDF

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Publication number
WO2014075324A1
WO2014075324A1 PCT/CN2012/084893 CN2012084893W WO2014075324A1 WO 2014075324 A1 WO2014075324 A1 WO 2014075324A1 CN 2012084893 W CN2012084893 W CN 2012084893W WO 2014075324 A1 WO2014075324 A1 WO 2014075324A1
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WIPO (PCT)
Prior art keywords
substrate
tft substrate
terminal
liquid crystal
pressurizing
Prior art date
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PCT/CN2012/084893
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English (en)
French (fr)
Inventor
张海建
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/811,414 priority Critical patent/US20140132866A1/en
Publication of WO2014075324A1 publication Critical patent/WO2014075324A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • the present invention relates to the field of liquid crystal panels, and in particular to a liquid crystal panel, a method for fabricating the same, and a method for fabricating a CF substrate.
  • a method for fabricating a liquid crystal panel includes the following steps:
  • TFT Thin Film Transistor
  • CF Color filter
  • the TFT substrate and the CF substrate each include a display area and a non-display area, wherein the non-display area of the TFT substrate is provided with a pressurizing terminal; and the display area of the CF substrate forms a color filter layer ;
  • the cracking effect of the single-plate cutting machine is easily affected by various factors. If the bonded CF substrate sometimes has a sealant due to the non-display area, the non-display area of the CF substrate and the TFT substrate is also After being bonded together, after being cut by a single-plate cutter, the portion of the CF substrate covering the pressurizing terminal cannot be completely removed, or even all cannot be removed. If the CF substrate covered on the pressing terminal is not removed, the alignment effect of the liquid crystal panel in the fourth step is affected, and even the liquid crystal panel is scrapped. In the prior art, a CF substrate that has not been removed during cutting is generally manually removed by an operator or a CF substrate is re-cut.
  • a main object of the present invention is to provide a liquid crystal panel, a method of fabricating the same, and a method of fabricating a CF substrate, which are directed to improving the production efficiency of the liquid crystal panel.
  • the present invention provides a method for fabricating a liquid crystal panel, comprising the steps of:
  • the TFT substrate and the CF substrate are bonded together.
  • the step of providing a through hole at a position of the CF substrate corresponding to the pressing terminal of the TFT substrate further includes:
  • the position at which the CF substrate is to be opened is determined according to the position of the pressing terminal on the TFT substrate.
  • the step of providing a perforation at a position of the CF substrate corresponding to the pressing terminal of the TFT substrate is specifically:
  • a perforation is provided at a position of the CF substrate corresponding to the pressing terminal of the TFT substrate by a laser hole puncher.
  • the laser hole punch is a CO2 laser hole puncher.
  • the method further includes:
  • a voltage is applied to the pressurizing terminal through the perforation.
  • the through holes are in one-to-one correspondence with the pressurizing terminals.
  • each of the perforations corresponds to at least two of the pressurizing terminals.
  • the present invention also provides a liquid crystal panel including a CF substrate and a TFT substrate which are bonded to each other, and the TFT substrate is provided with a pressurizing terminal, and the CF substrate is provided with a through hole corresponding to the pressurizing terminal.
  • the through holes are in one-to-one correspondence with the pressurizing terminals.
  • each of the perforations corresponds to at least two of the pressurizing terminals.
  • the invention also provides a method for fabricating a CF substrate, comprising the steps of:
  • a through hole corresponding to the position of the pressing terminal of the TFT substrate is provided on the non-display area.
  • the step of providing the perforation corresponding to the position of the pressing terminal of the TFT substrate on the non-display area further comprises:
  • the position to be opened in the non-display area of the CF substrate is determined according to the position of the pressing terminal on the TFT substrate.
  • the step of providing a perforation corresponding to the position of the pressing terminal of the TFT substrate on the non-display area is specifically:
  • a perforation is provided at a position on the non-display area corresponding to the pressing terminal of the TFT substrate by a laser hole puncher.
  • the laser hole punch is a CO2 laser hole puncher.
  • the perforations are in one-to-one correspondence with the pressurizing terminals, or each of the perforations corresponds to at least two of the pressurizing terminals.
  • the through hole directly exposes the pressurizing terminal after the CF substrate and the TFT substrate are bonded together. Therefore, it is not necessary to cut the CF substrate to expose the pressurizing terminal, thereby avoiding rework due to abnormal cutting, thereby improving production efficiency.
  • FIG. 1 is a flow chart showing a first embodiment of a method of fabricating a liquid crystal panel of the present invention
  • FIG. 2 is a flow chart showing a second embodiment of a method for fabricating a liquid crystal panel of the present invention
  • FIG. 3 is a flow chart showing an embodiment of a method for fabricating a CF substrate of a liquid crystal panel of the present invention
  • FIG. 4 is a schematic structural view of a first embodiment of a liquid crystal panel of the present invention.
  • Figure 5 is an exploded view of the liquid crystal panel of Figure 4.
  • Figure 6 is a schematic view showing the structure of a second embodiment of the liquid crystal panel of the present invention.
  • the method for fabricating the liquid crystal panel includes the following steps:
  • Step S101 a CF substrate and a TFT substrate are formed, and the TFT substrate is provided with a pressurizing terminal.
  • a display area and a non-display area are formed on the CF substrate; a display area and a non-display area are formed on the TFT substrate, and a press terminal is provided on the non-display area of the TFT substrate.
  • step S103 a through hole is provided at a position of the CF substrate corresponding to the pressing terminal of the TFT substrate.
  • a perforation device can be used to form a perforation on the CF substrate.
  • the perforating device may be various types of perforating devices.
  • the perforating device of the embodiment is a laser perforator, in particular a CO2 laser perforator. Since the CF substrate is made of glass, and the glass has good absorption of light having a wavelength of 5 um or more, a sealed CO2 laser puncher with a wavelength of 10.6 um and a power of 100 to 500 W can be used for the CF substrate. After punching, the CF substrate absorbs the laser light and then locally heats up, so that the CF substrate is opened in the scanning direction of the laser.
  • the edge of the CF substrate is smooth, no lateral micro-grain, and no debris, which can avoid scratching the CF substrate during the punching process and minimizing the possibility of breaking the CF substrate. It is possible to use a plurality of CO2 laser punchers to simultaneously punch a portion of the CF substrate that needs to be perforated to improve production efficiency.
  • Step S104 bonding the TFT substrate and the CF substrate.
  • liquid crystal is first dropped on the display area of the TFT substrate or the CF substrate, and the sealant is applied to the non-display area of the CF substrate or the TFT substrate, and then the CF substrate and the TFT substrate are vacuum-bonded.
  • the probe of the voltage applying device can be directly used to pass through the through hole and the pressurizing.
  • the terminals are in contact, and a voltage is applied to the pressurizing terminals.
  • it is not necessary to cut the CF substrate to cover the portion of the pressing terminal of the TFT substrate after bonding the TFT substrate and the CF substrate, and therefore, the production efficiency is not lowered due to abnormal cutting of the single-plate cutter. It also does not affect the application of a voltage to the pressurizing terminal due to incomplete cracking of the non-display area, resulting in an abnormal alignment. Therefore, the manufacturing method of the liquid crystal panel of the present embodiment improves the production efficiency.
  • one perforation may correspond to at least two pressing terminals, for example, one perforation corresponds to four pressing terminals, and even the non-display area on one side of the CF substrate has only one elongated hole to expose the TFT substrate. All the pressure terminals on one side.
  • the through holes on the CF substrate are in one-to-one correspondence with the pressing terminals on the TFT substrate, that is, each of the pressing terminals corresponds to one through hole.
  • the manufacturing method includes the following steps:
  • Step S101 a CF substrate and a TFT substrate are formed, and the TFT substrate is provided with a pressurizing terminal.
  • a display area and a non-display area are formed on the CF substrate; a display area and a non-display area are formed on the TFT substrate, and a press terminal is provided on the non-display area of the TFT substrate.
  • Step S102 determining a position to be opened in the non-display area of the CF substrate according to the position of the pressing terminal on the TFT substrate.
  • the position of the pressing terminal on the TFT substrate is first detected, and the position to be punched on the CF substrate is determined based on the position, so that the punching position is more accurate.
  • the position of the hole to be punched may be marked on the CF substrate to facilitate accurate punching in the subsequent step.
  • the position coordinates of the hole to be punched on the CF substrate are preset directly in the CO2 laser puncher, thereby automatically according to the position coordinate. Punch.
  • step S103 a through hole is provided at a position of the CF substrate corresponding to the pressing terminal of the TFT substrate.
  • the punching device can be used to set the punching hole on the CF substrate. Since the opening position is set in step S102, the hole is precisely punched at the mark or according to the input coordinates.
  • This embodiment uses the CO2 laser to punch holes. The device automatically opens the hole on the CF substrate according to the preset position coordinates.
  • Step S104 bonding the TFT substrate and the CF substrate.
  • liquid crystal is first dropped on the display area of the TFT substrate or the CF substrate, and the sealant is applied to the non-display area of the CF substrate or the TFT substrate, and then the CF substrate and the TFT substrate are vacuum-bonded.
  • Step S105 applying a voltage to the pressing terminal through the through hole.
  • the probe of the voltage applying device can be directly contacted with the pressing terminal through the through holes, and the pressing is performed. Voltage is applied to the terminals.
  • the position of the hole is formed in the CF substrate in advance, so that the punching position is more accurate.
  • the punching hole can accurately expose all the pressing terminals, thereby avoiding the position of the punching. Re-work, and further improve production efficiency.
  • the manufacturing method includes:
  • Step S201 forming a display area and a non-display area on the CF substrate.
  • Step S202 determining a position to be opened in the non-display area of the CF substrate based on the position of the pressing terminal on the TFT substrate bonded to the CF substrate.
  • the position of the pressing terminal on the TFT substrate is first detected, and the position to be punched in the CF substrate is determined based on the position, so that the punching position is more accurate.
  • the position of the hole to be punched can be marked on the CF substrate to facilitate the subsequent step of accurately punching with the punching device.
  • the perforating device of this embodiment is preferably a laser perforator, in particular a CO2 laser perforator. Since the CF substrate is made of glass, and the glass has good absorption of light having a wavelength of 5 um or more, a sealed CO2 laser puncher with a wavelength of 10.6 um and a power of 100 to 500 W can be used for the CF substrate.
  • the CF substrate After punching, the CF substrate absorbs the laser light and then locally heats up, so that the CF substrate is opened in the scanning direction of the laser. Therefore, in this embodiment, the position coordinates of the hole to be punched on the CF substrate are preset directly in the CO2 laser puncher, so that the CO2 laser puncher can automatically punch holes according to the position coordinates.
  • Step S203 providing a perforation at the determined opening position.
  • the punching device can be used to precisely punch the mark directly at the mark or according to the input coordinates, so that the punched holes punched on the non-display area of the CF substrate accurately correspond to the pressed terminals on the TFT substrate.
  • the CO2 laser puncher is used to automatically open a hole on the CF substrate according to a preset position coordinate. After the CO2 laser puncher is punched, the edge of the CF substrate is smooth, free of lateral micro-grain, and no debris, thereby avoiding scratching the CF substrate during the punching process and minimizing the possibility of breaking the CF substrate. It is possible to use a plurality of CO2 laser punchers to simultaneously punch a portion of the CF substrate that needs to be perforated to improve production efficiency.
  • the liquid crystal panel includes a CF substrate 100 and a TFT substrate 200 which are bonded to each other, and both the CF substrate 100 and the TFT substrate 200 have a display area and
  • the non-display area of the CF substrate 100 is provided with a through hole 110.
  • the non-display area of the TFT substrate 200 is provided with a pressurizing terminal 210, and the through hole 110 corresponds to the pressurizing terminal 210.
  • the CF substrate 100 is provided with a through hole 110, and the pressing terminal 210 on the TFT substrate 200 is exposed, so that the probe of the voltage device can directly contact the pressing terminal 210 through the through hole 110, and pressurize A voltage is applied to the terminal 210 to achieve alignment of the liquid crystal panel. Therefore, the production efficiency and product quality of the liquid crystal panel are improved.
  • the through holes 110 on the CF substrate 100 are in one-to-one correspondence with the pressing terminals 210 on the TFT substrate 200, that is, each of the pressing terminals 210 corresponds to one through hole 110.
  • each probe applies a voltage to the corresponding pressurizing terminal 210 through a through hole 110, which improves the accuracy of the pressurization.
  • each of the through holes 110 can correspond to four pressing terminals 210 on the TFT substrate 200.
  • the voltage device applies a voltage to the four pressurizing terminals 210 through a through hole 110 when a voltage is applied.
  • one of the through holes 110 may correspond to the two pressurizing terminals 210, and even the non-display area on one side of the CF substrate 100 may only have one slit hole to expose all the pressurizing terminals on the corresponding side of the TFT substrate 200. 210.
  • each of the through holes 110 corresponds to the plurality of pressurizing terminals 210, and the punching efficiency of the laser puncher can be improved.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
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Abstract

提供了一种液晶面板及其制作方法和CF基板的制作方法，该液晶面板的制作方法包括步骤：制作CF基板（100）和TFT基板（200），该TFT基板（200）上设有加压端子（210）；在CF基板（100）对应TFT基板（200）的加压端子（210）的位置处设置穿孔（110）；贴合该TFT基板（200）与CF基板（100）。由于在CF基板（100）上设置了与TFT基板（200）上的加压端子（210）相对应的穿孔（110），CF基板（100）和TFT基板（200）贴合后，该穿孔（110）直接露出加压端子（210），从而无需切割CF基板（100）以露出加压端子，避免因切割异常而返工，因此提高了生产效率。

Description

液晶面板及其制作方法和CF基板的制作方法
技术领域
本发明涉及液晶面板领域，尤其是涉及一种液晶面板及其制作方法和CF基板的制作方法。
背景技术
现有技术中，液晶面板的制作方法包括以下步骤：
1、制作TFT（Thin Film Transistor，薄膜晶体管）基板及CF（Color Filter，彩色滤光片）基板，且TFT基板及CF基板均包括显示区及非显示区，所述TFT基板的非显示区设有加压端子；所述CF基板的显示区形成彩色滤光层；
2、在CF基板的非显示区涂覆框胶，在TFT基板的显示区内滴注液晶，并将TFT基板与CF基板贴合形成液晶面板；
3、利用单板切割机切掉CF基板覆盖TFT基板的加压端子的部分，以露出TFT基板非显示区上的加压端子；
4、对加压端子施加电压并照射紫外光以实现液晶面板的配向。
其中第3步中，单板切割机的切裂效果容易受各种因素的影响，若贴合后的CF基板由于非显示区有时会存在框胶，导致CF基板与TFT基板的非显示区也粘合在一起，经过单板切割机切割后，CF基板覆盖加压端子的部分不能完全去除，甚至是全部无法去除。若覆盖在加压端子上的CF基板不去除，则会影响第4步中液晶面板的配向效果，甚至是液晶面板报废。现有技术中，一般由操作人员手动去除在切割中未能去除的CF基板或者对CF基板进行重新切割。但是采用手动处理，需要停止机台进行手动去除CF基板待切割部分；而对CF基板进行重新切割，则需要将已经过切割的液晶面板再次送入单板切割机进行切割，导致现有的液晶面板的生产效率都较低。
发明内容
本发明的主要目的在于提供一种液晶面板及其制作方法和CF基板的制作方法，旨在提高液晶面板的生产效率。
为达以上目的，本发明提出一种液晶面板的制作方法，包括步骤：
制作CF基板和TFT基板，所述TFT基板上设有加压端子；
在CF基板对应TFT基板的加压端子的位置处设置穿孔；
贴合所述TFT基板与CF基板。
优选地，所述在CF基板对应TFT基板的加压端子的位置处设置穿孔的步骤之前还包括：
根据TFT基板上的加压端子的位置，确定欲在CF基板开孔的位置。
优选地，所述在CF基板对应TFT基板的加压端子的位置处设置穿孔的步骤具体为：
利用激光打孔器在CF基板对应TFT基板的加压端子的位置处设置穿孔。
优选地，所述激光打孔器为CO2激光打孔器。
优选地，所述贴合所述TFT基板与CF基板的步骤之后还包括：
通过所述穿孔对所述加压端子施加电压。
优选地，所述穿孔与所述加压端子一一对应。
优选地，每一所述穿孔至少与两个所述加压端子对应。
本发明同时提出一种液晶面板，包括相互贴合的CF基板和TFT基板，所述TFT基板设有加压端子，所述CF基板设有与所述加压端子对应设置的穿孔。
优选地，所述穿孔与所述加压端子一一对应。
优选地，每一所述穿孔至少与两个所述加压端子对应。
本发明还提出一种CF基板的制作方法，包括步骤：
在CF基板上形成显示区和非显示区；
在所述非显示区上设置与TFT基板的加压端子的位置对应的穿孔。
优选地，所述在所述非显示区上设置与TFT基板的加压端子的位置对应的穿孔的步骤之前还包括：
根据TFT基板上的加压端子的位置，确定欲在CF基板的非显示区开孔的位置。
优选地，所述在所述非显示区上设置与TFT基板的加压端子的位置对应的穿孔的步骤具体为：
利用激光打孔器在所述非显示区上对应TFT基板的加压端子的位置处设置穿孔。
优选地，所述激光打孔器为CO2激光打孔器。
优选地，所述穿孔与所述加压端子一一对应，或者每一所述穿孔至少与两个所述加压端子对应。
本发明所提供的一种液晶面板的制作方法，由于在CF基板上设置了与TFT基板上的加压端子相对应的穿孔，CF基板和TFT基板贴合后，所述穿孔直接露出加压端子，从而无需切割CF基板以露出加压端子，避免因切割异常而返工，因此提高了生产效率。
附图说明
图1是本发明的液晶面板的制作方法第一实施例的流程图；
图2是本发明的液晶面板的制作方法第二实施例的流程图
图3是本发明的液晶面板的CF基板的制作方法一实施例的流程图；
图4 是本发明的液晶面板第一实施例的结构示意图；
图5是图4中液晶面板的爆炸图；
图6是本发明的液晶面板第二实施例的结构示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参见图1，提出本发明的液晶面板的制作方法第一实施例，所述液晶面板的制作方法包括以下步骤：
步骤S101、制作CF基板和TFT基板，所述TFT基板上设有加压端子。
本步骤S101中，在CF基板上形成显示区及非显示区；在TFT基板上形成显示区及非显示区，并在TFT基板的非显示区上设置加压端子。
步骤S103、在CF基板对应TFT基板的加压端子的位置处设置穿孔。
本步骤S103中，可以利用一打孔装置在CF基板上形成穿孔。该打孔装置可以是各种类型的打孔装置，作为一种优选方式，本实施例的打孔装置为激光打孔器，特别是CO2激光打孔器。由于CF基板是玻璃材质，而玻璃对波长为5um以上的光具有很好的吸收性，因此可利用波长为10.6um、功率在100~500W之间的封离型CO2激光打孔器对CF基板打孔，CF基板吸收激光之后局部急剧升温，从而使CF基板沿着激光的扫描方向开孔。激光打孔器打孔后，CF基板边缘光滑、无横向微纹、无碎片，可避免在打孔过程中划伤CF基板并且将CF基板破碎的可能性减小到最低程度。可以利用多台CO2激光打孔器对CF基板需要形成穿孔的部分同时进行打孔，以提高生产效率。
步骤S104、贴合所述TFT基板与CF基板。
本步骤104中，首先在TFT基板或CF基板的显示区上滴加液晶，并且对应地在CF基板或TFT基板的非显示区涂布框胶，然后真空贴合CF基板和TFT基板。
接下来再对TFT基板的加压端子施加电压，由于CF基板上的穿孔已经将TFT基板上的加压端子露出，因此可以直接利用电压施加装置的探针穿过所述穿孔与所述加压端子接触，对所述加压端子施加电压。本实施例的液晶面板的制作方法，无需在TFT基板与CF基板贴合后切割CF基板覆盖TFT基板的加压端子的部分，因此，不会因为单板切割机切裂异常而降低生产效率，也不会因为非显示区裂片不完全而影响对加压端子施加电压而导致配向异常。因此，本实施例的液晶面板的制作方法提高了生产效率。
上述实施例中，一个穿孔可以对应至少两个加压端子，例如一个穿孔对应4个加压端子，甚至CF基板一侧的非显示区仅开设一个狭长的孔，以露出TFT基板上与之对应的一侧所有的加压端子。作为一种优选方式，本实施例中，CF基板上的穿孔与TFT基板上的加压端子一一对应，也即每一个加压端子对应一个穿孔。从而，电压装置在施加电压时，每个探针穿过一个穿孔对相应的加压端子施加电压，提高了加压的准确性。
进一步地，为了使打孔位置更加精确，参见图2，提出本发明的液晶面板的制作方法第二实施例，所述制作方法包括以下步骤：
步骤S101、制作CF基板和TFT基板，所述TFT基板上设有加压端子。
本步骤S101中，在CF基板上形成显示区及非显示区；在TFT基板上形成显示区及非显示区，并在TFT基板的非显示区上设置加压端子。
步骤S102、根据TFT基板上的加压端子的位置，确定欲在CF基板的非显示区开孔的位置。
本步骤S102中，首先检测出TFT基板上的加压端子的位置，并根据该位置来确定欲在CF基板上打孔的位置，使得打孔位置更加精确。可以在CF基板上标记欲打孔的位置以方便后续步骤准确的打孔，本实施例则直接在CO2激光打孔器中预设欲在CF基板上打孔的位置坐标，从而根据位置坐标自动打孔。
步骤S103、在CF基板对应TFT基板的加压端子的位置处设置穿孔。
本步骤S103中，可以利用打孔装置在CF基板上设置穿孔，由于步骤S102已设定了开孔位置，因此直接在标记处或者根据输入的坐标精确打孔，本实施例利用CO2激光打孔器，根据预先设定的位置坐标自动在CF基板上快速开孔。
步骤S104、贴合所述TFT基板与CF基板。
本实施例中，首先在TFT基板或CF基板的显示区上滴加液晶，并且对应地在CF基板或TFT基板的非显示区涂布框胶，然后真空贴合CF基板和TFT基板。
步骤S105、通过所述穿孔对所述加压端子施加电压。
本步骤S105中，由于CF基板上的穿孔已经将TFT基板上的加压端子露出，因此可以直接利用电压施加装置的探针穿过所述穿孔与所述加压端子接触，对所述加压端子施加电压。
据此，本实施例通过预先设定在CF基板上开孔的位置，使得打孔位置更加准确，当CF基板和TFT基板贴合后穿孔能精确的露出所有加压端子，避免因穿孔位置不准而返工，进一步提高了生产效率。
参见图3，提出本发明的液晶面板的CF基板制作方法一较佳实施例，所述制作方法包括：
步骤S201、在CF基板上形成显示区和非显示区。
步骤S202、根据一与CF基板贴合的TFT基板上的加压端子的位置，确定欲在CF基板的非显示区开孔的位置。
本步骤S202中，首先检测出TFT基板上的加压端子的位置，并根据该位置来确定欲在CF基板上打孔的位置，使得打孔位置更加精确。可以在CF基板上标记欲打孔的位置以方便后续步骤利用打孔装置准确的打孔。本实施例的打孔装置优选激光打孔器，特别是CO2激光打孔器。由于CF基板是玻璃材质，而玻璃对波长为5um以上的光具有很好的吸收性，因此可利用波长为10.6um、功率在100~500W之间的封离型CO2激光打孔器对CF基板打孔，CF基板吸收激光之后局部急剧升温，从而使CF基板沿着激光的扫描方向开孔。因此本实施例直接在CO2激光打孔器中预设欲在CF基板上打孔的位置坐标，从而CO2激光打孔器可根据位置坐标自动打孔。
步骤S203、在所确定的开孔位置处设置穿孔。
本步骤S203中，可以利用打孔装置直接在标记处或者根据输入的坐标精确打孔，以使得在CF基板的非显示区上打出的穿孔与TFT基板上的加压端子精确对应。本实施例利用CO2激光打孔器根据预先设定的位置坐标自动在CF基板上快速开孔。该CO2激光打孔器打孔后，CF基板边缘光滑、无横向微纹、无碎片，可避免在打孔过程中划伤CF基板并且将CF基板破碎的可能性减小到最低程度。可以利用多台CO2激光打孔器对CF基板需要形成穿孔的部分同时进行打孔，以提高生产效率。
参见图4、图5，提出本发明的液晶面板第一实施例，所述液晶面板包括相互贴合的CF基板100和TFT基板200，所述CF基板100和TFT基板200上均具有显示区和非显示区，所述CF基板100非显示区设有穿孔110，所述TFT基板200非显示区上设有加压端子210，且所述穿孔110与所述加压端子210相对应。本实施例中，CF基板100上设有穿孔110，并且露出TFT基板200上的加压端子210，因此电压装置的探针可以直接穿过所述穿孔110与加压端子210接触，对加压端子210施加电压，以实现对液晶面板配向。因此提高了液晶面板的生产效率和产品质量。
进一步地，CF基板100上的穿孔110与TFT基板200上的加压端子210一一对应，也即每一个加压端子210对应一个穿孔110。从而，电压装置在施加电压时，每个探针穿过一个穿孔110对相应的加压端子210施加电压，提高了加压的准确性。
参见图6，提出本发明的液晶面板第二实施例，所述液晶面板的CF基板100上的穿孔110为一狭长孔，因此每个穿孔110可对应TFT基板200上4个加压端子210，电压装置在施加电压时，探针可穿过一个穿孔110对4个加压端子210施加电压。当然，一个穿孔110也可以对应2个加压端子210，甚至CF基板100的一侧的非显示区仅开设一个狭长的孔，以露出TFT基板200上与之对应的一侧所有的加压端子210。在本实施例中，每个穿孔110对应多个加压端子210，可以提高激光打孔器的打孔效率。
应当理解的是，以上仅为本发明的优选实施例，不能因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种液晶面板的制作方法，其特征在于，包括步骤：
    制作CF基板和TFT基板，所述TFT基板上设有加压端子；
    在CF基板对应TFT基板的加压端子的位置处设置穿孔；
    贴合所述TFT基板与CF基板。
  2. 根据权利要求1所述的制作方法，其特征在于，所述在CF基板对应TFT基板的加压端子的位置处设置穿孔的步骤之前还包括：
    根据TFT基板上的加压端子的位置，确定欲在CF基板开孔的位置。
  3. 根据权利要求1所述的制作方法，其特征在于，所述在CF基板对应TFT基板的加压端子的位置处设置穿孔的步骤具体为：
    利用激光打孔器在CF基板对应TFT基板的加压端子的位置处设置穿孔。
  4. 根据权利要求3所述的制作方法，其特征在于，所述激光打孔器为CO2激光打孔器。
  5. 根据权利要求1所述的制作方法，其特征在于，所述贴合所述TFT基板与CF基板的步骤之后还包括：
    通过所述穿孔对所述加压端子施加电压。
  6. 根据权利要求1所述的制作方法，其特征在于，所述穿孔与所述加压端子一一对应。
  7. 根据权利要求1所述的制作方法，其特征在于，每一所述穿孔至少与两个所述加压端子对应。
  8. 一种液晶面板，其特征在于，包括相互贴合的CF基板和TFT基板，所述TFT基板设有加压端子，所述CF基板设有与所述加压端子对应设置的穿孔。
  9. 根据权利要求8所述的液晶面板，其特征在于，所述穿孔与所述加压端子一一对应。
  10. 根据权利要求8所述的液晶面板，其特征在于，每一所述穿孔至少与两个所述加压端子对应。
  11. 一种CF基板的制作方法，其特征在于，包括步骤：
    在CF基板上形成显示区和非显示区；
    在所述非显示区上设置与TFT基板的加压端子的位置对应的穿孔。
  12. 根据权利要求11所述的CF基板的制作方法，其特征在于，所述在所述非显示区上设置与TFT基板的加压端子的位置对应的穿孔的步骤之前还包括：
    根据TFT基板上的加压端子的位置，确定欲在CF基板的非显示区开孔的位置。
  13. 根据权利要求11所述的CF基板的制作方法，其特征在于，所述在所述非显示区上设置与TFT基板的加压端子的位置对应的穿孔的步骤具体为：
    利用激光打孔器在所述非显示区上对应TFT基板的加压端子的位置处设置穿孔。
  14. 根据权利要求13所述的CF基板的制作方法，其特征在于，所述激光打孔器为CO2激光打孔器。
  15. 根据权利要求11所述的制作方法，其特征在于，所述穿孔与所述加压端子一一对应，或者每一所述穿孔至少与两个所述加压端子对应。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004333781A (ja) * 2003-05-07 2004-11-25 Sony Corp 液晶表示素子およびその特性評価方法
JP2008225398A (ja) * 2007-03-16 2008-09-25 Citizen Holdings Co Ltd 液晶表示素子の製造方法
JP2009103855A (ja) * 2007-10-23 2009-05-14 Citizen Holdings Co Ltd 積層構造体の製造方法
CN101813854A (zh) * 2009-02-20 2010-08-25 北京京东方光电科技有限公司 液晶显示器及其制造方法
CN101840114A (zh) * 2010-05-10 2010-09-22 深圳莱宝高科技股份有限公司 一种面板装置的制作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209663C (zh) * 2002-02-28 2005-07-06 新加坡籍联合投影有限公司 微型显示器的制造方法
CN101480800B (zh) * 2009-01-20 2011-01-05 宁波三盾电子科技有限公司 印制电路板打孔机及其打孔方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004333781A (ja) * 2003-05-07 2004-11-25 Sony Corp 液晶表示素子およびその特性評価方法
JP2008225398A (ja) * 2007-03-16 2008-09-25 Citizen Holdings Co Ltd 液晶表示素子の製造方法
JP2009103855A (ja) * 2007-10-23 2009-05-14 Citizen Holdings Co Ltd 積層構造体の製造方法
CN101813854A (zh) * 2009-02-20 2010-08-25 北京京东方光电科技有限公司 液晶显示器及其制造方法
CN101840114A (zh) * 2010-05-10 2010-09-22 深圳莱宝高科技股份有限公司 一种面板装置的制作方法

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