WO2013133240A1 - 印刷型接着剤及びこれを用いた接合体の製造方法 - Google Patents
印刷型接着剤及びこれを用いた接合体の製造方法 Download PDFInfo
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- WO2013133240A1 WO2013133240A1 PCT/JP2013/055905 JP2013055905W WO2013133240A1 WO 2013133240 A1 WO2013133240 A1 WO 2013133240A1 JP 2013055905 W JP2013055905 W JP 2013055905W WO 2013133240 A1 WO2013133240 A1 WO 2013133240A1
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- adhesive
- printing
- adherend
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- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Definitions
- the present invention when a reinforcing plate is bonded to a copper-clad laminate (CCL) or a flexible printed wiring board (FPC), or when an adhesive is applied to a portion other than a conductive portion of a substrate on which a conductive pattern is printed,
- the present invention relates to a printing type adhesive capable of forming an adhesive application portion (pattern) by screen printing, and a method of manufacturing a joined body using the adhesive.
- a flexible printed wiring board usually has a undulation on the coverlay film surface or base film surface due to a wiring pattern or the like. Moreover, as a cover-lay film, the hole for position alignment and another component mounting may be opened.
- an adherend flexible print
- a reinforcing plate 2 may be attached and bonded to a part of a wiring board or a copper-clad laminate) 1 in some cases.
- FIG. 1B is a schematic plan view of a part of the flexible printed wiring board 1 in which the reinforcing plate 2 is bonded as viewed from the direction in which the reinforcing plate is installed.
- FIG. 1A is a cross-sectional view of FIG. 1B. It is a schematic diagram.
- 3 is an adhesive, and the reinforcing plate 2 is bonded to the flexible printed wiring board 1 via the adhesive 3.
- a semi-cured film adhesive has been used for bonding a flexible printed wiring board or a copper-clad laminate and a reinforcing plate.
- the film adhesive is cut out in a necessary shape in advance according to the portion to which the reinforcing plate is attached, and is stuck to the adhesive attachment position.
- such a method is wasteful in cost because it discards the cut-out remaining portion of the film adhesive.
- the film-like adhesive has adhesiveness in a semi-cured state, it is usually traded with a structure of a three-layer sheet sandwiched between release papers. For this reason, the provider of a film adhesive needs to produce such a three-layer sheet, and the cost of a separate member called release paper is required.
- JP-A-4-77589 forms an adhesive layer by screen printing, and a flexible printed wiring board and a reinforcing board are provided. A bonding method for bonding has been proposed.
- thermosetting epoxy-based adhesive having a controlled variation, specifically, a viscosity measured at a shear rate of 1 sec ⁇ 1 by dilution with a solvent.
- Patent Document 1 Although an adhesive that can be screen-printed is proposed in Patent Document 1, there is no disclosure about a specific composition. On the other hand, when the adhesive composition used as a film adhesive is applied to screen printing instead of film formation, a film is produced such as chipping or bleeding of the printed portion, or poor plate separation. A new problem that did not exist when it occurred was simply unable to be diverted. In addition, in the case of an adhesive used for bonding a flexible printed wiring board or a copper-clad laminate and a reinforcing plate, there is a problem that required heat resistance and bonding strength are severe compared to simple printing ink. Cannot be diverted to adhesive
- a conductive paste containing conductive particles for example, silver particles or the like
- a substrate such as a flexible printed wiring board on which a conductive pattern is printed.
- conductive particles for example, silver particles or the like
- the present invention has been made in view of such circumstances, and an object of the present invention is a printing type adhesive capable of screen-printing an adhesive pattern, and further, heat resistance and bonding strength of a bonded portion. It is another object of the present invention to provide a printing adhesive capable of satisfying the above requirements, and a printing adhesive capable of high-level adjustment of a coating pattern such as printing only on a predetermined portion of an adherend.
- the printing type adhesive of the present invention comprises (A) an acrylic resin having a weight average molecular weight (Mw) of 80,000 to 300,000, (B) an epoxy resin of 30 to 70% by mass of (A) the amount of acrylic resin, and (C) curing. (D) a printing type adhesive containing an inorganic filler having an average particle diameter of 1 ⁇ m or less, and (E) a solvent, and having a viscosity of 15 to 800 Pa ⁇ s at a rotation speed of 1 rpm as measured by an E type viscometer. The viscosity at a rotational speed of 50 rpm is 4 to 200 Pa ⁇ s. In addition, let said viscosity be the value measured at room temperature (25 degreeC).
- the method for producing a joined body according to the present invention comprises a step of applying the printing adhesive of the present invention to the first adherend by screen printing and then heating at 100 to 250 ° C .; A step of placing two adherends; and a step of heating to 100 to 250 ° C. to thermally cure the adhesive application portion.
- a method for producing a joined body wherein a transfer film obtained by applying and printing the above printing adhesive of the present invention on a release film by screen printing, and a first deposition.
- the printing type adhesive of the present invention has a relatively high viscosity under a low shear rate and a low viscosity under a high shear rate, the adhesive can be applied by screen printing.
- the printing type adhesive of the present invention comprises (A) an acrylic resin having a weight average molecular weight (Mw) of 80,000 to 300,000, (B) an epoxy resin of 30 to 70% by mass of (A) the amount of acrylic resin, and (C) curing. (D) a printing type adhesive containing an inorganic filler having an average particle diameter of 1 ⁇ m or less, and (E) a solvent, and having a viscosity of 15 to 800 Pa ⁇ s at a rotation speed of 1 rpm as measured by an E type viscometer. The viscosity at a rotational speed of 50 rpm is 4 to 200 Pa ⁇ s. In addition, let said viscosity be the value measured at room temperature (25 degreeC).
- the (E) solvent is preferably an organic solvent having a boiling point of 160 ° C. or higher, and the content of the (E) solvent is preferably 55% by mass or less of the total amount of the printing adhesive.
- the (C) curing agent preferably contains an acid anhydride, and the (D) inorganic filler is preferably contained in an amount of 1 to 30% by mass of the resin content.
- the acrylic resin used in the present invention has a weight average molecular weight (Mw) of 80,000 to 300,000, preferably 100,000 to 200,000. This is because if the weight average molecular weight is less than 80,000, the heat resistance of the cured portion cannot be satisfied. On the other hand, if the weight average molecular weight exceeds 300,000, the melt viscosity of the adhesive increases, and even at a high shear rate, the viscosity is not sufficiently lowered, and stringing occurs during screen printing, resulting in poor plate separation. This is because irregularities are generated on the surface of the printed adhesive-applied portion, and as a result, voids are formed in the bonded portion, and the bonding strength may not be satisfied. In addition, when a solvent is added to lower the melt viscosity, the solid content concentration is lowered, and thick film printing may be difficult.
- Mw weight average molecular weight
- the acrylic resin is an acrylic ester or methacrylic ester (hereinafter referred to as “(meth) acrylic acid” unless the acrylic acid and methacrylic acid are particularly distinguished, and the ester is collectively referred to as “(meth) acrylate”). It is a polymer as a main constituent monomer.
- Examples of the (meth) acrylic acid ester include, for example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, acrylate-n-butyl, methacrylate-n-butyl, acrylate isobutyl, methacrylate isobutyl, Isopentyl acrylate, isopentyl methacrylate, acrylic acid-n-hexyl, methacrylic acid-n-hexyl, isooctyl acrylate, isooctyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, n-octyl acrylate Carbon number of (meth) acrylic acid such as methacrylic acid-n-octyl, isononyl acrylate, isononyl acrylate, acrylic acid-n-decyl, methacrylic acid-n-de
- epoxy-containing (meth) acrylates such as glycidyl acrylate, glycidyl methacrylate, and acryl glycidyl ether; acrylic acid, methacrylic acid, itaconic acid, as long as the effects of the present invention are not impaired.
- ⁇ , ⁇ -unsaturated carboxylic acids such as maleic acid and maleic anhydride
- hydroxyl group-substituted (meth) acrylates such as hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate
- amide-containing acrylics such as acrylamide and methacrylamide
- vinyl monomers such as vinyl monomers, cyano group-containing acrylic monomers such as acrylonitrile, vinyl chloride, vinylidene chloride, styrene, vinyl acetate may be copolymerized.
- Such an acrylic resin as a thermoplastic resin, softens and melts when heated, so that it flows into the concave portion of the adherend surface and the concave portion of the wiring pattern at the joining portion, and can be embedded in these concave portions.
- the epoxy resin used in the present invention may be a resin having at least two epoxy groups in one molecule, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl ether type epoxy resin, A glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, a novolac type epoxy resin, a cresol novolak type epoxy resin and the like can be mentioned.
- Epoxy resin is a thermosetting resin that contributes to the heat resistance and bonding strength of the joints and also contributes to ensuring insulation.
- the epoxy resin is preferably contained in an amount of 30 to 70% by mass, preferably 30 to 55% by mass, based on the amount of the acrylic resin as component A. It is because heat resistance will fall when content of an epoxy resin decreases too much with respect to an acrylic resin. On the other hand, if the amount is too large, the acrylic resin becomes relatively small, so it becomes difficult to soften and melt at the time of heating and pressurization, and as a result, it becomes difficult to sufficiently fill the concave portion of the adherend, causing a decrease in bonding strength. Because it becomes.
- (C) Hardener It is contained as a hardener for epoxy resins.
- the curing agent polyamine curing agents, acid anhydride curing agents, boron trifluoride amine complex salts, imidazole curing agents, aromatic diamine curing agents, carboxylic acid curing agents, and the like can be used.
- These curing agents, particularly imidazole-based curing agents include those that are liquid at room temperature and those that are solid at room temperature such as powder and fine particles. Which to use may be appropriately selected according to the application.
- an acid anhydride that is liquid at normal temperature and a liquid imidazole curing agent are preferably used.
- acid anhydrides that are liquid at room temperature include hexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride.
- imidazole curing agent include 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 2-ethyl-4-methylimidazole, and the like.
- solid curing agents at room temperature examples include 2-methylimidazole, 2-phenylimidazole, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid addition Such as things.
- a curing agent that is liquid at room temperature has a fast onset of curing reaction and a high reaction rate, it is preferable to use a liquid curing agent when heat curing is subsequently performed after printing of the adhesive.
- a liquid curing agent when heat curing is subsequently performed after printing of the adhesive.
- the curing reaction hardly proceeds during storage.
- the adhesive used for the transfer film it is preferable to use a powder or fine particle curing agent at room temperature.
- the blending amount of the curing agent may be appropriately determined according to the epoxy equivalent of (C) the epoxy resin, but is preferably 0.8 to 1.2 equivalents, more preferably 1 equivalent to 1 equivalent of epoxy resin. 0.8 to 1.0 equivalent.
- the inorganic filler is an inorganic filler having an average particle diameter of 1 ⁇ m or less, preferably 0.5 ⁇ m or less, more preferably 100 nm or less.
- the inorganic filler is preferable in that it can contribute not only to viscosity adjustment but also to improvement in bonding strength.
- the average particle diameter means 50% particle diameter (D50), and a particle size distribution measuring device (Nikkiso Co., Ltd., Nanotrac (registered trademark) particle size distribution measuring device UPA-EX150) applying the laser Doppler method, etc. Can be measured.
- a particle size distribution measuring device Nikkiso Co., Ltd., Nanotrac (registered trademark) particle size distribution measuring device UPA-EX150
- anhydrous silica, aluminum hydroxide, talc, clay and the like can be used as the inorganic filler.
- the filler is preferably 1 to 30% by mass of the resin content (total amount of acrylic resin and epoxy resin). If it exceeds 30% by mass, the viscosity becomes too high, and there is a possibility that the stringing or plate separation at the time of printing may be deteriorated. If it is less than 1% by mass, thixotropic properties cannot be imparted.
- the filler content is preferably 3 to 30% by mass, more preferably 10 to 30% by mass.
- the printing adhesive of this embodiment is obtained by dissolving the above components (A) to (D) in an organic solvent.
- organic solvent ester organic solvents such as propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate, and ⁇ -butyrolactone can be used.
- the organic solvent is used from the viewpoint of viscosity adjustment, as will be described later, so that the adhesive can be applied to screen printing.
- the amount of the solvent is selected so that the viscosity characteristic of the finally obtained adhesive satisfies the following range. That is, it is necessary to add such an amount that the viscosity is 15 to 800 Pa ⁇ s when the rotation speed is 1 rpm and the viscosity is 4 to 200 Pa ⁇ s when the rotation speed is 50 rpm.
- the type of the solvent, the types of the components (A), (B), (C), and (D), the combination, and the like are appropriately selected.
- the solvent amount is preferably 55% by weight or less of the total amount of the adhesive.
- the printing type adhesive of this embodiment may contain the (F) antifoaming agent further as needed.
- An antifoaming agent is preferable because it can defoam bubbles entrained during printing. In the case of screen printing, bubbles are easily involved when the adhesive is spread and pushed in as a squeegee. When it is cured while enclosing air bubbles, the cured product is in a state where air bubbles are included. Bubbles contained in the cured product may cause problems such as a decrease in bonding strength and heat resistance due to swelling at high temperatures. It is preferable to make it disappear.
- the content of the antifoaming agent is preferably 0 to 2% by mass, more preferably 0 to 1% by mass, based on the total amount of the adhesive.
- the printing type adhesive of this embodiment includes the above (A) acrylic resin, (B) epoxy resin, (C) curing agent, (D) inorganic filler, (E) solvent, and (F )
- thermoplastic resins other than acrylic resins polyolefin resins, polyester resins, etc.
- thermosetting resins other than epoxy resins for example, phenol resins, melamine resins, oxazine resins
- a curing accelerator, a silane coupling agent, a leveling agent, a surfactant, a flame retardant, and the like are appropriately blended as long as the viscosity characteristics of the printing adhesive of the present embodiment are not impaired. Also good.
- the printing type adhesive of the present invention comprises mixing the components (A) to (D) as described above, further mixing the components (F) and (G), which are added as necessary, and (E) a solvent. And mixing using a ball mill, a homogenizer or the like.
- the mixing order is not particularly limited.
- the printing type adhesive of the present embodiment has a viscosity of 15 to 800 Pa ⁇ s at a rotation speed of 1 rpm as measured with an E-type viscometer (100 to 800 Pa ⁇ s when a paint separation property is required) and a rotation speed of 50 rpm.
- the viscosity is adjusted to 4 to 200 Pa ⁇ s (4 to 13 Pa ⁇ s when smoothness of the printing surface is required).
- the viscosity at 50 rpm is less than 4 Pa ⁇ s, the printed adhesive tends to flow out, and when it exceeds 200 Pa ⁇ s, the separation of the plate is lowered and unevenness is likely to occur in the printed portion.
- the printing surface when it is desired to be smooth, it is preferably set to 13 Pa ⁇ s or less. Further, when the pressure is less than 15 Pa ⁇ s at 1 rpm, the viscosity becomes too low, causing the adhesive to flow out of the printed portion and the like, making it difficult to apply a thick adhesive.
- high-precision color separation such as a conductive portion and an adhesive portion is required, it is preferably 100 Pa ⁇ s or more. On the other hand, when it exceeds 800 Pa ⁇ s, the viscosity becomes too high, and it becomes difficult to apply the coating smoothly on the screen, and the printed portion is likely to be uneven.
- the method for producing a joined body according to the present invention comprises a step of applying the printing adhesive of the present invention to the first adherend by screen printing and then heating at 100 to 250 ° C .; A step of placing two adherends; and a step of heating to 100 to 250 ° C. to thermally cure the adhesive application portion.
- the manufacturing method of the joined body of the present invention is suitable when the first adherend is a flexible printed wiring board or a reinforcing board, and the second adherend is a reinforcing board or a flexible printed wiring board.
- the first adherend is a flexible printed wiring board on which a conductive portion is printed
- 3D to 30% by mass, preferably 10 to 30% of the (D) inorganic filler is used as the printing type adhesive.
- a printing type adhesive containing mass% is used, and application printing is performed on the part where the conductive part is not printed with the printing type adhesive.
- a method for producing a joined body wherein a transfer film obtained by applying and printing any one of the printing adhesives of the above-described embodiment on a release film by screen printing and a first film are provided.
- a step of producing the transfer film by applying the printing adhesive by screen printing and then heating at 50 to 100 ° C. may be included.
- the adhesive part preferably contains (D) the inorganic filler in an amount of 3 to 30% by mass of the resin content.
- the adhesive can be printed on the adherend such as a flexible printed wiring board and a copper-clad laminate by screen printing only at a portion where the adhesive needs to be applied.
- the printing type adhesive 12 of the present invention is placed on a silk screen 10 having openings 10a of a pattern to be bonded, and spread using a spatula such as a squeegee 11 (FIG. 2A). Then, the adhesive is pushed out from the opening 10a, and the adhesive pattern is applied to the adherend (flexible printed wiring board, copper-clad laminate, etc.) 13 (FIG. 2B).
- 12 ' is the applied adhesive.
- the viscosity when extending with a squeegee, the viscosity is such that it does not spread on the screen, and where a large shear stress that passes through the opening is generated, the viscosity Can be lowered and pass smoothly, and hence the separation of the plate is facilitated.
- the amount of adhesive placed on the screen during printing is appropriately selected according to the printing amount. Therefore, when performing continuous printing, it is necessary to mount an amount necessary for continuous printing.
- the adhesive pattern After the adhesive pattern is printed, heat at 100 to 250 ° C. for 1 minute to 1 hour. By heating, the solvent contained in the adhesive is volatilized to form a B stage. Further, the acrylic resin is softened and melted by heating, and can flow into the recesses of the adherend (flexible printed wiring board, reinforcing plate, etc.).
- the other adherend (reinforcing plate) to be bonded is placed on the B-staged adhesive part and temporarily bonded at 60 to 160 ° C. using a laminator of 0.1 to 1 MPa.
- the temporarily bonded portion is cured by heating at 100 to 250 ° C. for 30 minutes to 3 hours.
- curing agent react and it thermosets and a joined body is obtained.
- the adhesive can be applied to the part (pattern) to be bonded by screen printing, it is not necessary to cut out like the conventional film type adhesive, and is discarded. There is no part.
- the portion (pattern) to be bonded is not limited to a macro portion that bonds a reinforcing plate in a flexible printed wiring board as shown in FIG.
- an adhesive can be selectively printed on a portion 5 other than the conductive portion 4 in the flexible printed wiring board 1 ′ on which the conductive pattern 4 is printed.
- the adhesive containing 3% by mass or more, preferably 10% by mass or more of the resin content of the inorganic filler, the width of 100 ⁇ m or more can be applied separately by distinguishing the adhesive application part and the non-application part. Since it is possible, even a micro pattern that requires such precise adjustment can be screen-printed.
- the printing type adhesive is screen-printed on the first adherend, but the manufacturing method of the joined body using the printing type adhesive of the present invention is limited to this. Not. You may transfer an adhesive agent on a 1st to-be-adhered body using the film for transfer produced using the printing type adhesive agent of this invention. It is also possible to produce a joined body by placing the second adherend on the transferred adhesive and heating to 100 to 250 ° C. to thermally cure the transferred adhesive portion. it can.
- the printing type adhesive of the present invention is not particularly limited, but is suitably used for joining a flexible printed wiring board, a copper-clad laminate and a reinforcing plate.
- the position where the reinforcing plate is bonded to the flexible printed wiring board or the copper-clad laminate varies depending on the product, but according to the screen printing method, it is only necessary to prepare a silk screen corresponding to the pattern, and the film adhesive As in the case of using, cutting work for each film is not necessary, and further, there is no need to discard parts, which is economical.
- the target flexible printed wiring board is a laminate (copper-clad laminate) of a plurality of insulating films and metal foils serving as base films, and a circuit is formed on one or both sides. In some cases, the circuit is further covered with an insulating film (so-called coverlay).
- the base film examples include a polyimide film, a polyester film, a polyether ether ketone film, and a polyphenylene sulfide film.
- a plastic film such as a polyimide film
- a prepreg sheet based on a glass fiber reinforced resin sheet, a nonwoven fabric, or the like may be used.
- the metal foil examples include copper foil and aluminum foil, and copper foil is preferably used.
- a plastic film such as a polyimide film, a polyester film, a polyetheretherketone film, or a polyphenylene sulfide film is used.
- Metal plates such as an aluminum board and a silicon steel plate
- Plastic laminated boards such as a paper phenol laminated board and a glass epoxy laminated board
- Plastic boards such as a polyimide board, a polypropylene board, a polyethylene board, etc. are used. It is done.
- the present invention also includes the production of a transfer film for transferring the adhesive to the first adherend.
- the transfer film can be produced by screen-printing the printing adhesive on a release film and then drying by heating.
- the solvent is volatilized to a dry state by heating at 50 to 100 ° C., more preferably by heating at 50 to 100 ° C. for 0.5 to 2 hours.
- a release film having a tape peeling force of less than 600 mN / 50 mm is usually used.
- the transfer film may be a film on which a conductive portion and an adhesive portion are printed.
- the transfer film on which the conductive part and the adhesive part are pattern-printed is printed on the release film using a conductive adhesive such as silver paste, and on the part where the conductive part is not printed, It is manufactured by printing and drying the printing type adhesive of the present invention. After printing the adhesive pattern, the conductive adhesive may be printed on a portion where the adhesive is not printed.
- the release film is composed of the conductive part and the adhesive part corresponding to FIG. What is necessary is just to transfer to a 1st to-be-adhered body using the film for transfer on which the pattern was printed.
- the release film on which the conductive pattern and the adhesive pattern are printed is overlapped with the first adherend as a transfer film and heated at 50 to 100 ° C., so that the conductive portion and the adhesive portion are attached to the first adherend. Can be transferred to.
- an inorganic filler is used in an amount of 3 to 30% by weight, preferably 10 to 10% of the resin amount from the viewpoint of coating the conductive part and the adhesive part separately. It is preferable to use a printing type adhesive containing 30% by mass.
- the curing agent (C) contained in the adhesive is a solid curing at room temperature so that the transfer film on which the adhesive part of a predetermined pattern is printed can be mass-produced and stored in advance. It is preferable to use an agent.
- a joined body can be manufactured by placing the second adherend on the first adherend transferred using the transfer film, heating at 100 to 250 ° C., and thermosetting the adhesive portion. . Even in the adhesive portion transferred using the transfer film, it is possible to produce a bonded body having the same bonding strength and heat resistance as when the adhesive is applied and printed directly on the first adherend. .
- the present invention also includes a transfer film produced using the printing adhesive of the present invention.
- the epoxy resin contains (A) 30 to 70% by mass of the amount of the acrylic resin, (C) a curing agent, and (D) an inorganic filler having an average particle size of 1 ⁇ m or less.
- (Appendix 2) A transfer film in which a conductive part and an adhesive part are printed on a release film, wherein the adhesive part (C) includes a solid curing agent, and the (D The transfer film according to supplementary note 1, wherein the inorganic filler is contained in an amount of 3 to 30% by mass, preferably 10 to 30% by mass of the resin content.
- the flow-out amount of the printed part was measured with a microscope. As shown in FIG. 4, the flow-out amount was measured as the length (d) that protruded from the portion where the adhesive was to be applied (dotted line portion). Depending on the amount of protrusion (d), it is “excellent” when it is 0.05 mm or less, “good” when it is 0.05 to 0.1 mm, and “normal” when it is 0.1 to 0.2 mm. The case of exceeding 0.2 mm was defined as “defective”.
- Threading The presence or absence of threading during screen printing was visually observed. The case where threading was observed was judged as “bad” and the case where threading was not observed was judged as “good”.
- Thick film printability The thickness of the printed part was measured, and if it was 50 ⁇ m or more, it was judged as “good” and if it was less than 50 ⁇ m, it was judged as “bad”.
- Printing adhesive No. having the composition shown in Table 1 and Table 2.
- 1-6 and 11-16 were prepared.
- Acrylic resin A1 Vanare resin GH-7190 (weight average molecular weight 120,000) manufactured by Shin-Nakamura Kogyo
- Acrylic resin A2 Shin-Nakamura Vanade resin GH-7185 (weight average molecular weight 60,000)
- Epoxy resin EPICLON-N740 from DIC (epoxy equivalent 180 g / eq)
- Filler AEROSILRX300 (silica fine powder with a particle size of 7 nm) manufactured by Nippon Aerosil Co., Ltd.
- Acid anhydride Rikacid MH-700 from Nippon Rika Co., Ltd. (It is a mixture of 4-methylhexahydrophthalic acid and methylhexahydrophthalic acid and is liquid at normal temperature) Imidazole: 2E4MZ from Shikoku Chemicals (2-ethyl-4-methylimidazole, which is liquid at room temperature) Antifoaming agent: BYK-54 from Big Chemie Japan
- the unevenness of the printed portion can be reduced by reducing the viscosity at a high shear rate, even if the amount of the solvent is reduced, but the heat resistance cannot be satisfied ( No. 16).
- the adhesive using the solvent E1 having a boiling point of less than 160 ° C. satisfies the continuous printability at both printing speeds of 10 mm / sec and 30 mm / sec, even if the viscosity characteristics are similar. I could't.
- the adhesive using the solvent E2 having a boiling point of 218 ° C. was able to satisfy the continuous printability even at a printing speed of 30 mm / sec.
- the heat resistance is too low (No. 23, 24). Conversely, if the epoxy resin content is too high relative to the acrylic resin, the bonding strength is low. When the blended amount of the epoxy resin exceeded 50 parts by mass of the blended amount of the acrylic resin, the product specification of 10 N / cm could not be satisfied (No. 21, 22).
- Printing adhesive No. having the composition shown in Table 5 31-33 was prepared.
- Sanmide LH210 trade name of Air Products
- the continuous printability of the above evaluation method was evaluated, and (9) a transfer film was prepared based on the coatability, and the coatability was evaluated.
- the printing-type adhesive No. prepared above was used. In the same manner as for No. 1, the coatability was evaluated.
- a cover lay film (release film 38E0010GT (110 mN / 50 mm) manufactured by Fujimori Kogyo Co., Ltd.) was applied to the produced transfer film, and then heated at 60 ° C. for 48 hours. It was stored for 7 days in this state.
- the cover lay film of the transfer film-like adhesive was peeled off and heated at 70 ° C. in a state of being bonded to the first adherend (reinforcing plate), and then the release film was peeled off.
- a pattern composed of an Ag conductive portion and an adhesive portion could be transferred onto the first adherend.
- a flexible printed wiring board is placed as the second adherend on the surface of the first adherend having the transferred conductive pattern and adhesive pattern, heated at 70 ° C., and then at 170 ° C. and 3 MPa for 30 minutes. Press-cured for a minute to obtain a joined body. About the obtained joined body, peeling strength and heat resistance were evaluated and measured based on the said evaluation method. The results are shown in Table 5.
- the filler content is less than 3% by weight based on the resin content.
- No. 1 since the viscosity was low, it was not possible to satisfy a high color separation property.
- the 31-33 adhesive was able to satisfy a high level of paintability. Therefore, the printing type adhesive of the present invention can have a high level of paintability by adjusting the filler content. Further, even when applied to a transfer film, the joined body obtained by the transferred adhesive had a predetermined peel strength and was able to satisfy heat resistance.
- composition No. Concavities and convexities were observed on the printed surface of the adhesive part of the transfer film produced using 31-33, but the surface of the transfer part obtained by transfer was a contact surface (smooth surface) with the release film. So it doesn't matter.
- the printing type adhesive of the present invention can apply the adhesive to the necessary part of the adherend by screen printing, an economic effect can be obtained by applying it to the part where the film adhesive was used. It is done.
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Description
このようなフレキシブルプリント配線板や銅張り積層板において、他の部品を実装したり、他の装置に取り付けるための補強として、例えば、図1A及び図1Bに示すように、被着体(フレキシブルプリント配線板又は銅張り積層板)1の一部分に、補強板2を取り付け接着する場合がある。図1Bはフレキシブルプリント配線板1の一部に補強板2が接着されたものを補強板が設置されている方向から見た平面模式図であり、図1Aは、図1Bを断面方向から見た模式図である。図1中、3は接着剤であり、補強板2は接着剤3を介してフレキシブルプリント配線板1に接着されている。
しかし、このような方法は、フィルム状接着剤の切り抜き残存部分を廃棄することになるため、コスト的に無駄である。また、フィルム状接着剤は、半硬化状態で粘着性を有していることから、通常、離型紙に挟持した三層シートの構造で、取引される。このため、フィルム状接着剤の提供者は、このような三層シートを作製する必要があり、離型紙という別部材のコストが必要になる。
また、フレキシブルプリント配線板や銅張り積層板と補強板の接着に用いる接着剤の場合、単なる印刷用インクと比べて、求められる耐熱性、接合強度が厳しいという問題があるので、印刷用インクを接着剤に転用することはできない
本発明の印刷型接着剤は、(A)重量平均分子量(Mw)8万~30万のアクリル樹脂、(B)エポキシ樹脂を(A)アクリル樹脂量の30~70質量%、(C)硬化剤、(D)平均粒径1μm以下の無機フィラー、及び(E)溶剤を含有する印刷型接着剤であって、E型粘度計測定で回転数1rpmのときの粘度が15~800Pa・sで且つ回転数50rpmのときの粘度が4~200Pa・sである。尚、上記の粘度は室温(25℃)で測定した値とする。
本発明で使用するアクリル樹脂は、重量平均分子量(Mw)8万~30万、好ましくは10万~20万である。重量平均分子量が8万未満では、硬化部分の耐熱性を満足できないからである。一方、重量平均分子量30万を超えると、接着剤の溶融粘度が高くなり、特に高せん断速度下であっても、粘度低下が不十分となり、スクリーン印刷時に糸引きが生じて版離れが悪かったり、印刷された接着剤付与部分の表面に凹凸が生じ、その結果、接合部分に空隙が生じて、接合強度を満足できなくなるおそれがあるからである。また、溶融粘度を下げるために、溶剤を追加すると、固形分濃度が下がり、厚膜印刷が困難となるおそれがある。
本発明で用いられるエポキシ樹脂は、1分子中に少なくとも2個のエポキシ基を有する樹脂であればよく、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、グリシジルエーテル型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂等が挙げられる。
エポキシ樹脂の硬化剤として含有される。硬化剤としては、ポリアミン系硬化剤、酸無水物系硬化剤、三フッ化ホウ素アミン錯塩、イミダゾール系硬化剤、芳香族ジアミン系硬化剤、カルボン酸系硬化剤等を用いることが可能である。これらの硬化剤、特にイミダゾール系硬化剤としては、常温で液状のものと、常温で粉末、微粒子状といった固体のものがある。いずれを用いるかについては、用途に応じて適宜選択すればよい。
常温で液状の酸無水物としては、例えば、ヘキサヒドロ無水フタル酸、4-メチルヘキサヒドロフタル酸無水物等が挙げられる。イミダゾール系硬化剤としては、1-ベンジル-2-フェニルイミダゾール、1-シアノエチル-2-メチルイミダゾール、1-シアノエチル-2-ウンデシルイミダゾール、2-エチル-4-メチルイミダゾールなどが挙げられる。
常温で固体の硬化剤としては、例えば、2-メチルイミダゾール、2-フェニルイミダゾール、2,4-ジアミノ-6-[2'-メチルイミダゾリル-(1')]-エチル-s-トリアジンイソシアヌル酸付加物などが挙げられる。
(D)無機フィラーは、平均粒径1μm以下、好ましくは0.5μm以下、より好ましくは100nm以下の無機フィラーである。このような無機フィラーを含有することにより、低せん断速度下では形状保持に必要な粘度を有し、高せん断速度下では粘度が下がるというチクソトロピック性を発揮することができる。また、このようなフィラーは、粘度調節だけでなく、接合強度の向上にも寄与できるという点で好ましい。
ここで、平均粒径は、50%粒径(D50)をいい、レーザードップラー法を応用した粒度分布測定装置(日機装(株)製、ナノトラック(登録商標)粒度分布測定装置UPA-EX150)等により測定できる。
フィラーは、樹脂分量(アクリル樹脂、エポキシ樹脂の合計量)の1~30質量%とすることが好ましい。30質量%を超えると、粘度が高くなりすぎて、印刷時の糸引きや版離れが悪くなるおそれがあり、1質量%未満ではチクソトロピック性を付与できない。また、印刷箇所の精密な調節が必要な場合、例えば、導電パターンが印刷された被着体の、導電部が印刷されていない部分のみに接着剤を印刷するといった場合には、接着剤のダレ、糸引きを高度に抑制して、版離れをよくする必要があるので、フィラーの含有量は3~30質量%が好ましく、より好ましくは10~30質量%である。
本実施形態の印刷型接着剤は、上記(A)-(D)成分を有機溶剤に溶解したものである。
上記有機溶剤としては、プロピレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノメチルエーテルアセテート、γ-ブチロラクトン等のエステル系有機溶剤を用いることができる。有機溶剤は、接着剤をスクリーン印刷に適用できるように、後述するように、粘度調節の観点から用いられる。
通常、溶剤量は、接着剤全量の55重量%以下とすることが好ましい。溶剤が少なく且つ粘度が高くなりすぎると、印刷された部分の平滑性が低下し、ひどい場合には、版離れが悪くなって、糸引きを生じるようになる。一方、溶剤量が多くなり、粘度が低くなりすぎると、印刷部分に滲みがでやすくなる。
本実施形態の印刷型接着剤は、必要に応じて、さらに(F)消泡剤を含有してもよい。消泡剤は、印刷時に巻き込んだ気泡を消泡できるので好ましい。スクリーン印刷の場合、スキージとして接着剤の延展、押し込む際に、気泡を巻き込みやすい。気泡を巻き込んだままで硬化すると、硬化物に気泡が含まれた状態となる。硬化物に含まれていた気泡は、高温で膨らんだりする等の理由から、接合強度、耐熱性低下の問題を招来する場合があるので、印刷時に気泡を巻きこんでも、加熱硬化までに気泡が消滅するようにしておくことが好ましい。
本実施形態の印刷型接着剤は、上記(A)アクリル樹脂、(B)エポキシ樹脂、(C)硬化剤、(D)無機フィラー、(E)溶剤、及び(F)消泡剤の他、さらにアクリル樹脂以外の熱可塑性樹脂(ポリオレフィン樹脂やポリエステル樹脂等)、エポキシ樹脂以外の熱硬化性樹脂(例えば、フェノール樹脂、メラミン樹脂、オキサジン樹脂)を、本発明の効果を阻害しない範囲内(通常、10質量%以下)であれば、含有してもよい。
本発明の印刷型接着剤は、以上のような(A)~(D)成分を混合し、さらに必要に応じて添加される(F)成分、(G)成分を混合し、(E)溶剤を加えて、ボールミル、ホモジナイザー等を用いて混合することにより調製される。混合順序は特に限定しない。
本発明の接合体の製造方法は、第1の被着体に、上記本発明の印刷型接着剤をスクリーン印刷により塗布印刷した後、100~250℃で加熱する工程;接着剤塗布部分に第2の被着体を載置する工程;及び100~250℃に加熱して、接着剤塗布部分を熱硬化する工程を含む。
前記第1の被着体が、導電部が印刷されたフレキシブルプリント配線板の場合、前記印刷型接着剤として、前記(D)無機フィラーを樹脂分量の3~30質量%、好ましくは10~30質量%含有する印刷型接着剤を使用し、前記導電部が印刷されていない部分に、当該印刷型接着剤により塗布印刷する。
100~250℃に加熱して、前記転写部分の接着剤を熱硬化する工程
を含む。
例えば、図2に示すように、接着すべきパターンの開口部10aを有するシルクスクリーン10上に、本発明の印刷型接着剤12を載せ、スキージ11等のヘラを用いて延展すると(図2A)、開口部10aから接着剤が押し出され、被着体(フレキシブルプリント配線板や銅張り積層板など)13に、接着剤パターンが塗布される(図2B)。図2B中、12’は、塗布された接着剤である。本発明の印刷型接着剤によれば、スキージによる延展の際には、スクリーン上に広がってしまわない程度の粘度を有し、開口部を通過するような大きなせん断応力が発生するところでは、粘度が下がってスムーズに通過することができ、ひいては版離れを容易にする。
本発明の印刷型接着剤を用いて作製された転写用フィルムを用いて、第1の被着体上に接着剤を転写してもよい。転写された接着剤上に、第2の被着体を載置し、100~250℃に加熱して、前記転写された接着剤部分を熱硬化することによっても、接合体を製造することができる。
本発明の印刷型接着剤は、特に限定しないが、フレキシブルプリント配線板、銅張り積層板と補強板との接合に好適に用いられる。フレキシブルプリント配線板や銅張り積層板に補強板を接着する位置は、製品により種々多様であるが、スクリーン印刷方式によれば、パターンに対応するシルクスクリーンを準備するだけでよく、フィルム状接着剤を用いる場合のように、フィルム毎のカッティング作業が不要となり、さらに廃棄する部分がなくて済むので、経済的である。
カバーレイとしては、ポリイミドフィルム、ポリエステルフィルム、ポリエーテルエーテルケトンフィルム、ポリフェニレンスルフィドフィルム等のプラスチックフィルムが用いられる。
本発明は、第1の被着体に接着剤を転写するための転写用フィルムの作製も包含する。
転写用フィルムは、離型フィルム上に、前記印刷型接着剤をスクリーン印刷した後、加熱乾燥することにより作製できる。好ましくは、50~100℃で加熱することにより、さらに好ましくは50~100℃で0.5~2時間加熱することにより、溶剤を揮発させて乾燥状態とする。前記離型フィルムとしては、通常、テープ剥離力600mN/50mm未満程度の離型フィルムが用いられる。
本発明は、本発明の印刷型接着剤を用いて作製される転写用フィルムも包含する。
(付記1) 離型フィルム上に印刷された接着剤部分を有している転写用フィルムであって、前記接着剤部分は、(A)重量平均分子量(Mw)8万~30万のアクリル樹脂、(B)エポキシ樹脂を(A)アクリル樹脂量の30~70質量%、(C)硬化剤、及び(D)平均粒径1μm以下の無機フィラーを含有している。
以下の実施例で採用した測定評価方法は以下の通りである。
スクリーン印刷後、印刷した部分の流れ出し量をマイクロスコープで測定した。流れ出し量は、図4に示すように、接着剤を塗布すべき部分(点線部分)に対して、はみ出た長さ(d)として測定した。はみ出し量(d)に応じて、0.05mm以下の場合には「優良」、0.05~0.1mmの場合には「良好」、0.1mm~0.2mmの場合には「普通」、0.2mmを超える場合を「不良」とした。
スクリーン印刷時の糸引きの有無を目視にて観察し、糸引きが認められた場合を「不良」、認められない場合を「良好」とした。
印刷後、印刷により塗布された部分を目視で観察し、泡が存在していた場合を「不良」、存在していなかった場合は「良好」とした。
スクリーン印刷後、Bステージ乾燥後、印刷部分を目視にて観察し、表面が平滑な場合を「良好」、表面に凹凸が認められた場合を「不良」とした。
印刷部分の厚みを測定し、50μm以上あれば「良好」、50μm未満の場合を「不良」とした。
100枚印刷した後の印刷部分について、流れ出し性、糸引き、印刷時の気泡巻き込み、表面平滑性、厚膜印刷性を評価し、初期と差異がなければ「OK」、いずれか1つでも評価が「不良」に低下した場合を「NG」とした。
作製した接合体について、JIS-C-6481に準拠して、23℃において、補強板からフレキシブルプリント配線板を剥がすときの剥離強度(N/cm)を測定し、10N/cm以上の場合を「良好」、10N/cm未満の場合を「不良」とした。
260℃に加熱したプレート上に、得られた接合体を1分間載せた後の状態を目視で観察し、接合部分の外観に変化がない場合を「良好」、接合部分が融けだし等により膨れたり広がったりしていた場合を「不良」とした。
ニッパ株式会社の軽剥離型フィルムV8(剥離力520mN/50mm)表面に、導電性接着剤(Agペースト)を用いて、印刷速度10mm/秒で、幅0.2mm間隔をあけてストライプ状に導電パターンを印刷した後、80℃で30分間焼成した。導電性接着剤が施されていない部分(導電部が印刷されていない部分)に、印刷型接着剤を、50mm/秒で印刷した後、60℃で60分間加熱して乾燥させて、導電パターンを有する転写用フィルムを作成した。作成した転写用フィルムの接着剤印刷部分を目視で観察し、導電部に接着剤が塗布されていた場合を塗り分け性が「不良」とし、接着剤が導電部にまで広がっていなかった場合を塗り分け性「良好」と評価した。
表1及び表2に示す組成を有する印刷型接着剤No.1-6、11-16を調製した。なお、表1に示す成分としては、下記のものを用いた。
・アクリル樹脂A1:新中村工業製のバナレジンGH-7190(重量平均分子量12万)
・アクリル樹脂A2:新中村工業製のバナレジンGH-7185(重量平均分子量6万)
・エポキシ樹脂:DIC社のEPICLON-N740(エポキシ当量180g/eq)
・フィラー:日本アエロジル社のAEROSILRX300(粒径7nmのシリカ微粉末)
・酸無水物:日本理化社のリカシッドMH-700(4-メチルヘキサヒドロフタル酸とメチルヘキサヒドロフタル酸との混合物であり、常温で液状である)
・イミダゾール:四国化成社の2E4MZ(2-エチル-4-メチルイミダゾールであり、常温で液状である)
・消泡剤:ビックケミージャパン社のBYK-54
印刷後、200℃で3分間加熱することでBステージ化した後、フレキシブルプリント配線板を載せて、0.1~1.0MPaのラミネータを用いて、60~160℃で仮接着した。次いで、仮接着部分を120℃で2時間加熱することで、接着剤の印刷部分を熱硬化させた。得られた硬化物について、平滑性、厚膜印刷性、剥離強度、耐熱性を評価した。これらの結果を表2にあわせて示す。
一方、沸点218℃の溶剤E2を用いた接着剤では、印刷速度30mm/secでも連続印刷性を満足することができた。
アクリル樹脂A1、エポキシ樹脂、硬化剤(酸無水物、イミダゾール)の配合組成を表4に示すように変更して、印刷型接着剤No.21-27を調製した。得られた印刷型接着剤を用いて、スクリーン印刷で、補強板に印刷し、印刷後、200℃で3分間加熱することで、Bステージ化した後、フレキシブルプリント配線板を乗せて、80℃で0.3MPaのラミネータを用いて、仮接着した。次いで、仮接着した部分を120℃で2時間加熱することで、熱硬化させた。得られた接合体について、剥離強度、耐熱性を評価した。これらの結果を表4にあわせて示す。比較のためにNo.3、13を用いて、同様に接着を行った結果についても、あわせて表4に示す。
表5に示す組成を有する印刷型接着剤No.31-33を調製した。なお、表5に示す固体イミダゾール硬化剤としては、サンマイドLH210(エアープロダクツ社の商品名)を用いた。調製した接着剤を用いて、上記評価方法の連続印刷性を評価し、さらに(9)塗り分け性に基づいて転写用フィルムを作成し、塗り分け性を評価した。比較のために、上記で調製した印刷型接着剤No.1についても同様にして、塗り分け性を評価した。
得られた接合体について、上記評価方法に基づいて、剥離強度、耐熱性を評価測定した。結果を表5に示す。
また、転写用フィルムに適用しても、転写された接着剤により得られる接合体は、所定の剥離強度を有し、耐熱性も満足することができた。
2 補強板
3 接着剤
4 導電部
5 接着剤部
10 シルクスクリーン
11 スキージ
12、12’ 接着剤
13 被着体
Claims (11)
- (A)重量平均分子量(Mw)8万~30万のアクリル樹脂、(B)エポキシ樹脂を(A)アクリル樹脂量の30~70質量%、(C)硬化剤、(D)平均粒径1μm以下の無機フィラー、及び(E)溶剤を含有する印刷型接着剤であって、
E型粘度計測定で回転数1rpmのときの粘度が15~800Pa・sで且つ回転数50rpmのときの粘度が4~200Pa・sである印刷型接着剤。 - 前記(E)溶剤は、沸点160℃以上の有機溶剤である請求項1に記載の印刷型接着剤。
- 前記(E)溶剤の含有率は、印刷型接着剤全量の55質量%以下である請求項1又は2に記載の印刷型接着剤。
- 前記(C)硬化剤は、酸無水物を含む請求項1~3のいずれか1項に記載の印刷型接着剤。
- 前記(D)無機フィラーを、樹脂分量の1~30質量%含有する請求項1~4のいずれか1項に記載の印刷型接着剤。
- 第1の被着体に、請求項1~5のいずれか1項に記載の印刷型接着剤をスクリーン印刷により塗布印刷した後、100~250℃で加熱する工程;
接着剤塗布部分に第2の被着体を載置する工程;及び
100~250℃に加熱して、接着剤塗布部分を熱硬化する工程
を含む接合体の製造方法。 - 前記第1の被着体は、フレキシブルプリント配線板又は補強板であり、前記第2の被着体は、補強板又はプリント配線板である請求項6に記載の接合体の製造方法。
- 前記第1の被着体は、導電部が印刷されたフレキシブルプリント配線板であって、
前記印刷型接着剤として、前記(D)無機フィラーを樹脂分量の3~30質量%含有する印刷型接着剤を使用し、
当該印刷型接着剤により塗布印刷する部分は、前記導電部が印刷されていない部分である請求項6に記載の接合体の製造方法。 - 離型フィルム上に、請求項1~5のいずれか1項に記載の印刷型接着剤をスクリーン印刷により塗布印刷して得られた転写用フィルムと第1の被着体とを重ね合わせて50~100℃で加熱した後、前記離型フィルムを剥離除去することにより、前記転写用フィルムの転写部分を前記第1の被着体に転写する工程;
前記第1の被着体の転写部分に第2の被着体を載置する工程;及び
100~250℃に加熱して、前記転写部分の接着剤を熱硬化する工程
を含む接合体の製造方法。 - 前記印刷型接着剤をスクリーン印刷により塗布印刷した後、50~100℃で加熱することにより、前記転写用フィルムを作製する工程を含む請求項9に記載の接合体の製造方法。
- 前記転写用フィルムの転写部分は、導電部と接着剤部とを含んでいて、
前記接着剤部は、前記(D)無機フィラーを樹脂分量の3~30質量%含有している請求項9又は10に記載の接合体の製造方法。
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| CN201380012877.6A CN104185667B (zh) | 2012-03-07 | 2013-03-05 | 印刷型胶粘剂和使用该胶粘剂的接合体的制造方法 |
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| WO2003103352A1 (ja) * | 2002-06-04 | 2003-12-11 | 住友電気工業株式会社 | プリント配線用基板、プリント配線板およびこれらの製造方法 |
| JP2009084336A (ja) * | 2007-09-28 | 2009-04-23 | Kimoto & Co Ltd | 粘接着剤および粘接着シート |
| JP2011225856A (ja) * | 2010-03-31 | 2011-11-10 | Toray Ind Inc | 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート |
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| JP5008190B2 (ja) * | 2007-06-15 | 2012-08-22 | 信越化学工業株式会社 | スクリーン印刷用接着剤組成物 |
| JP5485523B2 (ja) * | 2008-08-19 | 2014-05-07 | 積水化学工業株式会社 | スクリーン印刷用接着剤 |
| JP4976481B2 (ja) * | 2009-12-04 | 2012-07-18 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置 |
| TW201141972A (en) * | 2010-03-31 | 2011-12-01 | Lintec Corp | Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| WO2011129272A1 (ja) * | 2010-04-13 | 2011-10-20 | 積水化学工業株式会社 | 半導体チップ接合用接着材料、半導体チップ接合用接着フィルム、半導体装置の製造方法、及び、半導体装置 |
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| WO2003103352A1 (ja) * | 2002-06-04 | 2003-12-11 | 住友電気工業株式会社 | プリント配線用基板、プリント配線板およびこれらの製造方法 |
| JP2009084336A (ja) * | 2007-09-28 | 2009-04-23 | Kimoto & Co Ltd | 粘接着剤および粘接着シート |
| JP2011225856A (ja) * | 2010-03-31 | 2011-11-10 | Toray Ind Inc | 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート |
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| JP6033841B2 (ja) | 2016-11-30 |
| CN104185667A (zh) | 2014-12-03 |
| CN104185667B (zh) | 2016-05-11 |
| JPWO2013133240A1 (ja) | 2015-07-30 |
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