[go: up one dir, main page]

WO2013035821A1 - Antenna device and wireless device - Google Patents

Antenna device and wireless device Download PDF

Info

Publication number
WO2013035821A1
WO2013035821A1 PCT/JP2012/072849 JP2012072849W WO2013035821A1 WO 2013035821 A1 WO2013035821 A1 WO 2013035821A1 JP 2012072849 W JP2012072849 W JP 2012072849W WO 2013035821 A1 WO2013035821 A1 WO 2013035821A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil conductor
antenna element
antenna
coil
power feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/072849
Other languages
French (fr)
Japanese (ja)
Inventor
加藤登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN201290000476.XU priority Critical patent/CN203553354U/en
Priority to JP2013532657A priority patent/JP5418737B2/en
Publication of WO2013035821A1 publication Critical patent/WO2013035821A1/en
Priority to US14/085,830 priority patent/US9543642B2/en
Anticipated expiration legal-status Critical
Priority to US15/364,371 priority patent/US9812764B2/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to an antenna device and a wireless device including the antenna device.
  • RFID tags and reader / writers include an RFIC (Radio Frequency Integrated Circuit) chip that processes high-frequency signals and an antenna element that radiates or receives high-frequency signals.
  • RFIC Radio Frequency Integrated Circuit
  • the RFID system for example, an HF band RFID system using a 13 MHz band such as FeliCa (registered trademark), and a UHF band RFID system using a 900 MHz band which has been used for warehouse management and the like are known.
  • Patent Document 1 Patent Document 2, and Patent Document 3
  • a method of connecting a feeding coil to an RFIC chip and connecting the feeding coil and the main antenna via an electromagnetic field is known. It has been.
  • the antenna device of the present invention An antenna element having a coupling portion; A power supply having a first coil conductor and a second coil conductor, wherein the first coil conductor and the second coil conductor are formed such that a magnetic flux generated in the first coil conductor and the second coil conductor constitutes a closed magnetic circuit. An element, The feed element and the antenna element are arranged so that the closed magnetic path of the feed element goes around the coupling portion of the antenna element.
  • the antenna element includes a spiral or loop-shaped coil conductor, the coupling portion is a part of the coil conductor, and the feeding element includes the first coil conductor and the second coil conductor as the antenna element. It is preferable that they are arranged so as to straddle the connecting portions.
  • the antenna element has a resonance frequency corresponding to a carrier frequency of a communication signal.
  • the coupling portion of the antenna element coupled to the feed element is disposed in the closed magnetic path formed by the coil conductors of the feed element, the coupling between the feed element and the antenna element is high. Can be combined. Therefore, a low insertion loss characteristic can be obtained in the transmission characteristic when the signal received by the antenna element is transmitted to the RFIC.
  • an RFID tag or a reader / writer having a large communicable maximum distance when used for an RFID tag or a reader / writer, an RFID tag or a reader / writer having a large communicable maximum distance can be configured.
  • FIG. 1 is an exploded perspective view of an RFID tag 401 according to the first embodiment.
  • 2A is a plan view of the RFID tag 401
  • FIG. 2B is a plan view of the power feeding device 301.
  • FIG. 3 is a diagram illustrating the relationship between the magnetic flux generated in the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201 and the coil conductor 11 of the antenna element 101.
  • FIG. 4A is an exploded perspective view of the coil conductors 11 and 12 included in the antenna element 102.
  • FIG. 4B is an equivalent circuit diagram of the antenna element 102 in a state where two coil conductors 11 and 12 face each other with a base material sheet interposed therebetween.
  • FIG. 4C is an equivalent circuit diagram in a state where the power feeding device is coupled to the antenna element.
  • FIG. 5 is an exploded perspective view of the power feeding element 203 and the power feeding device 303 of the third embodiment.
  • FIG. 6A is a plan view of the communication terminal device viewed from the back side.
  • FIG. 6B is a cross-sectional view taken along the line BB in FIG.
  • FIG. 7 is an enlarged cross-sectional view of the RFID tag portion.
  • FIG. 8 is a perspective view of the main part of the antenna device of the fifth embodiment.
  • FIG. 9 is a plan view of the RFID tag 406 of the sixth embodiment.
  • FIG. 10 is an exploded perspective view of the RFID tag 407 of the seventh embodiment.
  • FIG. 11 is a plan view of the RFID tag 407.
  • FIG. 12 is a plan view of the RFID tag 408 of the eighth embodiment.
  • FIG. 13 is an exploded perspective view of a feeding element 209 according to the ninth embodiment.
  • FIG. 14 is an external perspective view of the power feeding element 209.
  • FIG. 15 is a partial perspective view showing a coupling state of the antenna element 102 acting as a resonance booster and the feeding element 209.
  • FIG. 16 is a conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209.
  • FIG. 17 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209.
  • FIG. 18 is an exploded perspective view of the power feeding element 210 according to the tenth embodiment.
  • FIG. 19 is a partial perspective view showing a coupling state between the antenna element 102 and the feeding element 210 that act as a resonance booster.
  • FIG. 20 is a conceptual diagram showing a magnetic coupling state between the antenna element 102 and the power feeding element 210.
  • FIG. 21 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 210.
  • FIG. 22 is a diagram illustrating the internal structure of the housing of the wireless communication apparatus 501 according to the eleventh embodiment.
  • FIG. 1 is an exploded perspective view of an RFID tag 401 according to the first embodiment.
  • 2A is a plan view of the RFID tag 401
  • FIG. 2B is a plan view of the power feeding device 301.
  • the RFID tag 401 is an RFID tag for an HF band RFID system, and includes an antenna element 101 and a power feeding device 301.
  • the antenna element 101 includes a base material sheet 10 such as PET and a coil conductor 11 formed on the upper surface thereof.
  • the power feeding device 301 includes the power feeding element 201 and the RFIC 30.
  • the RFIC 30 is an IC chip for RFID.
  • the RFIC 30 includes a memory circuit and a logic circuit.
  • the power feeding element 201 includes a base sheet 20 such as PET, and a first coil conductor 21 and a second coil conductor 22 formed on the upper surface of the base sheet 20.
  • first coil conductor 21 and the second coil conductor 22 are formed on the base sheet 20 so that the magnetic flux generated in the first coil conductor 21 and the second coil conductor 22 forms a closed magnetic path (winding). Times / placement).
  • the power feeding device 301 is disposed close to the coupling portion CA of the antenna element 101. For example, it is stuck via a double-sided PSA sheet.
  • the feeding element 201 is arranged with respect to the antenna element 101 so that the closed magnetic circuit of the feeding element 201 circulates around the coupling portion CA of the antenna element 101. Is arranged.
  • FIG. 3 is a diagram illustrating the relationship between the magnetic flux generated in the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201 and the coil conductor 11 of the antenna element 101.
  • the magnetic flux indicated by the broken arrow circulates around the coil conductor 11. This magnetic flux is linked to the loop surfaces of the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201.
  • the first coil conductor 21 and the second coil conductor 22 are connected in series and connected to the RFIC 30 so that the electromotive forces of the first coil conductor 21 and the second coil conductor 22 at this time are added.
  • the electromotive force excited by the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201 is supplied to the RFIC 30.
  • the magnetic flux passing through the loop surfaces of the first coil conductor 21 and the second coil conductor 22 is the coil conductor 11 of the antenna element. Current is induced in the coil conductor 11.
  • the first coil conductor 21 and the second coil conductor 22 are preferably disposed adjacent to each other on the same plane. That is, a closed magnetic circuit is formed in a plane direction perpendicular to the coil surface of each coil element, and a coupling portion of the antenna element is provided so as to pass in a direction perpendicular to the surface (flux loop surface) of the closed magnetic circuit. It is preferable.
  • the first coil conductor 21 and the second coil conductor 22 preferably have winding axes that are substantially parallel to each other. This makes it easier for the magnetic flux passing through the first coil conductor 21 and the second coil conductor 22 to circulate along the closed magnetic path, and the coupling of the antenna element with the coil conductor 11 can be made more reliable.
  • the coupling portion of the antenna element is provided in the closed magnetic circuit formed by the feeding element, the feeding circuit and the antenna element are coupled via an electromagnetic field (mainly a magnetic field). Therefore, it is possible to realize a wireless device having a high degree of coupling between each coil element and the antenna element and a low insertion loss.
  • the power feeding element forms a closed magnetic circuit, even if a metal body such as a ground conductor or a battery pack is provided in the vicinity of the power feeding element, the formation of a magnetic field is prevented by these metal bodies, There is almost no loss as an eddy current. Therefore, when the antenna device and the wireless device of the present invention are used for an RFID tag or a reader / writer, an RFID tag or a reader / writer having a large communication distance can be configured.
  • the antenna element preferably has a resonance frequency corresponding to the carrier frequency of the communication signal.
  • the RFIC and the feed element also have a resonance frequency corresponding to the carrier frequency of the communication signal.
  • the resonance frequency composed of the RFIC and the feed element is determined by the stray capacitance of the RFIC itself and the inductance (and also the line capacitance) of the feed circuit.
  • Second Embodiment a configuration of an antenna element different from that of the first embodiment is shown.
  • FIG. 4B is an equivalent circuit diagram of the antenna element 102 in a state where the two coil conductors 11 and 12 face each other with the base material sheet interposed therebetween.
  • FIG. 4C is an equivalent circuit diagram in a state where the power feeding device is coupled to the antenna element.
  • the coil conductor 11 and the coil conductor 12 of the antenna element 102 are patterned in a rectangular spiral shape.
  • the winding direction of the coil conductor 11 and the winding direction of the coil conductor 12 are opposite (the same direction when seen from one direction), and both are electromagnetically coupled.
  • the inductor L11 represents the inductance due to the coil conductor 11 with a symbol
  • the inductor L12 represents the inductance due to the coil conductor 12 with a symbol.
  • Capacitors C1 and C2 represent the capacitance generated between the coil conductors 11 and 12 with a lumped constant symbol.
  • the coil conductors 11 and 12 of the antenna element 102 constitute an LC circuit.
  • an inductor L202 represents an inductance by a coil conductor constituting the power feeding element by a symbol.
  • the antenna element 102 acts as an HF band antenna.
  • the capacitor CIC represents a capacitance connected to the coil conductor of the power feeding element such as a parasitic capacitance of the RFIC 30 by a symbol.
  • the capacitor CIC and the inductor L201 resonate with each other.
  • the two LC resonant circuits of the RFIC 30 and the antenna element 102 are electromagnetically coupled (mainly magnetically coupled), whereby a signal is transmitted between the antenna element 102 and the RFIC 30. In this way, the antenna element 102 acts as a resonance booster.
  • FIG. 5 is an exploded perspective view of the power feeding element 203 and the power feeding device 303 of the third embodiment.
  • the power feeding element 203 is formed by laminating a plurality of dielectric base sheets on which patterns such as coil conductors are formed. Terminals 23 and 24 for connecting the RFIC 30 are formed on the base sheet 20a.
  • Coil conductors 21b and 22b are formed on the base sheet 20b.
  • Coil conductors 21c and 22c are formed on the base sheet 20c.
  • Coil conductors 21d and 22d are formed on the base sheet 20d. As shown by broken lines in FIG. 5, via conductors are formed on each base sheet, and interlayer connection is made.
  • the helical first coil conductor 21 and second coil conductor 22 may be formed on a dielectric ceramic multilayer substrate. According to this structure, a large coil opening can be secured even if the number of turns increases. For this reason, even if the number of turns of the coil conductor of the power feeding element is increased, the coil conductor of the antenna element can be magnetically coupled strongly.
  • FIG. 6A is a plan view of the communication terminal device viewed from the back side.
  • FIG. 6B is a cross-sectional view taken along the line BB in FIG.
  • FIG. 7 is an enlarged cross-sectional view of the RFID tag portion.
  • a printed wiring board 50 is accommodated in the housing 60.
  • a ground conductor 51 is formed inside the printed wiring board 50.
  • An antenna element 101, a power feeding device 301, and the like are provided on the inner surface of the housing.
  • the configurations of the antenna element 101 and the power feeding device 301 are the same as those shown in the first embodiment.
  • a magnetic layer 40 such as a ferrite sheet is disposed between the antenna element 101 and the power feeding device 301 and the printed wiring board 50.
  • the magnetic layer 40 is provided so that the ground conductor 51 cannot be seen equivalently when viewed from the antenna element 101 and the power feeding device 301.
  • the antenna element 101 is attached to the inner surface of the housing 60 via the adhesive layer 9.
  • the magnetic layer 40 may also be attached to the antenna element 101 and the power feeding device 301 via a double-sided adhesive sheet or the like.
  • the magnetic layer it is possible to block the magnetic flux that attempts to enter the metal such as the ground conductor and suppress the generation of eddy current.
  • a magnetic layer such as a ferrite sheet may be disposed between the antenna body and the metal body.
  • the antenna device may be arranged on the inner surface of the housing so that it is as far as possible from the metal body and the space can be used effectively.
  • a mixed molded product of resin and metal powder an article in which a metal sheet is molded into a resin article, and a metal part in the case
  • An article such as a battery or a liquid crystal display, which may generate an eddy current that cancels the magnetic field change of the coil antenna due to the presence of metal, corresponds to the metal body.
  • FIG. 8 is an exploded perspective view of the main part of the antenna device of the fifth embodiment.
  • the antenna device includes an antenna element and a feeding device.
  • the configurations of the antenna element and the power feeding device are the same as those shown in the first embodiment.
  • the base material sheet of the antenna element and the base material sheet of the power feeding element are excluded.
  • the magnetic layers 41 and 42 are disposed so as to sandwich the coil conductor 11 provided in the antenna element and the first coil conductor 21 and the second coil conductor 22 provided in the power feeding element.
  • the magnetic layers 41 and 42 are ferrite sheets or the like, and are attached to the antenna element and the power feeding device via a double-sided adhesive sheet.
  • the first coil conductor 21 is provided by sandwiching the coil conductor 11 provided in the antenna element, the first coil conductor 21 and the second coil conductor 22 provided in the feeding element between the magnetic layers 41 and 42. And most of the magnetic flux passing through the second coil conductor 22 passes through the magnetic layers 41 and 42. Therefore, the leakage magnetic flux is reduced, and the degree of coupling between the coil conductor 11 of the antenna element and the coil conductors 21 and 22 of the feeding element is increased.
  • FIG. 9 is a plan view of the RFID tag 406 of the sixth embodiment.
  • the RFID tag 406 includes an antenna element 101 and two power feeding devices 301 and 302.
  • the antenna element 101 includes a base sheet 10 and a coil conductor 11 formed on the upper surface thereof.
  • the power feeding devices 301 and 302 are the same as the power feeding device shown in the first embodiment, and are composed of a power feeding element and an RFIC.
  • the power feeding devices 301 and 302 may be arranged at two locations on the coil conductor 11 of the antenna element 101.
  • the power feeding device 301 and the power feeding device 302 may be different types corresponding to different RFIDs in the system. As a result, one antenna element 101 can also be used.
  • FIG. 10 is an exploded perspective view of the RFID tag 407 of the seventh embodiment.
  • FIG. 11 is a plan view of the RFID tag 407.
  • the RFID tag 407 includes an antenna element 107 and a power feeding device 307.
  • the antenna element 107 includes a base sheet 10 and a coil conductor 11 formed on the upper surface thereof.
  • the power feeding device 307 includes a power feeding element 207 and the RFIC 30.
  • the antenna element 107 has terminals 16 and 17 for mounting the capacitive element 19 in the middle of the coil conductor 11. By mounting the capacitive element 19 on the terminals 16 and 17, the capacitive element 19 is inserted into the coil conductor 11 in series.
  • the coil conductor 11 and the capacitive element 19 constitute an LC resonance circuit.
  • the antenna element 107 has a pattern of the coil conductor 11 so that the coupling portion CA is recessed inside the coil opening. In this way, by shifting the coupling portion CA to the inside of the base sheet 10, the position of the power feeding device 307 (sticking position) is shifted toward the inside of the base sheet 10, and the overall size can be reduced.
  • the power feeding element 207 includes a base sheet 20 and a first coil conductor 21 and a second coil conductor 22 formed on the upper surface of the base sheet 20. Terminals 23 and 24 for connecting the RFIC 30 are formed on the base sheet 20.
  • the power feeding element 207 is different from the power feeding element 201 shown in the first embodiment, and the first coil conductor 21 and the second coil conductor 22 are asymmetric. That is, the first coil conductor 21 is formed to be relatively small so as to face the recessed portion of the coil conductor 11 of the antenna element 107. Since the second coil conductor 22 faces the coil opening of the coil conductor 11 of the antenna element 107, the second coil conductor 22 has a sufficient size and is formed relatively large. Thus, by making the first coil conductor 21 and the second coil conductor 22 asymmetrical, the power feeding device can be reduced in size while ensuring the necessary number of turns.
  • FIG. 12 is a plan view of the RFID tag 408 of the eighth embodiment.
  • the RFID tag 408 includes an antenna element 108 and a power feeding device 301.
  • the antenna element 108 includes the base sheet 10 and radiation conductors 13 and 14 and a line portion 15 formed on the upper surface thereof.
  • the power feeding device 301 is the same as that shown in the first embodiment.
  • the radiating conductors 13 and 14 and the filament 15 of the antenna element 108 act as a dipole antenna.
  • the power feeding device 301 is coupled to the line portion 15 to feed power to the dipole antenna.
  • the RFIC of the power feeding device 301 and the power feeding element constituting the closed magnetic circuit have a resonance point at a predetermined frequency and are impedance matched.
  • the antenna element 108 may not be configured to resonate at a predetermined frequency. That is, the radiating conductors 13 and 14 may be larger than the power feeding device 301.
  • a dipole antenna can be used.
  • a loop-type, patch-type, etc. antenna can be used. Any antenna element can be fed by being magnetically coupled to the coil conductor of the feeding device.
  • FIG. 13 is an exploded perspective view of a feeding element 209 according to the ninth embodiment.
  • the power feeding element 209 is formed by laminating a plurality of insulating (for example, magnetic) base material sheets on which patterns such as coil conductors are formed.
  • Coil conductors 21a and 22a are formed on the base sheet 20a.
  • Coil conductors 21b and 22b are formed on the base sheet 20b.
  • Coil conductors 21c and 22c are formed on the base sheet 20c.
  • Coil conductors 21d and 22d are formed on the base sheet 20d.
  • Interlayer connection conductors are formed on the outer surface of each base sheet.
  • interlayer connection conductor has been described as being formed so as to be exposed to the outside of each base sheet, it may be provided so as to be positioned inside each base sheet.
  • FIG. 14 is an external perspective view of the feed element 209. Terminals 23 and 24 are drawn out on the lower surface of the rectangular parallelepiped laminate.
  • the helical first coil conductor 21 and second coil conductor 22 may be formed on a magnetic ceramic multilayer substrate.
  • FIG. 15 is a partial perspective view showing a coupling state between the antenna element 102 acting as a resonance booster and the feeding element 209.
  • the basic structure of the antenna element 102 is as shown in FIGS. 4 (A) and 4 (B).
  • the RFIC 30 is connected to the power feeding element 209. In this way, the feed element 209 is disposed, for example, below the coil conductor of the antenna element 102.
  • a matching circuit, a filter circuit, and the like are connected between the feeding element 209 and the RFIC 30.
  • FIG. 17 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209. As described above, the magnetic flux generated by the first coil conductor 21 and the second coil conductor 22 may be partially interlinked with the coil conductor of the antenna element 102.
  • the RFIC 30 described in each of the embodiments described above may be configured as a bare chip IC or may be configured as a package IC. In the case of a package IC, a matching circuit may be provided on the package substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)
  • Support Of Aerials (AREA)

Abstract

This RFID tag (401) is provided with an antenna element (101) and a feeder device (301). The antenna element (101) is configured from a substrate sheet (10) and a coil conductor (11) formed on the upper surface thereof. The feeder device (301) is configured from a feeder element (201) and an RFIC (30). The feeder element (201) is configured from a substrate sheet (20), and a first coil conductor (21) and second coil conductor (22) formed on the upper surface of the substrate sheet (20). The first coil conductor (21) and the second coil conductor (22) are formed to the substrate sheet (20) in a manner so that the magnetic flux arising at the first coil conductor (21) and the second coil conductor (22) configures a closed magnetic circuit. Also, the feeder device (301) is pasted to the joining section (CA) of the antenna element (101). As a result, the RFIC is strongly joined to the antenna element.

Description

アンテナ装置および無線デバイスAntenna device and wireless device

　本発明はアンテナ装置およびそれを備えた無線デバイスに関する。 The present invention relates to an antenna device and a wireless device including the antenna device.

　リーダライタとＲＦＩＤ（Radio Frequency Identification）タグとを非接触方式で通信し、リーダライタとＲＦＩＤタグとの間で情報を伝達するＲＦＩＤシステムが普及し始めている。ＲＦＩＤタグやリーダライタは、高周波信号を処理するＲＦＩＣ（Radio Frequency Integrated Circuit）チップと高周波信号を放射あるいは受信するアンテナ素子とを備える。ＲＦＩＤシステムとしては、例えばFeliCa（登録商標）のように１３ＭＨｚ帯を利用したＨＦ帯ＲＦＩＤシステムや、倉庫管理等に利用が始まっている９００ＭＨｚ帯を利用したＵＨＦ帯ＲＦＩＤシステムが知られている。 RFID systems that communicate between a reader / writer and an RFID (Radio Frequency Identification) tag in a non-contact manner and transmit information between the reader / writer and the RFID tag are beginning to spread. RFID tags and reader / writers include an RFIC (Radio Frequency Integrated Circuit) chip that processes high-frequency signals and an antenna element that radiates or receives high-frequency signals. As the RFID system, for example, an HF band RFID system using a 13 MHz band such as FeliCa (registered trademark), and a UHF band RFID system using a 900 MHz band which has been used for warehouse management and the like are known.

　一般的なＲＦＩＤタグにおいて、ＲＦＩＣチップとアンテナ素子との接続には金バンプを用いた接合が多用されている。しかし、この接合方法は、超音波を利用した接合方法であるため、接合プロセスが複雑であり、高い接続信頼性を確保し難いことがある。 In general RFID tags, bonding using gold bumps is often used to connect an RFIC chip and an antenna element. However, since this joining method is a joining method using ultrasonic waves, the joining process is complicated, and it may be difficult to ensure high connection reliability.

　そこで、例えば特許文献１、特許文献２、特許文献３に記載されているように、ＲＦＩＣチップに給電コイルを接続し、給電コイルとメインアンテナとを電磁界を介して接続する、という手法が知られている。 Therefore, for example, as described in Patent Document 1, Patent Document 2, and Patent Document 3, a method of connecting a feeding coil to an RFIC chip and connecting the feeding coil and the main antenna via an electromagnetic field is known. It has been.

特許第２８３４５８４号公報Japanese Patent No. 2834584 特開２００８－２１１５７２号公報JP 2008-211152 A 特開２００９－１１１９５０号公報JP 2009-111950 A

　ところが、ＲＦＩＣチップに給電コイルが接続され、給電コイルとメインアンテナとが電磁界を介して結合されるようにしたＲＦＩＤタグでは、ＲＦＩＣチップとアンテナ素子との接続が容易になるものの、その結合度を高めることが難しく、場合によってはメインアンテナで受信した信号または電磁エネルギーをＲＦＩＣチップに伝送にするにあたって挿入損失が大きくなってしまう。そのため、通信可能最大距離を充分に確保できない場合がある。 However, in the RFID tag in which the feeding coil is connected to the RFIC chip and the feeding coil and the main antenna are coupled via the electromagnetic field, the connection between the RFIC chip and the antenna element is facilitated. In some cases, the insertion loss increases when the signal or electromagnetic energy received by the main antenna is transmitted to the RFIC chip. Therefore, there may be a case where the maximum communicable distance cannot be secured sufficiently.

　このことはＲＦＩＤタグに限らず、ＲＦＩＣを備えた給電回路が接続されるアンテナ装置およびそれを備えた無線デバイスに共通の課題である。 This is a problem common to not only RFID tags but also antenna devices to which power supply circuits including RFICs are connected and wireless devices including the antenna devices.

　本発明はアンテナ素子にＲＦＩＣを強く結合させることのできるアンテナ装置および無線デバイスを提供することを目的としている。 It is an object of the present invention to provide an antenna device and a wireless device that can strongly couple an RFIC to an antenna element.

（１）本発明のアンテナ装置は、
　結合部を有するアンテナ素子と、
　第１コイル導体および第２コイル導体を有し、前記第１コイル導体および前記第２コイル導体に生じる磁束が閉磁路を構成するように当該第１コイル導体および第２コイル導体が形成された給電素子と、を備え、
　前記給電素子の前記閉磁路が前記アンテナ素子の前記結合部を周回するように、前記給電素子および前記アンテナ素子が配置されたことを特徴とする。 (1) The antenna device of the present invention
An antenna element having a coupling portion;
A power supply having a first coil conductor and a second coil conductor, wherein the first coil conductor and the second coil conductor are formed such that a magnetic flux generated in the first coil conductor and the second coil conductor constitutes a closed magnetic circuit. An element,
The feed element and the antenna element are arranged so that the closed magnetic path of the feed element goes around the coupling portion of the antenna element.

（２）前記第１コイル導体および前記第２コイル導体は、それぞれ異なる巻回軸を有し、且つ、互いに電気的に直列接続されていることが好ましい。 (2) It is preferable that the first coil conductor and the second coil conductor have different winding axes and are electrically connected in series to each other.

（３）前記アンテナ素子はスパイラル状またはループ状のコイル導体を備え、前記結合部は前記コイル導体の一部であり、前記給電素子は前記第１コイル導体および前記第２コイル導体が前記アンテナ素子の結合部を跨ぐように配置されていることが好ましい。 (3) The antenna element includes a spiral or loop-shaped coil conductor, the coupling portion is a part of the coil conductor, and the feeding element includes the first coil conductor and the second coil conductor as the antenna element. It is preferable that they are arranged so as to straddle the connecting portions.

（４）前記第１コイル導体および前記第２コイル導体は同一平面に隣接配置されていることが好ましい。 (4) It is preferable that the first coil conductor and the second coil conductor are arranged adjacent to each other on the same plane.

（５）前記第１コイル導体および前記第２コイル導体は互いに非対称の形状を有することが好ましい。 (5) It is preferable that the first coil conductor and the second coil conductor have asymmetric shapes.

（６）前記第１コイル導体および前記第２コイル導体は基材シートに形成されていることが好ましい。 (6) It is preferable that the said 1st coil conductor and the said 2nd coil conductor are formed in the base material sheet.

（７）前記アンテナ素子は通信信号のキャリア周波数に相当する共振周波数を有することが好ましい。 (7) It is preferable that the antenna element has a resonance frequency corresponding to a carrier frequency of a communication signal.

（８）本発明の無線デバイスは、
　結合部を有するアンテナ素子と、
　第１コイル導体および第２コイル導体を有し、前記第１コイル導体および前記第２コイル導体に生じる磁束が閉磁路を構成するように当該第１コイル導体および第２コイル導体が形成された給電素子と、
　前記給電素子の第１コイル導体および第２コイル導体につながるＲＦＩＣとを備え、
　前記給電素子の前記閉磁路が前記アンテナ素子の前記結合部を周回するように、前記給電素子および前記アンテナ素子が配置されたことを特徴とする。 (8) The wireless device of the present invention
An antenna element having a coupling portion;
A power supply having a first coil conductor and a second coil conductor, wherein the first coil conductor and the second coil conductor are formed such that a magnetic flux generated in the first coil conductor and the second coil conductor constitutes a closed magnetic circuit. Elements,
RFIC connected to the first coil conductor and the second coil conductor of the power feeding element,
The feed element and the antenna element are arranged so that the closed magnetic path of the feed element goes around the coupling portion of the antenna element.

（９）前記ＲＦＩＣおよび前記給電素子は通信信号のキャリア周波数に相当する周波数で共振する共振回路を構成することが好ましい。 (9) It is preferable that the RFIC and the power feeding element constitute a resonance circuit that resonates at a frequency corresponding to a carrier frequency of a communication signal.

　本発明のアンテナ装置によれば、給電素子と結合するアンテナ素子の結合部は、給電素子の各コイル導体で構成される閉磁路内に配置されるため、給電素子とアンテナ素子とを高い結合度で結合させることができる。そのため、アンテナ素子が受信した信号をＲＦＩＣに伝送する際の伝送特性において低挿入損失特性が得られる。 According to the antenna device of the present invention, since the coupling portion of the antenna element coupled to the feed element is disposed in the closed magnetic path formed by the coil conductors of the feed element, the coupling between the feed element and the antenna element is high. Can be combined. Therefore, a low insertion loss characteristic can be obtained in the transmission characteristic when the signal received by the antenna element is transmitted to the RFIC.

　また、本発明の無線デバイスによれば、ＲＦＩＤタグやリーダライタに利用すれば、通信可能最大距離の大きなＲＦＩＤタグやリーダライタを構成することができる。 Further, according to the wireless device of the present invention, when used for an RFID tag or a reader / writer, an RFID tag or a reader / writer having a large communicable maximum distance can be configured.

図１は第１の実施形態のＲＦＩＤタグ４０１の分解斜視図である。FIG. 1 is an exploded perspective view of an RFID tag 401 according to the first embodiment. 図２（Ａ）はＲＦＩＤタグ４０１の平面図、図２（Ｂ）は給電デバイス３０１の平面図である。2A is a plan view of the RFID tag 401, and FIG. 2B is a plan view of the power feeding device 301. 図３は、給電素子２０１の第１コイル導体２１および第２コイル導体２２に生じる磁束とアンテナ素子１０１のコイル導体１１との関係を示す図である。FIG. 3 is a diagram illustrating the relationship between the magnetic flux generated in the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201 and the coil conductor 11 of the antenna element 101. 図４（Ａ）はアンテナ素子１０２が備えるコイル導体１１および１２の分解斜視図である。図４（Ｂ）は二つのコイル導体１１，１２が基材シートを挟んで対向した状態でのアンテナ素子１０２の等価回路図である。また、図４（Ｃ）はアンテナ素子に給電デバイスが結合した状態での等価回路図である。FIG. 4A is an exploded perspective view of the coil conductors 11 and 12 included in the antenna element 102. FIG. 4B is an equivalent circuit diagram of the antenna element 102 in a state where two coil conductors 11 and 12 face each other with a base material sheet interposed therebetween. FIG. 4C is an equivalent circuit diagram in a state where the power feeding device is coupled to the antenna element. 図５は第３の実施形態の給電素子２０３および給電デバイス３０３の分解斜視図である。FIG. 5 is an exploded perspective view of the power feeding element 203 and the power feeding device 303 of the third embodiment. 図６（Ａ）は通信端末装置を裏面から見た平面図である。図６（Ｂ）は図６（Ａ）におけるＢ－Ｂ部分の断面図である。FIG. 6A is a plan view of the communication terminal device viewed from the back side. FIG. 6B is a cross-sectional view taken along the line BB in FIG. 図７はＲＦＩＤタグ部分の拡大断面図である。FIG. 7 is an enlarged cross-sectional view of the RFID tag portion. 図８は第５の実施形態のアンテナ装置の主要部の斜視図である。FIG. 8 is a perspective view of the main part of the antenna device of the fifth embodiment. 図９は第６の実施形態のＲＦＩＤタグ４０６の平面図である。FIG. 9 is a plan view of the RFID tag 406 of the sixth embodiment. 図１０は第７の実施形態のＲＦＩＤタグ４０７の分解斜視図である。FIG. 10 is an exploded perspective view of the RFID tag 407 of the seventh embodiment. 図１１はＲＦＩＤタグ４０７の平面図である。FIG. 11 is a plan view of the RFID tag 407. 図１２は第８の実施形態のＲＦＩＤタグ４０８の平面図である。FIG. 12 is a plan view of the RFID tag 408 of the eighth embodiment. 図１３は第９の実施形態に係る給電素子２０９の分解斜視図である。FIG. 13 is an exploded perspective view of a feeding element 209 according to the ninth embodiment. 図１４は給電素子２０９の外観斜視図である。FIG. 14 is an external perspective view of the power feeding element 209. 図１５は、共振ブースターとして作用するアンテナ素子１０２と給電素子２０９との結合状態を示す部分斜視図である。FIG. 15 is a partial perspective view showing a coupling state of the antenna element 102 acting as a resonance booster and the feeding element 209. 図１６は、アンテナ素子１０２と給電素子２０９との磁気結合状態を示す概念図である。FIG. 16 is a conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209. 図１７は、アンテナ素子１０２と給電素子２０９との磁気結合状態を示す別の概念図である。FIG. 17 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209. 図１８は第１０の実施形態に係る給電素子２１０の分解斜視図である。FIG. 18 is an exploded perspective view of the power feeding element 210 according to the tenth embodiment. 図１９は、共振ブースターとして作用するアンテナ素子１０２と給電素子２１０との結合状態を示す部分斜視図である。FIG. 19 is a partial perspective view showing a coupling state between the antenna element 102 and the feeding element 210 that act as a resonance booster. 図２０は、アンテナ素子１０２と給電素子２１０との磁気結合状態を示す概念図である。FIG. 20 is a conceptual diagram showing a magnetic coupling state between the antenna element 102 and the power feeding element 210. 図２１は、アンテナ素子１０２と給電素子２１０との磁気結合状態を示す別の概念図である。FIG. 21 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 210. 図２２は、第１１の実施形態に係る無線通信装置５０１の筐体内部の構造を示す図である。FIG. 22 is a diagram illustrating the internal structure of the housing of the wireless communication apparatus 501 according to the eleventh embodiment.

《第１の実施形態》
　図１は第１の実施形態のＲＦＩＤタグ４０１の分解斜視図である。図２（Ａ）はＲＦＩＤタグ４０１の平面図、図２（Ｂ）は給電デバイス３０１の平面図である。 << First Embodiment >>
FIG. 1 is an exploded perspective view of an RFID tag 401 according to the first embodiment. 2A is a plan view of the RFID tag 401, and FIG. 2B is a plan view of the power feeding device 301.

　この例では、ＲＦＩＤタグ４０１はＨＦ帯ＲＦＩＤシステム用のＲＦＩＤタグであり、アンテナ素子１０１および給電デバイス３０１を備えている。アンテナ素子１０１は、ＰＥＴ等の基材シート１０と、その上面に形成されたコイル導体１１とで構成されている。給電デバイス３０１は給電素子２０１とＲＦＩＣ３０とで構成されている。 In this example, the RFID tag 401 is an RFID tag for an HF band RFID system, and includes an antenna element 101 and a power feeding device 301. The antenna element 101 includes a base material sheet 10 such as PET and a coil conductor 11 formed on the upper surface thereof. The power feeding device 301 includes the power feeding element 201 and the RFIC 30.

　ＲＦＩＣ３０はＲＦＩＤ用ＩＣチップである。このＲＦＩＣ３０にはメモリー回路やロジック回路等を含む。 RFIC 30 is an IC chip for RFID. The RFIC 30 includes a memory circuit and a logic circuit.

　給電素子２０１は、ＰＥＴ等の基材シート２０と、この基材シート２０の上面に形成された第１コイル導体２１、第２コイル導体２２とで構成されている。 The power feeding element 201 includes a base sheet 20 such as PET, and a first coil conductor 21 and a second coil conductor 22 formed on the upper surface of the base sheet 20.

　後に詳述するように、第１コイル導体２１および第２コイル導体２２は、第１コイル導体２１および第２コイル導体２２に生じる磁束が閉磁路を構成するように基材シート２０に形成（巻回・配置）されている。 As described in detail later, the first coil conductor 21 and the second coil conductor 22 are formed on the base sheet 20 so that the magnetic flux generated in the first coil conductor 21 and the second coil conductor 22 forms a closed magnetic path (winding). Times / placement).

　給電デバイス３０１はアンテナ素子１０１の結合部ＣＡに近接配置されている。例えば両面粘着シートを介して貼着されている。給電デバイス３０１がアンテナ素子１０１の結合部ＣＡに近接配置された状態で、給電素子２０１の前記閉磁路がアンテナ素子１０１の結合部ＣＡを周回するように、アンテナ素子１０１に対して給電素子２０１が配置されている。 The power feeding device 301 is disposed close to the coupling portion CA of the antenna element 101. For example, it is stuck via a double-sided PSA sheet. In a state where the feeding device 301 is disposed close to the coupling portion CA of the antenna element 101, the feeding element 201 is arranged with respect to the antenna element 101 so that the closed magnetic circuit of the feeding element 201 circulates around the coupling portion CA of the antenna element 101. Is arranged.

　図３は、給電素子２０１の第１コイル導体２１および第２コイル導体２２に生じる磁束とアンテナ素子１０１のコイル導体１１との関係を示す図である。アンテナ素子１０１のコイル導体１１に、図３中に直線の矢印で示す方向に電流が流れるとコイル導体１１の周囲に破線の矢印で示す磁束が周回する。この磁束が給電素子２０１の第１コイル導体２１および第２コイル導体２２のループ面に鎖交する。このときの第１コイル導体２１および第２コイル導体２２の起電力が加算されるように、第１コイル導体２１および第２コイル導体２２は直列接続されていて、且つＲＦＩＣ３０に接続されている。そのため、給電素子２０１の第１コイル導体２１および第２コイル導体２２に励起される起電力がＲＦＩＣ３０に供給される。逆に、ＲＦＩＣ３０から第１コイル導体２１および第２コイル導体２２に電流が供給される場合には、第１コイル導体２１および第２コイル導体２２のループ面を通る磁束がアンテナ素子のコイル導体１１の周囲を周回し、コイル導体１１に電流が誘起される。 FIG. 3 is a diagram illustrating the relationship between the magnetic flux generated in the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201 and the coil conductor 11 of the antenna element 101. When a current flows through the coil conductor 11 of the antenna element 101 in the direction indicated by the straight arrow in FIG. 3, the magnetic flux indicated by the broken arrow circulates around the coil conductor 11. This magnetic flux is linked to the loop surfaces of the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201. The first coil conductor 21 and the second coil conductor 22 are connected in series and connected to the RFIC 30 so that the electromotive forces of the first coil conductor 21 and the second coil conductor 22 at this time are added. Therefore, the electromotive force excited by the first coil conductor 21 and the second coil conductor 22 of the power feeding element 201 is supplied to the RFIC 30. Conversely, when current is supplied from the RFIC 30 to the first coil conductor 21 and the second coil conductor 22, the magnetic flux passing through the loop surfaces of the first coil conductor 21 and the second coil conductor 22 is the coil conductor 11 of the antenna element. Current is induced in the coil conductor 11.

　以上に示したように、巻回軸の異なる二つのコイル導体（第１コイル導体２１および第２コイル導体２２）がアンテナ素子のコイル導体１１の結合部ＣＡを跨ぐように配置されていて、且つ第１コイル導体２１および第２コイル導体２２を通る磁束がアンテナ素子のコイル導体１１の近くを周回する（閉磁路に沿って周回する）ように第１コイル導体２１および第２コイル導体２２が接続されている。 As described above, the two coil conductors (the first coil conductor 21 and the second coil conductor 22) having different winding axes are disposed so as to straddle the coupling portion CA of the coil conductor 11 of the antenna element, and The first coil conductor 21 and the second coil conductor 22 are connected so that the magnetic flux passing through the first coil conductor 21 and the second coil conductor 22 circulates near the coil conductor 11 of the antenna element (circulates along the closed magnetic path). Has been.

　第１コイル導体２１および第２コイル導体２２は同一平面に隣接配置されていることが好ましい。すなわち、各コイル素子のコイル面に対して垂直な面方向に閉磁路を形成し、この閉磁路の形成面（磁束ループ面）に対して垂直方向にアンテナ素子の結合部が通過するように設けることが好ましい。 The first coil conductor 21 and the second coil conductor 22 are preferably disposed adjacent to each other on the same plane. That is, a closed magnetic circuit is formed in a plane direction perpendicular to the coil surface of each coil element, and a coupling portion of the antenna element is provided so as to pass in a direction perpendicular to the surface (flux loop surface) of the closed magnetic circuit. It is preferable.

　また、第１コイル導体２１および第２コイル導体２２は、互いにほぼ平行な巻回軸を有していることが好ましい。これにより、第１コイル導体２１および第２コイル導体２２を通る磁束が閉磁路に沿って周回しやすくなり、アンテナ素子のコイル導体１１との結合をより確実にできる。 The first coil conductor 21 and the second coil conductor 22 preferably have winding axes that are substantially parallel to each other. This makes it easier for the magnetic flux passing through the first coil conductor 21 and the second coil conductor 22 to circulate along the closed magnetic path, and the coupling of the antenna element with the coil conductor 11 can be made more reliable.

　なお、図１、図２に示した例では、給電素子２０１にＲＦＩＣ３０を搭載した給電デバイス３０１をアンテナ素子１０１に貼付することでＲＦＩＤタグ４０１を構成したが、給電素子２０１をアンテナ素子１０１に貼付した後にＲＦＩＣ３０を実装してもよい。このＲＦＩＣ３０を実装する前の状態、すなわちアンテナ素子１０１と給電素子２０１とでアンテナ装置を構成することになる。 In the example shown in FIGS. 1 and 2, the RFID tag 401 is configured by attaching the power supply device 301 in which the RFIC 30 is mounted on the power supply element 201 to the antenna element 101. However, the power supply element 201 is attached to the antenna element 101. After that, the RFIC 30 may be mounted. The antenna device is configured by the state before the RFIC 30 is mounted, that is, the antenna element 101 and the feeding element 201.

　本発明では、給電素子で形成される閉磁路内にアンテナ素子の結合部が設けられているので、給電回路とアンテナ素子とは電磁界（主に磁界）を介して結合されている。したがって、各コイル素子とアンテナ素子との結合度が高く、挿入損失の少ない無線デバイスを実現することができる。また、給電素子は閉磁路を構成しているため、給電素子の近傍にグランド導体やバッテリーパック等の金属体が設けられていても、これらの金属体によって磁界の形成が妨げられたり、金属体にて渦電流としてロスしてしまったりすることが殆ど無い。ゆえに、本発明のアンテナ装置および無線デバイスをＲＦＩＤタグやリーダライタに利用すれば、通信距離の大きなＲＦＩＤタグやリーダライタを構成することができる。 In the present invention, since the coupling portion of the antenna element is provided in the closed magnetic circuit formed by the feeding element, the feeding circuit and the antenna element are coupled via an electromagnetic field (mainly a magnetic field). Therefore, it is possible to realize a wireless device having a high degree of coupling between each coil element and the antenna element and a low insertion loss. In addition, since the power feeding element forms a closed magnetic circuit, even if a metal body such as a ground conductor or a battery pack is provided in the vicinity of the power feeding element, the formation of a magnetic field is prevented by these metal bodies, There is almost no loss as an eddy current. Therefore, when the antenna device and the wireless device of the present invention are used for an RFID tag or a reader / writer, an RFID tag or a reader / writer having a large communication distance can be configured.

　本発明においては、通信距離の最大化を目的として、アンテナ素子は通信信号のキャリア周波数に相当する共振周波数を有していることが好ましい。同様の理由で、ＲＦＩＣおよび給電素子も通信信号のキャリア周波数に相当する共振周波数を有していることが好ましい。後の実施形態でも示すように、ＲＦＩＣおよび給電素子で構成される共振周波数はＲＦＩＣ自身が有する浮遊容量と給電回路のインダクタンス（さらには線間容量）で決められる。 In the present invention, for the purpose of maximizing the communication distance, the antenna element preferably has a resonance frequency corresponding to the carrier frequency of the communication signal. For the same reason, it is preferable that the RFIC and the feed element also have a resonance frequency corresponding to the carrier frequency of the communication signal. As will be shown in later embodiments, the resonance frequency composed of the RFIC and the feed element is determined by the stray capacitance of the RFIC itself and the inductance (and also the line capacitance) of the feed circuit.

《第２の実施形態》
　第２の実施形態では第１の実施形態とは異なるアンテナ素子の構成について示す。 << Second Embodiment >>
In the second embodiment, a configuration of an antenna element different from that of the first embodiment is shown.

　図４（Ａ）はアンテナ素子１０２が備えるコイル導体１１および１２の分解斜視図である。コイル導体１１は基材シート（図４では図示を省略）の第１主面に形成されていて、コイル導体１２は基材シートの第２主面に形成されている。 FIG. 4A is an exploded perspective view of the coil conductors 11 and 12 included in the antenna element 102. The coil conductor 11 is formed on the first main surface of the base sheet (not shown in FIG. 4), and the coil conductor 12 is formed on the second main surface of the base sheet.

　図４（Ｂ）は二つのコイル導体１１，１２が基材シートを挟んで対向した状態でのアンテナ素子１０２の等価回路図である。また、図４（Ｃ）はアンテナ素子に給電デバイスが結合した状態での等価回路図である。 FIG. 4B is an equivalent circuit diagram of the antenna element 102 in a state where the two coil conductors 11 and 12 face each other with the base material sheet interposed therebetween. FIG. 4C is an equivalent circuit diagram in a state where the power feeding device is coupled to the antenna element.

　図４（Ａ）に示すように、アンテナ素子１０２のコイル導体１１とコイル導体１２は矩形の渦巻き状にパターン化されている。コイル導体１１の巻回方向とコイル導体１２の巻回方向は逆（一方向からの透視では同方向）であり、両者は電磁界結合する。図４（Ｂ）において、インダクタＬ１１はコイル導体１１によるインダクタンスを記号で表したもの、インダクタＬ１２はコイル導体１２によるインダクタンスを記号で表したものである。キャパシタＣ１，Ｃ２はコイル導体１１，１２間に生じる容量を集中定数の記号で表したものである。このようにアンテナ素子１０２のコイル導体１１，１２はＬＣ回路を構成している。 As shown in FIG. 4A, the coil conductor 11 and the coil conductor 12 of the antenna element 102 are patterned in a rectangular spiral shape. The winding direction of the coil conductor 11 and the winding direction of the coil conductor 12 are opposite (the same direction when seen from one direction), and both are electromagnetically coupled. In FIG. 4B, the inductor L11 represents the inductance due to the coil conductor 11 with a symbol, and the inductor L12 represents the inductance due to the coil conductor 12 with a symbol. Capacitors C1 and C2 represent the capacitance generated between the coil conductors 11 and 12 with a lumped constant symbol. Thus, the coil conductors 11 and 12 of the antenna element 102 constitute an LC circuit.

　図４（Ｃ）において、インダクタＬ２０２は給電素子を構成するコイル導体によるインダクタンスを記号で表したものである。給電素子のコイル導体がアンテナ素子のコイル導体１１，１２と電磁界結合することにより、アンテナ素子１０２はＨＦ帯のアンテナとして作用する。キャパシタＣＩＣはＲＦＩＣ３０の寄生容量など、給電素子のコイル導体に繋がるキャパシタンスを記号で表したものである。このキャパシタＣＩＣとインダクタＬ２０１はＬＣ共振する。このＲＦＩＣ３０とアンテナ素子１０２との２つのＬＣ共振回路どうしが電磁界結合（主に磁気結合）することにより、アンテナ素子１０２とＲＦＩＣ３０との間で信号が伝達される。このようにして、アンテナ素子１０２は共振ブースターとして作用する。 In FIG. 4C, an inductor L202 represents an inductance by a coil conductor constituting the power feeding element by a symbol. When the coil conductor of the feeding element is electromagnetically coupled to the coil conductors 11 and 12 of the antenna element, the antenna element 102 acts as an HF band antenna. The capacitor CIC represents a capacitance connected to the coil conductor of the power feeding element such as a parasitic capacitance of the RFIC 30 by a symbol. The capacitor CIC and the inductor L201 resonate with each other. The two LC resonant circuits of the RFIC 30 and the antenna element 102 are electromagnetically coupled (mainly magnetically coupled), whereby a signal is transmitted between the antenna element 102 and the RFIC 30. In this way, the antenna element 102 acts as a resonance booster.

《第３の実施形態》
　第３の実施形態では第１の実施形態とは異なる給電素子および給電デバイスの構成について示す。 << Third Embodiment >>
In 3rd Embodiment, it shows about the structure of the electric power feeding element and electric power feeding device different from 1st Embodiment.

　図５は第３の実施形態の給電素子２０３および給電デバイス３０３の分解斜視図である。給電素子２０３はコイル導体等のパターンが形成された複数の誘電体基材シートを積層したものである。基材シート２０ａにはＲＦＩＣ３０を接続するための端子２３，２４が形成されている。基材シート２０ｂにはコイル導体２１ｂ，２２ｂが形成されている。基材シート２０ｃにはコイル導体２１ｃ，２２ｃが形成されている。基材シート２０ｄにはコイル導体２１ｄ，２２ｄが形成されている。各基材シートには図５中に破線で示すようにビア導体が形成されていて層間接続が行われている。 FIG. 5 is an exploded perspective view of the power feeding element 203 and the power feeding device 303 of the third embodiment. The power feeding element 203 is formed by laminating a plurality of dielectric base sheets on which patterns such as coil conductors are formed. Terminals 23 and 24 for connecting the RFIC 30 are formed on the base sheet 20a. Coil conductors 21b and 22b are formed on the base sheet 20b. Coil conductors 21c and 22c are formed on the base sheet 20c. Coil conductors 21d and 22d are formed on the base sheet 20d. As shown by broken lines in FIG. 5, via conductors are formed on each base sheet, and interlayer connection is made.

　コイル導体２１ｂ，２１ｃ，２１ｄおよびそれらを接続するビア導体は第１コイル導体２１を構成している。また、コイル導体２２ｂ，２２ｃ，２２ｄおよびそれらを接続するビア導体は第２コイル導体２２を構成している。このように、第１コイル導体２１および第２コイル導体２２は生じる磁束が閉磁路を構成するように第１コイル導体２１および第２コイル導体２２が基材シート２０ａ，２０ｂ，２０ｃ，２０ｄに形成されている。 The coil conductors 21b, 21c, 21d and the via conductors connecting them constitute the first coil conductor 21. The coil conductors 22b, 22c and 22d and the via conductors connecting them constitute the second coil conductor 22. As described above, the first coil conductor 21 and the second coil conductor 22 are formed on the base sheet 20a, 20b, 20c, and 20d so that the generated magnetic flux constitutes a closed magnetic path. Has been.

　このように、ヘリカル状の第１コイル導体２１および第２コイル導体２２を誘電体セラミック多層基板に構成してもよい。この構造によれば、巻回数が増えてもコイル開口を大きく確保できる。そのため、給電素子のコイル導体の巻回数を増しても、アンテナ素子のコイル導体と磁気的に強く結合させることができる。 Thus, the helical first coil conductor 21 and second coil conductor 22 may be formed on a dielectric ceramic multilayer substrate. According to this structure, a large coil opening can be secured even if the number of turns increases. For this reason, even if the number of turns of the coil conductor of the power feeding element is increased, the coil conductor of the antenna element can be magnetically coupled strongly.

《第４の実施形態》
　第４の実施形態では、ＲＦＩＤタグを備えた通信端末装置の例を示す。 << Fourth Embodiment >>
In 4th Embodiment, the example of the communication terminal device provided with the RFID tag is shown.

　図６（Ａ）は通信端末装置を裏面から見た平面図である。図６（Ｂ）は図６（Ａ）におけるＢ－Ｂ部分の断面図である。図７はＲＦＩＤタグ部分の拡大断面図である。 FIG. 6A is a plan view of the communication terminal device viewed from the back side. FIG. 6B is a cross-sectional view taken along the line BB in FIG. FIG. 7 is an enlarged cross-sectional view of the RFID tag portion.

　筐体６０の内部にはプリント配線板５０が収納されている。プリント配線板５０の内部にはグランド導体５１が形成されている。筐体の内面にはアンテナ素子１０１および給電デバイス３０１等が設けられている。 A printed wiring board 50 is accommodated in the housing 60. A ground conductor 51 is formed inside the printed wiring board 50. An antenna element 101, a power feeding device 301, and the like are provided on the inner surface of the housing.

　アンテナ素子１０１および給電デバイス３０１の構成は第１の実施形態で示したものと同じである。図７に示すように、アンテナ素子１０１および給電デバイス３０１とプリント配線板５０との間にフェライトシート等の磁性体層４０が配置されている。この磁性体層４０はアンテナ素子１０１および給電デバイス３０１から見てグランド導体５１が等価的に見えないように設けられている。アンテナ素子１０１は接着剤層９を介して筐体６０の内面に貼付されている。磁性体層４０もアンテナ素子１０１および給電デバイス３０１に両面粘着シート等を介して貼付してもよい。 The configurations of the antenna element 101 and the power feeding device 301 are the same as those shown in the first embodiment. As shown in FIG. 7, a magnetic layer 40 such as a ferrite sheet is disposed between the antenna element 101 and the power feeding device 301 and the printed wiring board 50. The magnetic layer 40 is provided so that the ground conductor 51 cannot be seen equivalently when viewed from the antenna element 101 and the power feeding device 301. The antenna element 101 is attached to the inner surface of the housing 60 via the adhesive layer 9. The magnetic layer 40 may also be attached to the antenna element 101 and the power feeding device 301 via a double-sided adhesive sheet or the like.

　このように、磁性体層を設けることにより、グランド導体等の金属に入ろうとする磁束を遮断して、渦電流の発生を抑えることができる。このように、アンテナ装置を金属体とともに電子機器に組み込む際、金属体との間にフェライトシート等の磁性体層を配置すればよい。また、金属体からなるべく遠ざけるとともに、空間を有効に利用できるように筐体の内面にアンテナ装置を配置すればよい。 Thus, by providing the magnetic layer, it is possible to block the magnetic flux that attempts to enter the metal such as the ground conductor and suppress the generation of eddy current. In this way, when the antenna device is incorporated into an electronic device together with a metal body, a magnetic layer such as a ferrite sheet may be disposed between the antenna body and the metal body. Further, the antenna device may be arranged on the inner surface of the housing so that it is as far as possible from the metal body and the space can be used effectively.

　なお、面状に広がる（ベタ状の）平面導体が形成されたプリント配線板以外に、樹脂と金属粉の混合成形品、樹脂物品に金属シートがモールドされている物品、ケースに金属部分を含む電池や液晶ディスプレイなど、金属の存在によりコイルアンテナの磁界変化を打ち消すような渦電流が生じる可能性のある物品は前記金属体に相当する。 In addition to a printed wiring board on which a planar conductor that spreads in a plane (solid) is formed, a mixed molded product of resin and metal powder, an article in which a metal sheet is molded into a resin article, and a metal part in the case An article such as a battery or a liquid crystal display, which may generate an eddy current that cancels the magnetic field change of the coil antenna due to the presence of metal, corresponds to the metal body.

《第５の実施形態》
　図８は第５の実施形態のアンテナ装置の主要部の分解斜視図である。アンテナ装置はアンテナ素子および給電デバイスを備えている。アンテナ素子および給電デバイスの構成は第１の実施形態で示したものと同じである。図８では、アンテナ素子の基材シートおよび給電素子の基材シートを除いて図示している。アンテナ素子に設けられているコイル導体１１、給電素子に設けられている第１コイル導体２１および第２コイル導体２２を挟むように、磁性体層４１，４２が配置されている。この磁性体層４１，４２はフェライトシート等であり、両面粘着シートを介してアンテナ素子および給電デバイスに貼付されている。 << Fifth Embodiment >>
FIG. 8 is an exploded perspective view of the main part of the antenna device of the fifth embodiment. The antenna device includes an antenna element and a feeding device. The configurations of the antenna element and the power feeding device are the same as those shown in the first embodiment. In FIG. 8, the base material sheet of the antenna element and the base material sheet of the power feeding element are excluded. The magnetic layers 41 and 42 are disposed so as to sandwich the coil conductor 11 provided in the antenna element and the first coil conductor 21 and the second coil conductor 22 provided in the power feeding element. The magnetic layers 41 and 42 are ferrite sheets or the like, and are attached to the antenna element and the power feeding device via a double-sided adhesive sheet.

　このように、アンテナ素子に設けられているコイル導体１１、給電素子に設けられている第１コイル導体２１および第２コイル導体２２を磁性体層４１，４２で挟むことによって、第１コイル導体２１および第２コイル導体２２を通る磁束の大部分は磁性体層４１，４２を通る。そのため、漏れ磁束が少なくなって、アンテナ素子のコイル導体１１と給電素子のコイル導体２１，２２との結合度が高まる。 As described above, the first coil conductor 21 is provided by sandwiching the coil conductor 11 provided in the antenna element, the first coil conductor 21 and the second coil conductor 22 provided in the feeding element between the magnetic layers 41 and 42. And most of the magnetic flux passing through the second coil conductor 22 passes through the magnetic layers 41 and 42. Therefore, the leakage magnetic flux is reduced, and the degree of coupling between the coil conductor 11 of the antenna element and the coil conductors 21 and 22 of the feeding element is increased.

《第６の実施形態》
　図９は第６の実施形態のＲＦＩＤタグ４０６の平面図である。このＲＦＩＤタグ４０６は、アンテナ素子１０１および二つの給電デバイス３０１，３０２を備えている。アンテナ素子１０１は、基材シート１０と、その上面に形成されたコイル導体１１とで構成されている。給電デバイス３０１，３０２は第１の実施形態で示した給電デバイスと同じであり、給電素子とＲＦＩＣとで構成されている。 << Sixth Embodiment >>
FIG. 9 is a plan view of the RFID tag 406 of the sixth embodiment. The RFID tag 406 includes an antenna element 101 and two power feeding devices 301 and 302. The antenna element 101 includes a base sheet 10 and a coil conductor 11 formed on the upper surface thereof. The power feeding devices 301 and 302 are the same as the power feeding device shown in the first embodiment, and are composed of a power feeding element and an RFIC.

　このように、アンテナ素子１０１のコイル導体１１の二箇所に給電デバイス３０１，３０２を配置してもよい。給電デバイス３０１と給電デバイス３０２はシステムの異なるＲＦＩＤに対応する別種のものであってもよい。そのことで、一つのアンテナ素子１０１を兼用できる。 Thus, the power feeding devices 301 and 302 may be arranged at two locations on the coil conductor 11 of the antenna element 101. The power feeding device 301 and the power feeding device 302 may be different types corresponding to different RFIDs in the system. As a result, one antenna element 101 can also be used.

《第７の実施形態》
　図１０は第７の実施形態のＲＦＩＤタグ４０７の分解斜視図である。図１１はＲＦＩＤタグ４０７の平面図である。 << Seventh Embodiment >>
FIG. 10 is an exploded perspective view of the RFID tag 407 of the seventh embodiment. FIG. 11 is a plan view of the RFID tag 407.

　この例では、ＲＦＩＤタグ４０７はアンテナ素子１０７および給電デバイス３０７を備えている。アンテナ素子１０７は、基材シート１０と、その上面に形成されたコイル導体１１とで構成されている。給電デバイス３０７は給電素子２０７とＲＦＩＣ３０とで構成されている。 In this example, the RFID tag 407 includes an antenna element 107 and a power feeding device 307. The antenna element 107 includes a base sheet 10 and a coil conductor 11 formed on the upper surface thereof. The power feeding device 307 includes a power feeding element 207 and the RFIC 30.

　アンテナ素子１０７は第１の実施形態で示したアンテナ素子１０１と異なり、コイル導体１１の途中に容量素子１９を実装するための端子１６，１７が形成されている。この端子１６，１７に容量素子１９を実装することにより、コイル導体１１に容量素子１９が直列に挿入される。このコイル導体１１と容量素子１９とでＬＣ共振回路が構成される。 Unlike the antenna element 101 shown in the first embodiment, the antenna element 107 has terminals 16 and 17 for mounting the capacitive element 19 in the middle of the coil conductor 11. By mounting the capacitive element 19 on the terminals 16 and 17, the capacitive element 19 is inserted into the coil conductor 11 in series. The coil conductor 11 and the capacitive element 19 constitute an LC resonance circuit.

　また、アンテナ素子１０７は第１の実施形態で示したアンテナ素子１０１と異なり、結合部ＣＡがコイル開口の内側に凹むように、コイル導体１１のパターンが形成されている。このように、結合部ＣＡを基材シート１０の内側にシフトさせることにより、給電デバイス３０７の位置（貼付位置）を基材シート１０の内部方向にシフトさせることになり、全体に小型化できる。 Further, unlike the antenna element 101 shown in the first embodiment, the antenna element 107 has a pattern of the coil conductor 11 so that the coupling portion CA is recessed inside the coil opening. In this way, by shifting the coupling portion CA to the inside of the base sheet 10, the position of the power feeding device 307 (sticking position) is shifted toward the inside of the base sheet 10, and the overall size can be reduced.

　給電素子２０７は、基材シート２０と、この基材シート２０の上面に形成された第１コイル導体２１、第２コイル導体２２とで構成されている。基材シート２０にはＲＦＩＣ３０を接続する端子２３，２４が形成されている。給電素子２０７は第１の実施形態で示した給電素子２０１と異なり、第１コイル導体２１および第２コイル導体２２が非対称である。すなわち、第１コイル導体２１はアンテナ素子１０７のコイル導体１１の凹部状の位置に対向するように相対的に小さく形成されている。第２コイル導体２２はアンテナ素子１０７のコイル導体１１のコイル開口に対向するので、大きさに余裕があり、相対的に大きく形成されている。このように、第１コイル導体２１および第２コイル導体２２を非対称にすることで、必要な巻回数を確保しつつ給電デバイスを小型化できる。 The power feeding element 207 includes a base sheet 20 and a first coil conductor 21 and a second coil conductor 22 formed on the upper surface of the base sheet 20. Terminals 23 and 24 for connecting the RFIC 30 are formed on the base sheet 20. The power feeding element 207 is different from the power feeding element 201 shown in the first embodiment, and the first coil conductor 21 and the second coil conductor 22 are asymmetric. That is, the first coil conductor 21 is formed to be relatively small so as to face the recessed portion of the coil conductor 11 of the antenna element 107. Since the second coil conductor 22 faces the coil opening of the coil conductor 11 of the antenna element 107, the second coil conductor 22 has a sufficient size and is formed relatively large. Thus, by making the first coil conductor 21 and the second coil conductor 22 asymmetrical, the power feeding device can be reduced in size while ensuring the necessary number of turns.

《第８の実施形態》
　第８の実施形態ではＵＨＦ帯のＲＦＩＤシステム用のＲＦＩＤタグの例を示す。 << Eighth Embodiment >>
In the eighth embodiment, an example of an RFID tag for a UHF band RFID system is shown.

　図１２は第８の実施形態のＲＦＩＤタグ４０８の平面図である。このＲＦＩＤタグ４０８はアンテナ素子１０８および給電デバイス３０１を備えている。アンテナ素子１０８は、基材シート１０と、その上面に形成された放射導体１３，１４および線条部１５とで構成されている。給電デバイス３０１は第１の実施形態で示したものと同じである。 FIG. 12 is a plan view of the RFID tag 408 of the eighth embodiment. The RFID tag 408 includes an antenna element 108 and a power feeding device 301. The antenna element 108 includes the base sheet 10 and radiation conductors 13 and 14 and a line portion 15 formed on the upper surface thereof. The power feeding device 301 is the same as that shown in the first embodiment.

　アンテナ素子１０８の放射導体１３，１４および線条部１５はダイポール型アンテナとして作用する。給電デバイス３０１は線条部１５に結合してダイポール型アンテナに対して給電を行う。なお、本実施形態においては、給電デバイス３０１のＲＦＩＣと閉磁路を構成する給電素子とは所定の周波数で共振点を持ちインピーダンス整合している。 The radiating conductors 13 and 14 and the filament 15 of the antenna element 108 act as a dipole antenna. The power feeding device 301 is coupled to the line portion 15 to feed power to the dipole antenna. In the present embodiment, the RFIC of the power feeding device 301 and the power feeding element constituting the closed magnetic circuit have a resonance point at a predetermined frequency and are impedance matched.

　したがって、アンテナ素子１０８は所定の周波数で共振するように構成していなくてもよい。すなわち、放射導体１３，１４は給電デバイス３０１より大きな導体であればよい。 Therefore, the antenna element 108 may not be configured to resonate at a predetermined frequency. That is, the radiating conductors 13 and 14 may be larger than the power feeding device 301.

　このようにＵＨＦ帯のＲＦＩＤタグなどの無線デバイスであれば、ダイポール型のアンテナを用いることができる。また、それ以外にループ型、パッチ型等のアンテナを利用することができる。いずれのアンテナ素子でも、給電デバイスのコイル導体と磁界結合させることで給電を行うことができる。 Thus, if it is a wireless device such as an RFID tag in the UHF band, a dipole antenna can be used. In addition, a loop-type, patch-type, etc. antenna can be used. Any antenna element can be fed by being magnetically coupled to the coil conductor of the feeding device.

《第９の実施形態》
　図１３は第９の実施形態に係る給電素子２０９の分解斜視図である。給電素子２０９はコイル導体等のパターンが形成された複数の絶縁体（例えば磁性体）基材シートを積層したものである。基材シート２０ａにはコイル導体２１ａ，２２ａが形成されている。基材シート２０ｂにはコイル導体２１ｂ，２２ｂが形成されている。基材シート２０ｃにはコイル導体２１ｃ，２２ｃが形成されている。基材シート２０ｄにはコイル導体２１ｄ，２２ｄが形成されている。各基材シートの外側面には層間接続導体が形成されている。 << Ninth embodiment >>
FIG. 13 is an exploded perspective view of a feeding element 209 according to the ninth embodiment. The power feeding element 209 is formed by laminating a plurality of insulating (for example, magnetic) base material sheets on which patterns such as coil conductors are formed. Coil conductors 21a and 22a are formed on the base sheet 20a. Coil conductors 21b and 22b are formed on the base sheet 20b. Coil conductors 21c and 22c are formed on the base sheet 20c. Coil conductors 21d and 22d are formed on the base sheet 20d. Interlayer connection conductors are formed on the outer surface of each base sheet.

　なお、層間接続導体は、各基材シートの外側に露出するように形成されているもので説明したが、各基材シートの内側に位置するように設けてもよい。 In addition, although the interlayer connection conductor has been described as being formed so as to be exposed to the outside of each base sheet, it may be provided so as to be positioned inside each base sheet.

　図１４は給電素子２０９の外観斜視図である。直方体形状の積層体の下面に端子２３，２４が引き出されている。 FIG. 14 is an external perspective view of the feed element 209. Terminals 23 and 24 are drawn out on the lower surface of the rectangular parallelepiped laminate.

　このように、ヘリカル状の第１コイル導体２１および第２コイル導体２２を磁性体セラミック多層基板に構成してもよい。 Thus, the helical first coil conductor 21 and second coil conductor 22 may be formed on a magnetic ceramic multilayer substrate.

　図１５は、共振ブースターとして作用するアンテナ素子１０２と給電素子２０９との結合状態を示す部分斜視図である。アンテナ素子１０２の基本的な構成は、図４（Ａ）、図４（Ｂ）に示したとおりである。給電素子２０９にはＲＦＩＣ３０が接続される。このように、給電素子２０９をアンテナ素子１０２のコイル導体の例えば下部に配置する。 FIG. 15 is a partial perspective view showing a coupling state between the antenna element 102 acting as a resonance booster and the feeding element 209. The basic structure of the antenna element 102 is as shown in FIGS. 4 (A) and 4 (B). The RFIC 30 is connected to the power feeding element 209. In this way, the feed element 209 is disposed, for example, below the coil conductor of the antenna element 102.

　図１５においては省略しているが、給電素子２０９とＲＦＩＣ３０との間には、整合回路やフィルタ回路等が接続される。 Although omitted in FIG. 15, a matching circuit, a filter circuit, and the like are connected between the feeding element 209 and the RFIC 30.

　図１６は、アンテナ素子１０２と給電素子２０９との磁気結合状態を示す概念図である。磁束φは第１コイル導体２１および第２コイル導体２２により生じ、アンテナ素子１０２のコイル導体と鎖交する。図中のクロス記号はコイル導体に流れる電流の向きを表している。 FIG. 16 is a conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209. The magnetic flux φ is generated by the first coil conductor 21 and the second coil conductor 22 and is linked to the coil conductor of the antenna element 102. The cross symbol in the figure represents the direction of the current flowing through the coil conductor.

　図１７は、アンテナ素子１０２と給電素子２０９との磁気結合状態を示す別の概念図である。このように、第１コイル導体２１および第２コイル導体２２により生じる磁束がアンテナ素子１０２のコイル導体と部分的に鎖交する関係であってもよい。 FIG. 17 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 209. As described above, the magnetic flux generated by the first coil conductor 21 and the second coil conductor 22 may be partially interlinked with the coil conductor of the antenna element 102.

《第１０の実施形態》
　図１８は第１０の実施形態に係る給電素子２１０の分解斜視図である。給電素子２１０はコイル導体等のパターンが形成された複数の絶縁体（例えば磁性体）基材シートを積層したものである。図１３に示した給電素子２０９とは、各基材シートのコイル導体等のパターンが異なる。 << Tenth Embodiment >>
FIG. 18 is an exploded perspective view of the power feeding element 210 according to the tenth embodiment. The power feeding element 210 is formed by laminating a plurality of insulating (for example, magnetic) base material sheets on which patterns such as coil conductors are formed. The feed element 209 shown in FIG. 13 is different in the pattern of the coil conductors and the like of each base sheet.

　図１９は、共振ブースターとして作用するアンテナ素子１０２と給電素子２１０との結合状態を示す部分斜視図である。このように、給電素子２１０をアンテナ素子１０２のコイル導体の例えば側部に配置する。 FIG. 19 is a partial perspective view showing a coupling state between the antenna element 102 acting as a resonance booster and the feeding element 210. In this way, the feeding element 210 is disposed, for example, on the side of the coil conductor of the antenna element 102.

　図１９においては省略しているが、給電素子２１０とＲＦＩＣ３０との間には、整合回路やフィルタ回路等が接続される。 Although omitted in FIG. 19, a matching circuit, a filter circuit, and the like are connected between the feed element 210 and the RFIC 30.

　図２０は、アンテナ素子１０２と給電素子２１０との磁気結合状態を示す概念図である。磁束φは第１コイル導体２１および第２コイル導体２２により生じ、アンテナ素子１０２のコイル導体と鎖交する。図中のクロス記号はコイル導体に流れる電流の向きを表している。 FIG. 20 is a conceptual diagram showing a magnetic coupling state between the antenna element 102 and the feeding element 210. The magnetic flux φ is generated by the first coil conductor 21 and the second coil conductor 22 and is linked to the coil conductor of the antenna element 102. The cross symbol in the figure represents the direction of the current flowing through the coil conductor.

　図２１は、アンテナ素子１０２と給電素子２１０との磁気結合状態を示す別の概念図である。このように、第１コイル導体２１および第２コイル導体２２により生じる磁束がアンテナ素子１０２のコイル導体と部分的に鎖交する関係であってもよい。 FIG. 21 is another conceptual diagram showing a magnetic coupling state between the antenna element 102 and the power feeding element 210. As described above, the magnetic flux generated by the first coil conductor 21 and the second coil conductor 22 may be partially interlinked with the coil conductor of the antenna element 102.

《第１１の実施形態》
　図２２は、第１１の実施形態に係る無線通信装置５０１の筐体内部の構造を示す図であり、下部筐体９１と上部筐体９２とを分離して内部を露出させた状態での平面図である。下部筐体９１の内部にはプリント配線板７１，８１、バッテリーパック８３等が収められている。プリント配線板７１には通信回路を備えたＲＦＩＣ３０、給電素子２０９が実装されている。給電素子２０９の構成は図１３、図１４に示したとおりである。このプリント配線板７１にはＵＨＦ帯アンテナ７２、カメラモジュール７６等も搭載されている。また、プリント配線板８１にはＵＨＦ帯アンテナ８２等が搭載されている。プリント配線板７１とプリント配線板８１とは同軸ケーブル８４を介して接続されている。 << Eleventh Embodiment >>
FIG. 22 is a diagram showing a structure inside the housing of the wireless communication apparatus 501 according to the eleventh embodiment, and is a plan view in a state where the lower housing 91 and the upper housing 92 are separated and the inside is exposed. FIG. Printed wiring boards 71 and 81, a battery pack 83, and the like are housed inside the lower housing 91. On the printed wiring board 71, an RFIC 30 including a communication circuit and a power feeding element 209 are mounted. The configuration of the feeding element 209 is as shown in FIGS. The printed wiring board 71 is also equipped with a UHF band antenna 72, a camera module 76, and the like. The printed wiring board 81 is equipped with a UHF band antenna 82 and the like. The printed wiring board 71 and the printed wiring board 81 are connected via a coaxial cable 84.

　上部筐体９２の内面にはアンテナ素子１０２が形成されている。このアンテナ素子１０２は図４（Ａ）、図４（Ｂ）に示したとおりである。アンテナ素子１０２はアンテナ装置２０９のコイル導体と磁気的に結合し、磁界アンテナとして作用する。 An antenna element 102 is formed on the inner surface of the upper casing 92. The antenna element 102 is as shown in FIGS. 4 (A) and 4 (B). The antenna element 102 is magnetically coupled to the coil conductor of the antenna device 209 and functions as a magnetic field antenna.

　アンテナ装置２０９のコイル導体とアンテナ素子１０２とは互いに磁界結合するように配置されている。 The coil conductor of the antenna device 209 and the antenna element 102 are arranged so as to be magnetically coupled to each other.

《他の実施形態》
　以上に示した各実施形態では、アンテナ素子１０２を１層または２層構造のコイル導体として説明したが、その層数は特に限定されるものではない。 << Other embodiments >>
In each of the embodiments described above, the antenna element 102 has been described as a coil conductor having a one-layer or two-layer structure, but the number of layers is not particularly limited.

　以上に示した各実施形態では、アンテナ素子のコイル導体の一部を結合部ＣＡとして用いたが、アンテナ素子とは別に、アンテナ素子に接続される専用の結合用パターンを設けてもよい。 In each of the embodiments described above, a part of the coil conductor of the antenna element is used as the coupling portion CA. However, a dedicated coupling pattern connected to the antenna element may be provided separately from the antenna element.

　以上に示した幾つかの実施形態では、第１コイル導体２１および第２コイル導体２２はＲＦＩＣに対して直列に接続された例を示したが、これは並列に接続されていてもよい。 In some embodiments described above, the first coil conductor 21 and the second coil conductor 22 are illustrated as being connected in series to the RFIC, but may be connected in parallel.

　以上に示した各実施形態で示したＲＦＩＣ３０は、ベアチップＩＣとして構成されていてもよいし、パッケージＩＣとして構成されていてもよい。パッケージＩＣの場合、パッケージ基板に整合回路が設けられていてもよい。 The RFIC 30 described in each of the embodiments described above may be configured as a bare chip IC or may be configured as a package IC. In the case of a package IC, a matching circuit may be provided on the package substrate.

　本発明の無線デバイスは、ＲＦＩＤタグの他、リーダライタにも適用できる。また、例えば、ＧＰＳ受信回路や無線ＬＡＮ、デジタルＴＶ等、ＲＦＩＤシステム以外の無線システムにも適用できる。 The wireless device of the present invention can be applied to a reader / writer in addition to an RFID tag. Further, for example, the present invention can be applied to a wireless system other than the RFID system, such as a GPS receiving circuit, a wireless LAN, and a digital TV.

Ｃ１，Ｃ２…キャパシタ
ＣＡ…結合部
ＣＩＣ…キャパシタ
Ｌ１１，Ｌ１２…インダクタ
Ｌ２０１…インダクタ
９…接着剤層
１０…基材シート
１１，１２…コイル導体
１３，１４…放射導体
１５…線条部
１６，１７…端子
１９…容量素子
２０…基材シート
２０ａ，２０ｂ，２０ｃ，２０ｄ…基材シート
２１…第１コイル導体
２１ｂ，２２ｂ…コイル導体
２１ｃ，２２ｃ…コイル導体
２１ｄ，２２ｄ…コイル導体
２２…第２コイル導体
２３，２４…端子
３０…ＲＦＩＣ
４０，４１，４２…磁性体層
５０…プリント配線板
５１…グランド導体
６０…筐体
１０１，１０２，１０７，１０８…アンテナ素子
２０１，２０３，２０７，２０９，２１０…給電素子
３０１，３０２，３０３，３０７…給電デバイス
４０１，４０６，４０７，４０８…ＲＦＩＤタグ
５０１…無線通信装置 C1, C2 ... Capacitor CA ... Coupling portion CIC ... Capacitors L11, L12 ... Inductor L201 ... Inductor 9 ... Adhesive layer 10 ... Base material sheet 11, 12 ... Coil conductors 13, 14 ... Radiation conductor 15 ... Line portions 16, 17 ... terminal 19 ... capacitive element 20 ... base sheet 20a, 20b, 20c, 20d ... base sheet 21 ... first coil conductor 21b, 22b ... coil conductor 21c, 22c ... coil conductor 21d, 22d ... coil conductor 22 ... second Coil conductors 23, 24 ... terminal 30 ... RFIC
40, 41, 42 ... magnetic layer 50 ... printed wiring board 51 ... ground conductor 60 ... casing 101, 102, 107, 108 ... antenna elements 201, 203, 207, 209, 210 ... power feeding elements 301, 302, 303, 307: Power feeding devices 401, 406, 407, 408 ... RFID tags 501 ... Wireless communication devices

Claims (9)

　結合部を有するアンテナ素子と、
　第１コイル導体および第２コイル導体を有し、前記第１コイル導体および前記第２コイル導体に生じる磁束が閉磁路を構成するように当該第１コイル導体および第２コイル導体が形成された給電素子と、を備え、
　前記給電素子の前記閉磁路が前記アンテナ素子の前記結合部を周回するように、前記給電素子および前記アンテナ素子が配置されたことを特徴とするアンテナ装置。 An antenna element having a coupling portion;
A power supply having a first coil conductor and a second coil conductor, wherein the first coil conductor and the second coil conductor are formed such that a magnetic flux generated in the first coil conductor and the second coil conductor constitutes a closed magnetic circuit. An element,
The antenna device, wherein the feeding element and the antenna element are arranged so that the closed magnetic path of the feeding element goes around the coupling portion of the antenna element. 　前記第１コイル導体および前記第２コイル導体は、それぞれ異なる巻回軸を有し、且つ、互いに電気的に直列接続されている、請求項１に記載のアンテナ装置。 The antenna device according to claim 1, wherein the first coil conductor and the second coil conductor have different winding axes, and are electrically connected in series to each other. 　前記アンテナ素子はスパイラル状またはループ状のコイル導体を備え、
　前記結合部は前記コイル導体の一部であり、
　前記給電素子は、前記第１コイル導体および前記第２コイル導体が前記アンテナ素子の前記結合部を跨ぐように配置されている、請求項１または２に記載のアンテナ装置。 The antenna element includes a spiral or loop coil conductor,
The coupling portion is a part of the coil conductor;
The antenna device according to claim 1, wherein the feeding element is disposed such that the first coil conductor and the second coil conductor straddle the coupling portion of the antenna element. 　前記第１コイル導体および前記第２コイル導体は同一平面に隣接配置されている請求項１～３のいずれかに記載のアンテナ装置。 4. The antenna device according to claim 1, wherein the first coil conductor and the second coil conductor are arranged adjacent to each other on the same plane. 　前記第１コイル導体および前記第２コイル導体は互いに非対称の形状を有する請求項１～４のいずれかに記載のアンテナ装置。 The antenna device according to any one of claims 1 to 4, wherein the first coil conductor and the second coil conductor have an asymmetric shape with respect to each other. 　前記第１コイル導体および前記第２コイル導体は基材シートに形成されたものである請求項１～５のいずれかに記載のアンテナ装置。 6. The antenna device according to claim 1, wherein the first coil conductor and the second coil conductor are formed on a base sheet. 　前記アンテナ素子は、通信信号のキャリア周波数に相当する共振周波数を有する、請求項１～６のいずれかに記載のアンテナ装置。 The antenna device according to any one of claims 1 to 6, wherein the antenna element has a resonance frequency corresponding to a carrier frequency of a communication signal. 　結合部を有するアンテナ素子と、
　第１コイル導体および第２コイル導体を有し、前記第１コイル導体および前記第２コイル導体に生じる磁束が閉磁路を構成するように当該第１コイル導体および第２コイル導体が形成された給電素子と、
　前記給電素子の第１コイル導体および第２コイル導体につながるＲＦＩＣとを備え、
　前記給電素子の前記閉磁路が前記アンテナ素子の前記結合部を周回するように、前記給電素子および前記アンテナ素子が配置されたことを特徴とする無線デバイス。 An antenna element having a coupling portion;
A power supply having a first coil conductor and a second coil conductor, wherein the first coil conductor and the second coil conductor are formed such that a magnetic flux generated in the first coil conductor and the second coil conductor constitutes a closed magnetic circuit. Elements,
RFIC connected to the first coil conductor and the second coil conductor of the power feeding element,
The wireless device, wherein the feed element and the antenna element are arranged so that the closed magnetic path of the feed element goes around the coupling portion of the antenna element. 　前記ＲＦＩＣおよび前記給電素子は、通信信号のキャリア周波数に相当する周波数で共振する共振回路を構成する、請求項８に記載の無線デバイス。 The wireless device according to claim 8, wherein the RFIC and the power feeding element constitute a resonance circuit that resonates at a frequency corresponding to a carrier frequency of a communication signal.
PCT/JP2012/072849 2011-09-09 2012-09-07 Antenna device and wireless device Ceased WO2013035821A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201290000476.XU CN203553354U (en) 2011-09-09 2012-09-07 Antenna device and wireless device
JP2013532657A JP5418737B2 (en) 2011-09-09 2012-09-07 Antenna apparatus and wireless device
US14/085,830 US9543642B2 (en) 2011-09-09 2013-11-21 Antenna device and wireless device
US15/364,371 US9812764B2 (en) 2011-09-09 2016-11-30 Antenna device and wireless device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-196972 2011-09-09
JP2011196972 2011-09-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/085,830 Continuation US9543642B2 (en) 2011-09-09 2013-11-21 Antenna device and wireless device

Publications (1)

Publication Number Publication Date
WO2013035821A1 true WO2013035821A1 (en) 2013-03-14

Family

ID=47832261

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/072849 Ceased WO2013035821A1 (en) 2011-09-09 2012-09-07 Antenna device and wireless device

Country Status (4)

Country Link
US (2) US9543642B2 (en)
JP (1) JP5418737B2 (en)
CN (1) CN203553354U (en)
WO (1) WO2013035821A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022923A1 (en) * 2013-08-13 2015-02-19 株式会社村田製作所 Antenna device, card-type device, and electronic device
JP2016170071A (en) * 2015-03-13 2016-09-23 株式会社村田製作所 RFIC device for moisture detection
KR20200005490A (en) * 2018-07-06 2020-01-15 주식회사 아모텍 Combo antenna module
US12394903B2 (en) 2022-02-28 2025-08-19 Tdk Corporation Antenna module
WO2025177672A1 (en) * 2024-02-21 2025-08-28 株式会社村田製作所 Wireless communication device

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011118379A1 (en) * 2010-03-24 2011-09-29 株式会社村田製作所 Rfid system
WO2013035821A1 (en) * 2011-09-09 2013-03-14 株式会社村田製作所 Antenna device and wireless device
CN106099312B (en) 2012-03-23 2019-09-06 Lg伊诺特有限公司 antenna assembly
US9806565B2 (en) 2012-03-23 2017-10-31 Lg Innotek Co., Ltd. Wireless power receiver and method of manufacturing the same
US9978009B1 (en) * 2013-07-19 2018-05-22 Geotoll, Inc. RFID antenna structure for increased range when coupled with a mobile device
US10418711B2 (en) 2013-07-19 2019-09-17 Geotoll, Inc. RFID antenna structure for increased range when coupled with a mobile device
JP5895960B2 (en) * 2014-03-14 2016-03-30 カシオ計算機株式会社 ANTENNA DEVICE AND PORTABLE ELECTRONIC DEVICE
JP6197946B2 (en) * 2014-03-28 2017-09-20 株式会社村田製作所 Antenna device and communication device
KR102472232B1 (en) * 2015-04-22 2022-11-28 삼성에스디아이 주식회사 battery module
KR20160129336A (en) * 2015-04-30 2016-11-09 엘지전자 주식회사 Mobile terminal
WO2016186169A1 (en) * 2015-05-21 2016-11-24 シャープ株式会社 Display device
WO2017022511A1 (en) * 2015-07-31 2017-02-09 株式会社村田製作所 Feeding coil, antenna device, and electronic apparatus
EP3166181A1 (en) * 2015-11-05 2017-05-10 Gemalto Sa Method for manufacturing a radiofrequency antenna on a mounting and antenna thus obtained
WO2017083142A1 (en) * 2015-11-09 2017-05-18 3M Innovative Properties Company Radio frequency circuit with conductive loop
KR102527794B1 (en) * 2016-02-04 2023-05-03 삼성전자주식회사 Electronic device comprising coil
JP6251770B2 (en) * 2016-04-15 2017-12-20 株式会社エスケーエレクトロニクス RFID tag
CN110383294A (en) * 2016-12-30 2019-10-25 香港物流及供应链管理应用技术研发中心 Switchable RFID tags and methods for operating switchable RFID circuits
CN108960392A (en) * 2017-05-27 2018-12-07 江峰 A kind of double antenna RFID electronic label of counter magnetic flux
TWI724656B (en) * 2019-11-27 2021-04-11 正美企業股份有限公司 Radio frequency identification device and manufacturing method of the same
US11677151B2 (en) * 2020-09-11 2023-06-13 Nxp B.V. Near-field communications device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010102445A (en) * 2008-10-22 2010-05-06 Murata Mfg Co Ltd Radio communication system
JP2011142648A (en) * 2005-11-29 2011-07-21 Semiconductor Energy Lab Co Ltd Semiconductor device and method of manufacturing the same

Family Cites Families (571)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364564A (en) 1965-06-28 1968-01-23 Gregory Ind Inc Method of producing welding studs dischargeable in end-to-end relationship
JPS5754964B2 (en) 1974-05-08 1982-11-20
JPS6193701A (en) 1984-10-13 1986-05-12 Toyota Motor Corp Antenna system for automobile
JPS61284102A (en) 1985-06-11 1986-12-15 Oki Electric Ind Co Ltd Antenna for portable radio equipment
JPS62127140U (en) 1986-02-03 1987-08-12
JPH01212035A (en) 1987-08-13 1989-08-25 Secom Co Ltd Electromagnetic field diversity reception method
WO1989007347A1 (en) 1988-02-04 1989-08-10 Uniscan Ltd. Magnetic field concentrator
JPH0744114B2 (en) 1988-12-16 1995-05-15 株式会社村田製作所 Multilayer chip coil
JPH02164105A (en) 1988-12-19 1990-06-25 Mitsubishi Electric Corp spiral antenna
US5253969A (en) 1989-03-10 1993-10-19 Sms Schloemann-Siemag Aktiengesellschaft Feeding system for strip material, particularly in treatment plants for metal strips
JPH03171385A (en) 1989-11-30 1991-07-24 Sony Corp Information card
JP2662742B2 (en) 1990-03-13 1997-10-15 株式会社村田製作所 Bandpass filter
JP2763664B2 (en) 1990-07-25 1998-06-11 日本碍子株式会社 Wiring board for distributed constant circuit
JPH04150011A (en) 1990-10-12 1992-05-22 Tdk Corp Composite electronic component
JPH04167500A (en) 1990-10-30 1992-06-15 Omron Corp Printed-circuit board management system
JP2539367Y2 (en) 1991-01-30 1997-06-25 株式会社村田製作所 Multilayer electronic components
NL9100176A (en) 1991-02-01 1992-03-02 Nedap Nv Antenna configuration for contactless identification label - forms part of tuned circuit of ID or credit card interrogated via inductive coupling
JP2558330Y2 (en) 1991-02-06 1997-12-24 オムロン株式会社 Electromagnetic coupling type electronic equipment
NL9100347A (en) 1991-02-26 1992-03-02 Nedap Nv Integrated transformer circuit for ID or credit card - is interrogated via contactless inductive coupling using capacitor to form tuned circuit
JPH04321190A (en) 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
JPH0745933Y2 (en) 1991-06-07 1995-10-18 太陽誘電株式会社 Multilayer ceramic inductance element
DE69215283T2 (en) 1991-07-08 1997-03-20 Nippon Telegraph & Telephone Extendable antenna system
JP2839782B2 (en) 1992-02-14 1998-12-16 三菱電機株式会社 Printed slot antenna
JPH05327331A (en) 1992-05-15 1993-12-10 Matsushita Electric Works Ltd Printed antenna
JP3186235B2 (en) 1992-07-30 2001-07-11 株式会社村田製作所 Resonator antenna
JPH0677729A (en) 1992-08-25 1994-03-18 Mitsubishi Electric Corp Antenna integrated microwave circuit
JP2592328Y2 (en) 1992-09-09 1999-03-17 神鋼電機株式会社 Antenna device
JPH06177635A (en) 1992-12-07 1994-06-24 Mitsubishi Electric Corp Cross dipole antenna system
JPH06260949A (en) 1993-03-03 1994-09-16 Seiko Instr Inc Radio equipment
JPH07183836A (en) 1993-12-22 1995-07-21 San'eisha Mfg Co Ltd Coupling filter device for distribution line carrier communication
US5491483A (en) 1994-01-05 1996-02-13 Texas Instruments Incorporated Single loop transponder system and method
US6096431A (en) 1994-07-25 2000-08-01 Toppan Printing Co., Ltd. Biodegradable cards
JP3427527B2 (en) 1994-12-26 2003-07-22 凸版印刷株式会社 Biodegradable laminate and biodegradable card
JP2999374B2 (en) 1994-08-10 2000-01-17 太陽誘電株式会社 Multilayer chip inductor
JP3141692B2 (en) 1994-08-11 2001-03-05 松下電器産業株式会社 Millimeter wave detector
DE4431754C1 (en) 1994-09-06 1995-11-23 Siemens Ag Carrier element for ic module of chip card
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JPH0887580A (en) 1994-09-14 1996-04-02 Omron Corp Data carriers and ball games
JP3064840B2 (en) 1994-12-22 2000-07-12 ソニー株式会社 IC card
JP2837829B2 (en) 1995-03-31 1998-12-16 松下電器産業株式会社 Inspection method for semiconductor device
JPH08279027A (en) 1995-04-04 1996-10-22 Toshiba Corp Wireless communication card
US5955723A (en) 1995-05-03 1999-09-21 Siemens Aktiengesellschaft Contactless chip card
DE19516227C2 (en) 1995-05-03 2002-02-07 Infineon Technologies Ag Data carrier arrangement, in particular chip card
JPH08307126A (en) 1995-05-09 1996-11-22 Kyocera Corp Antenna storage structure
JP3637982B2 (en) 1995-06-27 2005-04-13 株式会社荏原電産 Inverter-driven pump control system
US5629241A (en) 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
JP3150575B2 (en) 1995-07-18 2001-03-26 沖電気工業株式会社 Tag device and manufacturing method thereof
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
DE19534229A1 (en) 1995-09-15 1997-03-20 Licentia Gmbh Transponder arrangement
JPH0993029A (en) 1995-09-21 1997-04-04 Matsushita Electric Ind Co Ltd Antenna device
JP3882218B2 (en) 1996-03-04 2007-02-14 ソニー株式会社 optical disk
JP3471160B2 (en) 1996-03-18 2003-11-25 株式会社東芝 Monolithic antenna
JPH09270623A (en) 1996-03-29 1997-10-14 Murata Mfg Co Ltd Antenna system
JPH09284038A (en) 1996-04-17 1997-10-31 Nhk Spring Co Ltd Antenna equipment of non-contact data carrier
JPH09294374A (en) 1996-04-26 1997-11-11 Hitachi Ltd Power supply circuit
JP3427663B2 (en) 1996-06-18 2003-07-22 凸版印刷株式会社 Non-contact IC card
AUPO055296A0 (en) 1996-06-19 1996-07-11 Integrated Silicon Design Pty Ltd Enhanced range transponder system
US6104311A (en) 1996-08-26 2000-08-15 Addison Technologies Information storage and identification tag
JP3767030B2 (en) 1996-09-09 2006-04-19 三菱電機株式会社 Foldable wireless communication device
WO1998015916A1 (en) 1996-10-09 1998-04-16 Pav Card Gmbh Method and connection arrangement for producing a smart card
JPH10171954A (en) 1996-12-05 1998-06-26 Hitachi Maxell Ltd Non-contact IC card
JP3279205B2 (en) 1996-12-10 2002-04-30 株式会社村田製作所 Surface mount antenna and communication equipment
JPH10193849A (en) 1996-12-27 1998-07-28 Rohm Co Ltd Circuit chip mounted card and circuit chip module
JPH10193851A (en) 1997-01-08 1998-07-28 Denso Corp Non-contact card
DE19703029A1 (en) 1997-01-28 1998-07-30 Amatech Gmbh & Co Kg Transmission module for a transponder device and transponder device and method for operating a transponder device
JPH10242742A (en) 1997-02-26 1998-09-11 Harada Ind Co Ltd Transmitting and receiving antenna
CA2283503C (en) 1997-03-10 2002-08-06 Precision Dynamics Corporation Reactively coupled elements in circuits on flexible substrates
JPH10293828A (en) 1997-04-18 1998-11-04 Omron Corp Data carrier, coil module, reader / writer, and clothing data acquisition method
JP3900593B2 (en) 1997-05-27 2007-04-04 凸版印刷株式会社 IC card and IC module
JPH11346114A (en) 1997-06-11 1999-12-14 Matsushita Electric Ind Co Ltd Antenna device
JPH1125244A (en) 1997-06-27 1999-01-29 Toshiba Chem Corp Non-contact data carrier package
JP3621560B2 (en) 1997-07-24 2005-02-16 三菱電機株式会社 Electromagnetic induction data carrier system
JPH1175329A (en) 1997-08-29 1999-03-16 Hitachi Ltd Non-contact IC card system
JPH1185937A (en) 1997-09-02 1999-03-30 Nippon Lsi Card Kk Non-contact lsi card and method for inspecting the same
JPH1188241A (en) 1997-09-04 1999-03-30 Nippon Steel Corp Data carrier system
JPH11103209A (en) 1997-09-26 1999-04-13 Fujitsu Ten Ltd Radio wave reception equipment
JP3853930B2 (en) 1997-09-26 2006-12-06 株式会社マースエンジニアリング Non-contact data carrier package and manufacturing method thereof
DE69831592T2 (en) 1997-11-14 2006-06-22 Toppan Printing Co. Ltd. COMPOSITE IC CARD
JP3800766B2 (en) 1997-11-14 2006-07-26 凸版印刷株式会社 Compound IC module and compound IC card
JPH11149536A (en) 1997-11-14 1999-06-02 Toppan Printing Co Ltd Composite IC card
JP3800765B2 (en) 1997-11-14 2006-07-26 凸版印刷株式会社 Compound IC card
JPH11175678A (en) 1997-12-09 1999-07-02 Toppan Printing Co Ltd IC module and IC card mounting the module
JPH11220319A (en) 1998-01-30 1999-08-10 Sharp Corp Antenna device
JPH11219420A (en) 1998-02-03 1999-08-10 Tokin Corp Ic card module, ic card and their manufacture
JP2001084463A (en) 1999-09-14 2001-03-30 Miyake:Kk Resonance circuit
JPH11261325A (en) 1998-03-10 1999-09-24 Shiro Sugimura Coil element and manufacturing method thereof
US6362784B1 (en) 1998-03-31 2002-03-26 Matsuda Electric Industrial Co., Ltd. Antenna unit and digital television receiver
JP4260917B2 (en) 1998-03-31 2009-04-30 株式会社東芝 Loop antenna
US5936150A (en) 1998-04-13 1999-08-10 Rockwell Science Center, Llc Thin film resonant chemical sensor with resonant acoustic isolator
WO1999052783A1 (en) 1998-04-14 1999-10-21 Liberty Carton Company Container for compressors and other goods
JP4030651B2 (en) 1998-05-12 2008-01-09 三菱電機株式会社 Mobile phone
JPH11328352A (en) 1998-05-19 1999-11-30 Tokin Corp Connection structure between antenna and IC chip, and IC card
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
JP2000021639A (en) 1998-07-02 2000-01-21 Sharp Corp Inductor, resonance circuit, matching circuit, antenna circuit and oscillation circuit using the same
JP2000021128A (en) 1998-07-03 2000-01-21 Nippon Steel Corp Disk-shaped storage medium and its storage case
JP2000022421A (en) 1998-07-03 2000-01-21 Murata Mfg Co Ltd Chip antenna and radio device mounted with it
AUPP473898A0 (en) 1998-07-20 1998-08-13 Integrated Silicon Design Pty Ltd Metal screened electronic labelling system
JP2000311226A (en) 1998-07-28 2000-11-07 Toshiba Corp Wireless IC card, manufacturing method thereof, and wireless IC card read / write system
EP0977145A3 (en) 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC card
JP3956172B2 (en) 1998-07-31 2007-08-08 吉川アールエフシステム株式会社 Data carrier and antenna for data carrier
JP2000059260A (en) 1998-08-04 2000-02-25 Sony Corp Storage device
CA2338522C (en) 1998-08-14 2009-04-07 3M Innovative Properties Company Radio frequency identification systems applications
ATE244427T1 (en) 1998-08-14 2003-07-15 3M Innovative Properties Co USE FOR A HIGH FREQUENCY IDENTIFICATION SYSTEM
JP4411670B2 (en) 1998-09-08 2010-02-10 凸版印刷株式会社 Non-contact IC card manufacturing method
JP4508301B2 (en) 1998-09-16 2010-07-21 大日本印刷株式会社 Non-contact IC card
JP3632466B2 (en) 1998-10-23 2005-03-23 凸版印刷株式会社 Inspection device and inspection method for non-contact IC card
JP3924962B2 (en) 1998-10-30 2007-06-06 株式会社デンソー ID tag for dishes
US6837438B1 (en) 1998-10-30 2005-01-04 Hitachi Maxell, Ltd. Non-contact information medium and communication system utilizing the same
JP2000137785A (en) 1998-10-30 2000-05-16 Sony Corp Method of manufacturing non-contact type IC card and non-contact type IC card
JP2000137779A (en) 1998-10-30 2000-05-16 Hitachi Maxell Ltd Non-contact information medium and its manufacturing method
JP2000148948A (en) 1998-11-05 2000-05-30 Sony Corp Non-contact type IC label and manufacturing method thereof
JP2000172812A (en) 1998-12-08 2000-06-23 Hitachi Maxell Ltd Noncontact information medium
FR2787640B1 (en) 1998-12-22 2003-02-14 Gemplus Card Int ARRANGEMENT OF AN ANTENNA IN A METALLIC ENVIRONMENT
JP3088404B2 (en) 1999-01-14 2000-09-18 埼玉日本電気株式会社 Mobile radio terminal and built-in antenna
JP2000222540A (en) 1999-02-03 2000-08-11 Hitachi Maxell Ltd Non-contact type semiconductor tag
JP2000228602A (en) 1999-02-08 2000-08-15 Alps Electric Co Ltd Resonance line
JP2000243797A (en) 1999-02-18 2000-09-08 Sanken Electric Co Ltd Semiconductor wafer, and cutting method thereof, and semiconductor wafer assembly and cutting method thereof
JP3967487B2 (en) 1999-02-23 2007-08-29 株式会社東芝 IC card
JP2000251049A (en) 1999-03-03 2000-09-14 Konica Corp Card and production thereof
JP4106673B2 (en) 1999-03-05 2008-06-25 株式会社エフ・イー・シー Antenna device using coil unit, printed circuit board
JP4349597B2 (en) 1999-03-26 2009-10-21 大日本印刷株式会社 IC chip manufacturing method and memory medium manufacturing method incorporating the same
JP3751178B2 (en) 1999-03-30 2006-03-01 日本碍子株式会社 Transceiver
US6542050B1 (en) 1999-03-30 2003-04-01 Ngk Insulators, Ltd. Transmitter-receiver
JP2000286634A (en) 1999-03-30 2000-10-13 Ngk Insulators Ltd Antenna system and its manufacture
JP3067764B1 (en) 1999-03-31 2000-07-24 株式会社豊田自動織機製作所 Mobile communication coupler, mobile body, and mobile communication method
JP2000321984A (en) 1999-05-12 2000-11-24 Hitachi Ltd Label with RF-ID tag
JP4286977B2 (en) 1999-07-02 2009-07-01 大日本印刷株式会社 Non-contact type IC card and its antenna characteristic adjustment method
JP3557130B2 (en) 1999-07-14 2004-08-25 新光電気工業株式会社 Method for manufacturing semiconductor device
JP2001043340A (en) 1999-07-29 2001-02-16 Toppan Printing Co Ltd Composite IC card
JP2001066990A (en) 1999-08-31 2001-03-16 Sumitomo Bakelite Co Ltd Protective filter and protection method of ic tag
US6259369B1 (en) 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
JP2001101369A (en) 1999-10-01 2001-04-13 Matsushita Electric Ind Co Ltd RF tag
JP3451373B2 (en) 1999-11-24 2003-09-29 オムロン株式会社 Manufacturing method of data carrier capable of reading electromagnetic wave
JP4186149B2 (en) 1999-12-06 2008-11-26 株式会社エフ・イー・シー Auxiliary antenna for IC card
JP2001188890A (en) 2000-01-05 2001-07-10 Omron Corp Non-contact tag
JP2001209767A (en) 2000-01-27 2001-08-03 Hitachi Maxell Ltd Accessee with non-contact IC module
US7334734B2 (en) 2000-01-27 2008-02-26 Hitachi Maxwell, Ltd. Non-contact IC module
JP2001240046A (en) 2000-02-25 2001-09-04 Toppan Forms Co Ltd Container and manufacturing method thereof
JP4514880B2 (en) 2000-02-28 2010-07-28 大日本印刷株式会社 Book delivery, returns and inventory management system
JP2001257292A (en) 2000-03-10 2001-09-21 Hitachi Maxell Ltd Semiconductor device
JP2001256457A (en) 2000-03-13 2001-09-21 Toshiba Corp Semiconductor device, manufacturing method thereof, and IC card communication system
US6796508B2 (en) 2000-03-28 2004-09-28 Lucatron Ag Rfid-label with an element for regulating the resonance frequency
JP4624537B2 (en) 2000-04-04 2011-02-02 大日本印刷株式会社 Non-contact data carrier device, storage
JP4624536B2 (en) 2000-04-04 2011-02-02 大日本印刷株式会社 Non-contact data carrier device
JP2001291181A (en) 2000-04-07 2001-10-19 Ricoh Elemex Corp Sensor and sensor system
JP2001319380A (en) 2000-05-11 2001-11-16 Mitsubishi Materials Corp Optical disk with RFID
JP2001331976A (en) 2000-05-17 2001-11-30 Casio Comput Co Ltd Optical recording type recording medium
JP4223174B2 (en) 2000-05-19 2009-02-12 Ｄｘアンテナ株式会社 Film antenna
JP2001339226A (en) 2000-05-26 2001-12-07 Nec Saitama Ltd Antenna system
JP2001344574A (en) 2000-05-30 2001-12-14 Mitsubishi Materials Corp Interrogator antenna device
JP2001352176A (en) 2000-06-05 2001-12-21 Fuji Xerox Co Ltd Multilayer printed wiring board and manufacturing method of multilayer printed wiring board
EP1290618A2 (en) 2000-06-06 2003-03-12 Battelle Memorial Institute Remote communication system
JP2001358527A (en) 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd Antenna device
EP1477928B1 (en) 2000-06-23 2009-06-17 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
JP2002157564A (en) 2000-11-21 2002-05-31 Toyo Aluminium Kk Antenna coil for ic card and its manufacturing method
US6894624B2 (en) 2000-07-04 2005-05-17 Credipass Co., Ltd. Passive transponder identification and credit-card type transponder
JP4138211B2 (en) 2000-07-06 2008-08-27 株式会社村田製作所 Electronic component and manufacturing method thereof, collective electronic component, mounting structure of electronic component, and electronic apparatus
JP2002024776A (en) 2000-07-07 2002-01-25 Nippon Signal Co Ltd:The Ic card reader/writer
JP2001076111A (en) 2000-07-12 2001-03-23 Hitachi Kokusai Electric Inc Resonance circuit
JP2002032731A (en) 2000-07-14 2002-01-31 Sony Corp Contactless information exchange card
DE60135855D1 (en) 2000-07-19 2008-10-30 Hanex Co Ltd RFID LABEL CASE STRUCTURE, RFID LABEL INSTALLATION STRUCTURE AND RFID LABEL COMMUNICATION PROCEDURES
RU2163739C1 (en) 2000-07-20 2001-02-27 Криштопов Александр Владимирович Antenna
JP2002042076A (en) 2000-07-21 2002-02-08 Dainippon Printing Co Ltd Non-contact data carrier and booklet having non-contact data carrier
JP2002042083A (en) 2000-07-27 2002-02-08 Hitachi Maxell Ltd Non-contact communication information carrier
JP3075400U (en) 2000-08-03 2001-02-16 昌栄印刷株式会社 Non-contact IC card
US6466007B1 (en) 2000-08-14 2002-10-15 Teradyne, Inc. Test system for smart card and indentification devices and the like
JP2002063557A (en) 2000-08-21 2002-02-28 Mitsubishi Materials Corp Tag for rfid
JP2002076750A (en) 2000-08-24 2002-03-15 Murata Mfg Co Ltd Antenna device and radio equipment equipped with it
JP2002143826A (en) 2000-08-30 2002-05-21 Denso Corp System for recycling waste and system for detecting unlawful dumping
JP3481575B2 (en) 2000-09-28 2003-12-22 寛児 川上 antenna
JP4615695B2 (en) 2000-10-19 2011-01-19 三星エスディーエス株式会社 IC module for IC card and IC card using it
US6634564B2 (en) 2000-10-24 2003-10-21 Dai Nippon Printing Co., Ltd. Contact/noncontact type data carrier module
JP4628611B2 (en) 2000-10-27 2011-02-09 三菱マテリアル株式会社 antenna
JP4432254B2 (en) 2000-11-20 2010-03-17 株式会社村田製作所 Surface mount antenna structure and communication device including the same
JP2002185358A (en) 2000-11-24 2002-06-28 Supersensor Pty Ltd Method for fitting rf transponder to container
JP4641096B2 (en) 2000-12-07 2011-03-02 大日本印刷株式会社 Non-contact data carrier device and wiring member for booster antenna
JP2002175920A (en) 2000-12-08 2002-06-21 Murata Mfg Co Ltd High-frequency filter element
JP2002183676A (en) 2000-12-08 2002-06-28 Hitachi Ltd Information reading device
JP2002183690A (en) 2000-12-11 2002-06-28 Hitachi Maxell Ltd Non-contact IC tag device
WO2002048980A1 (en) 2000-12-15 2002-06-20 Electrox Corp. Process for the manufacture of novel, inexpensive radio frequency identification devices
JP3788325B2 (en) 2000-12-19 2006-06-21 株式会社村田製作所 Multilayer coil component and manufacturing method thereof
TW531976B (en) 2001-01-11 2003-05-11 Hanex Co Ltd Communication apparatus and installing structure, manufacturing method and communication method
JP3621655B2 (en) 2001-04-23 2005-02-16 株式会社ハネックス中央研究所 RFID tag structure and manufacturing method thereof
KR20020061103A (en) 2001-01-12 2002-07-22 후루까와덴끼고오교 가부시끼가이샤 Antenna device and terminal with the antenna device
JP2002280821A (en) 2001-01-12 2002-09-27 Furukawa Electric Co Ltd:The Antenna device and terminal equipment
JP2002222398A (en) 2001-01-25 2002-08-09 Jstm Kk Non-contact data carrier
JP2002232221A (en) 2001-01-30 2002-08-16 Alps Electric Co Ltd Transmission and reception unit
WO2002061675A1 (en) 2001-01-31 2002-08-08 Hitachi, Ltd. Non-contact identification medium
JP4662400B2 (en) 2001-02-05 2011-03-30 大日本印刷株式会社 Articles with coil-on-chip semiconductor modules
JP2002246828A (en) 2001-02-15 2002-08-30 Mitsubishi Materials Corp Transponder antenna
JP4396046B2 (en) 2001-02-16 2010-01-13 株式会社デンソー Reader / writer for ID tag
WO2002071547A1 (en) 2001-03-02 2002-09-12 Koninklijke Philips Electronics N.V. Module and electronic device
JP4712986B2 (en) 2001-03-06 2011-06-29 大日本印刷株式会社 Liquid container with RFID tag
JP2002290130A (en) 2001-03-28 2002-10-04 Aiwa Co Ltd Radio communication unit
JP3570386B2 (en) 2001-03-30 2004-09-29 松下電器産業株式会社 Portable information terminal with built-in wireless function
JP2002298109A (en) 2001-03-30 2002-10-11 Toppan Forms Co Ltd Non-contact IC media and method of manufacturing the same
JP3772778B2 (en) 2001-03-30 2006-05-10 三菱マテリアル株式会社 Antenna coil, identification tag using the same, reader / writer device, reader device and writer device
JP2002308437A (en) 2001-04-16 2002-10-23 Dainippon Printing Co Ltd Inspection system using RFID tag
JP2002319812A (en) 2001-04-20 2002-10-31 Oji Paper Co Ltd Data carrier attachment method
JP4700831B2 (en) 2001-04-23 2011-06-15 株式会社ハネックス RFID tag communication distance expansion method
JP2002325013A (en) 2001-04-26 2002-11-08 Mitsubishi Materials Corp Antenna coil
JP4265114B2 (en) 2001-04-26 2009-05-20 三菱マテリアル株式会社 Antenna coil for tags
JP2005236339A (en) 2001-07-19 2005-09-02 Oji Paper Co Ltd IC chip assembly
FI112550B (en) 2001-05-31 2003-12-15 Rafsec Oy Smart label and smart label path
JP2002362613A (en) 2001-06-07 2002-12-18 Toppan Printing Co Ltd Laminated packaging material in which non-contact IC is laminated, packaging container using the same, and method for detecting opening of packaging container
JP2002366917A (en) 2001-06-07 2002-12-20 Hitachi Ltd IC card with built-in antenna
JP4710174B2 (en) 2001-06-13 2011-06-29 株式会社村田製作所 Balanced LC filter
JP4882167B2 (en) 2001-06-18 2012-02-22 大日本印刷株式会社 Card-integrated form with non-contact IC chip
JP2002373029A (en) 2001-06-18 2002-12-26 Hitachi Ltd How to prevent unauthorized copying of software using IC tags
JP4759854B2 (en) 2001-06-19 2011-08-31 株式会社寺岡精工 Mounting method of IC tag to metal object and IC tag built-in marker
JP2003087008A (en) 2001-07-02 2003-03-20 Ngk Insulators Ltd Multilayer dielectric filter
JP4058919B2 (en) 2001-07-03 2008-03-12 日立化成工業株式会社 Non-contact IC label, non-contact IC card, non-contact IC label or IC module for non-contact IC card
JP2003026177A (en) 2001-07-12 2003-01-29 Toppan Printing Co Ltd Non-contact package with IC chip
JP2003030612A (en) 2001-07-19 2003-01-31 Oji Paper Co Ltd Ic chip mounting body
JP4670195B2 (en) 2001-07-23 2011-04-13 凸版印刷株式会社 Mobile phone case with non-contact IC card
US7274285B2 (en) 2001-07-24 2007-09-25 Hewlett-Packard Development Company, L.P. System and method for improved object identification
ATE377908T1 (en) 2001-07-26 2007-11-15 Irdeto Access Bv TIME VALIDATION SYSTEM
JP3629448B2 (en) 2001-07-27 2005-03-16 Ｔｄｋ株式会社 ANTENNA DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
JP4731060B2 (en) 2001-07-31 2011-07-20 トッパン・フォームズ株式会社 RF-ID inspection method and inspection system
JP2003058840A (en) 2001-08-14 2003-02-28 Hirano Design Sekkei:Kk Information protection management program utilizing rfid-loaded computer recording medium
JP2003069335A (en) 2001-08-28 2003-03-07 Hitachi Kokusai Electric Inc Auxiliary antenna
JP2003067711A (en) 2001-08-29 2003-03-07 Toppan Forms Co Ltd Articles with IC chip mounting or antenna part
JP2003078336A (en) 2001-08-30 2003-03-14 Tokai Univ Stacked spiral antenna
JP2003078333A (en) 2001-08-30 2003-03-14 Murata Mfg Co Ltd Radio communication apparatus
JP4843885B2 (en) 2001-08-31 2011-12-21 凸版印刷株式会社 Fraud prevention label with IC memory chip
JP4514374B2 (en) 2001-09-05 2010-07-28 トッパン・フォームズ株式会社 RF-ID inspection system
JP4747467B2 (en) 2001-09-07 2011-08-17 大日本印刷株式会社 Non-contact IC tag
JP2003085520A (en) 2001-09-11 2003-03-20 Oji Paper Co Ltd IC card manufacturing method
JP2003087044A (en) 2001-09-12 2003-03-20 Mitsubishi Materials Corp RFID antenna and RFID system provided with the antenna
JP4698096B2 (en) 2001-09-25 2011-06-08 トッパン・フォームズ株式会社 RF-ID inspection system
JP4845306B2 (en) 2001-09-25 2011-12-28 トッパン・フォームズ株式会社 RF-ID inspection system
JP2003099184A (en) 2001-09-25 2003-04-04 Sharp Corp Information processing system, information processing device and input pen used therein
JP2003110344A (en) 2001-09-26 2003-04-11 Hitachi Metals Ltd Surface-mounting type antenna and antenna device mounting the same
EP1439608A4 (en) 2001-09-28 2008-02-06 Mitsubishi Materials Corp Antenna coil and rfid-use tag using it, transponder-use antenna
JP4196554B2 (en) 2001-09-28 2008-12-17 三菱マテリアル株式会社 Tag antenna coil and RFID tag using the same
JP2003132330A (en) 2001-10-25 2003-05-09 Sato Corp RFID label printer
JP2003134007A (en) 2001-10-30 2003-05-09 Auto Network Gijutsu Kenkyusho:Kk Signal transmission / reception system between vehicle-mounted devices and signal transmission / reception method between vehicle-mounted devices
JP3908514B2 (en) 2001-11-20 2007-04-25 大日本印刷株式会社 Package with IC tag and method of manufacturing package with IC tag
JP3984458B2 (en) 2001-11-20 2007-10-03 大日本印刷株式会社 Manufacturing method of package with IC tag
US6812707B2 (en) 2001-11-27 2004-11-02 Mitsubishi Materials Corporation Detection element for objects and detection device using the same
JP3894540B2 (en) 2001-11-30 2007-03-22 トッパン・フォームズ株式会社 Interposer with conductive connection
JP2003188338A (en) 2001-12-13 2003-07-04 Sony Corp Circuit board device and method of manufacturing the same
JP3700777B2 (en) 2001-12-17 2005-09-28 三菱マテリアル株式会社 Electrode structure of RFID tag and method for adjusting resonance frequency using the electrode
JP2003188620A (en) 2001-12-19 2003-07-04 Murata Mfg Co Ltd Module integrated antenna
JP4028224B2 (en) 2001-12-20 2007-12-26 大日本印刷株式会社 Paper IC card substrate having non-contact communication function
JP3895175B2 (en) 2001-12-28 2007-03-22 Ｎｔｎ株式会社 Dielectric resin integrated antenna
JP2003209421A (en) 2002-01-17 2003-07-25 Dainippon Printing Co Ltd RFID tag having transparent antenna and method of manufacturing the same
JP3896965B2 (en) 2002-01-17 2007-03-22 三菱マテリアル株式会社 Reader / writer antenna and reader / writer equipped with the antenna
JP3915092B2 (en) 2002-01-21 2007-05-16 株式会社エフ・イー・シー Booster antenna for IC card
JP2003216919A (en) 2002-01-23 2003-07-31 Toppan Forms Co Ltd RF-ID media
JP2003233780A (en) 2002-02-06 2003-08-22 Mitsubishi Electric Corp Data communication device
JP3998992B2 (en) 2002-02-14 2007-10-31 大日本印刷株式会社 Method for forming antenna pattern on IC chip mounted on web and package with IC tag
JP2003243918A (en) 2002-02-18 2003-08-29 Dainippon Printing Co Ltd Non-contact IC tag antenna and non-contact IC tag
JP2003249813A (en) 2002-02-25 2003-09-05 Tecdia Kk RFID tag with loop antenna
US7119693B1 (en) 2002-03-13 2006-10-10 Celis Semiconductor Corp. Integrated circuit with enhanced coupling
JP2003288560A (en) 2002-03-27 2003-10-10 Toppan Forms Co Ltd Interposer and inlet sheet having antistatic function
US7129834B2 (en) 2002-03-28 2006-10-31 Kabushiki Kaisha Toshiba String wireless sensor and its manufacturing method
JP2003309418A (en) 2002-04-17 2003-10-31 Alps Electric Co Ltd Dipole antenna
JP2003308363A (en) 2002-04-18 2003-10-31 Oki Electric Ind Co Ltd Product and related information management method
JP2003317060A (en) 2002-04-22 2003-11-07 Dainippon Printing Co Ltd IC card
US7135974B2 (en) 2002-04-22 2006-11-14 Symbol Technologies, Inc. Power source system for RF location/identification tags
JP2003317052A (en) 2002-04-24 2003-11-07 Smart Card:Kk Ic tag system
JP3879098B2 (en) 2002-05-10 2007-02-07 株式会社エフ・イー・シー Booster antenna for IC card
JP3979178B2 (en) 2002-05-14 2007-09-19 凸版印刷株式会社 Non-contact IC medium module and non-contact IC medium
US6753814B2 (en) 2002-06-27 2004-06-22 Harris Corporation Dipole arrangements using dielectric substrates of meta-materials
JP3863464B2 (en) 2002-07-05 2006-12-27 株式会社ヨコオ Filter built-in antenna
JP3803085B2 (en) 2002-08-08 2006-08-02 株式会社日立製作所 Wireless IC tag
JP4100993B2 (en) 2002-08-09 2008-06-11 キヤノン株式会社 Electronics
JP4107381B2 (en) 2002-08-23 2008-06-25 横浜ゴム株式会社 Pneumatic tire
JP2004088218A (en) 2002-08-23 2004-03-18 Tokai Univ Planar antenna
JP4273724B2 (en) 2002-08-29 2009-06-03 カシオ電子工業株式会社 Consumables unauthorized use prevention system
JP2004096566A (en) 2002-09-02 2004-03-25 Toenec Corp Inductive communication equipment
JP3925364B2 (en) 2002-09-03 2007-06-06 株式会社豊田中央研究所 Antenna and diversity receiver
JP3645239B2 (en) 2002-09-06 2005-05-11 シャープ株式会社 Dipole antenna, tag and moving object identification system using the same
WO2004027681A2 (en) 2002-09-20 2004-04-01 Fairchild Semiconductor Corporation Rfid tag wide bandwidth logarithmic spiral antenna method and system
JP3975918B2 (en) 2002-09-27 2007-09-12 ソニー株式会社 Antenna device
JP2004121412A (en) 2002-09-30 2004-04-22 Toppan Printing Co Ltd Surgical gauze and its management device
JP2004126750A (en) 2002-09-30 2004-04-22 Toppan Forms Co Ltd Information writing / reading device, antenna and RF-ID medium
JP3958667B2 (en) 2002-10-16 2007-08-15 株式会社日立国際電気 Loop antenna for reader / writer, and article management shelf and book management system provided with the loop antenna
CN1706176A (en) 2002-10-17 2005-12-07 安比恩特公司 Repeaters sharing a common medium for communications
JP4158483B2 (en) 2002-10-22 2008-10-01 ソニー株式会社 IC module
JP3659956B2 (en) 2002-11-11 2005-06-15 松下電器産業株式会社 Pressure measuring device and pressure measuring system
JP3789424B2 (en) 2002-11-20 2006-06-21 埼玉日本電気株式会社 Mobile device
JP2004213582A (en) 2003-01-09 2004-07-29 Mitsubishi Materials Corp RFID tag and reader / writer and RFID system provided with the tag
DE602004026549D1 (en) 2003-02-03 2010-05-27 Panasonic Corp ANTENNA DEVICE AND THEREOF USING WIRELESS COMMUNICATION DEVICE
JP2004234595A (en) 2003-02-03 2004-08-19 Matsushita Electric Ind Co Ltd Information recording medium reader
EP1445821A1 (en) 2003-02-06 2004-08-11 Matsushita Electric Industrial Co., Ltd. Portable radio communication apparatus provided with a boom portion
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
JP2004253858A (en) 2003-02-18 2004-09-09 Minerva:Kk Booster antenna device for ic tag
JP2004280390A (en) 2003-03-14 2004-10-07 Toppan Forms Co Ltd RF-ID media and method for manufacturing RF-ID media
JP4010263B2 (en) 2003-03-14 2007-11-21 富士電機ホールディングス株式会社 Antenna and data reader
JP4034676B2 (en) 2003-03-20 2008-01-16 日立マクセル株式会社 Non-contact communication type information carrier
JP4097139B2 (en) 2003-03-26 2008-06-11 Ｎｅｃトーキン株式会社 Wireless tag
JP2004297249A (en) 2003-03-26 2004-10-21 Matsushita Electric Ind Co Ltd Coupler between different phases and its mounting method, and coupling method between different phases
JP2004297681A (en) 2003-03-28 2004-10-21 Toppan Forms Co Ltd Non-contact information recording medium
JP2004304370A (en) 2003-03-28 2004-10-28 Sony Corp Antenna coil and communication equipment
JP4208631B2 (en) 2003-04-17 2009-01-14 日本ミクロン株式会社 Manufacturing method of semiconductor device
JP2004326380A (en) 2003-04-24 2004-11-18 Dainippon Printing Co Ltd RFID tag
JP2004334268A (en) 2003-04-30 2004-11-25 Dainippon Printing Co Ltd Paper IC tags and books / magazines with paper IC tags, books with paper IC tags
JP2004336250A (en) 2003-05-02 2004-11-25 Taiyo Yuden Co Ltd Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same
JP4080944B2 (en) 2003-05-12 2008-04-23 株式会社ハネックス Data carrier installation structure
JP2004343000A (en) 2003-05-19 2004-12-02 Fujikura Ltd Semiconductor module, non-contact IC tag having the same, and method of manufacturing semiconductor module
JP2004362190A (en) 2003-06-04 2004-12-24 Hitachi Ltd Semiconductor device
JP4828088B2 (en) 2003-06-05 2011-11-30 凸版印刷株式会社 IC tag
JP2005005866A (en) 2003-06-10 2005-01-06 Alps Electric Co Ltd Antenna-integrated module
JP3596774B1 (en) 2003-06-12 2004-12-02 松下電器産業株式会社 Portable radio
JP4210559B2 (en) 2003-06-23 2009-01-21 大日本印刷株式会社 Sheet with IC tag and manufacturing method thereof
JP2005033461A (en) 2003-07-11 2005-02-03 Mitsubishi Materials Corp RFID system and antenna structure in the system
JP2005050581A (en) 2003-07-30 2005-02-24 Seiko Epson Corp Power cord, power cord inspection device and power cord inspection method
JP2005064799A (en) 2003-08-11 2005-03-10 Toppan Printing Co Ltd RFID antenna for portable information terminal equipment
JP3982476B2 (en) 2003-10-01 2007-09-26 ソニー株式会社 Communications system
JP4062233B2 (en) 2003-10-20 2008-03-19 トヨタ自動車株式会社 Loop antenna device
JP4680489B2 (en) 2003-10-21 2011-05-11 三菱電機株式会社 Information record reading system
JP2005134942A (en) 2003-10-28 2005-05-26 Mitsubishi Materials Corp RFID reader / writer and antenna structure
JP3570430B1 (en) 2003-10-29 2004-09-29 オムロン株式会社 Loop coil antenna
JP4402426B2 (en) 2003-10-30 2010-01-20 大日本印刷株式会社 Temperature change detection system
JP4343655B2 (en) 2003-11-12 2009-10-14 株式会社日立製作所 antenna
JP4451125B2 (en) 2003-11-28 2010-04-14 シャープ株式会社 Small antenna
JP4177241B2 (en) 2003-12-04 2008-11-05 株式会社日立情報制御ソリューションズ Wireless IC tag antenna, wireless IC tag, and container with wireless IC tag
JP2005165839A (en) 2003-12-04 2005-06-23 Nippon Signal Co Ltd:The Reader/writer, ic tag, article control device, and optical disk device
US7494066B2 (en) 2003-12-19 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4916658B2 (en) 2003-12-19 2012-04-18 株式会社半導体エネルギー研究所 Semiconductor device
US6999028B2 (en) 2003-12-23 2006-02-14 3M Innovative Properties Company Ultra high frequency radio frequency identification tag
JP4326936B2 (en) 2003-12-24 2009-09-09 シャープ株式会社 Wireless tag
JP2005210676A (en) 2003-12-25 2005-08-04 Hitachi Ltd Wireless IC tag, wireless IC tag manufacturing method, and wireless IC tag manufacturing apparatus
EP1548674A1 (en) 2003-12-25 2005-06-29 Hitachi, Ltd. Radio IC tag, method and apparatus for manufacturing the same
JP4089680B2 (en) 2003-12-25 2008-05-28 三菱マテリアル株式会社 Antenna device
ATE503287T1 (en) 2003-12-25 2011-04-15 Mitsubishi Materials Corp ANTENNA DEVICE AND COMMUNICATION DEVICE
JP4218519B2 (en) 2003-12-26 2009-02-04 戸田工業株式会社 Magnetic field antenna, wireless system and communication system using the same
JP2005190417A (en) 2003-12-26 2005-07-14 Taketani Shoji:Kk Fixed object management system and individual identifier for use therein
JP4174801B2 (en) 2004-01-15 2008-11-05 株式会社エフ・イー・シー Identification tag reader / writer antenna
FR2865329B1 (en) 2004-01-19 2006-04-21 Pygmalyon PASSIVE RECEIVER-RECEIVER DEVICE POWERED BY AN ELECTROMAGNETIC WAVE
JP2005210223A (en) 2004-01-20 2005-08-04 Tdk Corp Antenna device
KR101107555B1 (en) 2004-01-22 2012-01-31 미코 코포레이션 A modular radio frequency identification tagging method
JP4271591B2 (en) 2004-01-30 2009-06-03 双信電機株式会社 Antenna device
KR101270180B1 (en) 2004-01-30 2013-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device
JP2005229474A (en) 2004-02-16 2005-08-25 Olympus Corp Information terminal device
JP4393228B2 (en) 2004-02-27 2010-01-06 シャープ株式会社 Small antenna and wireless tag provided with the same
JP2005252853A (en) 2004-03-05 2005-09-15 Fec Inc RF-ID antenna
JP2005277579A (en) 2004-03-23 2005-10-06 Kyocera Corp High frequency module and communication equipment using the same
JP4374346B2 (en) 2004-03-24 2009-12-02 株式会社内田洋行 IC tag affixing sheet for optical recording media
JP2005275870A (en) 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd INSERTION TYPE WIRELESS COMMUNICATION MEDIUM DEVICE AND ELECTRONIC DEVICE
JP2005284352A (en) 2004-03-26 2005-10-13 Toshiba Corp Portable electronic device
JP2005284455A (en) 2004-03-29 2005-10-13 Fujita Denki Seisakusho:Kk RFID system
JP4067510B2 (en) 2004-03-31 2008-03-26 シャープ株式会社 Television receiver
JP2005293537A (en) 2004-04-05 2005-10-20 Fuji Xynetics Kk Cardboard with ic tag
US8139759B2 (en) 2004-04-16 2012-03-20 Panasonic Corporation Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system
JP2005311205A (en) 2004-04-23 2005-11-04 Nec Corp Semiconductor device
JP2005306696A (en) 2004-04-26 2005-11-04 Matsushita Electric Ind Co Ltd Magnetic ferrite, common mode noise filter and chip transformer using the same
JP2005340759A (en) 2004-04-27 2005-12-08 Sony Corp Magnetic core member for antenna module, antenna module, and portable information terminal including the same
JP2005322119A (en) 2004-05-11 2005-11-17 Ic Brains Co Ltd Device for preventing illegal taking of article equipped with ic tag
JP2005321305A (en) 2004-05-10 2005-11-17 Murata Mfg Co Ltd Electronic component measurement jig
JP3867085B2 (en) 2004-05-13 2007-01-10 東芝テック株式会社 Wireless communication device, RF tag reader / writer, and printer
JP4191088B2 (en) 2004-05-14 2008-12-03 株式会社デンソー Electronic equipment
JP2005333244A (en) 2004-05-18 2005-12-02 Mitsubishi Electric Corp Mobile phone
JP4551122B2 (en) 2004-05-26 2010-09-22 株式会社岩田レーベル RFID label affixing device
US7317396B2 (en) 2004-05-26 2008-01-08 Funai Electric Co., Ltd. Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying
JP4360276B2 (en) 2004-06-02 2009-11-11 船井電機株式会社 Optical disc having wireless IC tag and optical disc reproducing apparatus
JP2005345802A (en) 2004-06-03 2005-12-15 Casio Comput Co Ltd IMAGING DEVICE, EXCHANGE UNIT USED FOR THIS IMAGING DEVICE, EXCHANGE UNIT USE CONTROL METHOD, AND PROGRAM
JP2005352858A (en) 2004-06-11 2005-12-22 Hitachi Maxell Ltd Communication record carrier
JP4348282B2 (en) 2004-06-11 2009-10-21 株式会社日立製作所 Wireless IC tag and method of manufacturing wireless IC tag
JP4530140B2 (en) 2004-06-28 2010-08-25 Ｔｄｋ株式会社 Soft magnetic material and antenna device using the same
JP4359198B2 (en) 2004-06-30 2009-11-04 株式会社日立製作所 IC tag mounting substrate manufacturing method
JP4328682B2 (en) 2004-07-13 2009-09-09 富士通株式会社 Radio tag antenna structure for optical recording medium and optical recording medium housing case with radio tag antenna
JP2006033312A (en) 2004-07-15 2006-02-02 Matsushita Electric Ind Co Ltd Antenna and antenna mounting method
JP2004362602A (en) 2004-07-26 2004-12-24 Hitachi Ltd RFID tag
JP2006039902A (en) 2004-07-27 2006-02-09 Ntn Corp Uhf band radio ic tag
JP2006039947A (en) 2004-07-27 2006-02-09 Daido Steel Co Ltd Composite magnetic sheet
JP2006042059A (en) 2004-07-28 2006-02-09 Tdk Corp Radio communication apparatus and impedance controlling method thereof
JP2006042097A (en) 2004-07-29 2006-02-09 Kyocera Corp Antenna wiring board
JP2006050200A (en) 2004-08-04 2006-02-16 Matsushita Electric Ind Co Ltd Reader / writer
JP4653440B2 (en) 2004-08-13 2011-03-16 富士通株式会社 RFID tag and manufacturing method thereof
JP4482403B2 (en) 2004-08-30 2010-06-16 日本発條株式会社 Non-contact information medium
JP4186895B2 (en) 2004-09-01 2008-11-26 株式会社デンソーウェーブ Coil antenna for non-contact communication device and manufacturing method thereof
JP4125275B2 (en) 2004-09-02 2008-07-30 日本電信電話株式会社 Non-contact IC medium control system
JP2005129019A (en) 2004-09-03 2005-05-19 Sony Chem Corp Ic card
JP2006080367A (en) 2004-09-10 2006-03-23 Brother Ind Ltd Inductance element, RFID tag circuit element, tag tape roll, and method of manufacturing inductance element
US20060055531A1 (en) 2004-09-14 2006-03-16 Honeywell International, Inc. Combined RF tag and SAW sensor
JP2006092630A (en) 2004-09-22 2006-04-06 Sony Corp Optical disc and manufacturing method thereof
JP4600742B2 (en) 2004-09-30 2010-12-15 ブラザー工業株式会社 Print head and tag label producing apparatus
JP2006107296A (en) 2004-10-08 2006-04-20 Dainippon Printing Co Ltd Non-contact IC tag and antenna for non-contact IC tag
GB2419779A (en) 2004-10-29 2006-05-03 Hewlett Packard Development Co Document having conductive tracks for coupling to a memory tag and a reader
US20070268113A1 (en) 2004-11-05 2007-11-22 Johnson Daniel R Detunable Rf Tags
WO2006049068A1 (en) 2004-11-08 2006-05-11 Matsushita Electric Industrial Co., Ltd. Antenna assembly and wireless communication system employing same
JP4088797B2 (en) 2004-11-18 2008-05-21 日本電気株式会社 RFID tag
JP2006148518A (en) 2004-11-19 2006-06-08 Matsushita Electric Works Ltd Adjuster and adjusting method of non-contact ic card
JP2006151402A (en) 2004-11-25 2006-06-15 Rengo Co Ltd Corrugated box with radio tag
US7545328B2 (en) 2004-12-08 2009-06-09 Electronics And Telecommunications Research Institute Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof
JP4281683B2 (en) 2004-12-16 2009-06-17 株式会社デンソー IC tag mounting structure
JP4541246B2 (en) 2004-12-24 2010-09-08 トッパン・フォームズ株式会社 Non-contact IC module
EP1829102A4 (en) 2004-12-24 2014-08-13 Semiconductor Energy Lab SEMICONDUCTOR DEVICE
JP4942998B2 (en) 2004-12-24 2012-05-30 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
JP4737505B2 (en) 2005-01-14 2011-08-03 日立化成工業株式会社 IC tag inlet and manufacturing method of IC tag inlet
US7714794B2 (en) 2005-01-19 2010-05-11 Behzad Tavassoli Hozouri RFID antenna
JP4711692B2 (en) 2005-02-01 2011-06-29 富士通株式会社 Meander line antenna
JP2006232292A (en) 2005-02-22 2006-09-07 Nippon Sheet Glass Co Ltd Container with RFID tag and RFID system
JP2006237674A (en) 2005-02-22 2006-09-07 Suncall Corp Patch antenna and rfid inlet
JP2006238282A (en) 2005-02-28 2006-09-07 Matsushita Electric Ind Co Ltd Antenna unit, transmission / reception device, wireless tag reading device, and wireless tag reading system
JP4639857B2 (en) 2005-03-07 2011-02-23 富士ゼロックス株式会社 A storage box for storing articles to which RFID tags are attached, an arrangement method thereof, a communication method, a communication confirmation method, and a packaging structure.
US7897337B2 (en) 2005-03-10 2011-03-01 Gen-Probe Incorporated Method for performing multi-formatted assays
JP4330575B2 (en) 2005-03-17 2009-09-16 富士通株式会社 Tag antenna
JP4437965B2 (en) 2005-03-22 2010-03-24 Ｎｅｃトーキン株式会社 Wireless tag
JP2006270681A (en) 2005-03-25 2006-10-05 Sony Corp Portable device
JP4087859B2 (en) 2005-03-25 2008-05-21 東芝テック株式会社 Wireless tag
JP2006287659A (en) 2005-03-31 2006-10-19 Tdk Corp Antenna device
JP4536775B2 (en) 2005-04-01 2010-09-01 富士通フロンテック株式会社 Metal-compatible RFID tag and RFID tag portion thereof
JP4750450B2 (en) 2005-04-05 2011-08-17 富士通株式会社 RFID tag
JP2006302219A (en) 2005-04-25 2006-11-02 Fujita Denki Seisakusho:Kk RFID tag communication range setting device
US8115681B2 (en) 2005-04-26 2012-02-14 Emw Co., Ltd. Ultra-wideband antenna having a band notch characteristic
JP4771115B2 (en) 2005-04-27 2011-09-14 日立化成工業株式会社 IC tag
JP4529786B2 (en) 2005-04-28 2010-08-25 株式会社日立製作所 Signal processing circuit and non-contact IC card and tag using the same
JP4452865B2 (en) 2005-04-28 2010-04-21 智三 太田 Wireless IC tag device and RFID system
US8111143B2 (en) 2005-04-29 2012-02-07 Hewlett-Packard Development Company, L.P. Assembly for monitoring an environment
JP4740645B2 (en) 2005-05-17 2011-08-03 富士通株式会社 Manufacturing method of semiconductor device
US7688272B2 (en) 2005-05-30 2010-03-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2007013120A (en) 2005-05-30 2007-01-18 Semiconductor Energy Lab Co Ltd Semiconductor device
JP4255931B2 (en) 2005-06-01 2009-04-22 日本電信電話株式会社 Non-contact IC medium and control device
JP2007007888A (en) 2005-06-28 2007-01-18 Oji Paper Co Ltd Non-contact IC chip mounting body mounted cardboard and manufacturing method thereof
JP2007018067A (en) 2005-07-05 2007-01-25 Kobayashi Kirokushi Co Ltd Rfid tag and rfid system
JP4286813B2 (en) 2005-07-08 2009-07-01 富士通株式会社 Antenna and RFID tag equipped with the same
JP2007028002A (en) 2005-07-13 2007-02-01 Matsushita Electric Ind Co Ltd Reader / writer antenna and communication system
JP2007040702A (en) 2005-07-29 2007-02-15 Oki Electric Ind Co Ltd Semiconductor ic, wireless ic tag and sensor
JPWO2007013168A1 (en) 2005-07-29 2009-02-05 富士通株式会社 RF tag and method of manufacturing RF tag
JP4720348B2 (en) 2005-08-04 2011-07-13 パナソニック株式会社 Antenna for RF-ID reader / writer device, RF-ID reader / writer device using the antenna, and RF-ID system
JP4737716B2 (en) 2005-08-11 2011-08-03 ブラザー工業株式会社 RFID tag IC circuit holder, tag tape roll, RFID tag cartridge
JP4801951B2 (en) 2005-08-18 2011-10-26 富士通フロンテック株式会社 RFID tag
JP2007065822A (en) 2005-08-30 2007-03-15 Sofueru:Kk Radio ic tag, intermediate ic tag body, intermediate ic tag body set and method for manufacturing radio ic tag
JP2007068073A (en) 2005-09-02 2007-03-15 Sony Corp Information processing device
DE102005042444B4 (en) 2005-09-06 2007-10-11 Ksw Microtec Ag Arrangement for an RFID transponder antenna
JP4725261B2 (en) 2005-09-12 2011-07-13 オムロン株式会社 RFID tag inspection method
JP4384102B2 (en) 2005-09-13 2009-12-16 株式会社東芝 Portable radio device and antenna device
JP2007096655A (en) 2005-09-28 2007-04-12 Oji Paper Co Ltd RFID tag antenna and RFID tag
JP4075919B2 (en) 2005-09-29 2008-04-16 オムロン株式会社 Antenna unit and non-contact IC tag
JP4826195B2 (en) 2005-09-30 2011-11-30 大日本印刷株式会社 RFID tag
JP2007116347A (en) 2005-10-19 2007-05-10 Mitsubishi Materials Corp Tag antenna and portable radio
US7374105B2 (en) * 2005-10-29 2008-05-20 Magnex Corporation RFID tag with improved range
JP4774273B2 (en) 2005-10-31 2011-09-14 株式会社サトー RFID label and RFID label attaching method
JP2007159083A (en) 2005-11-09 2007-06-21 Alps Electric Co Ltd Antenna matching circuit
JP4803184B2 (en) * 2005-11-22 2011-10-26 株式会社村田製作所 Coil antenna and portable electronic device
JP4899446B2 (en) 2005-11-24 2012-03-21 Ｔｄｋ株式会社 Composite electronic component and manufacturing method thereof
JP2007150642A (en) 2005-11-28 2007-06-14 Hitachi Ulsi Systems Co Ltd Interrogator for wireless tag, antenna for wireless tag, wireless tag system, and wireless tag selector
JP2007150868A (en) 2005-11-29 2007-06-14 Renesas Technology Corp Electronic device and manufacturing method thereof
US7573388B2 (en) 2005-12-08 2009-08-11 The Kennedy Group, Inc. RFID device with augmented grain
JP4560480B2 (en) 2005-12-13 2010-10-13 Ｎｅｃトーキン株式会社 Wireless tag
JP4815211B2 (en) 2005-12-22 2011-11-16 株式会社サトー RFID label and RFID label attaching method
JP4848764B2 (en) 2005-12-26 2011-12-28 大日本印刷株式会社 Non-contact data carrier device
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
WO2007083575A1 (en) 2006-01-19 2007-07-26 Murata Manufacturing Co., Ltd. Radio ic device
EP1976056A4 (en) 2006-01-19 2008-12-24 Murata Manufacturing Co INTEGRATED RADIO CIRCUIT DEVICE AND RADIO INTEGRATED CIRCUIT DEVICE PART
JP4696923B2 (en) 2006-01-19 2011-06-08 横河電機株式会社 Antenna, wireless tag device using the antenna, and wireless tag communication device
US20090231106A1 (en) 2006-01-27 2009-09-17 Totoku Electric Co., Ltd. Tag Apparatus,Transceiver Apparatus, and Tag System
EP1988601B1 (en) 2006-02-19 2012-10-10 Nissha Printing Co., Ltd. Feeding structure of housing with antenna
CN102514827B (en) 2006-02-22 2015-02-25 东洋制罐株式会社 Metal object with RFID tag
JP4524674B2 (en) 2006-02-23 2010-08-18 ブラザー工業株式会社 Interrogator for RFID tag communication system
JP4755921B2 (en) 2006-02-24 2011-08-24 富士通株式会社 RFID tag
JP4026080B2 (en) 2006-02-24 2007-12-26 オムロン株式会社 Antenna and RFID tag
WO2007099602A1 (en) 2006-02-28 2007-09-07 Matsushita Electric Industrial Co., Ltd. Portable radio apparatus
JP5055478B2 (en) 2006-02-28 2012-10-24 凸版印刷株式会社 IC tag
JP3121577U (en) 2006-03-02 2006-05-18 株式会社スマート Eccentric magnetic coil system
KR20080098412A (en) 2006-03-06 2008-11-07 미쓰비시덴키 가부시키가이샤 RFID tag, manufacturing method of RFID tag and RFID tag installation method
JP2007241789A (en) 2006-03-10 2007-09-20 Ic Brains Co Ltd Wireless tag reader / writer, communication apparatus, and communication system
JP3933191B1 (en) 2006-03-13 2007-06-20 株式会社村田製作所 Portable electronic devices
JP2007249620A (en) 2006-03-16 2007-09-27 Nec Tokin Corp Wireless tag
JP2007287128A (en) 2006-03-22 2007-11-01 Orient Sokki Computer Kk Non-contact ic medium
JP4735368B2 (en) 2006-03-28 2011-07-27 富士通株式会社 Planar antenna
JP4854362B2 (en) 2006-03-30 2012-01-18 富士通株式会社 RFID tag and manufacturing method thereof
JP4927625B2 (en) 2006-03-31 2012-05-09 ニッタ株式会社 Magnetic shield sheet, non-contact IC card communication improving method, and non-contact IC card container
JP2007279782A (en) 2006-04-03 2007-10-25 Dainippon Printing Co Ltd Non-contact IC tag having IC chip destruction prevention structure, non-contact IC tag connecting body, and manufacturing method of non-contact IC tag connecting body
JP4998463B2 (en) 2006-04-10 2012-08-15 株式会社村田製作所 Wireless IC device
EP2009736B1 (en) 2006-04-14 2016-01-13 Murata Manufacturing Co. Ltd. Wireless ic device
WO2007119310A1 (en) 2006-04-14 2007-10-25 Murata Manufacturing Co., Ltd. Antenna
JP4853095B2 (en) 2006-04-24 2012-01-11 大日本印刷株式会社 Non-contact data carrier, wiring board for non-contact data carrier
JP2007295395A (en) 2006-04-26 2007-11-08 Fujitsu Ltd Tag antenna and tag using the same
KR100963057B1 (en) 2006-04-26 2010-06-14 가부시키가이샤 무라타 세이사쿠쇼 Electronic coupling module accessory
ATE539463T1 (en) 2006-04-26 2012-01-15 Murata Manufacturing Co OBJECT PROVIDED WITH POWER CIRCUIT BOARD
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US20080068132A1 (en) 2006-05-16 2008-03-20 Georges Kayanakis Contactless radiofrequency device featuring several antennas and related antenna selection circuit
US7589675B2 (en) 2006-05-19 2009-09-15 Industrial Technology Research Institute Broadband antenna
JP2007324865A (en) 2006-05-31 2007-12-13 Sony Chemical & Information Device Corp Antenna circuit, and transponder
ATE507538T1 (en) 2006-06-01 2011-05-15 Murata Manufacturing Co HIGH FREQUENCY IC ARRANGEMENT AND COMPOSITE COMPONENT FOR A HIGH FREQUENCY IC ARRANGEMENT
WO2008001561A1 (en) 2006-06-30 2008-01-03 Murata Manufacturing Co., Ltd. Optical disc
WO2008007606A1 (en) 2006-07-11 2008-01-17 Murata Manufacturing Co., Ltd. Antenna and radio ic device
JP2008033716A (en) 2006-07-31 2008-02-14 Sankyo Kk Coin-type RFID tag
JP4169062B2 (en) 2006-08-03 2008-10-22 凸版印刷株式会社 Wireless tag
KR100797172B1 (en) 2006-08-08 2008-01-23 삼성전자주식회사 Loop antenna with integral matching circuit
JP4836899B2 (en) 2006-09-05 2011-12-14 パナソニック株式会社 Magnetic striped array sheet, RFID magnetic sheet, electromagnetic shielding sheet, and manufacturing method thereof
US7981528B2 (en) 2006-09-05 2011-07-19 Panasonic Corporation Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same
JP4770655B2 (en) 2006-09-12 2011-09-14 株式会社村田製作所 Wireless IC device
US8120462B2 (en) 2006-09-25 2012-02-21 Sensomatic Electronics, LLC Method and system for standing wave detection for radio frequency identification marker readers
JP2008083867A (en) 2006-09-26 2008-04-10 Matsushita Electric Works Ltd Memory card socket
JP2008092131A (en) 2006-09-29 2008-04-17 Tdk Corp Antenna element and mobile information terminal
JP2008098993A (en) 2006-10-12 2008-04-24 Dx Antenna Co Ltd Antenna
JP4913529B2 (en) 2006-10-13 2012-04-11 トッパン・フォームズ株式会社 RFID media
JP2008107947A (en) 2006-10-24 2008-05-08 Toppan Printing Co Ltd RFID tag
JP2008118359A (en) 2006-11-02 2008-05-22 Nec Corp Walkie-talkie
US7605761B2 (en) 2006-11-30 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Antenna and semiconductor device having the same
DE102006057369A1 (en) 2006-12-04 2008-06-05 Airbus Deutschland Gmbh Radio frequency identification tag for e.g. identifying metal container, has radio frequency identification scanning antenna with conductor loop that is aligned diagonally or perpendicularly to attachment surface
JP2008167190A (en) 2006-12-28 2008-07-17 Philtech Inc Base body sheet
US8237622B2 (en) 2006-12-28 2012-08-07 Philtech Inc. Base sheet
JP2008182438A (en) 2007-01-24 2008-08-07 Nec Tokin Corp Radio tag
JP2008207875A (en) 2007-01-30 2008-09-11 Sony Corp Optical disc case, optical disc tray, card member, and manufacturing method
US7886315B2 (en) 2007-01-30 2011-02-08 Sony Corporation Optical disc case, optical disc tray, card member, and manufacturing method
JP2008197714A (en) 2007-02-08 2008-08-28 Dainippon Printing Co Ltd Non-contact data carrier device and auxiliary antenna for non-contact data carrier
JP4872713B2 (en) 2007-02-27 2012-02-08 大日本印刷株式会社 Non-contact data carrier device
JP5061657B2 (en) 2007-03-05 2012-10-31 大日本印刷株式会社 Non-contact data carrier device
JP2008226099A (en) 2007-03-15 2008-09-25 Dainippon Printing Co Ltd Non-contact data carrier device
JP4865614B2 (en) 2007-03-27 2012-02-01 マグネックス・コーポレーション RFID chip and antenna with improved range
JP4867753B2 (en) 2007-03-30 2012-02-01 Ｔｄｋ株式会社 ANTENNA DEVICE AND RADIO COMMUNICATION DEVICE USING THE SAME
WO2008126458A1 (en) 2007-04-06 2008-10-23 Murata Manufacturing Co., Ltd. Radio ic device
CN101657938B (en) 2007-04-13 2014-05-14 株式会社村田制作所 Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods
WO2009005080A1 (en) 2007-07-04 2009-01-08 Murata Manufacturing Co., Ltd. Radio ic device and component for radio ic device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
JP4525859B2 (en) 2007-05-10 2010-08-18 株式会社村田製作所 Wireless IC device
JP4666102B2 (en) 2007-05-11 2011-04-06 株式会社村田製作所 Wireless IC device
JP4770792B2 (en) 2007-05-18 2011-09-14 パナソニック電工株式会社 Antenna device
JP4867787B2 (en) 2007-05-22 2012-02-01 Ｔｄｋ株式会社 Antenna device
JP4885093B2 (en) 2007-06-11 2012-02-29 株式会社タムラ製作所 Booster antenna coil
DE102007027838B4 (en) * 2007-06-13 2021-01-14 Leonhard Kurz Gmbh & Co. Kg Multi-layer film element
CN101558530B (en) * 2007-06-27 2013-02-27 株式会社村田制作所 Wireless ic device
JP2009017284A (en) 2007-07-05 2009-01-22 Panasonic Corp Antenna device
CN101542831B (en) 2007-07-09 2014-06-25 株式会社村田制作所 Wireless ic device
JP5167709B2 (en) 2007-07-17 2013-03-21 株式会社村田製作所 Wireless IC device, inspection system thereof, and method of manufacturing wireless IC device using the inspection system
CN101578616A (en) 2007-07-17 2009-11-11 株式会社村田制作所 Wireless IC device and electronic apparatus
EP2166616B1 (en) 2007-07-18 2013-11-27 Murata Manufacturing Co. Ltd. Wireless ic device
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
JP4867830B2 (en) 2007-07-18 2012-02-01 株式会社村田製作所 Wireless IC device
ATE556466T1 (en) 2007-07-18 2012-05-15 Murata Manufacturing Co WIRELESS IC DEVICE
US20090021352A1 (en) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Radio frequency ic device and electronic apparatus
JP2009037413A (en) 2007-08-01 2009-02-19 Murata Mfg Co Ltd Radio ic device
JP4702336B2 (en) 2007-08-10 2011-06-15 株式会社デンソーウェーブ Portable RFID tag reader
JP4885092B2 (en) 2007-09-06 2012-02-29 株式会社タムラ製作所 Booster antenna coil
US8717244B2 (en) 2007-10-11 2014-05-06 3M Innovative Properties Company RFID tag with a modified dipole antenna
JP2009110144A (en) 2007-10-29 2009-05-21 Oji Paper Co Ltd Coin-type RFID tag
TW200919327A (en) 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
JP2009111950A (en) 2007-11-01 2009-05-21 Dainippon Printing Co Ltd Non-contact type IC tag and method of manufacturing non-contact type IC tag
JP5155642B2 (en) 2007-11-28 2013-03-06 ルネサスエレクトロニクス株式会社 ID tag
JP2009135166A (en) 2007-11-29 2009-06-18 Nikon Corp Exposure method and apparatus, exposure unit, and device manufacturing method
KR101047189B1 (en) 2007-12-20 2011-07-06 가부시키가이샤 무라타 세이사쿠쇼 Wireless IC devices
JP2009181246A (en) 2008-01-29 2009-08-13 Toppan Forms Co Ltd RFID inspection system
JP2009182630A (en) 2008-01-30 2009-08-13 Dainippon Printing Co Ltd Booster antenna substrate, booster antenna substrate sheet and non-contact type data carrier device
EP2251934B1 (en) 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
EP2251933A4 (en) 2008-03-03 2012-09-12 Murata Manufacturing Co Composite antenna
WO2009119548A1 (en) 2008-03-26 2009-10-01 株式会社村田製作所 Radio ic device
JP4535209B2 (en) 2008-04-14 2010-09-01 株式会社村田製作所 Wireless IC device, electronic apparatus, and method for adjusting resonance frequency of wireless IC device
JP2009260758A (en) 2008-04-18 2009-11-05 Murata Mfg Co Ltd Radio ic device
US8629650B2 (en) 2008-05-13 2014-01-14 Qualcomm Incorporated Wireless power transfer using multiple transmit antennas
JP4927781B2 (en) 2008-05-15 2012-05-09 株式会社東海理化電機製作所 Portable machine
WO2009142114A1 (en) 2008-05-21 2009-11-26 株式会社村田製作所 Wireless ic device
JP5078022B2 (en) 2008-05-22 2012-11-21 Ｎｅｃトーキン株式会社 Wireless tag and method of using wireless tag
JP4557186B2 (en) 2008-06-25 2010-10-06 株式会社村田製作所 Wireless IC device and manufacturing method thereof
JP2010015342A (en) 2008-07-03 2010-01-21 Dainippon Printing Co Ltd Antenna sheet, inlet, and ic tag
JP2010050844A (en) 2008-08-22 2010-03-04 Sony Corp Loop antenna and communication device
JP5319313B2 (en) 2008-08-29 2013-10-16 峰光電子株式会社 Loop antenna
JP4618459B2 (en) 2008-09-05 2011-01-26 オムロン株式会社 RFID tag, RFID tag set and RFID system
JP3148168U (en) 2008-10-21 2009-02-05 株式会社村田製作所 Wireless IC device
DE112009002399B4 (en) 2008-10-29 2022-08-18 Murata Manufacturing Co., Ltd. Radio IC device
JP5041075B2 (en) 2009-01-09 2012-10-03 株式会社村田製作所 Wireless IC device and wireless IC module
JP5287289B2 (en) 2009-01-26 2013-09-11 株式会社村田製作所 Antenna device
JP5316638B2 (en) 2009-03-13 2013-10-16 株式会社村田製作所 Antenna device
JP5510450B2 (en) 2009-04-14 2014-06-04 株式会社村田製作所 Wireless IC device
JP5535752B2 (en) 2009-04-30 2014-07-02 ニッタ株式会社 Wireless communication improving sheet body, wireless tag with wireless communication improving sheet body, and wireless tag communication system
JP4883136B2 (en) 2009-05-15 2012-02-22 株式会社村田製作所 Coil antenna
JP2011015395A (en) 2009-06-03 2011-01-20 Nippon Information System:Kk Cloth with rfid tag, and system for managing cloth with rfid tag
JP5304580B2 (en) 2009-10-02 2013-10-02 株式会社村田製作所 Wireless IC device
JP2010051012A (en) 2009-11-06 2010-03-04 Tdk Corp Antenna, and radio ic memory
KR101705742B1 (en) 2009-11-20 2017-02-10 히타치 긴조쿠 가부시키가이샤 Antenna
JP5521686B2 (en) 2010-03-25 2014-06-18 株式会社村田製作所 Antenna apparatus and wireless communication device
JP5558960B2 (en) 2010-07-30 2014-07-23 トッパン・フォームズ株式会社 RF-ID media inspection device
JP4894960B2 (en) 2011-03-15 2012-03-14 株式会社村田製作所 Electronics
WO2013035821A1 (en) * 2011-09-09 2013-03-14 株式会社村田製作所 Antenna device and wireless device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142648A (en) * 2005-11-29 2011-07-21 Semiconductor Energy Lab Co Ltd Semiconductor device and method of manufacturing the same
JP2010102445A (en) * 2008-10-22 2010-05-06 Murata Mfg Co Ltd Radio communication system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015022923A1 (en) * 2013-08-13 2015-02-19 株式会社村田製作所 Antenna device, card-type device, and electronic device
US9627761B2 (en) 2013-08-13 2017-04-18 Murata Manufacturing Co., Ltd. Antenna device, card device, and electronic apparatus
JP2016170071A (en) * 2015-03-13 2016-09-23 株式会社村田製作所 RFIC device for moisture detection
KR20200005490A (en) * 2018-07-06 2020-01-15 주식회사 아모텍 Combo antenna module
KR102137633B1 (en) * 2018-07-06 2020-07-24 주식회사 아모텍 Combo antenna module
US11605889B2 (en) 2018-07-06 2023-03-14 Amotech Co., Ltd. Combo antenna module
US12394903B2 (en) 2022-02-28 2025-08-19 Tdk Corporation Antenna module
WO2025177672A1 (en) * 2024-02-21 2025-08-28 株式会社村田製作所 Wireless communication device

Also Published As

Publication number Publication date
JPWO2013035821A1 (en) 2015-03-23
US20140062827A1 (en) 2014-03-06
US20170084980A1 (en) 2017-03-23
US9812764B2 (en) 2017-11-07
JP5418737B2 (en) 2014-02-19
CN203553354U (en) 2014-04-16
US9543642B2 (en) 2017-01-10

Similar Documents

Publication Publication Date Title
JP5418737B2 (en) Antenna apparatus and wireless device
US8668151B2 (en) Wireless IC device
CN203850432U (en) Antenna device and communication terminal device
US9847578B2 (en) Antenna device and communication terminal apparatus
US8544759B2 (en) Wireless IC device, wireless IC module and method of manufacturing wireless IC module
JP6172210B2 (en) Antenna device
CN102084543B (en) Wireless IC device
JP5267463B2 (en) Wireless IC device and wireless communication system
US7830311B2 (en) Wireless IC device and electronic device
CN103620868B (en) Antenna device and communication terminal device
CN203674401U (en) Antenna device and communication terminal device
WO2013008874A1 (en) Wireless communication device
JP5672874B2 (en) Wireless IC tag and RFID system
US8720789B2 (en) Wireless IC device
JP4840275B2 (en) Wireless IC device and electronic apparatus
JP5630166B2 (en) Wireless IC tag and RFID system
JP5983724B2 (en) Wireless IC tag and RFID system

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201290000476.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12829374

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2013532657

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12829374

Country of ref document: EP

Kind code of ref document: A1