[go: up one dir, main page]

WO2010013470A1 - 半導体モジュールおよび半導体モジュールを備える携帯機器 - Google Patents

半導体モジュールおよび半導体モジュールを備える携帯機器 Download PDF

Info

Publication number
WO2010013470A1
WO2010013470A1 PCT/JP2009/003598 JP2009003598W WO2010013470A1 WO 2010013470 A1 WO2010013470 A1 WO 2010013470A1 JP 2009003598 W JP2009003598 W JP 2009003598W WO 2010013470 A1 WO2010013470 A1 WO 2010013470A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor module
protruding
semiconductor element
electrode
apparatus provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/003598
Other languages
English (en)
French (fr)
Inventor
小林初
中里真弓
臼井良輔
柳瀬康行
齋藤浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008199072A external-priority patent/JP5484694B2/ja
Priority claimed from JP2008255795A external-priority patent/JP5484705B2/ja
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to US13/056,851 priority Critical patent/US8373281B2/en
Priority to US17/954,718 priority patent/USRE50741E1/en
Publication of WO2010013470A1 publication Critical patent/WO2010013470A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W42/20—
    • H10W42/276—
    • H10W70/042—
    • H10W70/09—
    • H10W70/095—
    • H10W70/421—
    • H10W70/635—
    • H10W74/012—
    • H10W74/014—
    • H10W74/117—
    • H10W74/15—
    • H10W70/05—
    • H10W72/0198—
    • H10W72/07232—
    • H10W72/07236—
    • H10W72/241—
    • H10W72/242—
    • H10W72/29—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/856—
    • H10W74/00—
    • H10W80/301—
    • H10W90/724—
    • H10W90/726—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)

Abstract

　配線層２０の上に形成された絶縁樹脂層３０に搭載された半導体素子４０が封止樹脂５０により封止されている。配線層２０には、半導体素子４０の側に突出する突起電極２２と突起部８０とがそれぞれ一体的に形成されている。そして、突起電極２２は、絶縁樹脂層３０を貫通して半導体素子４０の素子電極４２と電気的に接続されている。突起部８０は、半導体素子４０の四辺に沿って半導体素子４０を取り囲むように配置され、突起電極２２と素子電極４２との接合部分よりも上方の位置にまで封止樹脂５０内に埋め込まれている。
PCT/JP2009/003598 2008-07-31 2009-07-29 半導体モジュールおよび半導体モジュールを備える携帯機器 Ceased WO2010013470A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/056,851 US8373281B2 (en) 2008-07-31 2009-07-29 Semiconductor module and portable apparatus provided with semiconductor module
US17/954,718 USRE50741E1 (en) 2008-07-31 2009-07-29 Semiconductor module and portable apparatus provided with semiconductor module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008199072A JP5484694B2 (ja) 2008-07-31 2008-07-31 半導体モジュールおよび半導体モジュールを備える携帯機器
JP2008-199072 2008-07-31
JP2008-255795 2008-09-30
JP2008255795A JP5484705B2 (ja) 2008-09-30 2008-09-30 半導体モジュールおよび半導体モジュールを備える携帯機器

Publications (1)

Publication Number Publication Date
WO2010013470A1 true WO2010013470A1 (ja) 2010-02-04

Family

ID=41610184

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/003598 Ceased WO2010013470A1 (ja) 2008-07-31 2009-07-29 半導体モジュールおよび半導体モジュールを備える携帯機器

Country Status (2)

Country Link
US (2) US8373281B2 (ja)
WO (1) WO2010013470A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012103369A1 (en) * 2011-01-28 2012-08-02 Marvell World Trade Ltd. Single layer bga substrate process
CN112151390A (zh) * 2019-06-27 2020-12-29 立昌先进科技股份有限公司 一种贴片式单颗小尺寸及阵列型的芯片半导体元件的封装方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8319339B2 (en) * 2009-07-10 2012-11-27 Stmicroelectronics (Tours) Sas Surface-mounted silicon chip
KR101323925B1 (ko) * 2012-03-30 2013-10-31 주식회사 네패스 반도체 패키지 및 그 제조 방법
TWI463619B (zh) * 2012-06-22 2014-12-01 矽品精密工業股份有限公司 半導體封裝件及其製法
JP6163421B2 (ja) * 2013-12-13 2017-07-12 株式会社東芝 半導体装置、および、半導体装置の製造方法
JP6219155B2 (ja) * 2013-12-13 2017-10-25 東芝メモリ株式会社 半導体装置の製造方法
US10163813B2 (en) 2016-11-17 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chip package structure including redistribution structure and conductive shielding film
JP7083256B2 (ja) 2018-02-19 2022-06-10 富士電機株式会社 半導体モジュール及びその製造方法
KR102570270B1 (ko) * 2018-10-30 2023-08-24 삼성전자주식회사 반도체 패키지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750383A (ja) * 1993-08-05 1995-02-21 Apic Yamada Kk リードフレーム及びその製造方法
JP2003007904A (ja) * 2001-06-27 2003-01-10 Hitachi Ltd 半導体装置
JP2005340862A (ja) * 2005-08-15 2005-12-08 North:Kk 配線基板とその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3400877B2 (ja) * 1994-12-14 2003-04-28 三菱電機株式会社 半導体装置及びその製造方法
US5841193A (en) 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
CN1167131C (zh) 1997-08-19 2004-09-15 株式会社日立制作所 基底基板及制作用来装载多个半导体裸芯片器件的构造体的方法
US7057294B2 (en) * 2001-07-13 2006-06-06 Rohm Co., Ltd. Semiconductor device
JP4595265B2 (ja) * 2001-08-13 2010-12-08 日本テキサス・インスツルメンツ株式会社 半導体装置の製造方法
WO2003019654A1 (en) 2001-08-22 2003-03-06 Tessera, Inc. Stacked chip assembly with stiffening layer
TWI253155B (en) * 2003-05-28 2006-04-11 Siliconware Precision Industries Co Ltd Thermally enhanced semiconductor package and fabrication method thereof
FR2861216B1 (fr) * 2003-10-21 2006-02-10 St Microelectronics Sa Boitier semi-conducteur a puce sur plaque-support
JP4361826B2 (ja) * 2004-04-20 2009-11-11 新光電気工業株式会社 半導体装置
JP4108643B2 (ja) * 2004-05-12 2008-06-25 日本電気株式会社 配線基板及びそれを用いた半導体パッケージ
KR100618892B1 (ko) * 2005-04-13 2006-09-01 삼성전자주식회사 와이어 본딩을 통해 팬 아웃 구조를 달성하는 반도체패키지
JP5000877B2 (ja) * 2005-10-07 2012-08-15 ルネサスエレクトロニクス株式会社 半導体装置
KR100887475B1 (ko) * 2007-02-26 2009-03-10 주식회사 네패스 반도체 패키지 및 그 제조방법
US7863090B2 (en) 2007-06-25 2011-01-04 Epic Technologies, Inc. Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system
US7872347B2 (en) * 2007-08-09 2011-01-18 Broadcom Corporation Larger than die size wafer-level redistribution packaging process
JP2008060587A (ja) 2007-09-18 2008-03-13 Seiko Epson Corp 半導体装置および半導体装置の製造方法
US8018043B2 (en) * 2008-03-10 2011-09-13 Hynix Semiconductor Inc. Semiconductor package having side walls and method for manufacturing the same
JP5005603B2 (ja) * 2008-04-03 2012-08-22 新光電気工業株式会社 半導体装置及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750383A (ja) * 1993-08-05 1995-02-21 Apic Yamada Kk リードフレーム及びその製造方法
JP2003007904A (ja) * 2001-06-27 2003-01-10 Hitachi Ltd 半導体装置
JP2005340862A (ja) * 2005-08-15 2005-12-08 North:Kk 配線基板とその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012103369A1 (en) * 2011-01-28 2012-08-02 Marvell World Trade Ltd. Single layer bga substrate process
US8673689B2 (en) 2011-01-28 2014-03-18 Marvell World Trade Ltd. Single layer BGA substrate process
US8940585B2 (en) 2011-01-28 2015-01-27 Marvell World Trade Ltd. Single layer BGA substrate process
CN112151390A (zh) * 2019-06-27 2020-12-29 立昌先进科技股份有限公司 一种贴片式单颗小尺寸及阵列型的芯片半导体元件的封装方法
EP3758061A1 (en) * 2019-06-27 2020-12-30 SFI Electronics Technology Inc. Packaging method for attached single small-size and array type chip semiconductor components with one or two circuit boards with electroplated through-interconnections

Also Published As

Publication number Publication date
US20110186993A1 (en) 2011-08-04
US8373281B2 (en) 2013-02-12
USRE50741E1 (en) 2026-01-06

Similar Documents

Publication Publication Date Title
WO2010013470A1 (ja) 半導体モジュールおよび半導体モジュールを備える携帯機器
WO2009044863A1 (ja) モジュール、配線板、及びモジュールの製造方法
WO2009041212A1 (ja) 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール
JP2013500579A5 (ja)
TWI266394B (en) Semiconductor device and method of fabricating the same
WO2009069551A1 (ja) 光電変換素子用電極基板
TWI260056B (en) Module structure having an embedded chip
WO2009071956A3 (en) Electric power generating solar roof tile and a procedure for its production
TW200802653A (en) Semiconductor apparatus and method of producing the same
WO2009022461A1 (ja) 回路装置及びその製造方法、携帯機器
WO2007095468A3 (en) Multi-chip module for battery power control
TW200739875A (en) Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device
AU2014380483A1 (en) Fingerprint recognition device, manufacturing method therefor and electronic device
WO2009011077A1 (ja) 半導体装置及びその製造方法
TW200723457A (en) Semiconductor device and method for manufacturing semiconductor device
TW200638520A (en) Multilevel semiconductor module and method for fabricating the same
TW200951538A (en) Flexible display module and method of manufacturing the same
WO2009066504A1 (ja) 部品内蔵モジュール
WO2008130012A1 (ja) パワー半導体モジュール
WO2014023807A3 (de) Verkapselte bauelemente mit organischer schicht und verfahren zu deren herstellung
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
WO2008093563A1 (ja) 太陽電池モジュール、太陽電池用配線部材、および太陽電池モジュールの製造方法
WO2008152865A1 (ja) 薄膜太陽電池およびその製造方法
TW200610073A (en) Semiconductor device and semiconductor device producing substrate and production methods therefor
WO2009072225A1 (ja) 表示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09802719

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13056851

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 09802719

Country of ref document: EP

Kind code of ref document: A1