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WO2009044737A1 - Electronic component - Google Patents

Electronic component Download PDF

Info

Publication number
WO2009044737A1
WO2009044737A1 PCT/JP2008/067749 JP2008067749W WO2009044737A1 WO 2009044737 A1 WO2009044737 A1 WO 2009044737A1 JP 2008067749 W JP2008067749 W JP 2008067749W WO 2009044737 A1 WO2009044737 A1 WO 2009044737A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic substrate
electronic component
main surface
corners
land electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067749
Other languages
French (fr)
Japanese (ja)
Inventor
Hisanori Murase
Naoki Nakayama
Muneyoshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2009044737A1 publication Critical patent/WO2009044737A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H10W42/121—
    • H10W70/65—
    • H10W70/692—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Provided is an electronic component wherein breakage and chipping of corners of a ceramic substrate due to shocks applied by dropping or the like are prevented from being generated. An electronic component (10) has, on one main surface (12b) of a ceramic substrate (12) having a rectangular outer shape, first and second land electrodes (20, 22) which are arranged along the four sides of the main surface (12b) of the ceramic substrate (12). The first land electrodes (20) are arranged at areas other than the four corners of the main surface (12b) of the ceramic substrate (12). The second land electrodes (22) are arranged at the four corners of the main surface (12b) of the ceramic substrate (12). Each of the second land electrode (22) has round corners.
PCT/JP2008/067749 2007-10-01 2008-09-30 Electronic component Ceased WO2009044737A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-257500 2007-10-01
JP2007257500 2007-10-01

Publications (1)

Publication Number Publication Date
WO2009044737A1 true WO2009044737A1 (en) 2009-04-09

Family

ID=40526164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067749 Ceased WO2009044737A1 (en) 2007-10-01 2008-09-30 Electronic component

Country Status (1)

Country Link
WO (1) WO2009044737A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278133A (en) * 2009-05-27 2010-12-09 Murata Mfg Co Ltd Circuit board
WO2012101978A1 (en) * 2011-01-25 2012-08-02 株式会社村田製作所 Electronic component
JP2013033821A (en) * 2011-08-01 2013-02-14 Seiko Epson Corp Substrate, electronic device and electronic apparatus
WO2018155559A1 (en) * 2017-02-22 2018-08-30 京セラ株式会社 Wiring substrate, electronic device, and electronic module
WO2018155434A1 (en) * 2017-02-21 2018-08-30 京セラ株式会社 Wiring substrate, electronic device, and electronic module
JP2020123618A (en) * 2019-01-29 2020-08-13 京セラ株式会社 Circuit boards, electronic components and electronic modules
US11024572B2 (en) 2015-11-28 2021-06-01 Kyocera Corporation Wiring board, electronic device, and electronic module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265876U (en) * 1985-10-14 1987-04-23
JP2001156204A (en) * 1999-11-25 2001-06-08 Murata Mfg Co Ltd Surface mount components
JP2003179175A (en) * 2001-12-10 2003-06-27 Kyocera Corp Wiring board
JP2004281473A (en) * 2003-03-12 2004-10-07 Kyocera Corp Wiring board
JP2005026312A (en) * 2003-06-30 2005-01-27 Hitachi Metals Ltd High-frequency electronic part and its mounting method
WO2006114971A2 (en) * 2005-04-18 2006-11-02 Murata Manufacturing Co Electronic component module
WO2007060784A1 (en) * 2005-11-28 2007-05-31 Murata Manufacturing Co., Ltd. Circuit module and method for fabricating the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265876U (en) * 1985-10-14 1987-04-23
JP2001156204A (en) * 1999-11-25 2001-06-08 Murata Mfg Co Ltd Surface mount components
JP2003179175A (en) * 2001-12-10 2003-06-27 Kyocera Corp Wiring board
JP2004281473A (en) * 2003-03-12 2004-10-07 Kyocera Corp Wiring board
JP2005026312A (en) * 2003-06-30 2005-01-27 Hitachi Metals Ltd High-frequency electronic part and its mounting method
WO2006114971A2 (en) * 2005-04-18 2006-11-02 Murata Manufacturing Co Electronic component module
WO2007060784A1 (en) * 2005-11-28 2007-05-31 Murata Manufacturing Co., Ltd. Circuit module and method for fabricating the same

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278133A (en) * 2009-05-27 2010-12-09 Murata Mfg Co Ltd Circuit board
WO2012101978A1 (en) * 2011-01-25 2012-08-02 株式会社村田製作所 Electronic component
JP5704177B2 (en) * 2011-01-25 2015-04-22 株式会社村田製作所 Electronic components
US9343844B2 (en) 2011-01-25 2016-05-17 Murata Manufacturing Co., Ltd. Electronic component
JP2013033821A (en) * 2011-08-01 2013-02-14 Seiko Epson Corp Substrate, electronic device and electronic apparatus
US11024572B2 (en) 2015-11-28 2021-06-01 Kyocera Corporation Wiring board, electronic device, and electronic module
CN110326101A (en) * 2017-02-21 2019-10-11 京瓷株式会社 Circuit board, electronic device and electronic module
WO2018155434A1 (en) * 2017-02-21 2018-08-30 京セラ株式会社 Wiring substrate, electronic device, and electronic module
JPWO2018155434A1 (en) * 2017-02-21 2019-11-21 京セラ株式会社 Wiring board, electronic device and electronic module
US11024554B2 (en) 2017-02-21 2021-06-01 Kyocera Corporation Wiring substrate, electronic device, and electronic module
CN110326101B (en) * 2017-02-21 2024-02-02 京瓷株式会社 Wiring substrates, electronic devices and electronic modules
CN110291628A (en) * 2017-02-22 2019-09-27 京瓷株式会社 Wiring board, electronic device, and electronic module
JPWO2018155559A1 (en) * 2017-02-22 2020-01-09 京セラ株式会社 Wiring board, electronic device and electronic module
US10937707B2 (en) 2017-02-22 2021-03-02 Kyocera Corporation Wiring substrate, electronic device, and electronic module
WO2018155559A1 (en) * 2017-02-22 2018-08-30 京セラ株式会社 Wiring substrate, electronic device, and electronic module
JP2020123618A (en) * 2019-01-29 2020-08-13 京セラ株式会社 Circuit boards, electronic components and electronic modules
JP7433766B2 (en) 2019-01-29 2024-02-20 京セラ株式会社 Circuit boards, electronic components and electronic modules

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