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WO2009044737A1 - 電子部品 - Google Patents

電子部品 Download PDF

Info

Publication number
WO2009044737A1
WO2009044737A1 PCT/JP2008/067749 JP2008067749W WO2009044737A1 WO 2009044737 A1 WO2009044737 A1 WO 2009044737A1 JP 2008067749 W JP2008067749 W JP 2008067749W WO 2009044737 A1 WO2009044737 A1 WO 2009044737A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic substrate
electronic component
main surface
corners
land electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067749
Other languages
English (en)
French (fr)
Inventor
Hisanori Murase
Naoki Nakayama
Muneyoshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2009044737A1 publication Critical patent/WO2009044737A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H10W42/121—
    • H10W70/65—
    • H10W70/692—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　落下等の衝撃によるセラミック基板の角部の割れや欠けの発生を防ぐことができる電子部品を提供する。 　電子部品１０は、外形が矩形のセラミック基板１２の一方主面１２ｂに、セラミック基板１２の一方主面１２ｂの４辺に沿って配置された第１及び第２のランド電極２０，２２を備える。第１のランド電極２０は、セラミック基板１２の一方主面１２ｂの四隅以外に配置される。第２のランド電極２２は、セラミック基板１２の一方主面１２ｂの四隅に配置される。第２のランド電極２２は、角が丸い形状である。
PCT/JP2008/067749 2007-10-01 2008-09-30 電子部品 Ceased WO2009044737A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-257500 2007-10-01
JP2007257500 2007-10-01

Publications (1)

Publication Number Publication Date
WO2009044737A1 true WO2009044737A1 (ja) 2009-04-09

Family

ID=40526164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067749 Ceased WO2009044737A1 (ja) 2007-10-01 2008-09-30 電子部品

Country Status (1)

Country Link
WO (1) WO2009044737A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278133A (ja) * 2009-05-27 2010-12-09 Murata Mfg Co Ltd 回路基板
WO2012101978A1 (ja) * 2011-01-25 2012-08-02 株式会社村田製作所 電子部品
JP2013033821A (ja) * 2011-08-01 2013-02-14 Seiko Epson Corp 基板、電子デバイスおよび電子機器
WO2018155559A1 (ja) * 2017-02-22 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
WO2018155434A1 (ja) * 2017-02-21 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
JP2020123618A (ja) * 2019-01-29 2020-08-13 京セラ株式会社 回路基板、電子部品および電子モジュール
US11024572B2 (en) 2015-11-28 2021-06-01 Kyocera Corporation Wiring board, electronic device, and electronic module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265876U (ja) * 1985-10-14 1987-04-23
JP2001156204A (ja) * 1999-11-25 2001-06-08 Murata Mfg Co Ltd 表面実装部品
JP2003179175A (ja) * 2001-12-10 2003-06-27 Kyocera Corp 配線基板
JP2004281473A (ja) * 2003-03-12 2004-10-07 Kyocera Corp 配線基板
JP2005026312A (ja) * 2003-06-30 2005-01-27 Hitachi Metals Ltd 高周波電子部品およびその実装方法
WO2006114971A2 (ja) * 2005-04-18 2006-11-02 Murata Manufacturing Co 電子部品モジュール
WO2007060784A1 (ja) * 2005-11-28 2007-05-31 Murata Manufacturing Co., Ltd. 回路モジュールの製造方法および回路モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265876U (ja) * 1985-10-14 1987-04-23
JP2001156204A (ja) * 1999-11-25 2001-06-08 Murata Mfg Co Ltd 表面実装部品
JP2003179175A (ja) * 2001-12-10 2003-06-27 Kyocera Corp 配線基板
JP2004281473A (ja) * 2003-03-12 2004-10-07 Kyocera Corp 配線基板
JP2005026312A (ja) * 2003-06-30 2005-01-27 Hitachi Metals Ltd 高周波電子部品およびその実装方法
WO2006114971A2 (ja) * 2005-04-18 2006-11-02 Murata Manufacturing Co 電子部品モジュール
WO2007060784A1 (ja) * 2005-11-28 2007-05-31 Murata Manufacturing Co., Ltd. 回路モジュールの製造方法および回路モジュール

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278133A (ja) * 2009-05-27 2010-12-09 Murata Mfg Co Ltd 回路基板
WO2012101978A1 (ja) * 2011-01-25 2012-08-02 株式会社村田製作所 電子部品
JP5704177B2 (ja) * 2011-01-25 2015-04-22 株式会社村田製作所 電子部品
US9343844B2 (en) 2011-01-25 2016-05-17 Murata Manufacturing Co., Ltd. Electronic component
JP2013033821A (ja) * 2011-08-01 2013-02-14 Seiko Epson Corp 基板、電子デバイスおよび電子機器
US11024572B2 (en) 2015-11-28 2021-06-01 Kyocera Corporation Wiring board, electronic device, and electronic module
CN110326101A (zh) * 2017-02-21 2019-10-11 京瓷株式会社 布线基板、电子装置及电子模块
WO2018155434A1 (ja) * 2017-02-21 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
JPWO2018155434A1 (ja) * 2017-02-21 2019-11-21 京セラ株式会社 配線基板、電子装置および電子モジュール
US11024554B2 (en) 2017-02-21 2021-06-01 Kyocera Corporation Wiring substrate, electronic device, and electronic module
CN110326101B (zh) * 2017-02-21 2024-02-02 京瓷株式会社 布线基板、电子装置及电子模块
CN110291628A (zh) * 2017-02-22 2019-09-27 京瓷株式会社 布线基板、电子装置及电子模块
JPWO2018155559A1 (ja) * 2017-02-22 2020-01-09 京セラ株式会社 配線基板、電子装置および電子モジュール
US10937707B2 (en) 2017-02-22 2021-03-02 Kyocera Corporation Wiring substrate, electronic device, and electronic module
WO2018155559A1 (ja) * 2017-02-22 2018-08-30 京セラ株式会社 配線基板、電子装置および電子モジュール
JP2020123618A (ja) * 2019-01-29 2020-08-13 京セラ株式会社 回路基板、電子部品および電子モジュール
JP7433766B2 (ja) 2019-01-29 2024-02-20 京セラ株式会社 回路基板、電子部品および電子モジュール

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