[go: up one dir, main page]

WO2009044695A1 - 電子部品の実装方法等 - Google Patents

電子部品の実装方法等 Download PDF

Info

Publication number
WO2009044695A1
WO2009044695A1 PCT/JP2008/067621 JP2008067621W WO2009044695A1 WO 2009044695 A1 WO2009044695 A1 WO 2009044695A1 JP 2008067621 W JP2008067621 W JP 2008067621W WO 2009044695 A1 WO2009044695 A1 WO 2009044695A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
conductive adhesive
particles
substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067621
Other languages
English (en)
French (fr)
Inventor
Tomohiro Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009536036A priority Critical patent/JP5560713B2/ja
Publication of WO2009044695A1 publication Critical patent/WO2009044695A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/012—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/07233—
    • H10W72/07331—
    • H10W72/07336—
    • H10W72/07338—
    • H10W72/07341—
    • H10W72/074—
    • H10W72/20—
    • H10W72/29—
    • H10W72/325—
    • H10W72/352—
    • H10W72/932—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

　本発明は、電子部品の信頼性を損なう要因となる端子間ブリッジや未接合バンプや残留粒子の発生を抑制できる電子部品の実装方法に関する。 具体的には、第１の電子部品又は基板（１０）と第２の電子部品又は基板（２０）を導電性接着剤（３０）に含有されるはんだ粒子（３１）の凝集、一体化により相対する電極端子（１１），（２１）間をはんだ接合する電子部品の実装方法において、少なくともこれら電極端子（１１），（２１）いずれかの表面上に、電極端子からはり出した吸引膜（１０１）を形成する。この吸引膜（１０１）は、その融点を導電性接着剤中のはんだ粒子（３１）の融点より高く、導電性接着剤の樹脂成分（３２）の硬化温度より低いものとする。
PCT/JP2008/067621 2007-10-05 2008-09-29 電子部品の実装方法等 Ceased WO2009044695A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009536036A JP5560713B2 (ja) 2007-10-05 2008-09-29 電子部品の実装方法等

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007261596 2007-10-05
JP2007-261596 2007-10-05

Publications (1)

Publication Number Publication Date
WO2009044695A1 true WO2009044695A1 (ja) 2009-04-09

Family

ID=40526124

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067621 Ceased WO2009044695A1 (ja) 2007-10-05 2008-09-29 電子部品の実装方法等

Country Status (2)

Country Link
JP (1) JP5560713B2 (ja)
WO (1) WO2009044695A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102456658A (zh) * 2010-10-20 2012-05-16 三星电子株式会社 半导体封装件及其制造方法
WO2015154236A1 (en) * 2014-04-09 2015-10-15 GM Global Technology Operations LLC Systems and methods for reinforced adhesive bonding
JP2016178177A (ja) * 2015-03-19 2016-10-06 新光電気工業株式会社 配線基板及び電子部品装置と電子部品装置の製造方法
CN113130457A (zh) * 2019-12-31 2021-07-16 Tcl集团股份有限公司 光源板及其制备方法和显示器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260131A (ja) * 2003-02-05 2004-09-16 Japan Science & Technology Agency 端子間の接続方法及び半導体装置の実装方法
WO2006098196A1 (ja) * 2005-03-17 2006-09-21 Matsushita Electric Industrial Co., Ltd. 半導体チップを備えた実装体およびその製造方法
JP2008078238A (ja) * 2006-09-19 2008-04-03 Nec Corp 電子部品の実装構造及び電子部品の実装方法
WO2008075537A1 (ja) * 2006-12-18 2008-06-26 Panasonic Corporation 電極構造体およびバンプ形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
JPH10308413A (ja) * 1997-05-07 1998-11-17 Casio Comput Co Ltd 電子部品及び電子部品搭載モジュール
JPH10313167A (ja) * 1997-05-12 1998-11-24 Canon Inc 配線基板
JP2000271782A (ja) * 1999-03-24 2000-10-03 Matsushita Electric Ind Co Ltd 半田接合用の金属ペーストおよび半田接合方法
JP2006245189A (ja) * 2005-03-02 2006-09-14 Matsushita Electric Ind Co Ltd 半導体素子のフリップチップ実装方法及び実装構造体
CN100533701C (zh) * 2005-03-16 2009-08-26 松下电器产业株式会社 使用了导电性粒子的倒装片安装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260131A (ja) * 2003-02-05 2004-09-16 Japan Science & Technology Agency 端子間の接続方法及び半導体装置の実装方法
WO2006098196A1 (ja) * 2005-03-17 2006-09-21 Matsushita Electric Industrial Co., Ltd. 半導体チップを備えた実装体およびその製造方法
JP2008078238A (ja) * 2006-09-19 2008-04-03 Nec Corp 電子部品の実装構造及び電子部品の実装方法
WO2008075537A1 (ja) * 2006-12-18 2008-06-26 Panasonic Corporation 電極構造体およびバンプ形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102456658A (zh) * 2010-10-20 2012-05-16 三星电子株式会社 半导体封装件及其制造方法
WO2015154236A1 (en) * 2014-04-09 2015-10-15 GM Global Technology Operations LLC Systems and methods for reinforced adhesive bonding
JP2016178177A (ja) * 2015-03-19 2016-10-06 新光電気工業株式会社 配線基板及び電子部品装置と電子部品装置の製造方法
CN113130457A (zh) * 2019-12-31 2021-07-16 Tcl集团股份有限公司 光源板及其制备方法和显示器

Also Published As

Publication number Publication date
JPWO2009044695A1 (ja) 2011-02-10
JP5560713B2 (ja) 2014-07-30

Similar Documents

Publication Publication Date Title
WO2009004902A1 (ja) 異方性導電膜及びその製造方法、並びに接合体
JP4135565B2 (ja) 電子回路装置およびその製造方法
WO2009044801A1 (ja) 接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置
US20090108445A1 (en) Substrate structure and semiconductor package using the same
WO2009016906A1 (ja) 弾性波装置及びその製造方法
EP1643818A4 (en) MODULE AND METHOD FOR ITS MANUFACTURE
WO2009037964A1 (ja) 異方性導電膜及びその製造方法、並びに、該異方性導電膜を用いた接合体
WO2009057332A1 (ja) 回路接続方法
CN101615649A (zh) 光半导体装置
CN110402492B (zh) 柔性导电粘合
TW200843583A (en) Printed circuit board and method of producing the same
CN102270589B (zh) 半导体元件的制造方法和相应的半导体元件
TW200634915A (en) Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
EP2048109A3 (en) Electronic device, electronic module, and methods for manufacturing the same
WO2007098306A3 (en) Cap layer for an aluminum copper bond pad
TW200626036A (en) Packaging method of electronic device
WO2009044695A1 (ja) 電子部品の実装方法等
TW200610205A (en) Organic semiconductor device and manufacturing method thereof
US8409932B2 (en) Method for manufacturing semiconductor device
WO2008078478A1 (ja) 導電性バンプとその形成方法および半導体装置とその製造方法
WO2008120564A1 (ja) 電子部品の実装構造、及び電子部品の実装方法
WO2009031586A1 (ja) 回路基板及び回路基板の製造方法
WO2005112113A3 (en) Mounting with auxiliary bumps
JP5114773B2 (ja) 表面実装型発光装置
TW200721930A (en) Method of mounting electronic components

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08835675

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009536036

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08835675

Country of ref document: EP

Kind code of ref document: A1