WO2008136351A1 - 熱硬化性樹脂組成物及びその硬化物を用いた光学部材 - Google Patents
熱硬化性樹脂組成物及びその硬化物を用いた光学部材 Download PDFInfo
- Publication number
- WO2008136351A1 WO2008136351A1 PCT/JP2008/057932 JP2008057932W WO2008136351A1 WO 2008136351 A1 WO2008136351 A1 WO 2008136351A1 JP 2008057932 W JP2008057932 W JP 2008057932W WO 2008136351 A1 WO2008136351 A1 WO 2008136351A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- thermosetting resin
- cured product
- optical member
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1545—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009512953A JPWO2008136351A1 (ja) | 2007-04-26 | 2008-04-24 | 熱硬化性樹脂組成物及びその硬化物を用いた光学部材 |
| EP08752031A EP2141203A4 (en) | 2007-04-26 | 2008-04-24 | THERMOSETTING RESIN COMPOSITION AND OPTICAL ELEMENT USING A CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION |
| US12/597,531 US20100160587A1 (en) | 2007-04-26 | 2008-04-24 | Thermosetting resin composition and optical member using cured product of the thermosetting resin composition |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007116784 | 2007-04-26 | ||
| JP2007-116784 | 2007-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008136351A1 true WO2008136351A1 (ja) | 2008-11-13 |
Family
ID=39943462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/057932 Ceased WO2008136351A1 (ja) | 2007-04-26 | 2008-04-24 | 熱硬化性樹脂組成物及びその硬化物を用いた光学部材 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100160587A1 (ja) |
| EP (1) | EP2141203A4 (ja) |
| JP (1) | JPWO2008136351A1 (ja) |
| KR (1) | KR20090130193A (ja) |
| CN (1) | CN101668816A (ja) |
| TW (1) | TW200911925A (ja) |
| WO (1) | WO2008136351A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009046616A (ja) * | 2007-08-21 | 2009-03-05 | Kaneka Corp | SiH基を有する化合物の製造方法および硬化性組成物 |
| JP2018145374A (ja) * | 2017-03-09 | 2018-09-20 | 日立化成株式会社 | 熱硬化性樹脂組成物の製造方法、光半導体素子搭載用基板の製造方法、光半導体装置の製造方法及び熱硬化性樹脂組成物 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102245654A (zh) * | 2008-12-09 | 2011-11-16 | 出光兴产株式会社 | 光学部件用树脂原料组合物、光学部件用树脂和光学部件 |
| JP2013525955A (ja) | 2010-04-16 | 2013-06-20 | フレックス ライティング 2,エルエルシー | フィルムベースのライトガイドを備える照明デバイス |
| US9028123B2 (en) | 2010-04-16 | 2015-05-12 | Flex Lighting Ii, Llc | Display illumination device with a film-based lightguide having stacked incident surfaces |
| CN103515367B (zh) * | 2012-06-25 | 2016-10-05 | 青岛玉兰祥商务服务有限公司 | 发光二极管封装结构 |
| CN105754318B (zh) * | 2014-12-19 | 2019-02-19 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其应用 |
| CN108300408B (zh) * | 2017-12-21 | 2020-09-04 | 宁波凯耀电器制造有限公司 | 一种高光通维持率led封装用有机硅材料 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08134220A (ja) * | 1994-11-02 | 1996-05-28 | Kanegafuchi Chem Ind Co Ltd | 射出成形用硬化性組成物 |
| JPH08157604A (ja) * | 1994-12-09 | 1996-06-18 | Kanegafuchi Chem Ind Co Ltd | 硬化剤の貯蔵安定性改善方法 |
| WO1999024509A1 (en) * | 1997-11-06 | 1999-05-20 | Kaneka Corporation | Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same |
| JP2002241501A (ja) * | 2001-02-15 | 2002-08-28 | Kanegafuchi Chem Ind Co Ltd | 硬化剤、硬化性組成物および硬化物 |
| JP2002317048A (ja) * | 2001-02-14 | 2002-10-31 | Kanegafuchi Chem Ind Co Ltd | 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びled |
| JP2006335718A (ja) * | 2005-06-03 | 2006-12-14 | Kaneka Corp | SiH基含有化合物の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1029888A4 (en) * | 1997-11-06 | 2001-07-04 | Kaneka Corp | FOAMABLE RESIN COMPOSITION AND METHOD FOR PRODUCING FOAM |
| EP1369458B1 (en) * | 2000-12-27 | 2011-06-29 | Kaneka Corporation | Curing agents, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and led's made by using the materials |
-
2008
- 2008-04-24 WO PCT/JP2008/057932 patent/WO2008136351A1/ja not_active Ceased
- 2008-04-24 KR KR1020097022213A patent/KR20090130193A/ko not_active Ceased
- 2008-04-24 CN CN200880013356A patent/CN101668816A/zh active Pending
- 2008-04-24 JP JP2009512953A patent/JPWO2008136351A1/ja active Pending
- 2008-04-24 EP EP08752031A patent/EP2141203A4/en not_active Withdrawn
- 2008-04-24 US US12/597,531 patent/US20100160587A1/en not_active Abandoned
- 2008-04-25 TW TW097115353A patent/TW200911925A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08134220A (ja) * | 1994-11-02 | 1996-05-28 | Kanegafuchi Chem Ind Co Ltd | 射出成形用硬化性組成物 |
| JPH08157604A (ja) * | 1994-12-09 | 1996-06-18 | Kanegafuchi Chem Ind Co Ltd | 硬化剤の貯蔵安定性改善方法 |
| WO1999024509A1 (en) * | 1997-11-06 | 1999-05-20 | Kaneka Corporation | Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same |
| JP2002317048A (ja) * | 2001-02-14 | 2002-10-31 | Kanegafuchi Chem Ind Co Ltd | 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びled |
| JP2002241501A (ja) * | 2001-02-15 | 2002-08-28 | Kanegafuchi Chem Ind Co Ltd | 硬化剤、硬化性組成物および硬化物 |
| JP2006335718A (ja) * | 2005-06-03 | 2006-12-14 | Kaneka Corp | SiH基含有化合物の製造方法 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2141203A4 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009046616A (ja) * | 2007-08-21 | 2009-03-05 | Kaneka Corp | SiH基を有する化合物の製造方法および硬化性組成物 |
| JP2018145374A (ja) * | 2017-03-09 | 2018-09-20 | 日立化成株式会社 | 熱硬化性樹脂組成物の製造方法、光半導体素子搭載用基板の製造方法、光半導体装置の製造方法及び熱硬化性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100160587A1 (en) | 2010-06-24 |
| KR20090130193A (ko) | 2009-12-18 |
| EP2141203A1 (en) | 2010-01-06 |
| TW200911925A (en) | 2009-03-16 |
| JPWO2008136351A1 (ja) | 2010-07-29 |
| CN101668816A (zh) | 2010-03-10 |
| EP2141203A4 (en) | 2010-09-22 |
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