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WO2008136351A1 - 熱硬化性樹脂組成物及びその硬化物を用いた光学部材 - Google Patents

熱硬化性樹脂組成物及びその硬化物を用いた光学部材 Download PDF

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Publication number
WO2008136351A1
WO2008136351A1 PCT/JP2008/057932 JP2008057932W WO2008136351A1 WO 2008136351 A1 WO2008136351 A1 WO 2008136351A1 JP 2008057932 W JP2008057932 W JP 2008057932W WO 2008136351 A1 WO2008136351 A1 WO 2008136351A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
thermosetting resin
cured product
optical member
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057932
Other languages
English (en)
French (fr)
Inventor
Akihiro Yoshida
Takeo Tomiyama
Shingo Kobayashi
Shouko Tanaka
Minoru Suzuki
Masaru Shiina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009512953A priority Critical patent/JPWO2008136351A1/ja
Priority to EP08752031A priority patent/EP2141203A4/en
Priority to US12/597,531 priority patent/US20100160587A1/en
Publication of WO2008136351A1 publication Critical patent/WO2008136351A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5435Silicon-containing compounds containing oxygen containing oxygen in a ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1545Six-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)

Abstract

 本発明の熱硬化性樹脂組成物は、(A)炭素数が2以上の有機基及びヒドロシリル基を含む化合物と、(B)炭素-炭素二重結合を含む化合物と、(C)ヒドロシリル化触媒と、を含有し、25°Cで液体であるものである。
PCT/JP2008/057932 2007-04-26 2008-04-24 熱硬化性樹脂組成物及びその硬化物を用いた光学部材 Ceased WO2008136351A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009512953A JPWO2008136351A1 (ja) 2007-04-26 2008-04-24 熱硬化性樹脂組成物及びその硬化物を用いた光学部材
EP08752031A EP2141203A4 (en) 2007-04-26 2008-04-24 THERMOSETTING RESIN COMPOSITION AND OPTICAL ELEMENT USING A CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION
US12/597,531 US20100160587A1 (en) 2007-04-26 2008-04-24 Thermosetting resin composition and optical member using cured product of the thermosetting resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007116784 2007-04-26
JP2007-116784 2007-04-26

Publications (1)

Publication Number Publication Date
WO2008136351A1 true WO2008136351A1 (ja) 2008-11-13

Family

ID=39943462

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057932 Ceased WO2008136351A1 (ja) 2007-04-26 2008-04-24 熱硬化性樹脂組成物及びその硬化物を用いた光学部材

Country Status (7)

Country Link
US (1) US20100160587A1 (ja)
EP (1) EP2141203A4 (ja)
JP (1) JPWO2008136351A1 (ja)
KR (1) KR20090130193A (ja)
CN (1) CN101668816A (ja)
TW (1) TW200911925A (ja)
WO (1) WO2008136351A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009046616A (ja) * 2007-08-21 2009-03-05 Kaneka Corp SiH基を有する化合物の製造方法および硬化性組成物
JP2018145374A (ja) * 2017-03-09 2018-09-20 日立化成株式会社 熱硬化性樹脂組成物の製造方法、光半導体素子搭載用基板の製造方法、光半導体装置の製造方法及び熱硬化性樹脂組成物

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102245654A (zh) * 2008-12-09 2011-11-16 出光兴产株式会社 光学部件用树脂原料组合物、光学部件用树脂和光学部件
JP2013525955A (ja) 2010-04-16 2013-06-20 フレックス ライティング 2,エルエルシー フィルムベースのライトガイドを備える照明デバイス
US9028123B2 (en) 2010-04-16 2015-05-12 Flex Lighting Ii, Llc Display illumination device with a film-based lightguide having stacked incident surfaces
CN103515367B (zh) * 2012-06-25 2016-10-05 青岛玉兰祥商务服务有限公司 发光二极管封装结构
CN105754318B (zh) * 2014-12-19 2019-02-19 广东生益科技股份有限公司 一种热固性树脂组合物及其应用
CN108300408B (zh) * 2017-12-21 2020-09-04 宁波凯耀电器制造有限公司 一种高光通维持率led封装用有机硅材料

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134220A (ja) * 1994-11-02 1996-05-28 Kanegafuchi Chem Ind Co Ltd 射出成形用硬化性組成物
JPH08157604A (ja) * 1994-12-09 1996-06-18 Kanegafuchi Chem Ind Co Ltd 硬化剤の貯蔵安定性改善方法
WO1999024509A1 (en) * 1997-11-06 1999-05-20 Kaneka Corporation Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same
JP2002241501A (ja) * 2001-02-15 2002-08-28 Kanegafuchi Chem Ind Co Ltd 硬化剤、硬化性組成物および硬化物
JP2002317048A (ja) * 2001-02-14 2002-10-31 Kanegafuchi Chem Ind Co Ltd 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びled
JP2006335718A (ja) * 2005-06-03 2006-12-14 Kaneka Corp SiH基含有化合物の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1029888A4 (en) * 1997-11-06 2001-07-04 Kaneka Corp FOAMABLE RESIN COMPOSITION AND METHOD FOR PRODUCING FOAM
EP1369458B1 (en) * 2000-12-27 2011-06-29 Kaneka Corporation Curing agents, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and led's made by using the materials

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134220A (ja) * 1994-11-02 1996-05-28 Kanegafuchi Chem Ind Co Ltd 射出成形用硬化性組成物
JPH08157604A (ja) * 1994-12-09 1996-06-18 Kanegafuchi Chem Ind Co Ltd 硬化剤の貯蔵安定性改善方法
WO1999024509A1 (en) * 1997-11-06 1999-05-20 Kaneka Corporation Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same
JP2002317048A (ja) * 2001-02-14 2002-10-31 Kanegafuchi Chem Ind Co Ltd 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びled
JP2002241501A (ja) * 2001-02-15 2002-08-28 Kanegafuchi Chem Ind Co Ltd 硬化剤、硬化性組成物および硬化物
JP2006335718A (ja) * 2005-06-03 2006-12-14 Kaneka Corp SiH基含有化合物の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2141203A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009046616A (ja) * 2007-08-21 2009-03-05 Kaneka Corp SiH基を有する化合物の製造方法および硬化性組成物
JP2018145374A (ja) * 2017-03-09 2018-09-20 日立化成株式会社 熱硬化性樹脂組成物の製造方法、光半導体素子搭載用基板の製造方法、光半導体装置の製造方法及び熱硬化性樹脂組成物

Also Published As

Publication number Publication date
US20100160587A1 (en) 2010-06-24
KR20090130193A (ko) 2009-12-18
EP2141203A1 (en) 2010-01-06
TW200911925A (en) 2009-03-16
JPWO2008136351A1 (ja) 2010-07-29
CN101668816A (zh) 2010-03-10
EP2141203A4 (en) 2010-09-22

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