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WO2008133293A1 - 接着シート - Google Patents

接着シート Download PDF

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Publication number
WO2008133293A1
WO2008133293A1 PCT/JP2008/057909 JP2008057909W WO2008133293A1 WO 2008133293 A1 WO2008133293 A1 WO 2008133293A1 JP 2008057909 W JP2008057909 W JP 2008057909W WO 2008133293 A1 WO2008133293 A1 WO 2008133293A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
base
resin layer
adhesive resin
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057909
Other languages
English (en)
French (fr)
Inventor
Yoshitsugu Matsuura
Kazuhito Obata
Masaki Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN200880011737.6A priority Critical patent/CN101657512B/zh
Priority to US12/597,197 priority patent/US20100196703A1/en
Priority to KR1020097018745A priority patent/KR101108639B1/ko
Priority to JP2009511898A priority patent/JPWO2008133293A1/ja
Publication of WO2008133293A1 publication Critical patent/WO2008133293A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　基材３と、該基材３の一方の面上に形成された接着樹脂層４と、を備え、上記接着樹脂層４は、ガラス転移温度が１７０～２００°Cであり、且つ、硬化後の弾性率が１００～５００ＭＰａである層である、接着シート。
PCT/JP2008/057909 2007-04-25 2008-04-24 接着シート Ceased WO2008133293A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880011737.6A CN101657512B (zh) 2007-04-25 2008-04-24 粘接片
US12/597,197 US20100196703A1 (en) 2007-04-25 2008-04-24 Adhesive sheet
KR1020097018745A KR101108639B1 (ko) 2007-04-25 2008-04-24 접착시트
JP2009511898A JPWO2008133293A1 (ja) 2007-04-25 2008-04-24 接着シート

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007115470 2007-04-25
JP2007-115470 2007-04-25
JP2007247785 2007-09-25
JP2007-247785 2007-09-25

Publications (1)

Publication Number Publication Date
WO2008133293A1 true WO2008133293A1 (ja) 2008-11-06

Family

ID=39925741

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057909 Ceased WO2008133293A1 (ja) 2007-04-25 2008-04-24 接着シート

Country Status (6)

Country Link
US (1) US20100196703A1 (ja)
JP (2) JPWO2008133293A1 (ja)
KR (1) KR101108639B1 (ja)
CN (1) CN101657512B (ja)
TW (2) TWI423740B (ja)
WO (1) WO2008133293A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013038315A (ja) * 2011-08-10 2013-02-21 Ajinomoto Co Inc 半導体パッケージの製造方法
JP2018125378A (ja) * 2017-01-31 2018-08-09 太陽インキ製造株式会社 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法
JP2019161101A (ja) * 2018-03-15 2019-09-19 タツタ電線株式会社 電磁波シールドフィルム及びシールドプリント配線板
JP2019216234A (ja) * 2019-03-01 2019-12-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、部品搭載基板、および電子機器
JP2019216156A (ja) * 2018-06-12 2019-12-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、部品搭載基板、および電子機器

Families Citing this family (16)

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JP5348473B2 (ja) * 2009-01-20 2013-11-20 ソニー株式会社 液晶表示装置および電子機器
JP5874289B2 (ja) * 2011-10-07 2016-03-02 ブラザー工業株式会社 テープカセット及びテープ印字装置
KR20140140061A (ko) * 2012-04-02 2014-12-08 다우 글로벌 테크놀로지스 엘엘씨 에폭시 접착제, 그의 제조 및 용도
DE102015211852A1 (de) * 2015-06-25 2016-12-29 Schaeffler Technologies AG & Co. KG Multilayer-Platine und Verfahren zu deren Herstellung
JP6502824B2 (ja) * 2015-10-19 2019-04-17 信越化学工業株式会社 ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
WO2017099172A1 (ja) * 2015-12-09 2017-06-15 東レ株式会社 樹脂、スラリーおよびそれらを用いた積層体とその製造方法
TWI613939B (zh) * 2016-06-23 2018-02-01 Pomiran Metalization Research Co Ltd 金屬化軟性基板及使用該基板之多層電路板製造方法
FR3059151B1 (fr) * 2016-11-21 2018-12-07 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit electronique et son procede de fabrication
CN110050036A (zh) * 2016-12-09 2019-07-23 日立化成株式会社 组合物、粘接剂、烧结体、接合体和接合体的制造方法
US10605785B2 (en) * 2017-06-07 2020-03-31 General Electric Company Sensor system and method
JP7072860B2 (ja) * 2017-09-19 2022-05-23 賢三 有山 ジグソーパズルとその製造方法
CN107764736A (zh) * 2017-10-18 2018-03-06 广东生益科技股份有限公司 多层板的粗化效果评估方法
JP6994926B2 (ja) * 2017-12-19 2022-01-14 三菱電機株式会社 回転電機のロータの製造方法及びスリーブ接着装置
JP7424868B2 (ja) * 2020-03-06 2024-01-30 日本航空電子工業株式会社 電気接続部材を生産する方法及び配線構造
JP7552786B2 (ja) * 2020-09-23 2024-09-18 味の素株式会社 配線板及び半導体装置
TWI831200B (zh) * 2022-05-11 2024-02-01 欣興電子股份有限公司 製造電路板的方法及堆疊結構

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JPH10330696A (ja) * 1997-05-28 1998-12-15 Hitachi Chem Co Ltd 多層配線板用接着フィルム
JPH11217503A (ja) * 1997-11-28 1999-08-10 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた接着フィルム
JPH11263912A (ja) * 1998-03-17 1999-09-28 Hitachi Chem Co Ltd 耐熱性難燃樹脂組成物及びそれを用いた接着フィルム、接着剤付金属箔
JP2001123060A (ja) * 1999-10-28 2001-05-08 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JP2001152015A (ja) * 1999-11-29 2001-06-05 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた接着フィルム
JP2002146325A (ja) * 2000-11-16 2002-05-22 Hitachi Chem Co Ltd 接着剤組成物とそれを用いた接着部材と半導体搭載用基板と半導体装置
JP2004051910A (ja) * 2002-07-24 2004-02-19 Hitachi Chem Co Ltd 樹脂フィルム及び金属張り積層板
JP2004182792A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd ポリアミドイミド樹脂及びそれを用いた接着剤組成物
JP2005244150A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2007051226A (ja) * 2005-08-18 2007-03-01 Ajinomoto Co Inc 低誘電率樹脂組成物

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JP3994298B2 (ja) * 1998-03-20 2007-10-17 日立化成工業株式会社 フレキシブル配線板
US6492030B1 (en) * 1999-02-03 2002-12-10 Tomoegawa Paper Co., Ltd. Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same
JP2003138241A (ja) * 2001-08-21 2003-05-14 Hitachi Chem Co Ltd 耐熱性接着剤並びにこの接着剤を用いた積層物、接着剤付き放熱板、接着剤付金属箔
JP4075581B2 (ja) * 2002-11-21 2008-04-16 日立化成工業株式会社 接着剤層付きプリプレグ、金属張積層板の製造方法及び金属張積層板
JP2004256631A (ja) * 2003-02-25 2004-09-16 Hitachi Chem Co Ltd 接着剤組成物及び接着フィルム
EP1627901B1 (en) * 2003-05-21 2020-02-19 Hitachi Chemical Co., Ltd. Primer, conductor foil with resin, laminate and process for producing the laminate
JP2006066894A (ja) * 2004-07-28 2006-03-09 Hitachi Chem Co Ltd 印刷回路板

Patent Citations (10)

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Publication number Priority date Publication date Assignee Title
JPH10330696A (ja) * 1997-05-28 1998-12-15 Hitachi Chem Co Ltd 多層配線板用接着フィルム
JPH11217503A (ja) * 1997-11-28 1999-08-10 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた接着フィルム
JPH11263912A (ja) * 1998-03-17 1999-09-28 Hitachi Chem Co Ltd 耐熱性難燃樹脂組成物及びそれを用いた接着フィルム、接着剤付金属箔
JP2001123060A (ja) * 1999-10-28 2001-05-08 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JP2001152015A (ja) * 1999-11-29 2001-06-05 Hitachi Chem Co Ltd 耐熱性樹脂組成物及びそれを用いた接着フィルム
JP2002146325A (ja) * 2000-11-16 2002-05-22 Hitachi Chem Co Ltd 接着剤組成物とそれを用いた接着部材と半導体搭載用基板と半導体装置
JP2004051910A (ja) * 2002-07-24 2004-02-19 Hitachi Chem Co Ltd 樹脂フィルム及び金属張り積層板
JP2004182792A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd ポリアミドイミド樹脂及びそれを用いた接着剤組成物
JP2005244150A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2007051226A (ja) * 2005-08-18 2007-03-01 Ajinomoto Co Inc 低誘電率樹脂組成物

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JP2013038315A (ja) * 2011-08-10 2013-02-21 Ajinomoto Co Inc 半導体パッケージの製造方法
JP2018125378A (ja) * 2017-01-31 2018-08-09 太陽インキ製造株式会社 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法
WO2018142827A1 (ja) * 2017-01-31 2018-08-09 太陽インキ製造株式会社 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法
JP2019161101A (ja) * 2018-03-15 2019-09-19 タツタ電線株式会社 電磁波シールドフィルム及びシールドプリント配線板
JP2019216156A (ja) * 2018-06-12 2019-12-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、部品搭載基板、および電子機器
US11990420B2 (en) 2018-06-12 2024-05-21 Artience Co., Ltd. Electromagnetic wave shielding sheet
JP2019216234A (ja) * 2019-03-01 2019-12-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、部品搭載基板、および電子機器
JP7099365B2 (ja) 2019-03-01 2022-07-12 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、部品搭載基板、および電子機器

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US20100196703A1 (en) 2010-08-05
TWI423740B (zh) 2014-01-11
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TW200908822A (en) 2009-02-16
JP5751284B2 (ja) 2015-07-22
TWI430882B (zh) 2014-03-21
JP2013237846A (ja) 2013-11-28
CN101657512A (zh) 2010-02-24
TW201242765A (en) 2012-11-01
KR101108639B1 (ko) 2012-01-31
CN101657512B (zh) 2014-05-28

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