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WO2009034774A1 - ウエハ加工用テープ - Google Patents

ウエハ加工用テープ Download PDF

Info

Publication number
WO2009034774A1
WO2009034774A1 PCT/JP2008/062784 JP2008062784W WO2009034774A1 WO 2009034774 A1 WO2009034774 A1 WO 2009034774A1 JP 2008062784 W JP2008062784 W JP 2008062784W WO 2009034774 A1 WO2009034774 A1 WO 2009034774A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold release
release film
wafer processing
processing tape
supporting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062784
Other languages
English (en)
French (fr)
Inventor
Hiromitsu Maruyama
Shuzo Taguchi
Noboru Sakuma
Yasumasa Morishima
Shinichi Ishiwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008068670A external-priority patent/JP2009224628A/ja
Priority claimed from JP2008172022A external-priority patent/JP4360653B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to US12/675,593 priority Critical patent/US9324592B2/en
Priority to CN2008800012887A priority patent/CN101569002B/zh
Priority to AT08791179T priority patent/ATE554500T1/de
Priority to KR1020107003743A priority patent/KR101161941B1/ko
Priority to EP08791179A priority patent/EP2192611B9/en
Publication of WO2009034774A1 publication Critical patent/WO2009034774A1/ja
Anticipated expiration legal-status Critical
Priority to US13/342,535 priority patent/US9324593B2/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • H10P72/0442—
    • H10P72/7402—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H10P72/7416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1467—Coloring agent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　本発明のウエハ加工用テープ（１０）は、長尺の離型フィルム（１１）と；離型フィルム（１１）の第１の面（１１ａ）上に設けられた平面形状を有する接着剤層（１２）と；平面形状を有するラベル部（１３ａ）とラベル部（１３ａ）の外側を囲むような周辺部（１３ｂ）とを有する粘着フィルムと；離型フィルム（１１）の第１の面（１１ａ）とは反対の第２の面（１１ｂ）であって、且つ、離型フィルム（１１）の短手方向両端部に設けられた支持部材（１４）とを有し、支持部材（１４）の線膨張係数が３００ｐｐｍ／℃以下である。
PCT/JP2008/062784 2007-09-14 2008-07-16 ウエハ加工用テープ Ceased WO2009034774A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/675,593 US9324592B2 (en) 2007-09-14 2008-07-16 Wafer processing tape
CN2008800012887A CN101569002B (zh) 2007-09-14 2008-07-16 晶片加工用带
AT08791179T ATE554500T1 (de) 2007-09-14 2008-07-16 Wafer-verarbeitungsband
KR1020107003743A KR101161941B1 (ko) 2007-09-14 2008-07-16 웨이퍼 가공용 테이프
EP08791179A EP2192611B9 (en) 2007-09-14 2008-07-16 Wafer processing tape
US13/342,535 US9324593B2 (en) 2007-09-14 2012-01-03 Wafer processing tape

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-238865 2007-09-14
JP2007238865 2007-09-14
JP2008068670A JP2009224628A (ja) 2008-03-18 2008-03-18 ウエハ加工用テープ
JP2008-068670 2008-03-18
JP2008-172022 2008-07-01
JP2008172022A JP4360653B2 (ja) 2007-09-14 2008-07-01 ウエハ加工用テープ

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/675,593 A-371-Of-International US9324592B2 (en) 2007-09-14 2008-07-16 Wafer processing tape
US13/342,535 Division US9324593B2 (en) 2007-09-14 2012-01-03 Wafer processing tape

Publications (1)

Publication Number Publication Date
WO2009034774A1 true WO2009034774A1 (ja) 2009-03-19

Family

ID=42126069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062784 Ceased WO2009034774A1 (ja) 2007-09-14 2008-07-16 ウエハ加工用テープ

Country Status (9)

Country Link
US (2) US9324592B2 (ja)
EP (2) EP2261967A3 (ja)
KR (2) KR101161941B1 (ja)
CN (2) CN102093828A (ja)
AT (1) ATE554500T1 (ja)
MY (1) MY153006A (ja)
SG (1) SG170115A1 (ja)
TW (1) TWI320799B (ja)
WO (1) WO2009034774A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013006929A (ja) * 2011-06-23 2013-01-10 Hitachi Chemical Co Ltd 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456440B2 (ja) * 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
KR101019756B1 (ko) * 2009-12-24 2011-03-09 제일모직주식회사 비자외선형 다이접착필름 및 제조방법
CN102157422A (zh) * 2010-02-12 2011-08-17 古河电气工业株式会社 卷芯及卷绕于卷芯的晶片加工用带
CN102250555B (zh) * 2010-05-17 2015-04-01 古河电气工业株式会社 晶片加工用带
JP5641641B2 (ja) 2010-07-29 2014-12-17 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法
EP2671249A4 (en) 2011-02-01 2015-10-07 Henkel IP & Holding GmbH UNDERLYING FILM APPLIED ON A PRECEDED WAFER
EP2671248A4 (en) * 2011-02-01 2015-10-07 Henkel Corp ON A PRECUTED WAFER APPLIED FILM ON A DICING TAPE
JP5036887B1 (ja) * 2011-03-11 2012-09-26 日東電工株式会社 保護フィルム付きダイシングフィルム
US10160891B2 (en) 2012-02-08 2018-12-25 Honeywell International Inc. High performance water-based tackified acrylic pressure sensitive adhesives
US10167416B2 (en) 2012-02-08 2019-01-01 Honeywell International Inc. High performance water-based adhesion compositions and applications
CN103305142B (zh) * 2012-03-07 2016-01-20 古河电气工业株式会社 粘接带
JP5158906B1 (ja) 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
JP5158907B1 (ja) 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
JP2014007344A (ja) * 2012-06-26 2014-01-16 Disco Abrasive Syst Ltd 収容カセット
US8912075B1 (en) * 2014-04-29 2014-12-16 Applied Materials, Inc. Wafer edge warp supression for thin wafer supported by tape frame
JP6410582B2 (ja) * 2014-12-04 2018-10-24 古河電気工業株式会社 ウエハ加工用テープ
JP6362526B2 (ja) * 2014-12-04 2018-07-25 古河電気工業株式会社 ウエハ加工用テープ
JP6406999B2 (ja) * 2014-12-04 2018-10-17 古河電気工業株式会社 ウェハ加工用テープ
JP2016111156A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP6382088B2 (ja) * 2014-12-04 2018-08-29 古河電気工業株式会社 ウェハ加工用テープ
JP2016111163A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウエハ加工用テープ
KR102233439B1 (ko) * 2016-03-02 2021-03-30 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 테이프
JP6723644B2 (ja) * 2016-05-16 2020-07-15 株式会社ディスコ エキスパンドシート
US12552975B2 (en) 2020-03-06 2026-02-17 Tredegar Surface Protection, Llc Carrier film for semi-conductor wafer processing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948511U (ja) * 1982-09-25 1984-03-31 日東電工株式会社 ロ−ル状粘着偏光板の構造
JPH11109131A (ja) * 1997-10-02 1999-04-23 Nippon Synthetic Chem Ind Co Ltd:The 積層体の保管方法
JP2004331869A (ja) * 2003-05-09 2004-11-25 Lintec Corp 積層シートの巻取体およびその製造方法
JP2007002173A (ja) * 2005-06-27 2007-01-11 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置

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JPH04170488A (ja) * 1990-11-02 1992-06-18 Nec Kyushu Ltd 半導体装置製造用粘着テープ
US5538771A (en) * 1991-06-28 1996-07-23 Furukawa Electric Co., Ltd. Semiconductor wafer-securing adhesive tape
DE4421485A1 (de) * 1994-06-20 1995-12-21 Hildebrandt Spulen Bobbins Gmb Kodiereinrichtung
JP2000203765A (ja) * 1999-01-13 2000-07-25 Fuji Photo Film Co Ltd 情報記録紙ロ―ル及び情報記録紙の識別方法
JP2000221888A (ja) * 1999-01-29 2000-08-11 Nitto Denko Corp 半導体ウエハ用粘着ラベルシート
TW200401237A (en) * 2002-07-05 2004-01-16 Lintec Corp Laminate sheet, laminate sheet roll, and producing methods therefor
JP4087169B2 (ja) 2002-07-05 2008-05-21 リンテック株式会社 積層シートおよびその製造方法
US20050133973A1 (en) * 2003-12-22 2005-06-23 Lear Corporation Vehicle floor covering and method of making the same
JP4275522B2 (ja) * 2003-12-26 2009-06-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2005350520A (ja) 2004-06-08 2005-12-22 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP4405323B2 (ja) 2004-06-21 2010-01-27 リンテック株式会社 積層シートおよびその製造方法
JP4614126B2 (ja) 2005-02-21 2011-01-19 リンテック株式会社 積層シート、積層シートの巻取体およびそれらの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948511U (ja) * 1982-09-25 1984-03-31 日東電工株式会社 ロ−ル状粘着偏光板の構造
JPH11109131A (ja) * 1997-10-02 1999-04-23 Nippon Synthetic Chem Ind Co Ltd:The 積層体の保管方法
JP2004331869A (ja) * 2003-05-09 2004-11-25 Lintec Corp 積層シートの巻取体およびその製造方法
JP2007002173A (ja) * 2005-06-27 2007-01-11 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013006929A (ja) * 2011-06-23 2013-01-10 Hitachi Chemical Co Ltd 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置

Also Published As

Publication number Publication date
TW200911955A (en) 2009-03-16
US9324593B2 (en) 2016-04-26
ATE554500T1 (de) 2012-05-15
EP2261967A2 (en) 2010-12-15
CN101569002B (zh) 2012-03-28
CN101569002A (zh) 2009-10-28
EP2192611B1 (en) 2012-04-18
KR20100033469A (ko) 2010-03-30
TWI320799B (en) 2010-02-21
KR101009122B1 (ko) 2011-01-18
MY153006A (en) 2014-12-31
EP2192611B9 (en) 2012-08-15
US20100227165A1 (en) 2010-09-09
KR20100042284A (ko) 2010-04-23
EP2192611A4 (en) 2010-11-03
SG170115A1 (en) 2011-04-29
KR101161941B1 (ko) 2012-07-04
US9324592B2 (en) 2016-04-26
US20120100325A1 (en) 2012-04-26
CN102093828A (zh) 2011-06-15
EP2192611A1 (en) 2010-06-02
EP2261967A3 (en) 2012-06-27

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