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WO2008114546A1 - 配線板モジュール及び該配線板モジュールの製造方法 - Google Patents

配線板モジュール及び該配線板モジュールの製造方法 Download PDF

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Publication number
WO2008114546A1
WO2008114546A1 PCT/JP2008/052174 JP2008052174W WO2008114546A1 WO 2008114546 A1 WO2008114546 A1 WO 2008114546A1 JP 2008052174 W JP2008052174 W JP 2008052174W WO 2008114546 A1 WO2008114546 A1 WO 2008114546A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
board module
component
connecting section
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052174
Other languages
English (en)
French (fr)
Inventor
Keiji Koyama
Masamichi Yamamoto
Katsunari Mikage
Jin-Joo Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to CN2008800001859A priority Critical patent/CN101543145B/zh
Priority to US12/299,561 priority patent/US20090175019A1/en
Publication of WO2008114546A1 publication Critical patent/WO2008114546A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H10W72/073—
    • H10W72/074—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

【課題】ＦＰＣと接続するＰＣＢにおいて、ＦＰＣとの接続部の裏面側にも部品を実装できるようにする。 【解決手段】第一の配線板の導体配線と第二の配線板の導体配線とが異方導電性接着剤で接続された接続部を備え、前記異方導電性接着剤は、針状または直鎖状とした金属粉末を、接着方向の厚さ方向に配向させた絶縁樹脂中に含むものであり、かつ、前記第一の配線板と第二の配線板の少なくとも一方に部品が実装されており、該部品は前記接続部が形成された表面と対向する裏面に実装されている。
PCT/JP2008/052174 2007-03-20 2008-02-08 配線板モジュール及び該配線板モジュールの製造方法 Ceased WO2008114546A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800001859A CN101543145B (zh) 2007-03-20 2008-02-08 电路板模块及制造方法
US12/299,561 US20090175019A1 (en) 2007-03-20 2008-02-08 Circuit-board module and manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-072720 2007-03-20
JP2007072720A JP2008235556A (ja) 2007-03-20 2007-03-20 配線板モジュール及び該配線板モジュールの製造方法

Publications (1)

Publication Number Publication Date
WO2008114546A1 true WO2008114546A1 (ja) 2008-09-25

Family

ID=39765661

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052174 Ceased WO2008114546A1 (ja) 2007-03-20 2008-02-08 配線板モジュール及び該配線板モジュールの製造方法

Country Status (5)

Country Link
US (1) US20090175019A1 (ja)
JP (1) JP2008235556A (ja)
KR (1) KR20090122872A (ja)
CN (1) CN101543145B (ja)
WO (1) WO2008114546A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8507803B2 (en) 2009-03-13 2013-08-13 Sumitomo Electric Industries, Ltd. Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity

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KR101437991B1 (ko) * 2008-06-09 2014-09-05 엘지전자 주식회사 휴대 단말기
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JP5668636B2 (ja) * 2010-08-24 2015-02-12 日立化成株式会社 回路接続構造体の製造方法
CN102645955B (zh) * 2011-02-17 2016-11-23 重庆市巴南区前进机械厂 主板
CN103296489B (zh) * 2012-04-13 2015-08-26 上海天马微电子有限公司 连接装置、平板装置、图像传感器、显示器及触摸设备
CN102762029B (zh) * 2012-06-28 2016-07-13 惠州Tcl移动通信有限公司 移动通讯设备及其电路板组合和电路板的连接方法
CN102883554B (zh) * 2012-09-03 2016-08-17 惠州Tcl移动通信有限公司 手机电路板制造方法、手机电路板及手机
US11224131B2 (en) * 2018-04-04 2022-01-11 Lenovo (Singapore) Pte. Ltd. Systems and methods for surface mounting cable connections
JP7141877B2 (ja) 2018-07-18 2022-09-26 キオクシア株式会社 半導体記憶装置
CN109637368B (zh) * 2019-01-07 2023-12-26 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
EP3977524A4 (en) * 2019-05-28 2023-11-08 Liquid Wire Inc. CONTINUOUS CONNECTIONS BETWEEN HETERGENEOUS MATERIALS
CA3170289A1 (en) * 2020-03-04 2021-09-10 Jonathan Nobert Structural locating sensors for a sensor module using a printed circuit board assembly
KR102843210B1 (ko) 2020-10-05 2025-08-05 삼성전자주식회사 디스플레이 장치

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8507803B2 (en) 2009-03-13 2013-08-13 Sumitomo Electric Industries, Ltd. Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity
EP2229041B1 (en) * 2009-03-13 2014-04-30 Sumitomo Electric Industries, Ltd. Structure of connected printed wiring boards

Also Published As

Publication number Publication date
CN101543145B (zh) 2011-12-21
CN101543145A (zh) 2009-09-23
JP2008235556A (ja) 2008-10-02
KR20090122872A (ko) 2009-12-01
US20090175019A1 (en) 2009-07-09

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