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WO2006033346A3 - フレキシブルプリント配線板 - Google Patents

フレキシブルプリント配線板 Download PDF

Info

Publication number
WO2006033346A3
WO2006033346A3 PCT/JP2005/017374 JP2005017374W WO2006033346A3 WO 2006033346 A3 WO2006033346 A3 WO 2006033346A3 JP 2005017374 W JP2005017374 W JP 2005017374W WO 2006033346 A3 WO2006033346 A3 WO 2006033346A3
Authority
WO
WIPO (PCT)
Prior art keywords
layers
component mounting
bending part
wiring board
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/017374
Other languages
English (en)
French (fr)
Other versions
WO2006033346A1 (ja
WO2006033346A2 (ja
Inventor
Kiyotaka Tsukada
Terumasa Ninomaru
Masaki Kizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to EP05785562A priority Critical patent/EP1793656B1/en
Priority to JP2006536390A priority patent/JP5006649B2/ja
Publication of WO2006033346A1 publication Critical patent/WO2006033346A1/ja
Publication of WO2006033346A2 publication Critical patent/WO2006033346A2/ja
Publication of WO2006033346A3 publication Critical patent/WO2006033346A3/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H10W72/877—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　回路素子が実装される部品実装部６０Ａ，６０Ｂと、折り曲げ軸回りに折り曲げられるべき折り曲げ部７０とを備え、内層に内層導体層３４Ｕ’が形成されたフレキシブル配線基板１０であって、部品実装部６０Ａ，６０Ｂには、外層１７Ｕ，１３の両面のそれぞれに部品実装部導体層３６Ｕ’，３３Ｌが形成され、折り曲げ部７０には、前記外層の両面のうち、折り曲げられたときに外側となるべき面にのみ折り曲げ部導体層３６Ｕ’が形成されている。 　この結果、折り曲げ部７０の層数を部品実装部６０Ａ，６０Ｂの層数より減らすことによって、耐クラック性を高めるとともに、折り曲げ部７０に設けられた信号導体パターン３６Ｕ’の線路インピーダンスを安定化させることができる。
PCT/JP2005/017374 2004-09-21 2005-09-21 フレキシブルプリント配線板 Ceased WO2006033346A2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05785562A EP1793656B1 (en) 2004-09-21 2005-09-21 Flexible printed wiring board
JP2006536390A JP5006649B2 (ja) 2004-09-21 2005-09-21 フレキシブルプリント配線板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-273669 2004-09-21
JP2004273669 2004-09-21

Publications (3)

Publication Number Publication Date
WO2006033346A1 WO2006033346A1 (ja) 2006-03-30
WO2006033346A2 WO2006033346A2 (ja) 2006-03-30
WO2006033346A3 true WO2006033346A3 (ja) 2006-05-11

Family

ID=36090408

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/017374 Ceased WO2006033346A2 (ja) 2004-09-21 2005-09-21 フレキシブルプリント配線板

Country Status (6)

Country Link
US (2) US7312401B2 (ja)
EP (1) EP1793656B1 (ja)
JP (1) JP5006649B2 (ja)
CN (1) CN101023716A (ja)
TW (1) TW200638811A (ja)
WO (1) WO2006033346A2 (ja)

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CN106376169A (zh) * 2015-07-24 2017-02-01 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
JP6670063B2 (ja) * 2015-09-16 2020-03-18 セーレン株式会社 導電性部材
DE102015218841A1 (de) * 2015-09-30 2017-03-30 Hella Kgaa Hueck & Co. Verfahren zur Herstellung eines Radoms und ein solches Radom
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WO2017111903A1 (en) * 2015-12-21 2017-06-29 Intel Corporation Integrating system in package (sip) with input/output (io) board for platform miniaturization
CN108257875B (zh) * 2016-12-28 2021-11-23 碁鼎科技秦皇岛有限公司 芯片封装基板、芯片封装结构及二者的制作方法
CN109475039A (zh) * 2017-09-08 2019-03-15 东莞骅国电子有限公司 微薄双通道柔性电路桥接线
DE102018219917A1 (de) * 2018-11-21 2020-05-28 Albert-Ludwigs-Universität Freiburg Implantierbare elektrische Verbindungseinrichtung
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CN113545170A (zh) * 2019-10-31 2021-10-22 鹏鼎控股(深圳)股份有限公司 薄型电路板及其制造方法
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CN114554691B (zh) * 2020-11-25 2024-08-02 鹏鼎控股(深圳)股份有限公司 超长电路板及其制备方法
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Also Published As

Publication number Publication date
WO2006033346A2 (ja) 2006-03-30
EP1793656A2 (en) 2007-06-06
JP5006649B2 (ja) 2012-08-22
US7312401B2 (en) 2007-12-25
EP1793656B1 (en) 2012-08-29
JPWO2006033346A1 (ja) 2008-05-15
US20060068613A1 (en) 2006-03-30
TW200638811A (en) 2006-11-01
US20080115963A1 (en) 2008-05-22
CN101023716A (zh) 2007-08-22
US7786389B2 (en) 2010-08-31
TWI304712B (ja) 2008-12-21
EP1793656A4 (en) 2007-11-07

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