[go: up one dir, main page]

WO2008081696A1 - 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型 - Google Patents

発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型 Download PDF

Info

Publication number
WO2008081696A1
WO2008081696A1 PCT/JP2007/074031 JP2007074031W WO2008081696A1 WO 2008081696 A1 WO2008081696 A1 WO 2008081696A1 JP 2007074031 W JP2007074031 W JP 2007074031W WO 2008081696 A1 WO2008081696 A1 WO 2008081696A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
package
emitting device
manufacturing
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074031
Other languages
English (en)
French (fr)
Inventor
Masaki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to EP07850551.8A priority Critical patent/EP2112697B1/en
Priority to CN200780030989.9A priority patent/CN101507004B/zh
Priority to US12/309,024 priority patent/US8217414B2/en
Priority to JP2008523467A priority patent/JP5277960B2/ja
Priority to PCT/JP2007/074031 priority patent/WO2008081696A1/ja
Publication of WO2008081696A1 publication Critical patent/WO2008081696A1/ja
Anticipated expiration legal-status Critical
Priority to US13/488,560 priority patent/US8440478B2/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B29C2045/0027—Gate or gate mark locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　中央に円形又は楕円形の凹部を有する樹脂成形体において、クラックの発生を抑制することができる発光装置を提供することを課題とする。発光素子（２）と、複数の外側面（１１）を有し、中央に凹部（１０ａ）を備えた第一樹脂成形体（１０）と、発光素子（２）に電気的に接続される第一リード（２０）及び第二リード（３０）と、凹部（１０ａ）に充填された第二樹脂成形体（４０）と、を有し、第一リード（２０）上に発光素子（２）が載置され、第二樹脂成形体（４０）の表面を発光面とする発光装置（１）であって、第一樹脂成形体（１０）の外側面（１１）に成形されるゲートを切削して得られたゲート痕（５０）が、凹部（１０ａ）の円断面の一点における法線の延長線上に、法線方向に向けて成形されていることを特徴とする。
PCT/JP2007/074031 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型 Ceased WO2008081696A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP07850551.8A EP2112697B1 (en) 2006-12-28 2007-12-13 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
CN200780030989.9A CN101507004B (zh) 2006-12-28 2007-12-13 发光装置、封装体、发光装置的制造方法、封装体的制造方法以及封装体制造用模具
US12/309,024 US8217414B2 (en) 2006-12-28 2007-12-13 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
JP2008523467A JP5277960B2 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法及びパッケージの製造方法
PCT/JP2007/074031 WO2008081696A1 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
US13/488,560 US8440478B2 (en) 2006-12-28 2012-06-05 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006356629 2006-12-28
JP2006-356629 2006-12-28
PCT/JP2007/074031 WO2008081696A1 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/309,024 A-371-Of-International US8217414B2 (en) 2006-12-28 2007-12-13 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
US13/488,560 Division US8440478B2 (en) 2006-12-28 2012-06-05 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die

Publications (1)

Publication Number Publication Date
WO2008081696A1 true WO2008081696A1 (ja) 2008-07-10

Family

ID=39588380

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074031 Ceased WO2008081696A1 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型

Country Status (6)

Country Link
US (2) US8217414B2 (ja)
EP (1) EP2112697B1 (ja)
JP (1) JP5277960B2 (ja)
KR (1) KR101026914B1 (ja)
CN (2) CN101944567B (ja)
WO (1) WO2008081696A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
WO2011046084A1 (ja) 2009-10-15 2011-04-21 日亜化学工業株式会社 発光装置及びその製造方法
JP2011091311A (ja) * 2009-10-26 2011-05-06 Hitachi Chem Co Ltd 光半導体装置の製造方法、光半導体素子搭載用基板の製造方法及び光半導体装置
JP2011134902A (ja) * 2009-12-24 2011-07-07 Toyoda Gosei Co Ltd Ｌｅｄ発光装置
US20120104427A1 (en) * 2009-01-14 2012-05-03 Chi Keung Chan Miniature surface mount device with large pin pads
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN103311402A (zh) * 2012-03-16 2013-09-18 日月光半导体制造股份有限公司 发光二极管封装以及承载板
WO2013137005A1 (ja) * 2012-03-13 2013-09-19 シャープ株式会社 発光装置およびバックライト装置
USD691100S1 (en) 2011-03-02 2013-10-08 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
RU2537091C2 (ru) * 2009-10-29 2014-12-27 Нития Корпорейшн Светоизлучающее устройство и способ изготовления светоизлучающего устройства
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
JP2022121352A (ja) * 2021-02-08 2022-08-19 健策精密工業股▲ふん▼有限公司 リードフレーム構造及びその製造方法

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) * 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) * 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
KR100901618B1 (ko) 2007-04-19 2009-06-08 엘지이노텍 주식회사 발광 다이오드 패키지 및 제조방법
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
US8866169B2 (en) * 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
JP5416975B2 (ja) 2008-03-11 2014-02-12 ローム株式会社 半導体発光装置
JP5463622B2 (ja) * 2008-03-19 2014-04-09 スズキ株式会社 メタリック調樹脂成型品の製造方法及び金型
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20100289055A1 (en) * 2009-05-14 2010-11-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Silicone leaded chip carrier
US8354303B2 (en) * 2009-09-29 2013-01-15 Texas Instruments Incorporated Thermally enhanced low parasitic power semiconductor package
JP5263788B2 (ja) * 2009-10-22 2013-08-14 シャープ株式会社 表示装置
TWI445139B (zh) * 2010-06-11 2014-07-11 日月光半導體製造股份有限公司 晶片封裝結構、晶片封裝模具與晶片封裝製程
CN102751391B (zh) * 2011-04-18 2015-04-29 深圳市龙岗区横岗光台电子厂 一种led封装体及其制造方法和led
KR101869246B1 (ko) * 2012-01-13 2018-07-20 엘지이노텍 주식회사 발광소자 패키지
CN103367344B (zh) * 2012-04-11 2016-04-27 光宝电子(广州)有限公司 连板料片、发光二极管封装品及发光二极管灯条
CN102997136B (zh) * 2012-12-07 2015-01-28 京东方科技集团股份有限公司 一种发光装置、背光模组及显示装置
TWI556476B (zh) * 2013-01-17 2016-11-01 隆達電子股份有限公司 發光裝置、發光二極體承載座及其模具
CN105765808B (zh) * 2013-12-26 2018-03-23 矢崎总业株式会社 电子电路单元及其制造方法
KR101501020B1 (ko) * 2014-02-17 2015-03-13 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
DE102014110074A1 (de) * 2014-07-17 2016-01-21 Osram Opto Semiconductors Gmbh Elektronisches Bauelement, Leiterrahmen und Verfahren zum Herstellen eines elektronischen Bauelements
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
CN111081854B (zh) * 2014-09-26 2023-11-17 日亚化学工业株式会社 发光组件
US9406594B2 (en) * 2014-11-21 2016-08-02 Cree, Inc. Leadframe based light emitter components and related methods
JP6438177B1 (ja) * 2017-03-31 2018-12-12 オリンパス株式会社 内視鏡の先端カバー
JP6729537B2 (ja) * 2017-11-20 2020-07-22 日亜化学工業株式会社 発光装置及びその製造方法
CN110875410A (zh) * 2018-08-30 2020-03-10 深圳市聚飞光电股份有限公司 Led支架及其制作方法、led发光器件、发光装置
US11056624B2 (en) * 2018-10-31 2021-07-06 Nichia Corporation Method of manufacturing package and method of manufacturing light-emitting device
JP6986539B2 (ja) * 2019-11-25 2021-12-22 Ｔｏｗａ株式会社 樹脂成形済リードフレームの製造方法、樹脂成形品の製造方法、及びリードフレーム

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145958A (ja) 1997-07-24 1999-02-16 Kyowa Kasei Kk 表面実装部品及びその製造方法
JP2001024228A (ja) * 1999-07-06 2001-01-26 Nichia Chem Ind Ltd 発光装置
JP2001177160A (ja) 1999-10-07 2001-06-29 Denso Corp 表面実装型発光ダイオード
US20030132701A1 (en) * 2001-11-01 2003-07-17 Nichia Corporation Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same
JP2005259972A (ja) 2004-03-11 2005-09-22 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP2005294736A (ja) 2004-04-05 2005-10-20 Stanley Electric Co Ltd 半導体発光装置の製造方法
JP2006140207A (ja) * 2004-11-10 2006-06-01 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
JP2006156704A (ja) 2004-11-30 2006-06-15 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2007116074A (ja) * 2005-09-22 2007-05-10 Toshiba Lighting & Technology Corp 発光ダイオード装置および照明装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0269215A (ja) 1988-09-05 1990-03-08 Mitsubishi Electric Corp リング伏プラスチツク成形用金型
JP2739279B2 (ja) * 1993-06-30 1998-04-15 三菱電線工業株式会社 基板に実装された電子部品のモールド方法
JP4316019B2 (ja) * 1996-10-01 2009-08-19 株式会社東芝 半導体装置及び半導体装置製造方法
JP2001168400A (ja) * 1999-12-09 2001-06-22 Rohm Co Ltd ケース付チップ型発光装置およびその製造方法
JP4212255B2 (ja) * 2001-03-30 2009-01-21 株式会社東芝 半導体パッケージ
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP2003340889A (ja) 2002-05-27 2003-12-02 Fuji Electric Co Ltd 射出成形方法および射出成形金型
WO2004001862A1 (ja) * 2002-06-19 2003-12-31 Sanken Electric Co., Ltd. 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
JP4692007B2 (ja) 2005-02-16 2011-06-01 Ｔｄｋ株式会社 成形方法
JP2006237190A (ja) * 2005-02-24 2006-09-07 Toshiba Discrete Technology Kk 半導体発光装置
JP4901117B2 (ja) * 2005-03-04 2012-03-21 株式会社東芝 半導体発光素子及び半導体発光素子の製造方法
US20100104794A1 (en) * 2005-08-04 2010-04-29 Shin-Etsu Chemical Co., Ltd. Thermosetting epoxy resin composition and semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145958A (ja) 1997-07-24 1999-02-16 Kyowa Kasei Kk 表面実装部品及びその製造方法
JP2001024228A (ja) * 1999-07-06 2001-01-26 Nichia Chem Ind Ltd 発光装置
JP2001177160A (ja) 1999-10-07 2001-06-29 Denso Corp 表面実装型発光ダイオード
US20030132701A1 (en) * 2001-11-01 2003-07-17 Nichia Corporation Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same
JP2005259972A (ja) 2004-03-11 2005-09-22 Stanley Electric Co Ltd 表面実装型ｌｅｄ
JP2005294736A (ja) 2004-04-05 2005-10-20 Stanley Electric Co Ltd 半導体発光装置の製造方法
JP2006140207A (ja) * 2004-11-10 2006-06-01 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
JP2006156704A (ja) 2004-11-30 2006-06-15 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2007116074A (ja) * 2005-09-22 2007-05-10 Toshiba Lighting & Technology Corp 発光ダイオード装置および照明装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2112697A4

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US12211959B2 (en) 2008-09-03 2025-01-28 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573789B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10700241B2 (en) 2008-09-03 2020-06-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US11094854B2 (en) 2008-09-03 2021-08-17 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
KR20230042151A (ko) * 2008-09-03 2023-03-27 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
KR102677856B1 (ko) * 2008-09-03 2024-06-25 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
US20120104427A1 (en) * 2009-01-14 2012-05-03 Chi Keung Chan Miniature surface mount device with large pin pads
US9685592B2 (en) * 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
WO2011046084A1 (ja) 2009-10-15 2011-04-21 日亜化学工業株式会社 発光装置及びその製造方法
US9705048B2 (en) 2009-10-15 2017-07-11 Nichia Corporation Light-emitting device and method for manufacturing same
CN102612761A (zh) * 2009-10-15 2012-07-25 日亚化学工业株式会社 发光装置及其制造方法
KR20120098691A (ko) 2009-10-15 2012-09-05 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 그 제조 방법
CN102612761B (zh) * 2009-10-15 2015-09-30 日亚化学工业株式会社 发光装置及其制造方法
JP2011103437A (ja) * 2009-10-15 2011-05-26 Nichia Corp 発光装置及びその製造方法
JP2011091311A (ja) * 2009-10-26 2011-05-06 Hitachi Chem Co Ltd 光半導体装置の製造方法、光半導体素子搭載用基板の製造方法及び光半導体装置
RU2537091C2 (ru) * 2009-10-29 2014-12-27 Нития Корпорейшн Светоизлучающее устройство и способ изготовления светоизлучающего устройства
JP2011134902A (ja) * 2009-12-24 2011-07-07 Toyoda Gosei Co Ltd Ｌｅｄ発光装置
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
USD691100S1 (en) 2011-03-02 2013-10-08 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
US9163810B2 (en) 2012-03-13 2015-10-20 Sharp Kabushiki Kaisha Light emitting device and backlight device
CN104170105B (zh) * 2012-03-13 2017-03-15 夏普株式会社 发光装置以及背光装置
JPWO2013137005A1 (ja) * 2012-03-13 2015-08-03 シャープ株式会社 発光装置およびバックライト装置
CN104170105A (zh) * 2012-03-13 2014-11-26 夏普株式会社 发光装置以及背光装置
WO2013137005A1 (ja) * 2012-03-13 2013-09-19 シャープ株式会社 発光装置およびバックライト装置
US10177283B2 (en) 2012-03-16 2019-01-08 Advanced Semiconductor Engineering, Inc. LED packages and related methods
US9653656B2 (en) 2012-03-16 2017-05-16 Advanced Semiconductor Engineering, Inc. LED packages and related methods
CN103311402B (zh) * 2012-03-16 2016-03-16 日月光半导体制造股份有限公司 发光二极管封装以及承载板
CN103311402A (zh) * 2012-03-16 2013-09-18 日月光半导体制造股份有限公司 发光二极管封装以及承载板
JP2022121352A (ja) * 2021-02-08 2022-08-19 健策精密工業股▲ふん▼有限公司 リードフレーム構造及びその製造方法
JP7220738B2 (ja) 2021-02-08 2023-02-10 健策精密工業股▲ふん▼有限公司 リードフレーム構造及びその製造方法
US11984385B2 (en) 2021-02-08 2024-05-14 Jentech Precision Industrial Co., Ltd. Lead frame structure and manufacturing method thereof

Also Published As

Publication number Publication date
CN101944567A (zh) 2011-01-12
KR20090028698A (ko) 2009-03-19
US20120295374A1 (en) 2012-11-22
EP2112697B1 (en) 2020-01-22
CN101944567B (zh) 2012-12-05
CN101507004B (zh) 2011-04-20
JPWO2008081696A1 (ja) 2010-04-30
EP2112697A1 (en) 2009-10-28
US8217414B2 (en) 2012-07-10
EP2112697A4 (en) 2011-05-11
US8440478B2 (en) 2013-05-14
US20090289275A1 (en) 2009-11-26
JP5277960B2 (ja) 2013-08-28
CN101507004A (zh) 2009-08-12
KR101026914B1 (ko) 2011-04-04

Similar Documents

Publication Publication Date Title
WO2008081696A1 (ja) 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
WO2009114392A3 (en) Semiconductor die package including embedded flip chip
TW200633149A (en) Semiconductor die package including universal footprint and method for manufacturing the same
WO2010036709A3 (en) Overmolded semiconductor package with an integrated antenna
TWI411092B (en) Led package structure with external lateral cutting beveled edges and method for manufacturing the same
WO2009072786A3 (en) Led package and method for fabricating the same
EP2378570A3 (en) Light emitting device with a stepped light extracting structure and method of manufacturing the same
TW200746474A (en) Semiconductor device and semiconductor device fabrication method
WO2007120282A3 (en) Stackable molded packages and methods of making the same
WO2008076661A3 (en) Ceramic package substrate with recessed device
TW200717743A (en) Semiconductor device
WO2006101768A3 (en) Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure
TW200735425A (en) Light-emitting diode package and manufacturing method thereof
WO2008105437A1 (ja) 半導体装置、リードフレームおよび半導体装置の製造方法
EP2290690A3 (en) Light emitting device
WO2008135905A3 (en) A photosensitive device and a method of manufacturing a photosensitive device
EP2296199A3 (en) Semiconductor light emitting device and manufacturing method thereof
WO2008106040A3 (en) Led device having improved light output
WO2008011276A3 (en) Microphone module and method for fabricating the same
WO2009002040A3 (en) Semiconductor light emitting device and method of fabricating the same
MY151840A (en) Optical coupler package
WO2006036297A3 (en) Organic electroluminescence device and method of production of same
WO2009060670A1 (ja) 半導体装置及びその製造方法
JP2011114341A5 (ja)
WO2009031856A3 (en) Lighting emitting device package and method of fabricating the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780030989.9

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2008523467

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07850551

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2007850551

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020087029498

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 10752/DELNP/2008

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 12309024

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE