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WO2007013262A1 - Boîtier de connexion de module solaire - Google Patents

Boîtier de connexion de module solaire Download PDF

Info

Publication number
WO2007013262A1
WO2007013262A1 PCT/JP2006/313219 JP2006313219W WO2007013262A1 WO 2007013262 A1 WO2007013262 A1 WO 2007013262A1 JP 2006313219 W JP2006313219 W JP 2006313219W WO 2007013262 A1 WO2007013262 A1 WO 2007013262A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal plate
relay terminal
diode
solar cell
cell module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/313219
Other languages
English (en)
Japanese (ja)
Inventor
Makoto Higashikozono
Hiroyuki Yoshikawa
Kazuki Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of WO2007013262A1 publication Critical patent/WO2007013262A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a terminal box for a solar cell module.
  • the present invention has been completed based on the above situation, and an object of the present invention is to provide a terminal box for a solar cell module that is excellent in workability when connecting rectifying elements.
  • a diode terminal plate portion having opposing surfaces provided opposite to each other, a flat shape as a whole, both end surfaces in the thickness direction being exposed as electrode surfaces, and side surfaces being mold-coated with grease; It is a terminal box for a solar cell module having a reverse load bypass rectifying element in which the opposing surface and the electrode surface are electrically connected by being inserted between the opposing surfaces of the plate portion.
  • the positioning hole and the positioning protrusion are formed in a rectangular shape that fits closely to each other. In this way, since the displacement hardly occurs when the positioning protrusion is fitted, the relay terminal plate can be positioned with certainty.
  • a step is formed in the thickness direction of the relay terminal plate on the substrate, the relay terminal plates are arranged adjacent to each other with a difference in height on both sides of the step, and one diode terminal plate portion is high.
  • the relay terminal plate located at the position is low and overlapped with the relay terminal plate located at the upper position. This is preferable because it is not bulky in the thickness direction of the relay terminal board.
  • FIG. 1 is a plan view of a box body according to a first embodiment.
  • a positioning projection 15 that can be engaged with the positioning hole 31 of the relay terminal plate 30 is provided so as to correspond to each relay terminal plate 30.
  • the positioning projection 15 has a truncated pyramid shape, more specifically, a shape obtained by cutting the apex side of a pyramid having a rectangular bottom surface by a plane substantially parallel to the bottom surface.
  • the positioning hole 30 has a rectangular shape that allows the positioning projection 15 to be tightly fitted, and the relay terminal plate 30 is difficult to be displaced after the positioning projection 15 is fitted.
  • a positioning wall 21 for positioning the relay terminal plate 30 is provided on the upper surface of the substrate 11.
  • the positioning wall 21 is formed so as to extend along the width direction of the corresponding relay terminal plate 30, and a receiving groove (not shown) into which the rear end portion of the relay terminal plate 30 can be fitted is provided at the base.
  • the relay terminal plate 30 takes an oblique posture when mounted on the board 11 and receives the rear end of the relay terminal plate 30 against the inner surface of the groove, and the state force applied is tilted so that the front end is tilted.
  • the positioning protrusions 15 that are not present are configured to fit into the positioning holes 31.
  • the side plate 12 is provided with a pair of left and right cutouts 17, to which an output cable 18 for external connection is fitted, and a cable pressing member 19 is further fitted to fix the output cable 18.
  • the cable pressing member 19 and the side plate 12 are integrally connected.
  • the partition wall 13 is partitioned in a manner along the outer edge of the relay terminal plate 30, and is assembled with the relay terminal plate 30 positioned by the guide of the partition wall 13. Further, the insulating resin is filled on the relay terminal plate 30 in the inner space partitioned by the partition wall 13 so that the amount of the insulating resin used can be reduced.
  • the relay terminal plate 30 is formed in a strip shape by cutting a conductive metal plate material or the like, and six relay terminal plates 30 are provided side by side on the substrate 11.
  • cable terminal plates 30A to which corresponding external connection cables 18 are connected are arranged.
  • the cable terminal plate 30A is formed shorter in the length direction than the other terminal plates 30B and 30C.
  • the end of the cable 18 is placed on the rear end of the cable terminal board 30A with the conductor exposed, and is screwed with a screw 25.
  • the tip of the screw 25 is screwed into a screw hole (not shown) provided in the board 11, so that the cable terminal plate 30A is connected to the cable 18 and fixed to the board 11. Talk!
  • the power bypass diode 50 includes a grease portion 54! /, And differs from a bare chip diode in that it is also different from a package diode in that both ends are exposed as electrode surfaces 51. .
  • As the bypass diode 50 a commercially available product can be used.
  • the box body 10 is fixed to the back surface side of the solar cell module with an adhesive, a double-sided tape, or a bolt.
  • the lead 20 connected to the electrode of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead 20 is soldered to the tip of the terminal plates 30A and 30C.
  • an insulating resin such as silicon resin is filled in the inner space of the partition wall 13 in the box body 10, and further covered with a cover to tighten the lid.
  • the inside of the box body 10 is hermetically sealed by the insulating grease.
  • the cable terminal plate 30A is not provided with a screw insertion hole, and the board 11 is not provided with a screw hole.
  • the cable terminal plate 30A is formed longer in the front-rear direction than that of the first embodiment, and the barrel portion 24 provided at the rear end thereof is caulked to the terminal conductor of the cable 18.
  • the terminal plates 30B and 30C not connected to the cable 18 have a short terminal plate 30B and a long terminal plate 30C adjacent to each other. It is connected together via the connecting part 34, and the jumper pin 32 is provided!
  • the thin plate 35 separate from the relay terminal plate 30 is made of metal that is thinner than the relay terminal plate 30.
  • the thin plate 35 includes a connecting portion 36 that is placed on the upper surface of the relay terminal plate 30 across the attachment portion 33 of the relay terminal plate 30 having a flat shape, and a diode terminal plate that stands up substantially at right angles from one end thereof.
  • the bypass diode 50 having the same configuration as that of the first embodiment can be inserted between the opposing surfaces 41 of the two diode terminal plate portions 40.
  • the diode terminal plate portion 40 located on the right side in FIG. 4 is the N-side terminal plate portion 40A, and the left-hand side is the P-side terminal.
  • the N-side terminal plate portion 40A is formed larger than the P-side terminal plate portion 40B.
  • Embodiment 3 of the present invention the difference between the first and second embodiments is that the step 26 is provided on the upper surface of the substrate 11 and the insertion direction of the binos diode 50 is set in the horizontal direction. ing.
  • the thin plate 35A is configured to extend linearly as a whole, and has one end connected to the relay terminal plate 30 arranged at a high position and the other end at a low position.
  • the relay terminal board 30 is arranged so as to overlap the relay terminal board 30.
  • another thin plate 35B is placed on the upper surface of the relay terminal plate 30 disposed at a lower position, and the other end portion of the thin plate 35A is disposed so as to cover the other thin plate 35B.
  • the bypass diode 50 having the same form as that of the first embodiment can be elastically inserted between the opposing surfaces of the thin plates 35A and 35B in a lateral orientation. In this case, the other end of the thin plate 35A is connected to the bypass diode 50.
  • a circular arc is formed along the outer edge.
  • the other end portion of the thin plate 35A connected to the relay terminal plate at the high position and the one end portion of the thin plate 35B arranged at the relay terminal plate 30 at the low position are used for the diode terminal plate of the present invention.
  • Part 40 is constructed. Furthermore, the diode terminal plate portion 40 of the thin plate 35A that contacts the P-side electrode 51B of the bypass diode 50 is defined as the P-side terminal plate portion 40B, and the diode terminal plate portion of the thin plate 35B that contacts the N-side electrode 51A of the bypass diode 50. 40 is the N-side terminal plate 40A. When the entire N-side terminal plate portion 40A is mounted and connected to the relay terminal plate 30, heat can be efficiently radiated from the N-side terminal plate portion 40A.
  • the diode terminal plate portion is provided with a flat plate shape, but at least one of the opposing surfaces is bent inwardly to apply a bending force to the protruding switch shape. It is also possible to have a contact portion formed.

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

La présente invention concerne un boîtier de connexion disposé sur un substrat (11) comprenant une pluralité de plaques à bornes (30) pour une interconnexion électrique de l’électrode positive ou négative d’un module solaire et un câble (18) pour le raccord externe correspondant aux deux électrodes. Une diode en parallèle (50) de forme plane dans son ensemble présente des faces d’extrémité opposées dans le sens d’épaisseur exposées en tant que faces d’électrode (51), et une face latérale moulée en résine (52). Ladite diode (50) est insérée entre les surfaces opposées (41) d’une section de plaque à bornes de diode (40) formée sur deux plaques à bornes d’interconnexion adjacentes (30), ce qui relie électriquement ces surfaces (41) aux faces d’électrode (51).
PCT/JP2006/313219 2005-07-28 2006-07-03 Boîtier de connexion de module solaire Ceased WO2007013262A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005219227A JP2007036036A (ja) 2005-07-28 2005-07-28 太陽電池モジュール用端子ボックス
JP2005-219227 2005-07-28

Publications (1)

Publication Number Publication Date
WO2007013262A1 true WO2007013262A1 (fr) 2007-02-01

Family

ID=37683164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/313219 Ceased WO2007013262A1 (fr) 2005-07-28 2006-07-03 Boîtier de connexion de module solaire

Country Status (2)

Country Link
JP (1) JP2007036036A (fr)
WO (1) WO2007013262A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134572A1 (fr) * 2009-05-20 2010-11-25 行田電線株式会社 Borne de connexion, structure de connexion de bornes et boîte à bornes
CN102194896A (zh) * 2010-03-12 2011-09-21 泰科电子(上海)有限公司 太阳能光伏接线盒组件
CN102386261A (zh) * 2010-08-30 2012-03-21 星电株式会社 端子盒
JP2012069593A (ja) * 2010-09-21 2012-04-05 Mitsubishi Electric Corp 太陽電池モジュール用端子ボックスおよび太陽電池モジュール
CN113328698A (zh) * 2021-08-02 2021-08-31 江苏泽润新材料有限公司 轴向二极管接线盒及其制造方法

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210641A (ja) * 1982-05-31 1983-12-07 Rohm Co Ltd 小型電子部品の製造法
JPS596843U (ja) * 1982-07-05 1984-01-17 日本電気株式会社 半導体装置
JPS61153350U (fr) * 1985-03-13 1986-09-22
JPS62149848U (fr) * 1986-03-12 1987-09-22
JPH0286150A (ja) * 1988-09-22 1990-03-27 Nec Kansai Ltd モールドダイオードおよびその製造方法
JPH02120848U (fr) * 1989-03-14 1990-09-28
JPH0945948A (ja) * 1995-07-27 1997-02-14 Fuji Electric Co Ltd 太陽電池モジュール
JP2000277785A (ja) * 1999-03-29 2000-10-06 Matsushita Electronics Industry Corp 太陽電池モジュール用バイパスダイオード
JP2001168368A (ja) * 1999-12-09 2001-06-22 Kanegafuchi Chem Ind Co Ltd 端子ボックス
JP2001298134A (ja) * 2000-04-14 2001-10-26 Mitsubishi Electric Corp バイパスダイオードとこのバイパスダイオードを含む太陽電池モジュール
JP2002057360A (ja) * 2000-08-11 2002-02-22 Sumitomo Wiring Syst Ltd 太陽電池モジュール接続用端子ボックス装置およびその製造方法
JP2002237613A (ja) * 2002-02-21 2002-08-23 Powered Kk 太陽電池の端子箱
JP2002252356A (ja) * 2001-02-23 2002-09-06 Sumitomo Wiring Syst Ltd バイパス用整流素子及びこのバイパス用整流素子を用いた太陽電池モジュール用の端子ボックス装置
JP2004273997A (ja) * 2003-03-12 2004-09-30 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP3664312B1 (ja) * 2004-08-05 2005-06-22 住友電装株式会社 太陽電池モジュール用端子ボックス
JP3664311B1 (ja) * 2004-06-09 2005-06-22 住友電装株式会社 太陽電池モジュール用端子ボックス

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210641A (ja) * 1982-05-31 1983-12-07 Rohm Co Ltd 小型電子部品の製造法
JPS596843U (ja) * 1982-07-05 1984-01-17 日本電気株式会社 半導体装置
JPS61153350U (fr) * 1985-03-13 1986-09-22
JPS62149848U (fr) * 1986-03-12 1987-09-22
JPH0286150A (ja) * 1988-09-22 1990-03-27 Nec Kansai Ltd モールドダイオードおよびその製造方法
JPH02120848U (fr) * 1989-03-14 1990-09-28
JPH0945948A (ja) * 1995-07-27 1997-02-14 Fuji Electric Co Ltd 太陽電池モジュール
JP2000277785A (ja) * 1999-03-29 2000-10-06 Matsushita Electronics Industry Corp 太陽電池モジュール用バイパスダイオード
JP2001168368A (ja) * 1999-12-09 2001-06-22 Kanegafuchi Chem Ind Co Ltd 端子ボックス
JP2001298134A (ja) * 2000-04-14 2001-10-26 Mitsubishi Electric Corp バイパスダイオードとこのバイパスダイオードを含む太陽電池モジュール
JP2002057360A (ja) * 2000-08-11 2002-02-22 Sumitomo Wiring Syst Ltd 太陽電池モジュール接続用端子ボックス装置およびその製造方法
JP2002252356A (ja) * 2001-02-23 2002-09-06 Sumitomo Wiring Syst Ltd バイパス用整流素子及びこのバイパス用整流素子を用いた太陽電池モジュール用の端子ボックス装置
JP2002237613A (ja) * 2002-02-21 2002-08-23 Powered Kk 太陽電池の端子箱
JP2004273997A (ja) * 2003-03-12 2004-09-30 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP3664311B1 (ja) * 2004-06-09 2005-06-22 住友電装株式会社 太陽電池モジュール用端子ボックス
JP3664312B1 (ja) * 2004-08-05 2005-06-22 住友電装株式会社 太陽電池モジュール用端子ボックス

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134572A1 (fr) * 2009-05-20 2010-11-25 行田電線株式会社 Borne de connexion, structure de connexion de bornes et boîte à bornes
US8647160B2 (en) 2009-05-20 2014-02-11 Yukita Electric Wire Co., Ltd. Connection terminal, terminal connection structure, and terminal box
JP5643753B2 (ja) * 2009-05-20 2014-12-17 行田電線株式会社 接続端子、端子接続構造、及び端子ボックス
CN102194896A (zh) * 2010-03-12 2011-09-21 泰科电子(上海)有限公司 太阳能光伏接线盒组件
CN102194896B (zh) * 2010-03-12 2013-03-27 泰科电子(上海)有限公司 太阳能光伏接线盒组件
CN102386261A (zh) * 2010-08-30 2012-03-21 星电株式会社 端子盒
JP2012069593A (ja) * 2010-09-21 2012-04-05 Mitsubishi Electric Corp 太陽電池モジュール用端子ボックスおよび太陽電池モジュール
CN113328698A (zh) * 2021-08-02 2021-08-31 江苏泽润新材料有限公司 轴向二极管接线盒及其制造方法

Also Published As

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JP2007036036A (ja) 2007-02-08

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