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WO2009054105A1 - 部品内蔵プリント配線基板およびその製造方法 - Google Patents

部品内蔵プリント配線基板およびその製造方法 Download PDF

Info

Publication number
WO2009054105A1
WO2009054105A1 PCT/JP2008/002892 JP2008002892W WO2009054105A1 WO 2009054105 A1 WO2009054105 A1 WO 2009054105A1 JP 2008002892 W JP2008002892 W JP 2008002892W WO 2009054105 A1 WO2009054105 A1 WO 2009054105A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
wiring board
printed wiring
electronic part
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002892
Other languages
English (en)
French (fr)
Inventor
Yoshiyuki Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2009054105A1 publication Critical patent/WO2009054105A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

第１配線回路（３）を有し電子部品（７）が実装されたコア層（１）と第２配線回路（１４ａ）を有する配線層（１２）とが積層して構成され、電子部品（７）は第１配線回路（３）を構成する接続用の電極（３ａ）に半田接合され、電子部品（７）と電極（３ａ）との半田接合部（６ｃ）は樹脂コート部（９）で覆われ、電子部品（７）および樹脂コート部（９）を周囲から固定する部品固定層（１１ａ）がコア層（１）に形成され、第１配線回路（３）と第２配線回路（１４ａ）とを接続する層間配線部（１９）がコア層（１）および配線層（１２）に設けられた構成を有し、簡便な工程で効率よく半導体部品などを内蔵したプリント配線基板を製造することができる。
PCT/JP2008/002892 2007-10-26 2008-10-14 部品内蔵プリント配線基板およびその製造方法 Ceased WO2009054105A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007278557A JP5172275B2 (ja) 2007-10-26 2007-10-26 部品内蔵プリント配線基板および部品内蔵プリント配線基板の製造方法
JP2007-278557 2007-10-26

Publications (1)

Publication Number Publication Date
WO2009054105A1 true WO2009054105A1 (ja) 2009-04-30

Family

ID=40579215

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002892 Ceased WO2009054105A1 (ja) 2007-10-26 2008-10-14 部品内蔵プリント配線基板およびその製造方法

Country Status (3)

Country Link
JP (1) JP5172275B2 (ja)
TW (1) TW200920197A (ja)
WO (1) WO2009054105A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060875A (ja) * 2009-09-08 2011-03-24 Panasonic Corp 電子部品内蔵基板及びその製造方法とこれを用いた半導体装置
WO2011040480A1 (ja) * 2009-09-30 2011-04-07 株式会社村田製作所 回路基板
JP2013187359A (ja) * 2012-03-08 2013-09-19 Panasonic Corp 部品内蔵基板の製造方法および部品内蔵基板
JP2013191620A (ja) * 2012-03-12 2013-09-26 Panasonic Corp 部品内蔵基板の製造方法および部品内蔵基板
KR101455533B1 (ko) 2013-06-27 2014-10-27 주식회사 코리아써키트 부품실장형 인쇄회로기판 제조방법
TWI667945B (zh) * 2019-01-04 2019-08-01 力成科技股份有限公司 包覆成型封裝結構及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077536A (ja) * 1999-09-01 2001-03-23 Sony Corp 電子回路内蔵プリント配線板およびその製造方法
JP2004152943A (ja) * 2002-10-30 2004-05-27 Denso Corp 電子部品の実装構造およびそれに用いる基板ならびにその基板の製造方法
JP2004311736A (ja) * 2003-04-08 2004-11-04 Nec Toppan Circuit Solutions Inc チップ部品内蔵ビルドアップ多層配線板の製造方法
WO2007034629A1 (ja) * 2005-09-20 2007-03-29 Murata Manufacturing Co., Ltd. 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP2007214535A (ja) * 2006-01-13 2007-08-23 Cmk Corp 半導体素子内蔵プリント配線板及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606610B2 (ja) * 1994-12-20 1997-05-07 日本電気株式会社 ソルダーペースト、半導体装置の接続方法および接続構造
WO1997007542A1 (en) * 1995-08-11 1997-02-27 Kirsten Kenneth J Epoxy resin based solder paste
JP2001244299A (ja) * 2000-02-29 2001-09-07 Sony Corp 配線基板及びその製造方法
JP4442353B2 (ja) * 2004-07-28 2010-03-31 株式会社デンソー 配線基板の製造方法
JP2006093493A (ja) * 2004-09-27 2006-04-06 Cmk Corp 部品内蔵型プリント配線板及びその製造方法
JP4471825B2 (ja) * 2004-12-09 2010-06-02 日本電波工業株式会社 電子部品、及び電子部品の製造方法
JP2007049004A (ja) * 2005-08-11 2007-02-22 Cmk Corp プリント配線板とその製造方法
JP2007214230A (ja) * 2006-02-08 2007-08-23 Cmk Corp プリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077536A (ja) * 1999-09-01 2001-03-23 Sony Corp 電子回路内蔵プリント配線板およびその製造方法
JP2004152943A (ja) * 2002-10-30 2004-05-27 Denso Corp 電子部品の実装構造およびそれに用いる基板ならびにその基板の製造方法
JP2004311736A (ja) * 2003-04-08 2004-11-04 Nec Toppan Circuit Solutions Inc チップ部品内蔵ビルドアップ多層配線板の製造方法
WO2007034629A1 (ja) * 2005-09-20 2007-03-29 Murata Manufacturing Co., Ltd. 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP2007214535A (ja) * 2006-01-13 2007-08-23 Cmk Corp 半導体素子内蔵プリント配線板及びその製造方法

Also Published As

Publication number Publication date
JP2009110992A (ja) 2009-05-21
TW200920197A (en) 2009-05-01
JP5172275B2 (ja) 2013-03-27

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