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WO2004040949A1 - Carte de circuits imprimes pour des telephones mobiles - Google Patents

Carte de circuits imprimes pour des telephones mobiles Download PDF

Info

Publication number
WO2004040949A1
WO2004040949A1 PCT/DE2003/003617 DE0303617W WO2004040949A1 WO 2004040949 A1 WO2004040949 A1 WO 2004040949A1 DE 0303617 W DE0303617 W DE 0303617W WO 2004040949 A1 WO2004040949 A1 WO 2004040949A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
frame
mobile telephones
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2003/003617
Other languages
German (de)
English (en)
Inventor
Matthias Stockel
Rene Crain
Klaus Kroesen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2004040949A1 publication Critical patent/WO2004040949A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Definitions

  • the present invention relates to a printed circuit board for mobile telephones, which has large-area components on at least one side, which are connected to the printed circuit board in a form-fitting or material-locking manner.
  • Printed circuit boards of this type have most of the mobile phones. Normally, on one side of these printed circuit boards, e.g. B. RF modules are arranged and on the other side of the circuit board z. B. an LCD module or components of the keyboard are arranged.
  • screen frames are provided on the side of the circuit board on which the RF modules are arranged, which extend over the entire area of the circuit board, these screen frames ensure a certain stability of the circuit board, so that no additional measures for stabilization are required.
  • stiffeners are provided in the area of the large components in the side areas of the printed circuit board.
  • the intended partial stiffening of the circuit board in the critical areas, i. H. In the direct vicinity of the endangered components, bending of the printed circuit board is greatly reduced, thus preventing unintentional detachment of these large components.
  • this solution again leads to a larger space requirement, which can be disadvantageous in the case of miniaturization.
  • the object of the present invention is to provide a printed circuit board of the type mentioned at the outset which, even with a low printed circuit board thickness, ensures a secure positive or integral connection of large components to the printed circuit board.
  • the advantage of the solution according to the invention is that one and the same component, the frame, serves both to stiffen the printed circuit board and to accommodate the large-area component, which leads to a smaller space requirement compared to conventional solutions.
  • FIG. 1 shows a perspective view of a printed circuit board according to the invention with a frame firmly attached to it
  • Figure 2 is an exploded view of the circuit board shown in Figure 1 and a large component
  • Figure 3 is an illustration of the circuit board shown in Figure with a large component attached to it.
  • FIG. 1 shows a printed circuit board 1 with a frame 2 mounted thereon according to the invention.
  • the frame 2 for receiving a large-area component can be, for example, a display holder.
  • This frame or this display holder 2 can be soldered onto the circuit board 1.
  • This display holder 2 is designed such that the side parts extending in the longitudinal direction of the printed circuit board 1 have an L-shaped profile, as a result of which bending of the printed circuit board can be reliably prevented.
  • the display holder 2 thus serves once to stabilize the circuit board and at the same time also serves to accommodate a large-area component, in the exemplary embodiment shown for accommodating a display module 4.
  • the display holder 2 and the display module 4 are designed such that the two parts can be locked together.
  • 2 recesses 3 are provided in the display holder and 4 snap hooks 5 on the display module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne une carte de circuits imprimés pour des téléphones mobiles. La carte de circuits imprimés selon l'invention présente, sur au moins une face, des composants à grande surface qui sont reliés à la carte imprimée par liaison de forme ou de matière. Afin de stabiliser la carte de circuits imprimés, au moins un cadre (2) recevant un composant à grande surface (4) est relié de manière fixe à la carte de circuits imprimés (1).
PCT/DE2003/003617 2002-10-31 2003-10-30 Carte de circuits imprimes pour des telephones mobiles Ceased WO2004040949A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002150907 DE10250907A1 (de) 2002-10-31 2002-10-31 Leiterplatte für Mobiltelefone
DE10250907.7 2002-10-31

Publications (1)

Publication Number Publication Date
WO2004040949A1 true WO2004040949A1 (fr) 2004-05-13

Family

ID=32185294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/003617 Ceased WO2004040949A1 (fr) 2002-10-31 2003-10-30 Carte de circuits imprimes pour des telephones mobiles

Country Status (2)

Country Link
DE (1) DE10250907A1 (fr)
WO (1) WO2004040949A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691593A1 (fr) * 2005-02-11 2006-08-16 Research In Motion Limited Châssis pour un dispositif monté au-dessus d'une carte à circuit imprimé dans un appareil électronique
US7362585B2 (en) 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
EP1746809A3 (fr) * 2005-07-19 2012-08-08 LG Electronics Inc. Module d'affichage et terminal mobile comprenant un tel module d'affichage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010028164B4 (de) * 2010-04-23 2022-05-05 BSH Hausgeräte GmbH Bedieneinrichtung für ein Haushaltsgerät

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173198A (ja) * 1989-11-30 1991-07-26 Matsushita Electric Ind Co Ltd リモコン送信器
US5157723A (en) * 1991-02-21 1992-10-20 Northern Telecom Limited Mounts for articles
DE4405578A1 (de) * 1994-02-22 1995-08-24 Vdo Schindling Elektronische Baueinheit
JPH11153782A (ja) * 1997-11-19 1999-06-08 Matsushita Electric Ind Co Ltd 液晶表示装置およびその組立方法
EP1054549A2 (fr) * 1999-05-19 2000-11-22 DeTeWe - Deutsche Telephonwerke Aktiengesellschaft & Co. Dispositif de montage et de fixation d'un élément d'affichage optique dans un appareil de télécommunication
US6248957B1 (en) * 1998-08-10 2001-06-19 Fujitsu Limited Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
EP1217807A1 (fr) * 2000-12-19 2002-06-26 Telefonaktiebolaget L M Ericsson (Publ) Assemblage de cartes de circuits imprimés

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20009217U1 (de) * 2000-05-22 2000-08-24 Lu, Ping Chang, Taipeh/T'ai-pei Batteriesatz für Mobiltelefone

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173198A (ja) * 1989-11-30 1991-07-26 Matsushita Electric Ind Co Ltd リモコン送信器
US5157723A (en) * 1991-02-21 1992-10-20 Northern Telecom Limited Mounts for articles
DE4405578A1 (de) * 1994-02-22 1995-08-24 Vdo Schindling Elektronische Baueinheit
JPH11153782A (ja) * 1997-11-19 1999-06-08 Matsushita Electric Ind Co Ltd 液晶表示装置およびその組立方法
US6248957B1 (en) * 1998-08-10 2001-06-19 Fujitsu Limited Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
EP1054549A2 (fr) * 1999-05-19 2000-11-22 DeTeWe - Deutsche Telephonwerke Aktiengesellschaft & Co. Dispositif de montage et de fixation d'un élément d'affichage optique dans un appareil de télécommunication
EP1217807A1 (fr) * 2000-12-19 2002-06-26 Telefonaktiebolaget L M Ericsson (Publ) Assemblage de cartes de circuits imprimés

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 417 (E - 1125) 23 October 1991 (1991-10-23) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691593A1 (fr) * 2005-02-11 2006-08-16 Research In Motion Limited Châssis pour un dispositif monté au-dessus d'une carte à circuit imprimé dans un appareil électronique
US7362585B2 (en) 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US8233282B2 (en) 2005-02-11 2012-07-31 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US8824152B2 (en) 2005-02-11 2014-09-02 Blackberry Limited Cover for a frame for a device mounted above a printed circuit board in an electronic device
US9052870B2 (en) 2005-02-11 2015-06-09 Blackberry Limited System and frame for mounting a device above a printed circuit board in an electronic device
EP1746809A3 (fr) * 2005-07-19 2012-08-08 LG Electronics Inc. Module d'affichage et terminal mobile comprenant un tel module d'affichage

Also Published As

Publication number Publication date
DE10250907A1 (de) 2004-06-03

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