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WO2003018675A1 - Resin composition, prepreg, laminated sheet and semiconductor package - Google Patents

Resin composition, prepreg, laminated sheet and semiconductor package Download PDF

Info

Publication number
WO2003018675A1
WO2003018675A1 PCT/JP2002/008845 JP0208845W WO03018675A1 WO 2003018675 A1 WO2003018675 A1 WO 2003018675A1 JP 0208845 W JP0208845 W JP 0208845W WO 03018675 A1 WO03018675 A1 WO 03018675A1
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
resin composition
semiconductor package
thermosetting resin
laminated sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/008845
Other languages
English (en)
French (fr)
Inventor
Takeshi Hosomi
Masako Yamashita
Takayuki Baba
Kentaro Yabuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to KR1020047002910A priority Critical patent/KR100920535B1/ko
Priority to JP2003523530A priority patent/JP4133817B2/ja
Priority to HK05109244.0A priority patent/HK1077313B/xx
Priority to EP02772828A priority patent/EP1457515A4/en
Publication of WO2003018675A1 publication Critical patent/WO2003018675A1/ja
Priority to US10/789,914 priority patent/US7368497B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2002/008845 2001-08-31 2002-08-30 Resin composition, prepreg, laminated sheet and semiconductor package Ceased WO2003018675A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020047002910A KR100920535B1 (ko) 2001-08-31 2002-08-30 수지 조성물, 프리프레그, 적층판 및 반도체 패키지
JP2003523530A JP4133817B2 (ja) 2001-08-31 2002-08-30 樹脂組成物、プリプレグ、積層板および半導体パッケージ
HK05109244.0A HK1077313B (en) 2001-08-31 2002-08-30 Resin composition, prepreg, laminated sheet and semiconductor package
EP02772828A EP1457515A4 (en) 2001-08-31 2002-08-30 RESIN COMPOSITION, PREPREG, LAMINATE FILM AND SEMICONDUCTOR COMPONENT
US10/789,914 US7368497B2 (en) 2001-08-31 2004-02-27 Resin composition, prepreg, laminate, and semiconductor package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001264385 2001-08-31
JP2001-264385 2001-08-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/789,914 Continuation-In-Part US7368497B2 (en) 2001-08-31 2004-02-27 Resin composition, prepreg, laminate, and semiconductor package

Publications (1)

Publication Number Publication Date
WO2003018675A1 true WO2003018675A1 (en) 2003-03-06

Family

ID=19090990

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008845 Ceased WO2003018675A1 (en) 2001-08-31 2002-08-30 Resin composition, prepreg, laminated sheet and semiconductor package

Country Status (7)

Country Link
US (1) US7368497B2 (ja)
EP (1) EP1457515A4 (ja)
JP (3) JP4133817B2 (ja)
KR (1) KR100920535B1 (ja)
CN (1) CN100422244C (ja)
TW (1) TWI290942B (ja)
WO (1) WO2003018675A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097524A (ja) * 2003-09-05 2005-04-14 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
JP2005262513A (ja) * 2004-03-17 2005-09-29 Sumitomo Bakelite Co Ltd 絶縁層付き金属箔及び多層プリント配線板
WO2005092945A1 (ja) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
JP2006273950A (ja) * 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
CN100383965C (zh) * 2004-01-27 2008-04-23 卡西欧计算机株式会社 半导体器件及其制造方法
WO2008099596A1 (ja) * 2007-02-14 2008-08-21 Sumitomo Bakelite Co., Ltd. キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
JP2008254451A (ja) * 2008-06-23 2008-10-23 Matsushita Electric Works Ltd 金属箔付き絶縁シート
US8357859B2 (en) 2007-01-16 2013-01-22 Sumitomo Bakelite Co., Ltd. Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
JP5332608B2 (ja) * 2006-03-03 2013-11-06 住友ベークライト株式会社 中間層材料およびコンポジット積層板

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101973146B (zh) * 2005-09-30 2012-09-26 住友电木株式会社 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
US7682879B2 (en) * 2006-03-28 2010-03-23 Seagate Technology Llc Edge coating a microelectronic device
KR101360531B1 (ko) * 2006-04-28 2014-02-10 스미토모 베이클리트 컴퍼니 리미티드 땜납 레지스트 재료 및 그것을 이용한 배선판 및 반도체 패키지
WO2008093579A1 (ja) * 2007-01-29 2008-08-07 Sumitomo Bakelite Company Limited 積層体、基板の製造方法、基板および半導体装置
KR101409048B1 (ko) * 2007-02-16 2014-06-18 스미토모 베이클리트 컴퍼니 리미티드 회로 기판의 제조 방법, 반도체 제조 장치, 회로 기판 및 반도체 장치
KR100823998B1 (ko) * 2007-05-28 2008-04-23 전자부품연구원 동박적층판, 인쇄회로기판 및 동박적층판의 제조방법
KR100910767B1 (ko) * 2007-11-13 2009-08-04 삼성정밀화학 주식회사 함침성이 개선된 열가소성 수지 프리프레그의 제조방법 및그 방법에 의하여 제조된 열가소성 수지 프리프레그
KR20110121616A (ko) * 2009-02-12 2011-11-07 스미토모 베이클리트 컴퍼니 리미티드 배선판용 수지 조성물, 배선판용 수지 시트, 복합체, 복합체의 제조 방법 및 반도체 장치
TW201204548A (en) * 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
KR101933853B1 (ko) * 2010-04-05 2019-01-02 니토 보세키 가부시기가이샤 실리카 미립자 보유 유리 섬유 직물의 제조 방법, 실리카 미립자 보유 유리 섬유 직물 및 섬유 강화 수지 성형체
KR101233668B1 (ko) * 2010-12-23 2013-02-15 전자부품연구원 반도체 패키지 기판용 수지조성물
US8823186B2 (en) 2010-12-27 2014-09-02 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
WO2012124307A1 (ja) * 2011-03-14 2012-09-20 住友ベークライト株式会社 ビルドアップ用プリプレグ
US9818714B2 (en) 2011-09-02 2017-11-14 Lg Innotek Co., Ltd. Method of manufacturing substrate for chip packages and method of manufacturing chip package
TW201400294A (zh) * 2012-03-30 2014-01-01 Sumitomo Bakelite Co 被研磨物保持材及用於此之積層板
CN102676112B (zh) * 2012-06-08 2014-05-07 黑龙江省科学院石油化学研究院 低温固化氰酸酯胶粘剂及其制备方法
JP6343885B2 (ja) * 2013-08-02 2018-06-20 味の素株式会社 多層プリント配線板の製造方法
JP6277543B2 (ja) * 2013-11-27 2018-02-14 パナソニックＩｐマネジメント株式会社 コンポジット積層板及びその製造方法
KR101878478B1 (ko) * 2014-04-03 2018-07-13 주식회사 엘지화학 시아네이트계 수지에 대한 분산성이 우수한 실리카졸 조성물 및 이의 제조 방법
CN106459451B (zh) * 2014-06-09 2020-03-20 陶氏环球技术有限责任公司 用于制备可固化、多层纤维增强预浸材料的方法
CN104191794B (zh) * 2014-09-18 2015-12-30 苏州生益科技有限公司 一种层压板的制备方法
FI128003B (fi) 2016-03-24 2019-07-31 Metsaeliitto Osuuskunta Menetelmä puuviilutuotteen valmistamiseksi ja menetelmällä valmistettu puuviilutuote
KR102432295B1 (ko) * 2016-11-09 2022-08-11 쇼와덴코머티리얼즈가부시끼가이샤 프린트 배선판 및 반도체 패키지
JP6928908B2 (ja) * 2017-04-07 2021-09-01 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板及びフレックスリジッドプリント配線板
CN110181903B (zh) * 2019-06-06 2021-04-13 江门建滔电子发展有限公司 一种高频高速覆铜板及其制备方法
CN111690231A (zh) * 2020-06-08 2020-09-22 安徽宏飞钓具有限公司 基于高性能纤维复合材料军工产品外包装的制备方法
JP7739891B2 (ja) 2021-09-22 2025-09-17 富士フイルムビジネスイノベーション株式会社 静電荷像現像用トナー、静電荷像現像剤、トナーカートリッジ、プロセスカートリッジ、画像形成装置、及び画像形成方法

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JP2005097524A (ja) * 2003-09-05 2005-04-14 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグおよび積層板
CN100383965C (zh) * 2004-01-27 2008-04-23 卡西欧计算机株式会社 半导体器件及其制造方法
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KR101184139B1 (ko) * 2004-03-29 2012-09-18 스미토모 베이클라이트 가부시키가이샤 수지 조성물, 수지 부착 금속박, 기재 부착 절연시트 및다층 프린트 배선판
WO2005092945A1 (ja) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
US7655871B2 (en) 2004-03-29 2010-02-02 Sumitomo Bakelite Company Limited Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board
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US8357859B2 (en) 2007-01-16 2013-01-22 Sumitomo Bakelite Co., Ltd. Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
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US8637151B2 (en) 2007-02-14 2014-01-28 Sumitomo Bakelite Co., Ltd. Interlayer dielectric film with carrier material and multilayer printed circuit board therewith
JP2008254451A (ja) * 2008-06-23 2008-10-23 Matsushita Electric Works Ltd 金属箔付き絶縁シート

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CN1608100A (zh) 2005-04-20
EP1457515A1 (en) 2004-09-15
JP5573331B2 (ja) 2014-08-20
EP1457515A4 (en) 2004-11-24
JP2012031428A (ja) 2012-02-16
JP2010215911A (ja) 2010-09-30
KR20040029080A (ko) 2004-04-03
US20040234741A1 (en) 2004-11-25
JPWO2003018675A1 (ja) 2004-12-09
KR100920535B1 (ko) 2009-10-08
CN100422244C (zh) 2008-10-01
JP4133817B2 (ja) 2008-08-13
TWI290942B (en) 2007-12-11
US7368497B2 (en) 2008-05-06

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