WO2003059029A2 - Integrated sensor module and method for producing the same - Google Patents
Integrated sensor module and method for producing the same Download PDFInfo
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- WO2003059029A2 WO2003059029A2 PCT/DE2003/000044 DE0300044W WO03059029A2 WO 2003059029 A2 WO2003059029 A2 WO 2003059029A2 DE 0300044 W DE0300044 W DE 0300044W WO 03059029 A2 WO03059029 A2 WO 03059029A2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
Definitions
- the invention relates to an integrated sensor module, in particular for use in motor vehicles, and a method for its production.
- Sensors or groups of sensors for mobile applications must be provided with a sensor housing in order to protect sensitive sensor components.
- This sensor housing is typically often made of plastic.
- sensors are often coupled to further passive or active electronic components, which are typically arranged spatially separate from the sensor component itself.
- the sensor components are usually delivered from the manufacturer to a supplier, where they are further processed into a ready-to-install sensor module.
- the sensor component may be combined with the passive and active electronic components in
- Such a sensor module typically has connection lugs which, when the sensor module is installed, provide them with a soldered-on cable and are then used as a complete structural unit.
- Hall sensors which consist of a Hall coil and an associated evaluation circuit, may be considered as such sensor components for the sensor modules mentioned.
- An object of the invention is to provide an integrated sensor module that is well protected against mechanical influences and that is easy to assemble and disassemble.
- an integrated sensor module with an electronic sensor component which is enclosed by a sensor housing, comprises a connector housing which is fixedly connected to the sensor housing, for receiving active and / or passive electronic components.
- the sensor module further comprises contact connections protruding from the connector housing for the electrical connection of the sensor module to a circuit periphery by means of plug contacts.
- the integrated sensor module can be electrically connected to its intended installation location without soldering.
- the sensor module can be easily installed and replaced in the event of a repair.
- passive and / or active circuits can be integrated in the reinforced housing.
- the sensor housing and the connector housing are each designed as an essentially flat plastic housing.
- the contact connections are preferably designed as flat contact tabs that can be used for electrical connection with standard plugs.
- the robust and simple design made of plastic enables cost-effective production and a simple connection to an electrical circuit periphery without the need for soldered connections.
- Passive components such as resistors or capacitors can also be provided in the connector housing.
- the sensor housing and the connector housing adjoin one another directly, which leads to a particularly compact design.
- An alternative embodiment of the invention provides that the sensor housing and the plug housing are arranged at a distance from one another and are connected to one another by means of self-supporting, flat connecting contacts.
- the sensor can be mounted particularly close to its intended installation location, without the plug contacts or the connector housing being in the way when the installation space is tight.
- a mounting eyelet or the like on the sensor housing and / or on the connector housing. be provided which enables the components to be screwed together at the installation site.
- the connector housing can be connected to the connecting contacts in a particularly stable manner, which also permits rough handling under workshop conditions.
- An advantage of the integrated sensor module according to the invention is that it can be manufactured using a commercially available leadframe manufacturing method. In this way, large series of so-called benefits of sensor modules can be produced in very short clock cycles and then separated into individual sensor modules, for example. by mechanical sawing processes or by laser or water jet cutting or the like.
- the sensor and connector housings are preferably thermosetting plastic housings which are applied by means of transfer molding processes.
- the electronic sensor component in the sensor housing can be, for example, a non-contact Hall sensor or the like, as is necessary as a wheel speed sensor of an anti-lock braking system in a motor vehicle.
- a method according to the invention for producing an integrated sensor module comprises the following steps.
- An electronic sensor component is provided, which is mechanically and electrically conductively connected to connection contacts.
- At least one active and / or passive electronic component is provided, which is connected to the connection contacts. clocking as well as mechanically and electrically connected with contact connections.
- a plastic sensor housing is applied around the electronic sensor component and at least some of the connection contacts.
- a plastic connector housing is applied around the at least one active and / or passive electronic component and at least a part of the connection contacts and at least a part of the contact connections.
- the sensor module can advantageously be manufactured in standard assembly lines in semiconductor assembly.
- the contact connections are part of the connector housing and are handled as a so-called lead frame.
- the housings can be manufactured using the conventional transfer molding process.
- the connector housing and the contact connections can be specially adapted to customer requirements, depending on the desired application.
- the sensor module is mechanically protected by the relatively solid connector housing and the robust sensor housing. An additional casting process can therefore be omitted.
- FIG. 1 shows a first embodiment of an integrated sensor module according to the invention in a perspective schematic representation.
- FIG. 2 shows an alternative embodiment of the sensor module in a perspective schematic representation.
- FIG. 1 shows an integrated sensor module 2 according to the invention in a perspective schematic representation.
- the sensor module 2 comprises a flat sensor housing 4 and a flat plug housing 6 adjoining this, from which two contact connections 8 protrude.
- the sensor housing 4 can include, for example, a Hall sensor, an inductive sensor or the like.
- the connector housing 6 can preferably have additional passive and / or active electronic components contain. An electronic sensor component, which cannot be seen here because it is hidden by the sensor housing, is located in the sensor housing 4 and is electrically conductively connected to the components located in the connector housing 6 and to the contact connections 8.
- the sensor component can be processed particularly advantageously in a known leadframe production method to form the sensor module 2.
- the contact connections 8 reaching into the sensor housing 4 which is subsequently attached are referred to as so-called.
- Leadframe provided and mechanically and electrically connected to the sensor component. This connection can advantageously be established by a bonding technique. In the same way, this leadframe can be provided with the necessary passive and / or active electronic peripheral components.
- the leadframe is then encased with a commercially available duroplastic molding compound by means of the transfer molding process, as a result of which the finished sensor module 2 is produced, as shown by way of example in FIG. 1 and FIG.
- an elongated guide groove 12 is provided in a second surface 34 of the connector housing 6, into which a corresponding guide lug of a corresponding connector can engage and which prevents reverse polarity when connecting the connector.
- the transition edges between side surfaces 20 and surfaces 34 are each provided with bevels 14, which make it easier to push on a plug.
- FIG . 2 shows an alternative embodiment of the sensor module 2 according to the invention, in which the sensor housing 4 and the plug housing 6 are arranged at a distance from one another and are connected to one another in an electrically conductive and mechanical manner via self-supporting connecting contacts 10.
- the essentially Flat, metallic connecting contacts 10, which are encased with insulation, represent a connection between the second end face 26 of the sensor housing 4 and a third end face 28 of the plug housing 6.
- the remaining structure of the sensor module according to FIG. 2 corresponds to the first embodiment according to FIG.
- a method according to the invention for producing the integrated sensor module 2 is presented below with reference to FIGS. 1 and 2.
- An electronic sensor component is provided which is mechanically and electrically conductively connected to connection contacts 10.
- At least one active and / or passive electronic component is provided, which is mechanically and electrically conductively connected to the connection contacts 10 and to contact connections 8.
- a plastic sensor housing 4 is applied around the electronic sensor component and at least some of the connection contacts.
- a plastic connector housing 6 is applied around the at least one active and / or passive electronic component, at least a part of the connecting contacts 10 and at least a part of the contact connections 8.
- the sensor components are preferably manufactured using leadframe technology.
- the sensor housing 4 and the connector housing 6 can be applied, for example, using a conventional transfer molding method.
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Abstract
Description
Beschreibungdescription
Integriertes Sensormodul und Verfahren zu seiner HerstellungIntegrated sensor module and method for its manufacture
Die Erfindung betrifft ein integriertes Sensormodul, insbesondere zum Einsatz in Kraftfahrzeugen, und ein Verfahren zu seiner Herstellung.The invention relates to an integrated sensor module, in particular for use in motor vehicles, and a method for its production.
Sensoren bzw. Gruppen von Sensoren für mobile Anwendungen, wie sie beispielsweise im Kraftfahrzeug vorgesehen sind, müssen zum Schutz von empfindlichen Sensorbauteilen mit einem Sensorgehäuse versehen sein. Dieses Sensorgehäuse besteht typischerweise oftmals aus Kunststoff. Zusätzlich sind derartige Sensoren oftmals mit weiteren passiven oder aktiven elekt- ronische Bauteilen gekoppelt, die typischerweise räumlich getrennt vom Sensorbauteil selbst angeordnet sind. Die Sensorbauteile werden meist vom Hersteller an einen Zulieferer geliefert, bei dem die weitere Verarbeitung zum einbaufertigen Sensormodul erfolgt. Dabei wird das Sensorbauteil ggf. zusa - men mit den passiven und aktiven Elektronikbauteilen inSensors or groups of sensors for mobile applications, such as those provided for example in motor vehicles, must be provided with a sensor housing in order to protect sensitive sensor components. This sensor housing is typically often made of plastic. In addition, such sensors are often coupled to further passive or active electronic components, which are typically arranged spatially separate from the sensor component itself. The sensor components are usually delivered from the manufacturer to a supplier, where they are further processed into a ready-to-install sensor module. The sensor component may be combined with the passive and active electronic components in
Kunststoff vergossen. Ein solches Sensormodul weist typischerweise Anschlussfahnen auf, die im eingebauten Zustand des Sensormoduls mit einem angelöteten Kabel versehen und anschließend als komplette Baueinheit verwendet werden.Potted plastic. Such a sensor module typically has connection lugs which, when the sensor module is installed, provide them with a soldered-on cable and are then used as a complete structural unit.
Als derartige Sensorbauteile für die genannten Sensormodule kommen beispielsweise sog. Hall-Geber in Frage, die aus einer Hall-Spule und einer zugehörigen Auswerteschaltung bestehen.So-called Hall sensors, which consist of a Hall coil and an associated evaluation circuit, may be considered as such sensor components for the sensor modules mentioned.
Ein Ziel der Erfindung besteht darin, ein integriertes Sensormodul zur Verfügung zu stellen, das gut gegen mechanische Einwirkungen geschützt ist und das sich leicht montieren und demontieren lässt.An object of the invention is to provide an integrated sensor module that is well protected against mechanical influences and that is easy to assemble and disassemble.
Dieses Ziel der Erfindung wird mit dem Gegenstand der unabhängigen Ansprüche erreicht. Merkmale vorteilhafter Weiter- bildungen der Erfindung ergeben sich aus den abhängigen Ansprüchen.This object of the invention is achieved with the subject matter of the independent claims. Features of advantageous further formations of the invention result from the dependent claims.
Erfindungsgemäß umfasst ein integriertes Sensormodul mit ei- nem elektronischen Sensorbauteil, das von einem Sensorgehäuse umschlossen ist, ein mit dem Sensorgehäuse fest verbundenes Steckergehäuse zur Aufnahme von aktiven und/oder passiven e- lektronischen Bauteilen. Das Sensormodul umfasst weiterhin aus dem Steckergehäuse ragende Kontaktanschlüsse zur elektri- sehen Verbindung des Sensormoduls mit einer Schaltungsperipherie mittels Steckkontakten.According to the invention, an integrated sensor module with an electronic sensor component, which is enclosed by a sensor housing, comprises a connector housing which is fixedly connected to the sensor housing, for receiving active and / or passive electronic components. The sensor module further comprises contact connections protruding from the connector housing for the electrical connection of the sensor module to a circuit periphery by means of plug contacts.
Durch eine Kombination eines Sensorgehäuses mit einem Stecker kann das integrierte Sensormodul ohne Löten an seinem vorge- sehenen Einbauort elektrisch angeschlossen werden. Besonders in speziellen Anwendungsfällen für Sensoren im Automobilbereich wie beispielsweise ABS-Sensoren kann das Sensormodul leicht montiert und im Reparaturfall ausgetauscht werden. Zusätzlich können im verstärkten Gehäuse passive und/oder akti- ve Schaltungen integriert werden.By combining a sensor housing with a plug, the integrated sensor module can be electrically connected to its intended installation location without soldering. Especially in special applications for sensors in the automotive sector, such as ABS sensors, the sensor module can be easily installed and replaced in the event of a repair. In addition, passive and / or active circuits can be integrated in the reinforced housing.
Eine Ausführungsform der Erfindung sieht vor, dass das Sensorgehäuse und das Steckergehäuse jeweils als im wesentlichen flache Kunststoffgehäuse ausgebildet sind. Die Kontaktan- Schlüsse sind vorzugsweise als flache Kontaktfahnen ausgebildet, die zur elektrischen Verbindung mit Standardsteckern dienen können. Die robuste und einfache Bauweise aus Kunststoff ermöglichen kostengünstige Fertigung sowie eine einfache Verbindung mit einer elektrischen Schaltungsperipherie, ohne dass Lötverbindungen notwendig sind. Gerade im Steckergehäuse können auch passive Bauteile wie Widerstände oder Kondensatoren vorgesehen werden.One embodiment of the invention provides that the sensor housing and the connector housing are each designed as an essentially flat plastic housing. The contact connections are preferably designed as flat contact tabs that can be used for electrical connection with standard plugs. The robust and simple design made of plastic enables cost-effective production and a simple connection to an electrical circuit periphery without the need for soldered connections. Passive components such as resistors or capacitors can also be provided in the connector housing.
Gemäß einer ersten Ausführungsform der Erfindung grenzen Sen- sorgehäuse und Steckergehäuse unmittelbar aneinander, was zu einer besonders kompakten Bauform führt. Eine alternative Ausführungsform der Erfindung sieht vor, dass Sensorgehäuse und Steckergehäuse beabstandet voneinander angeordnet und mittels freitragender, flacher Verbindungskontakte miteinander verbunden sind. Der Sensor kann bei dieser alternativen Bauform besonders nahe an seinem vorgesehenen Einbauort montiert werden, ohne dass die Steckkontakte bzw. das Steckergehäuse bei engem Einbauraum im Wege stehen würden. Ggf. kann am Sensorgehäuse und/oder am Steckergehäuse eine Montageöse oder dgl . vorgesehen sein, die eine Ver- schraubung der Bauteile am Einbauort ermöglicht. Das Steckergehäuse kann dabei besonders stabil mit den Verbindungskon- takten verbunden werden, was auch eine grobe Handhabung unter Werkstattbedingungen zuläßt.According to a first embodiment of the invention, the sensor housing and the connector housing adjoin one another directly, which leads to a particularly compact design. An alternative embodiment of the invention provides that the sensor housing and the plug housing are arranged at a distance from one another and are connected to one another by means of self-supporting, flat connecting contacts. With this alternative design, the sensor can be mounted particularly close to its intended installation location, without the plug contacts or the connector housing being in the way when the installation space is tight. Possibly. can a mounting eyelet or the like on the sensor housing and / or on the connector housing. be provided which enables the components to be screwed together at the installation site. The connector housing can be connected to the connecting contacts in a particularly stable manner, which also permits rough handling under workshop conditions.
Ein Vorteil des erfindungsgemäßen integrierten Sensormoduls liegt darin, dass es mittels handelsüblichem Leadframe- Herstellungsverfahren gefertigt werden kann. Auf diese Weise können große Serien von sog. Nutzen von Sensormodulen in sehr kurzen Taktzyklen gefertigt und anschließend zu einzelnen Sensormodulen vereinzelt werden, bpsw. durch mechanische Sägeverfahren oder durch Laser- oder Wasserstrahlschneiden oder dgl. Das Sensor- und das Steckergehäuse sind vorzugsweise duroplastische Kunststoffgehäuse, die mittels Transfer-Molding- Verfahren aufgebracht sind.An advantage of the integrated sensor module according to the invention is that it can be manufactured using a commercially available leadframe manufacturing method. In this way, large series of so-called benefits of sensor modules can be produced in very short clock cycles and then separated into individual sensor modules, for example. by mechanical sawing processes or by laser or water jet cutting or the like. The sensor and connector housings are preferably thermosetting plastic housings which are applied by means of transfer molding processes.
Das elektronische Sensorbauteil im Sensorgehäuse kann beispielsweise ein berührungslos arbeitender Hall-Sensor oder dergleichen sein, wie er als Raddrehzahlsensor eines Antiblo- ckiersystems im Kraftfahrzeug notwendig ist.The electronic sensor component in the sensor housing can be, for example, a non-contact Hall sensor or the like, as is necessary as a wheel speed sensor of an anti-lock braking system in a motor vehicle.
Ein erfindungsgemäßes Verfahren zur Herstellung eines integrierten Sensormoduls gemäß einem der zuvor beschriebenen Ausführungsformen umfasst die folgenden Schritte. Es wird ein elektronisches Sensorbauteil bereitgestellt, das mit Verbin- dungskontakten mechanisch und elektrisch leitend verbunden wird. Es wird wenigstens ein aktives und/oder passives elektronisches Bauteil bereitgestellt, das mit den Verbindungskon- takten sowie mit Kontaktanschlüssen mechanisch und elektrisch leitend verbunden wird. Um das elektronische Sensorbauteil und um zumindest einen Teil der Verbindungskontakte wird ein Sensorgehäuse aus Kunststoff aufgebracht. Um das wenigstens eine aktive und/oder passive elektronische Bauteil und um zumindest einen Teil der Verbindungskontakte und um zumindest einen Teil der Kontaktanschlüsse, wird ein Steckergehäuse aus Kunststoff aufgebracht.A method according to the invention for producing an integrated sensor module according to one of the previously described embodiments comprises the following steps. An electronic sensor component is provided, which is mechanically and electrically conductively connected to connection contacts. At least one active and / or passive electronic component is provided, which is connected to the connection contacts. clocking as well as mechanically and electrically connected with contact connections. A plastic sensor housing is applied around the electronic sensor component and at least some of the connection contacts. A plastic connector housing is applied around the at least one active and / or passive electronic component and at least a part of the connection contacts and at least a part of the contact connections.
Das Sensormodul kann vorteilhaft in Standardmontagelinien in der Halbleitermontage gefertigt werden. Die Kontaktanschlüsse sind Teil des Steckergehäuses und werden als sogenannter Leadframe gehandhabt. Die Gehäuse können im herkömmlichen Transfermold-Verfahren hergestellt werden. Das Steckergehäuse und die Kontaktanschlüsse können je nach gewünschtem Anwendungsfall speziell an Kundenanforderungen angepasst werden. Durch das relativ massive Steckergehäuse und das robuste Sensorgehäuse ist das Sensormodul mechanisch geschützt. Ein zusätzlicher Vergießprozess kann somit entfallen.The sensor module can advantageously be manufactured in standard assembly lines in semiconductor assembly. The contact connections are part of the connector housing and are handled as a so-called lead frame. The housings can be manufactured using the conventional transfer molding process. The connector housing and the contact connections can be specially adapted to customer requirements, depending on the desired application. The sensor module is mechanically protected by the relatively solid connector housing and the robust sensor housing. An additional casting process can therefore be omitted.
Die Erfindung wird nun anhand von Ausführungsformen mit Bezug auf die beiliegenden Figuren näher erläutert.The invention will now be explained in more detail by means of embodiments with reference to the accompanying figures.
Figur 1 zeigt eine erste Ausführungsform eines erfindungs- gemäßen integrierten Sensormoduls in perspektivischer Schemadarstellung. Figur 2 zeigt eine alternative Ausführungsform des Sensormoduls in perspektivischer Schemadarstellung.FIG. 1 shows a first embodiment of an integrated sensor module according to the invention in a perspective schematic representation. FIG. 2 shows an alternative embodiment of the sensor module in a perspective schematic representation.
Figur 1 zeigt ein erfindungsgemäßes, integriertes Sensormodul 2 in perspektivischer Schemadarstellung. Das Sensormodul 2 umfasst ein flaches Sensorgehäuse 4 und ein an dieses grenzendes, flaches Steckergehäuse 6, aus dem zwei Kontaktanschlüsse 8 herausragen. Das Sensorgehäuse 4 kann beispiels- weise einen Hall-Sensor, einen induktiven Sensor oder dergleichen beinhalten. Das Steckergehäuse 6 kann vorzugsweise zusätzliche passive und/oder aktive elektronische Bauelemente enthalten. Ein - hier nicht erkennbares, weil vom Sensorgehäuse verdecktes - im Sensorgehäuse 4 befindliches elektronisches Sensorbauteil ist mit den im Steckergehäuse 6 befindlichen Komponenten sowie mit den Kontaktanschlüssen 8 elekt- risch leitend verbunden.FIG. 1 shows an integrated sensor module 2 according to the invention in a perspective schematic representation. The sensor module 2 comprises a flat sensor housing 4 and a flat plug housing 6 adjoining this, from which two contact connections 8 protrude. The sensor housing 4 can include, for example, a Hall sensor, an inductive sensor or the like. The connector housing 6 can preferably have additional passive and / or active electronic components contain. An electronic sensor component, which cannot be seen here because it is hidden by the sensor housing, is located in the sensor housing 4 and is electrically conductively connected to the components located in the connector housing 6 and to the contact connections 8.
Das Sensorbauteil kann besonders vorteilhaft in einem bekannten Leadframe-Herstellungsverfahren zum Sensormodul 2 verarbeitet werden. Hierbei werden die in das später aufgebrachte Sensorgehäuse 4 reichenden Kontaktanschlüsse 8 als sog.The sensor component can be processed particularly advantageously in a known leadframe production method to form the sensor module 2. In this case, the contact connections 8 reaching into the sensor housing 4 which is subsequently attached are referred to as so-called.
Leadframe zur Verfügung gestellt und mit dem Sensorbauteil mechanisch und elektrisch leitend verbunden. Diese Verbindung kann in vorteilhafter Weise durch eine Bondtechnik hergestellt werden. Auf gleiche Weise kann dieser Leadframe mit den notwendigen passiven und/oder aktiven elektronischen Peripheriebauteilen versehen werden. Anschließend wird der Leadframe mittels Transfer-Molding-Verfahren mit einer handelsüblichen Duroplast-Pressmasse umhüllt, wodurch das fertige Sensormodul 2, wie in Figur 1 und Figur 2 beispielhaft dargestellt, entsteht.Leadframe provided and mechanically and electrically connected to the sensor component. This connection can advantageously be established by a bonding technique. In the same way, this leadframe can be provided with the necessary passive and / or active electronic peripheral components. The leadframe is then encased with a commercially available duroplastic molding compound by means of the transfer molding process, as a result of which the finished sensor module 2 is produced, as shown by way of example in FIG. 1 and FIG.
Zum passgenauen Verbinden mit einem entsprechend an die Kontaktanschlüsse 8 anschließbaren Stecker ist in einer zweiten Oberfläche 34 des Steckergehäuses 6 eine längliche Führungs- nut 12 vorgesehen, in die eine entsprechende Führungsnase eines korrespondierenden Steckers eingreifen kann und die eine Verpolung beim Anschließen des Steckers verhindert. Über eine bestimmte Länge sind die Übergangskanten zwischen Seitenflächen 20 und Oberflächen 34 jeweils mit Abschrägungen 14 ver- sehen, die ein leichteres Aufschieben eines Steckers ermöglichen.For a precisely fitting connection to a connector that can be connected appropriately to the contact connections 8, an elongated guide groove 12 is provided in a second surface 34 of the connector housing 6, into which a corresponding guide lug of a corresponding connector can engage and which prevents reverse polarity when connecting the connector. Over a certain length, the transition edges between side surfaces 20 and surfaces 34 are each provided with bevels 14, which make it easier to push on a plug.
Figur' 2 zeigt eine alternative Ausführungsform des erfindungsgemäßen Sensormoduls 2, bei dem Sensorgehäuse 4 und Ste- ckergehäuse 6 beabstandet voneinander angeordnet und über freitragende Verbindungskontakte 10 miteinander elektrisch leitend und mechanisch verbunden sind. Die im wesentlichen flachen, metallischen Verbindungskontakte 10, die mit einer Isolierung ummantelt sind, stellen eine Verbindung zwischen zweiter Stirnfläche 26 des Sensorgehäuses 4 und einer dritten Stirnfläche 28 des Steckergehäuses 6 dar. Aus der vierten Stirnfläche 30 ragen die im wesentlichen parallel zu den Verbindungskontakten 10 orientierten Kontaktanschlüsse 8. Der übrige Aufbau des Sensormoduls gemäß Figur 2 entspricht der ersten Ausführung gemäß Figur 1.FIG . 2 shows an alternative embodiment of the sensor module 2 according to the invention, in which the sensor housing 4 and the plug housing 6 are arranged at a distance from one another and are connected to one another in an electrically conductive and mechanical manner via self-supporting connecting contacts 10. The essentially Flat, metallic connecting contacts 10, which are encased with insulation, represent a connection between the second end face 26 of the sensor housing 4 and a third end face 28 of the plug housing 6. The contact connections 8, which are oriented essentially parallel to the connecting contacts 10, protrude from the fourth end face 30 The remaining structure of the sensor module according to FIG. 2 corresponds to the first embodiment according to FIG.
Im folgenden wird anhand der Figuren 1 und 2 ein erfindungsgemäßes Verfahren zur Herstellung des integrierten Sensormoduls 2 vorgestellt. Es wird ein elektronisches Sensorbauteil bereitgestellt, das mit Verbindungskontakten 10 mechanisch und elektrisch leitend verbunden wird. Es wird wenigstens ein aktives und/oder passives elektronisches Bauteil bereitgestellt, das mit den Verbindungskontakten 10 sowie mit Kontaktanschlüssen 8 mechanisch und elektrisch leitend verbunden wird. Um das elektronische Sensorbauteil und um zumindest einen Teil der Verbindungskontakte wird ein Sensorgehäuse 4 aus Kunststoff aufgebracht. Um das wenigstens eine aktive und/oder passive elektronische Bauteil, um zumindest einen Teil der Verbindungskontakte 10 und um zumindest einen Teil der Kontaktanschlüsse 8 wird ein Steckergehäuse 6 aus Kunststoff aufgebracht.A method according to the invention for producing the integrated sensor module 2 is presented below with reference to FIGS. 1 and 2. An electronic sensor component is provided which is mechanically and electrically conductively connected to connection contacts 10. At least one active and / or passive electronic component is provided, which is mechanically and electrically conductively connected to the connection contacts 10 and to contact connections 8. A plastic sensor housing 4 is applied around the electronic sensor component and at least some of the connection contacts. A plastic connector housing 6 is applied around the at least one active and / or passive electronic component, at least a part of the connecting contacts 10 and at least a part of the contact connections 8.
Die Sensorbauelemente werden vorzugsweise in Leadframe- Technik gefertigt. Das Sensorgehäuse 4 und das Steckergehäuse 6 können beispielsweise mit einem herkömmlichen Transfermolding-Verfahren aufgebracht werden. The sensor components are preferably manufactured using leadframe technology. The sensor housing 4 and the connector housing 6 can be applied, for example, using a conventional transfer molding method.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002101000 DE10201000A1 (en) | 2002-01-11 | 2002-01-11 | Integrated sensor module and method for its manufacture |
| DE10201000.5 | 2002-01-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2003059029A2 true WO2003059029A2 (en) | 2003-07-17 |
| WO2003059029A3 WO2003059029A3 (en) | 2003-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/DE2003/000044 Ceased WO2003059029A2 (en) | 2002-01-11 | 2003-01-09 | Integrated sensor module and method for producing the same |
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| DE (1) | DE10201000A1 (en) |
| WO (1) | WO2003059029A2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005016648A1 (en) * | 2005-04-12 | 2006-10-19 | Bayerische Motoren Werke Ag | Function e.g. safety function, controlling device for motor vehicle, has sensor component, and electrical control connected to control unit and applied based on output of analysis of electrical current generated in connecting cable |
| DE102011052809A1 (en) * | 2011-08-18 | 2013-03-14 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Mounting arrangement for parking assistance sensor used in motor vehicle, has housing portions that are provided with electrical connection units and guide surfaces which are connected at junction box portion |
| DE102016203560B4 (en) | 2016-03-04 | 2025-10-16 | Schaeffler Technologies AG & Co. KG | Actuator arrangement with a sensor module for an actuator with a movable armature |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT214347Z2 (en) * | 1988-03-31 | 1990-05-03 | Veglia Borletti Srl | PERFECTED TYPE TRANSDUCER |
| DE3812182C2 (en) * | 1988-04-13 | 1997-05-15 | Teves Gmbh Alfred | Transducers, in particular ultrasound transducers for a distance measuring device installed in a motor vehicle |
| JPH05166977A (en) * | 1991-12-17 | 1993-07-02 | Witco Of Jupiter Dentsu Kk | Molded semiconductor sensor holder |
| DE4323084A1 (en) * | 1993-07-10 | 1995-01-12 | Vdo Schindling | Inductive tachometer generator (tacho-generator, tacho) and method for producing it |
| DE4327584A1 (en) * | 1993-08-17 | 1995-02-23 | Bayerische Motoren Werke Ag | Electric drive unit |
| JPH0766356A (en) * | 1993-08-30 | 1995-03-10 | Nec Corp | Chip part mounting structure |
| DE4340177A1 (en) * | 1993-11-25 | 1995-06-01 | Mannesmann Kienzle Gmbh | Sensor |
| JPH0821775A (en) * | 1994-07-08 | 1996-01-23 | Fuji Koki Seisakusho:Kk | Pressure sensor |
| DE4426812A1 (en) * | 1994-07-28 | 1996-02-08 | Siemens Ag | Water-tight housing for electronic switching device |
| DE19504608C2 (en) * | 1995-02-11 | 2002-03-21 | Balluff Gebhard Feinmech | Position sensor and method for manufacturing the same |
| DE19544660A1 (en) * | 1995-11-30 | 1997-06-05 | Bosch Gmbh Robert | Plug fitment for electrical equipment |
| DE19621000C2 (en) * | 1996-05-24 | 1999-01-28 | Heraeus Sensor Nite Gmbh | Temperature sensor with a measuring resistor |
| JPH11153452A (en) * | 1997-11-20 | 1999-06-08 | Hitachi Ltd | Rotation detection device |
| DE19748982A1 (en) * | 1997-11-06 | 1999-06-02 | Bosch Gmbh Robert | Component holder for a Hall sensor and method for producing a component holder |
| DE19938868B4 (en) * | 1999-08-17 | 2005-11-24 | Siemens Ag | Sensor device and method for producing a sensor device |
| DE29916221U1 (en) * | 1999-09-15 | 1999-12-30 | Ab Elektronik Gmbh, 59368 Werne | Crankshaft encoder |
| DE10014992C2 (en) * | 2000-03-25 | 2002-01-31 | Bosch Gmbh Robert | sensor arrangement |
-
2002
- 2002-01-11 DE DE2002101000 patent/DE10201000A1/en not_active Ceased
-
2003
- 2003-01-09 WO PCT/DE2003/000044 patent/WO2003059029A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003059029A3 (en) | 2003-11-13 |
| DE10201000A1 (en) | 2003-07-31 |
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