DE102007039618A1 - Module for integrated control electronics with simplified design - Google Patents

Abstract

The invention relates to a module for an integrated control electronics with at least one housing cover and a base element (2) as an electrical connection between the housing interior and outside of the housing components, wherein the base element (2) support for the electronic components of the central control electronics and at the same time thermal connection is at the bottom plate and from at least two electrically and mechanically directly interconnected two- or multi-layer printed circuit boards (1 a, 1 b) is formed, which are constructed the same or different. The invention further relates to the production of such a module and its use.

Description

The The invention relates to a module for an integrated control electronics according to the preamble of claim 1 and a method for producing such a module, in particular for gear or motor controls in the automotive industry.

State of the art

In automotive technology, components such as transmission, engine or braking systems increasingly predominantly electronically controlled. in this connection is there a move towards integrated mechatronic controls, So for the integration of control electronics and the associated electronic components such as sensors or valves in the transmission, the engine or the braking system. Controllers have so generally have a variety of electronic components, which in conjunction with other components outside the Control unit stand. In such "on-the-spot electronics" these controllers are no longer protected in a separate Housed electronics room and must therefore appropriate Environmental influences and mechanical, thermal and chemical Withstand stresses.

she are usually used for this purpose in special housings used. In addition, the housings fulfill an important Shielding function. To have a reliable connection to outside to allow components lying on the housing is an electrical connection from the inside of the housing to Housing outside necessary. The distribution of Electrical signals and currents are used in current series applications by punched grid (leadframes) or by using flexible circuit boards (FPCB) realized.

The usual Setup for such integrated mechatronic applications consists of a ceramic substrate, which is the various electronic Includes components of the central control unit. This ceramic Substrate is made by bonding with rigid or flexible printed circuit boards connected to the connection of the peripheral components to the central unit to enable. As already described, for example Transmission control modules housed in transmission oil sump and therefore completely with oil and the contained therein surrounded by conductive contamination. This can be for example Contaminations from tooth wear, machining residues from manufacturing processes or inadequate washing and cleaning processes of the Be gear housing and / or the installed components. For the necessary protection against such contamination, against damage and trace or bond shorts becomes a cap, usually as a metallic, non-metallic or metallized housing cover, applied to the housing bottom plate and hermetically sealed. This Overall composite of ceramic substrate, printed circuit boards and their Connection to the electronic connection of the periphery as well as hermetically sealed Housing is a significant cost driver. Just that preferably used as a circuit carrier LTCCs (Low Temperature co-fired ceramics), which contribute to mechanical stability and thermal connection are applied to a base plate, provide a big cost factor of the entire component dar. Your electronic connection via flexible circuit boards or Punching grid to the outside of the sealed housing lying components is also expensive and therefore costly.

It is known PCB (Printed Circuit Boards) as a signal and power distribution components use. Should an electronic connection between two PCBs be prepared, this is usually with a separate plug, a so-called press fit interconnector, realized that on two sides at least one pressfit pin or has a pressfit pin area. The disadvantage is that such Plug must be individually designed and made. moreover is the installation and connection step of the connector to the printed circuit boards an additional process, the corresponding quality requirements has to suffice and is expensive.

In the US 6,691,408 is an electrical connection of two printed circuit boards described. In one of the printed circuit boards to be mounted separately electrical connection elements on at least one end face the circuit board. These electrical connection elements can be inserted into corresponding recesses of a second circuit board to make an electrical connection. The production and molding of these separate fasteners is very expensive. Another disadvantage is that the resulting compound has low stability.

From the US 2004214466 AA It is known to shorten the length of the signal and current paths in the connection of two PCB circuit boards, wherein two PCBs are provided here in each case over the width of their front side comb-like with a plurality of recesses, each having at least one electrical contact. The end faces of the two PCBs are matched with their recesses, so that they can be pushed into each other and contacted via bonds with each other. The contacts must therefore be made consuming and also be protected by additional measures against conductive contamination from short circuits. The production of the plurality of recesses is very critical and expensive, especially with regard to the tolerances to be complied with. In addition, the stability of the resulting printed circuit board assembly is low vertical to the various layers of the circuit boards and to the recesses.

task

task The invention is therefore a module for an integrated Control electronics with a housing, housed therein central control unit comprising various electronic components and an electronic connection between the housing interior and to provide the housing exterior, which a simple and flexible connection to outside the Housing lying components allows, where the electronic connection and the central control unit with favorable utilization of utilization a simplified and therefore has less expensive construction and at the same time safely protected against short circuits and / or conductive contamination is.

This is according to the invention with a device accordingly of claim 1 and a method of manufacture achieved such a device according to claim 10.

According to the invention a module for an integrated control electronics with at least one housing cover and a base element as electrical connection between the housing interior and proposed outside of the housing components, in which the base element carrier for the electronic Components of the central control electronics and at the same time thermal Connection to the bottom plate is made up of at least two electric and mechanically directly interconnected two or more layers PCB circuit boards is formed, the same or different are constructed.

With In other words, according to the invention, a printed circuit board composite of at least two electrically and mechanically directly with each other connected two- or multi-layer PCB PCB as a base element used for signal and potential distribution, which continues to the carries electronic components of the central control unit and also the derivation of the heat generated by the power units ensures.

Prefers can according to the invention cost-effective, two- or multi-layer standard PCB circuit boards for the Training the base element can be used. advantageously, can with PCB PCBs over the punched grid technology very much fine line structures can be realized. Furthermore can the multilayer design of the circuit boards for unbundling the signal and current paths are used. Furthermore you can by a simple punching process advantageously variable application-specific Outside contours of the PCB are formed.

Under direct connection of the at least two PCB is understood according to the invention, that the connection is realized without a separate plug, so that the number of parts and interfaces can be minimized. Thus, over the usual one described above Connection through plug mechanical fastening and electrical Connection of the at least two PCB simplified to the base element and therefore manufactured more cheaply. To this It also significantly reduces the number of interfaces and at the same time the length of the signal and current paths clearly shortened and minimized. The direct connection The PCBs according to the invention also the advantage that the electrical connection is no longer accessible is and therefore without an additional cover or seal against contamination, especially against metallic chips or particles and short circuits caused thereby, is protected.

The At least two PCBs can be the same or different be constructed. For example, they can be different Layers, in particular layers with different copper thicknesses, conductor track widths or layer numbers be constructed. This is advantageous a complex printed circuit board construction of the base element, a good benefit utilization and a variable adaptation to different requirements and applications possible.

In In a preferred embodiment, at least one PCB of the base element be at least partially deformable. This will make it possible for example, by bending the PCB, even three-dimensional structures to create. The deformability can, for example, by PCB areas which are a very thin core and very thin Have copper surfaces. The core can be for example one Thickness of 0.15 mm and the copper surfaces a thickness of 35 μm.

In a preferred embodiment of the invention, the direct connection of the PCBs can be realized by oppositely configured edges. According to the invention, this is understood to mean that the edges in one PCB can be milled from above and the other from below in such a way that the respective surfaces formed are substantially matched to one another. The edges are galvanically contacted with each other on their mutually facing surfaces. The contact points are subsequently no longer accessible, so that an additional cover to protect against conductive contamination is no longer necessary. To the electrical contact, the circuit boards can be connected to each other, for example by soldering or welding.

equally Preferably, the direct connection of the printed circuit boards as a groove and spring connection be configured. According to the invention is hereunder understood that essentially the entire width of the front page a circuit board as a groove and a second circuit board designed as a spring. This embodiment is in Especially vertical to the layer structure of printed circuit boards especially stable.

Around to increase the mechanical strength of the connection of the PCBs may additionally in a further embodiment supporting rivets, screws and / or hot caulking, Lamination or gluing be provided.

In In a particularly preferred embodiment of the invention, the electrical and mechanical connection in a parallel process be made possible that means to be done simultaneously. Especially can by soldering the galvanic contacting and the mechanical stabilization and attachment by gluing or laminating will be realized. The parallel connection process can be so be configured that each solder pads on the connecting Printed circuit boards are attached and these are placed on each other and continue on at least one PCB page, for example an adhesive film, in particular acrylic adhesive film, is provided. In the following, the introduction of pressure and temperature, for example, with a heat-seal press, a solder joint produced while the adhesive crosslinked and cured become. This has the advantage that the solder joint, the usual Transmission temperatures above 150 ° C to holding power can lose, due to the additional mechanical bonding is stabilized all around. The production of permanent connection in a parallel process step is also in the Comparison with the execution in two consecutive Steps particularly cost-effective.

Under Carrier for the electronic components of the central Control unit is understood according to the invention, that the usual ceramic substrates with the integrated therein electronic components of the control electronics on the base element can be applied. According to the invention preferred can the electronic components of the control electronics also be integrated directly in the base element. In this preferred Design can be the use of expensive ceramic circuit board such as LTCCs (Low Temperature Co-fired Ceramics) or HTCs (High Temperature Ceramics) and their connection by means of rigid or flexible printed circuit boards to the peripheral components avoided become.

In In another preferred embodiment, the electronic Components of the central control electronics in one or more Be integrated circuit board of the base element. As electronic Components can, for example, printed resistors or capacities, also called conduits or areas can be executed, as well as chips or complex Chips (ICs) are used. In this way are an increased Long-term stability and excellent connection to Ensures the signal and potential distribution.

By the modules according to the invention can be advantageous the carrier effect, the signal and potential distribution and the thermal connection to the heat-dissipating bottom plate or mounting of a single component, namely the Basic element. The bottom plate according to the invention also for example, be a hydraulic plate. That way you can significant costs of the ceramic LTCCs and their complex connection to the heat dissipation and the peripheral components like Sensors, valves or other actuators, opposite this previously customary form and use can be avoided.

Around to achieve an improved and more defined heat dissipation can the module of the invention in a preferred Training to be laminated to a bottom plate. The bottom plate is preferably made of a metallic material, especially it is preferably made of aluminum. In a preferred embodiment the invention, the multilayer printed circuit board on the metallic bottom plate laminated. This represents a reliable and cost effective Fixation sure. In addition, in this way a seal of the Electronics space down, for example, to the transmission oil reached. The housing cover can be made of any material, That is a secure cover of the surface of the electronics compartment allowed with the components of the central control unit and at the same time brings the necessary EMC shielding values. For example can be used a metallized plastic molded body become. In an advantageous embodiment of the housing cover but also of a metallic material such as steel sheet manufactured. This results in an increased long-term stability and improved shielding over the lifetime the electronic control device. In addition, an improved Achieved diffusion density.

In a preferred embodiment of the invention, the multilayer printed circuit boards of the base element may be different vias for thermal connection to the bottom plate and for electronic connection to the outside of the housing have the components. The term Via (Vertical Interconnection Access) is understood according to the invention as a via, which is arranged between the interconnect levels of a multilayer printed circuit board. With the help of vias, it is also possible to change the printed circuit levels in two- or multi-layer printed circuit boards. This is particularly advantageous in terms of good unbundling of complex circuits.

In In a preferred embodiment, the electronic connection the outside of the housing components executed by means of press-fitting and / or laser welding become. About so-called pressfit pins in the press-fitting technology can a variable, simple and secure electronic connection to the peripheral components are produced. equally Preferably, this compound can be used depending on the requirement of the component also be produced by laser welding. As a general rule The type of connection is not critical and can be after the respective requirements of the components and the existing process equipment be selected from known in the art methods. For example, the connections can be releasable as a plug or not solvable by, for example, soldering or welding. The base element becomes particularly preferably directly with the signal transmitters and receivers (especially sensors, valves, etc.) outside of the housing connected.

The electronic components of the central control electronics can preferably by means of soldering or gluing on the base element attached and / or contacted. The soldering process can, for example a reflow soldering process.

to Production of a module according to the invention for An electronic control unit can at least two two- or multi-layer printed circuit boards directly to each other electrically and mechanically connected to a base member and the base member with the electronic components of the central control electronics be mounted on a base plate and with the components lying outside the housing connected and subsequently attached to the housing cover. In the sequence, the placement of the base element with the electronic components either before or after application done on the bottom plate. According to the invention one or more printed circuit boards of the base element with electronic Be equipped components. The electronic components can at least partially integrated in the base element.

In further embodiments of the invention Method can be the mechanical and electrical connection of printed circuit boards to the basic element in successive process steps or be prepared in a parallel step. The execution in a parallel, that means at the same time, performed step is particularly cost-effective and therefore preferred according to the invention. In a Particularly preferred embodiment, the electrical Connection by soldering or welding and the mechanical connection of printed circuit boards by lamination or gluing getting produced.

The Invention will be described below by way of example with reference to various Embodiments explained in conjunction with the drawings, without being limited thereto.

In show this:

1a and 1b a schematic sectional view of two PCB printed circuit boards in the manufacture of a base member via oppositely running edges for a module according to the invention.

2a and 2 B a schematic sectional view of two PCB printed circuit boards in the manufacture of a base member via a tongue and groove joint for a module according to the invention.

3 a schematic representation of the production direct connection of two PCBs in a parallel process step.

3a and 3c are doing as sectional views and 3b shown as a top view.

1a shows a schematic sectional view of two PCB boards 1a . 1b for the production of a basic element 2 over oppositely designed edges 3a . 3b for a module according to the invention. The first PCB 1a can do this from the top and the second PCB 1b be milled from below so that in each case a protruding edge 3a and 3b is formed, each having on its surface an exposed copper layer area 4a . 4b wearing. These exposed copper layer areas 4a . 4b are then available, for example, for a soldering or welding connection process. The edges 3a and 3b can be designed so that they are exactly matched in their dimensions and the two PCB 1a . 1b can be connected directly to each other electrically and mechanically. Advantageously, according to the invention, no additional connecting elements, such as pressfit pins, are required for this purpose. Through the connection process designed in this way, the electrical contacting of the Lei terplatten 1a . 1b be completely covered, so that protection against metallic contamination, such as chips or particles, a short circuit caused thereby is ensured. An additional cover or protective device is therefore not necessary according to the invention. In the embodiment shown, the PCBs are 1a and 1b built differently. The PCB 1a For example, has only two inner copper layers 5a on while the PCB 1b four inner copper layers 5b has. Due to the possible different technological structure of the PCBs 1a and 1b It is advantageously possible in a simple manner to provide very complex printed circuit board structures. The basic element 2 The module according to the invention can be variably adapted to a wide variety of requirements and applications. In the embodiment shown, both circuit boards carry 1a . 1b electronic components 6a . 6b , The electrical connection of the electronic components 6a . 6b on the circuit boards 1a and or 1b For example, by bonding 7 respectively. The mechanical fastening of the components 6a . 6b can be achieved by standard soldering, such as reflow soldering, or by gluing. The electronic connection of peripheral components can be done, for example, with a Pressfit connection by Pressfit pins or by laser welding. The electrical components of the control electronics may alternatively be integrated in one or both printed circuit boards. In addition, the printed circuit boards can have different vias 8th For example, for heat dissipation and / or electrical connection between the different layers.

1b shows how 1a a schematic sectional view of two PCB boards 1a . 1b for the production of a basic element 2 over oppositely executed edges 3a . 3b for a module according to the invention. The design and the structure essentially correspond to the 1 , The exposed copper layer areas 4a . 4b can be connected by a welding process in this embodiment shown. For this purpose, in addition to the edges 3a . 3b a Z-axis controlled milling or drilling 9 exhibit.

2a shows a schematic sectional view of two PCB boards 1a . 1b in the manufacture of a base element 2 via a tongue and groove connection for a module according to the invention. This can be done on a first circuit board 1a by milling on one edge from above and from below the projecting spring 10 be formed while on a second circuit board 1b a recess adapted thereto 11 , that is, the groove is generated. groove 12 and spring 11 can be connected to each other by a Lochgalvanisierung and telescoping without the need for additional fasteners, such as Pressfit pins, must be used. The connection is therefore very stable. In addition, the preparation of the connection is simple and inexpensive. Also in this connection process designed in this way, the electrical contacting of the printed circuit boards 1a . 1b be completely covered, so that a protection against metallic contamination, such as chips or particles, and a short circuit caused thereby is ensured. The further embodiment with the corresponding associated effects and advantages corresponds to the comments on the 1a and 1b are described.

2 B shows a schematic sectional view of two PCB boards 1a . 1b in the manufacture of a base element 3 via a tongue and groove connection for a module according to the invention. In the embodiment shown are groove 11 and spring 10 already to the base element 2 together. In addition, by groove and spring a hole 12 be guided by the example, with a pin or a screw additional mechanical reinforcement can be achieved. The further embodiment with the associated effects and advantages also corresponds to the 1a and 1b described embodiments.

3a to 3c show a schematic representation of the production of a direct connection of two PCBs 1a . 1b in a parallel process step. In the embodiment shown, a soldering process is used for the electrical contacting and lamination or bonding is used for the mechanical connection and stabilization. The additional mechanical stabilization is advantageous since in application areas of gear technology often ambient temperatures up to 150 ° C or more may occur and at high temperatures solder joints may lose their holding power.

3a shows the two circuit boards 1a . 1b in a sectional view. On the circuit boards are each one or more solder pads 13 arranged for. Between both circuit boards 1a . 1b can be a glue foil 14 For example, an acrylic adhesive film or polyimide film may be used.

3b shows a plan view of one of the circuit boards 1 on the one adhesive foil 14 is arranged. The adhesive film 14 points in the area of the solder pads 13 perforations 15 on.

3c shows the two circuit boards 1a . 1b in a sectional view. The circuit boards 1a . 1b are positioned on top of each other so that the solder pads 13 come to rest on each other. About the introduction of pressure and temperature, for example in the direction of arrow A, a solder joint can be made and at the same time the adhesive crosslinked and cured. The introduction of pressure and temperature can be done for example with a heat seal press. Also in this preferred Ausfüh The form of the invention can be the electrical contacting of the printed circuit boards 1a . 1b be completely covered, so that a protection against metallic contamination, such as chips or particles, a resulting short circuit is ensured. Likewise, the circuit boards 1a . 1b be constructed the same or different, so that easily even complex basic elements 2 can be formed. This allows the subdivision of Lei terplatten 1a . 1b can be variably adapted to a wide variety of applications and requirements.

Advantageously, according to the invention no additional plug and connection component is required for the purpose of direct connection of the printed circuit boards to the base element. The length of the signal and current paths can be kept to a minimum by the direct connection of the printed circuit boards. This applies equally to the number of interfaces required. In comparison with basic elements, which are connected by a separate plug component according to the invention, the error rate of the resulting electronic assembly can be reduced and their reliability can be significantly improved. The basic elements according to the invention 2 are simple and inexpensive to manufacture and are characterized by a high stability.

In summary is therefore a module for an integrated control electronics proposed, in which the function of the carrier for the electronic components on the one hand and the electronic ones at the same time Connection to the peripheral components taken by a base element becomes. The signal and potential distribution can be through the base element be ensured equally reliable and long-term stability like the thermal connection to the bottom plate or similar Heat Sinks. In addition, the inventive connection concept allows the construction of complex printed circuit board structures as a base element, without that for this an additional plug and connection component designed, deployed and installed. The thus provided module is lightweight and variably assortable and can be inexpensively manufactured using standard processes. The assembly is therefore easy and inexpensive in the overall assembly process an electronic device integrated.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - US 6691408 [0006]
• US 2004214466 AA [0007]

Claims (13)

Module for an integrated control electronics with at least one housing cover and a base element ( 2 ) as an electrical connection between the housing interior and components lying outside the housing, characterized in that the base element ( 2 ) Carrier for the electronic components ( 6 ) of the central control electronics and at the same time thermal connection to the bottom plate and from at least two electrically and mechanically directly interconnected two- or multi-layer PCB circuit boards ( 1a . 1b ), which are constructed the same or different. Module according to claim 1, characterized in that at least one printed circuit board ( 1a . 1b ) of the base element ( 2 ) is at least partially deformable. Module according to claim 1 or 2, characterized in that the direct connection of the printed circuit boards ( 1a . 1b ) to the base element ( 2 ) by oppositely designed edges ( 3a . 3b ) or via a groove ( 11 ) and spring ( 10 ) Connection is realized. Module according to one of claims 1 to 3, characterized in that the electrical connection by soldering or welding and the mechanical connection by gluing or laminating. Module according to one of claims 1 to 4, characterized in that an additional mechanical Connection of printed circuit boards by rivets, screws and / or a Hot caulking, lamination or gluing is provided. Module according to one of the preceding claims 1 to 5, characterized in that at least one two- or multilayer printed circuit board ( 1a . 1b ) of the base element ( 2 ) different vias ( 8th ) for thermal connection to the bottom plate, for the electronic connection between different printed circuit board layers and / or for electronic connection to the components located outside of the housing. Module according to one of the preceding claims 1 to 6, characterized in that the electronic connection the outside of the housing components executed by means of press-fitting and / or laser welding becomes. Module according to one of the preceding claims 1 to 7, characterized in that the electronic components ( 6 ) of the central control electronics in at least one two- or multi-layer printed circuit board ( 1a . 1b ) of the base element ( 2 ) are integrated. Module according to one of the preceding claims 1 to 8, characterized in that the electronic components ( 6 ) of the central control electronics by means of soldering and / or gluing on the base element ( 5 ) are attached and / or contacted. Method for producing a module having the features of at least one of the preceding claims 1 to 9, characterized in that at least two two-layer or multi-layer printed circuit boards ( 1a . 1b ) directly to each other electrically and mechanically to a base element ( 2 ) and the base element ( 2 ) with the electronic components ( 6 ) of the central control electronics, applied to a bottom plate and connected to the components located outside the housing and subsequently the housing cover is attached. A method according to claim 10, characterized in that the mechanical and electrical connection of the printed circuit boards ( 1a . 1b ) to the base element ( 2 ) is produced in a parallel step. Method according to claim 10 or 11, characterized that the electrical connection by soldering or welding and the mechanical connection made by lamination or gluing becomes. Use of a module according to one of the preceding Claims 1 to 9 preferred for an integrated Transmission control of a motor vehicle.